ETC 1.5KE6V8CA/440CA

1.5KE6V8A/440A
1.5KE6V8CA/440CA

TRANSILTM
FEATURES
PEAK PULSE POWER : 1500 W (10/1000µs)
BREAKDOWN VOLTAGE RANGE :
From 6.8V to 440 V
UNI AND BIDIRECTIONAL TYPES
LOW CLAMPING FACTOR
FAST RESPONSE TIME
UL RECOGNIZED
DESCRIPTION
Transil diodes provide high overvoltage protection
by clamping action. Their instantaneousresponse
to transient overvoltages makes them particularly
suited to protect voltage sensitive devices such
as MOS Technology and low voltage supplied IC’s.
CB429
ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)
Symbol
PPP
Parameter
Peak pulse power dissipation (see note 1)
Tj initial = Tamb
Power dissipation on infinite heatsink
Tamb = 75°C
IFSM
Non repetitive surge peak forward current
for unidirectional types
tp = 10ms
Tj initial = Tamb
Tstg
Tj
Storage temperature range
Maximum junction temperature
TL
Maximum lead temperature for soldering during 10s at 5mm
from case
P
Value
Unit
1500
W
5
W
200
A
- 65 to + 175
175
°C
°C
230
°C
Value
Unit
Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit.
THERMAL RESISTANCES
Symbol
Parameter
Rth (j-l)
Junction to leads
20
°C/W
Rth (j-a)
Junction to ambient on printed circuit. Llead = 10 mm
75
°C/W
January 1998 Ed: 2
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1.5KExx
ELECTRICAL CHARACTERISTICS (Tamb = 25°C)
I
Symbol
IF
Parameter
VRM
Stand-off voltage
VBR
Breakdown voltage
VCL
Clamping voltage
IRM
Leakage current @ VRM
IPP
Peak pulse current
αT
Voltage temperature coefficient
VF
Forward voltage drop
Types
Unidirectional
1.5KE6V8A
Bidirectional
1.5KE6V8CA
VCL
VBR
VF
V RM
V
I RM
I PP
IRM @ VRM
max
µA
min
VBR @ IR
nom max
VCL @ IPP
max
VCL @ IPP
max
αT
max
C
typ
note2
10/1000µs
8/20µs
note3
note4
-4
10 /°C
pF
V
V
V
V
mA
V
A
V
A
1000
5.8
6.45
6.8
7.14
10
10.5 143 13.4 746
5.7
9500
500
6.4
7.13
7.5
7.88
10
11.3 132 14.5 690
6.1
8500
1.5KE7V5A
1.5KE7V5CA
1.5KE10A
1.5KE10CA
10
8.55
9.5
10
10.5
1
14.5 100 18.6 538
7.3
7000
1.5KE12A
1.5KE12CA
5
10.2
11.4
12
12.6
1
16.7
90
21.7 461
7.8
6000
1.5KE15A
1.5KE15CA
1
12.8
14.3
15
15.8
1
21.2
71
27.2 368
8.4
5000
1.5KE18A
1.5KE18CA
1
15.3
17.1
18
18.9
1
25.2 59.5 32.5 308
8.8
4300
1.5KE22A
1.5KE22CA
1
18.8
20.9
22
23.1
1
30.6
49
39.3 254
9.2
3700
1.5KE24A
1.5KE24CA
1
20.5
22.8
24
25.2
1
33.2
45
42.8 234
9.4
3500
1.5KE27A
1.5KE27CA
1
23.1
25.7
27
28.4
1
37.5
40
48.3 207
9.6
3200
1.5KE30A
1.5KE30CA
1
25.6
28.5
30
31.5
1
41.5
36
53.5 187
9.7
2900
1.5KE33A
1.5KE33CA
1
28.2
31.4
33
34.7
1
45.7
33
59.0 169
9.8
2700
1.5KE36A
1.5KE36CA
1
30.8
34.2
36
37.8
1
49.9
30
64.3 156
9.9
2500
1.5KE39A
1.5KE39CA
1
33.3
37.1
39
41.0
1
53.9
28
69.7 143
10.0
2400
1.5KE47A
1.5KE47CA
1
40.2
44.7
47
49.4
1
64.8 23.2
119
10.1
2050
1.5KE56A
1.5KE56CA
1
47.8
53.2
56
58.8
1
77
19.5 100
100
10.3
1800
1.5KE62A
1.5KE62CA
1
53.0
58.9
62
65.1
1
85
17.7 111
90
10.4
1700
1.5KE68A
1.5KE68CA
1
58.1
64.6
68
71.4
1
92
16.3 121
83
10.4
1550
1.5KE82A
1.5KE82CA
1
70.1
77.9
82
86.1
1
113 13.3 146
69
10.5
1350
1.5KE100A
1.5KE100CA
1
85.5
95.0
100
105
1
137
11
178
56
10.6
1150
1.5KE120A
1.5KE120CA
1
102
114
120
126
1
165
9.1
212
47
10.7
1000
1.5KE150A
1.5KE150CA
1
128
143
150
158
1
207
7.2
265
38
10.8
850
1.5KE180A
1.5KE180CA
1
154
171
180
189
1
246
6.1
317 31.5
10.8
725
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
84
1.5KExx
Types
Unidirectional
IRM @ VRM
max
Bidirectional
µA
min
VBR @ IR
nom max
VCL @ IPP
max
VCL @ IPP
max
αT
max
C
typ
note2
10/1000µs
8/20µs
note3
note4
-4
V
V
V
V
mA
V
A
V
A
10 /°C
pF
1.5KE200A
1.5KE200CA
1
171
190
200
210
1
274
5.5
353
28
10.8
675
1.5KE220A
1.5KE220CA
1
188
209
220
231
1
328
4.6
388
26
10.8
625
1.5KE250A
1.5KE250CA
1
213
237
250
263
1
344
5.0
442
23
11
560
1.5KE300A
1.5KE300CA
1
256
285
300
315
1
414
5.0
529
19
11
500
1.5KE350A
1.5KE350CA
1
299
332
350
368
1
482
4.0
618
16
11
430
1.5KE400A
1.5KE400CA
1
342
380
400
420
1
548
4.0
706
14
11
390
1.5KE440A
1.5KE440CA
1
376
418
440
462
1
603
3.5
776
13
11
360
Fig. 1: Peak pulse power dissipation versus
initial junction temperature (printed circuit board).
% I PP
100
10 s
PULSE WAVEFORM 10/10 00 s
50
0
t
1000 s
Note 2 :
Note 3 :
Note 4 :
Pulse test: tp < 50 ms.
∆VBR = αT * (Tamb - 25) * VBR(25°C).
VR = 0 V, F = 1 MHz. For bidirectional types,
capacitance value is divided by 2.
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
1.5KExx
Fig. 2 : Peak pulse power versus exponential pulse duration.
Fig. 3 :
Clamping voltage versus peak pulse current.
Exponentialwaveform: tp = 20 µs________
tp = 1 ms------------tp = 10 ms ...............
Note : The curves of the figure 3 are specified for a junction temperature of 25 °C before surge.
The given results may be extrapolated for other junction temperatures by using the following formula :
∆VBR = αT * (Tamb -25) * VBR(25°C).
For intermediate voltages, extrapolate the given results.
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
1.5KExx
Fig. 4a : Capacitance versus reverse applied
voltage for unidirectional types (typical values).
Fig. 5 : Peak forward voltage drop versus peak
forward current (typical values for unidirectional
types).
Note : Multiply by 2 for units with VBR > 220 V.
Fig. 4b : Capacitance versus reverse applied
voltage for bidirectional types (typical values).
Fig. 6 : Transient thermal impedance junctionambient versus pulse duration (For FR4 PC
Board with L lead = 10mm).
Fig. 7 : Relative variation of leakage current
versus junction temperature.
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
1.5KExx
ORDER CODE
1.5 KE 100 C A RL
PACKAGING:
= Ammopack tape
RL = Tape and reel.
1500 W
BREAKDOWN VOLTAGE
BIDIRECTIONAL
No suffix : Unidirectional
MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only).
PACKAGE MECHANICAL DATA
CB429 (Plastic)
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ. Max. Min.
Typ. Max.
A
B
9.45
26
9.50
9.80 0.372 0.374 0.386
1.024
∅C
∅D
4.90
0.94
5.00
1.00
5.10 0.193 0.197 0.201
1.06 0.037 0.039 0.042
L1
1.27
0.050
Note 1 : The lead is not controlled within zone L1
Packaging : standard packaging is in tape and reel.
Weight = 0.85 g.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
 1998 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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