REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes to slew rate test. Changes IAW NOR 5962-R194-93 93-08-26 M. A. Frye B Change boilerplate to add one-part part numbers. Add device type 03. Add delta test limits. Redrawn. 97-06-03 R. Monnin C Change to group A subgroups for TCVOOS in table I. Update boilerplate. -rrp 00-10-26 R. Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Rajesh Pithadia STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 CHECKED BY Rajesh Pithadia APPROVED BY Raymond Monnin MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-09-13 REVISION LEVEL C SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-88630 12 5962-E036-01 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 88630 V 01 X Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device class V: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 88630 V 01 V X Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 03 AMP-01A AMP-01B AMP01 Circuit function Low-noise, precision, instrumentation amplifier Low-noise, precision, instrumentation amplifier Low-noise, precision, instrumentation amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter V 3 K Descriptive designator GDIP1-T18 or CDIP2-T18 CQCC1-N28 GDFP2-F24 or CDFP3-F24 Terminals Package style 18 28 24 Dual-in-line Square leadless chip carrier Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) ...................................................................................... Power dissipation (PD) ................................................................................. Common mode input voltage ....................................................................... Differential input voltage: RG 2 k ................................................................................................. RG < 2 k ................................................................................................. Output short circuit duration ........................................................................ Storage temperature range ......................................................................... Lead temperature (soldering, 60 seconds) .................................................. Thermal resistance, junction-to-case (JC) .................................................. Thermal resistance, junction-to-ambient (JA): Case V ..................................................................................................... Case 3 ...................................................................................................... Case K ..................................................................................................... 18 V dc 500 mW 2/ Supply voltage 20 V dc 10 V dc Indefinite -65C to +150C +300C See MIL-STD-1835 120C/W 104C/W 69C/W 1.4 Recommended operating conditions. Supply voltage (VS) ...................................................................................... 15 V dc Ambient operating temperature range (TA) .................................................. -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-973 MIL-STD-1835 - 1/ 2/ Test Method Standard Microcircuits. Configuration Management. Interface Standard Electronic Component Case Outlines. Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Must withstand the added PD due to short circuit test, e.g., IOS. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 3 HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings (SMD's). Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 4 TABLE I. Electrical performance characteristics. Test Input bias current Symbol Group A subgroups Conditions 1/ -55C TA +125C unless otherwise specified Device type Min IB 1 6 02 15 2, 3 1 1 01, 03 2, 3 2 02 2, 3 +PSR V+ = +5 V to +15 V, V- = -15 V, G = 1000 6 1, 2, 3 -PSR 01, 03 120 V+ = +5 V to +15 V, V- = -15 V, G= 100 110 V+ = +5 V to +15 V, V- = -15 V, G = 10 95 V+ = +5 V to +15 V, V- = -15 V, G = 1 75 V+ = +5 V to +15 V, V- = -15 V, G = 1000 Offset referred to input vs. negative supply V+ = +5 V to +15 V, V- = -15 V, G = 100 100 V+ = +5 V to +15 V, V- = -15 V, G = 10 90 V+ = +5 V to +15 V, V- = -15 V, G = 1 70 1, 2, 3 dB 110 02 V- = -5 V to -15 V, V+ = +15 V, G = 1000 nA 3 1 Offset referred to input vs. positive supply nA 10 1 IIO Max 4 01,03 2, 3 Input offset current Unit Limits All 105 V- = -5 V to -15 V, V+ = -15 V, G = 100 90 V- = -5 V to -15 V, V+ = +15 V, G = 10 70 V- = -5 V to -15 V, V+ = +15 V, G = 1 50 dB See footnote at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Common mode rejection Symbol CMR Group A subgroups Conditions 1/ -55C TA +125C unless otherwise specified Device type Min VCM = 10 V, 1 k source imbalance, G = 1000 1 01, 03 120 VCM = 10 V, 1 k source imbalance, G = 10 100 VCM = 10 V, 1 k source imbalance, G = 1 85 VCM = 10 V, 1 k source imbalance, G= 100 115 VCM = 10 V, 1 k source imbalance, G = 10 95 VCM = 10 V, 1 k source imbalance, G = 1 80 1 02 115 VCM = 10 V, 1 k source imbalance, G = 100 110 VCM = 10 V, 1 k source imbalance, G = 10 95 VCM = 10 V, 1 k source imbalance, G = 1 75 VCM = 10 V, 1 k source imbalance, G = 1000 dB 120 2, 3 VCM = 10 V, 1 k source imbalance, G = 1000 Max 125 VCM = 10 V, 1 k source imbalance, G = 100 VCM = 10 V, 1 k source imbalance, G = 1000 Unit Limits 2, 3 110 VCM = 10 V, 1 k source imbalance, G= 100 105 VCM = 10 V, 1 k source imbalance, G = 10 90 VCM = 10 V, 1 k source imbalance, G = 1 75 See footnote at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Gain equation accuracy Symbol GE Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups G = 20RS/RG, TA = +25C 1 Device type Min Accuracy measured at G = 1, 10, 100, and 1000 Unit Limits Max 01 0.6 02, 03 0.8 % Gain range G TA = +25C 1 All 1 1000 V/V Output short circuit current IOS+ TA = +25C 1 All 60 120 mA -120 -60 35 65 k IOS- Reference input resistance RINREF TA = +25C Quiescent current IQ +V linked to +VOP -V linked to -VOP Input offset voltage VIOS 1 All 1, 2, 3 All 4.8 mA 4 01 50 V 5, 6 4 80 02, 03 5, 6 Output offset voltage VOOS 4 150 3 01 5, 6 4 TCVOOS RG = 8 mV 6 02, 03 5, 6 Output offset voltage drift 100 6 10 V/C 01, 03 50 02 120 See footnote at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 7 TABLE I. Electrical performance characteristics – Continued. Test Output voltage swing Symbol VO Group A subgroups Conditions 1/ -55C TA +125C unless otherwise specified Device type Min RL = 500 , 2 k 4 12 5, 6 G = 10 4 4 2.75 02, 03 5, 6 TCVIOS TA = -55C, +125C 8 V/s 3.5 01 5, 6 Average input offset voltage drift V 2.5 RL = 500 , 2 k SR Max 13 All RL = 50 Slew rate Unit Limits 3.0 2.0 01 0.3 02, 03 1.0 V/C 1/ VS = 15 V, RS = 10 k, RL = 2 k, unless otherwise specified. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 8 Device types Case outlines Terminal number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 01 and 02 V RG RG -IN VOOSNULL VOOSNULL TEST PIN SENSE REFERENCE OUTPUT -VOP VV+ +VOP RS RS VIOSNULL VIOSNULL +IN ------------------------------- 3 Terminal symbol NC RG RG -IN NC VOOSNULL NC VOOSNULL NC TEST PIN NC SENSE REFERENCE OUT NC -VOP NC VV+ NC +VOP RS RS NC VIOSNULL VIOSNULL NC +IN 03 K RG2 RG1 -IN NC VOOSNULL NC VOOSNULL TEST PIN NC NC SENSE REFERENCE OUTPUT -VOP NC VV+ +VOP NC RS2 RS1 VIOSNULL VIOSNULL +IN ------------- FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 9 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q Device class V Interim electrical parameters (see 4.2) 1 Final electrical parameters (see 4.2) 1, 2, 3, 4, 5, 6, 8 1/ 1,2,3,4,5,6,8 1/ 1,2,3,4,5,6,8 1/ 2/ 1, 2, 3, 4, 5, 6, 8 1,2,3,4,5,6,8 1,2,3,4,5,6,8 Group C end-point electrical parameters (see 4.4) 1 1 1 2/ Group D end-point electrical parameters (see 4.4) 1 1 1 Group E end-point electrical parameters (see 4.4) ---- ---- ---- Group A test requirements (see 4.4) 1/ PDA applies to subgroup 1. 2/ Delta limits in accordance with table IIB shall be computed with reference to the previous interim electrical parameters. Table IIB. 240 hour burn-in and group C end-point electrical parameters. Parameter Device type Limit Min VIOS VOOS IB+ IB- 03 03 03 03 Delta Max 100 V 6 mV 4 nA 4 nA Min Max 40 V 6 mV 3 nA 3 nA 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 10 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of MIL-PRF-38535 permits alternate in-line control testing. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 7, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 11 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0525. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0674. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-88630 A REVISION LEVEL C SHEET 12 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 00-10-26 Approved sources of supply for SMD 5962-88630 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8863001VA 24355 AMP-01AX/883 5962-8863002VA 24355 AMP-01BX/883 5962-88630023A 24355 AMP-01BTC/883 5962-8863003VVA 24355 AMP01X/QMLV 5962-8863003VKA 24355 AMP01N/QMLV 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 24355 Vendor name and address Analog Devices RT 1 Industrial Park PO Box 9106 Norwood, MA 02062 Point of contact: 1500 Space Park Drive PO Box 58020 Santa Clara, CA 95052-8020 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.