PRELIMINARY TECHNICAL DATA 16-/32- Channel, 3.5 Ω 1.8 V to 5.5 V, ±2.5 V, Analog Multiplexers ADG726/ADG732 Preliminary Technical Data = FEATURES 1.8 V to 5.5 V Single Supply ±2.5 V Dual Supply Operation 3.5 Ω On Resistance 0.5 Ω On Resistance Flatness Rail to Rail Operation 30ns Switching Times Single 32 to 1 Channel Multiplexer Dual/Differential 16 to 1 Channel Multiplexer TTL/CMOS Compatible Inputs For Functionally Equivalent devices with Serial Interface See ADG725/ADG731 FUNCTIONAL BLOCK DIAGRAMS ADG732 ADG726 S1 S1A DA S16A D S1B DB S32 APPLICATIONS Optical Applications Data Acquisition Systems Communication Systems Relay replacement Audio and Video Switching Battery Powered Systems Medical Instrumentation Automatic Test Equipment WR CS S16B 1 OF 32 DECODER A0 A1 A2 A3 A4 EN WR CSA CSB 1 OF 16 DECODER A0 A1 A2 A3 EN GENERAL DESCRIPTION The ADG726/ADG732 are monolithic CMOS 32 channel/dual 16 channel analog multiplexers. The ADG732 switches one of thirty-two inputs (S1-S32) to a common output, D, as determined by the 5-bit binary address lines A0, A1, A2, A3 and A4. The ADG726 switches one of sixteen inputs as determined by the four bit binary address lines, A0, A1, A2 and A3. On chip latches facilitate microprocessor interfacing. The ADG726 device may also be configured for differential operation by tying CSA and CSB together. An EN input is used to enable or disable the devices. When disabled, all channels are switched OFF. These multiplexers are designed on an enhanced submicron process that provides low power dissipation yet gives high switching speed, very low on resistance and leakage currents. They operate from single supply of 1.8V to 5.5V and ±2.5 V dual supply, making them ideally suited to a variety of applications. On resistance is in the region of a few Ohms and is closely matched between switches and very flat over the full signal range. These parts can operate equally well as either Multiplexers or De-Multiplexers and have an input signal range which extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit break before make switching action preventing momentary shorting when switching channels. They are available in either 48 lead LFCSP or TQFP package. PRODUCT HIGHLIGHTS 1. +1.8 V to +5.5 V Single or ±2.5 V Dual Supply operation. These parts are specified and guaranteed with +5 V ±10%, +3 V ±10% single supply and ±2.5 V ±10% dual supply rails. 2. On Resistance of 3.5 Ω. 3. Guaranteed Break-Before-Make Switching Action. 4. 7mm x 7mm 48 lead LF Chip Scale Package (CSP) or 48 lead TQFP package. REV. PrD 2001 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 Analog Devices, Inc., 2001 PRELIMINARY TECHNICAL DATA ADG726/ADG732–SPECIFICATIONS1(V B Version –40°C +25oC to +85°C Parameter ANALOG SWITCH Analog Signal Range On-Resistance (RON) 0 V to VDD 3.5 5.5 On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) 6 0.3 0.8 0.5 1.2 LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH = 5V ± 10%, VSS = 0V, GND = 0 V, unless otherwise noted) Units V Ω Ω Ω Ω Ω Ω typ max typ max typ max VS = 0 V to VDD, IDS = 10 mA; Test Circuit 1 VS = 0 V to VDD , IDS = 10 mA VS = 0 V to VDD, IDS = 10 mA VDD = 5.5 V VD = 4.5 V/1 V, VS = 1 V/4.5 V; Test Circuit 2 VD = 4.5 V/1 V, VS = 1 V/4.5 V; Test Circuit 3 VD = VS = 1 V, or 4.5V; Test Circuit 4 ±10 2.4 0.8 V min V max µA typ µA max pF typ VIN = VINL or VINH ±0.1 ±5 ±5 5 typ max typ max typ max Test Conditions/Comments nA nA nA nA nA nA 0.005 CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tTRANSITION ±0.01 ±0.5 ±0.01 ±0.5 ±0.01 ±1 DD 2 Break-Before-Make Time Delay, tD 30 tON(EN, WR) 32 tOFF(EN) 10 Charge Injection ±5 ns typ ns max ns typ ns min ns typ ns max ns typ ns max pC typ Off Isolation -60 dB typ Channel to Channel Crosstalk -60 dB typ -3 dB Bandwidth C S (OFF) C D (OFF) ADG726 ADG732 CD, CS (ON) ADG726 ADG732 10 13 MHz typ pF typ RL = 300 Ω, CL = 35 pF,Test Circuit 5; VS1 = 3 V/0 V, VS32 = 0 V/3V RL = 300 Ω, CL = 35 pF; VS = 3 V, Test Circuit 6 RL = 300 Ω, CL = 35 pF; VS = 3 V, Test Circuit 7 RL = 300 Ω, CL = 35 pF; VS = 3 V, Test Circuit 8 VS = 0 V, RS = 0 Ω, CL = 1 nF; Test Circuit 9 RL = 50 Ω, CL = 5 pF, f = 100 kHz; Test Circuit 10 RL = 50 Ω, CL = 5 pF, f = 100 kHz; Test Circuit 11 RL = 50 Ω, CL = 5 pF, Test Circuit 10 f = 1 MHz 180 360 pF typ pF typ f = 1 MHz f = 1 MHz 200 400 pF typ pF typ f = 1 MHz f = 1 MHz 10 µA typ µA max 40 60 1 50 14 POWER REQUIREMENTS IDD 20 VDD = +5.5 V Digital Inputs = 0 V or +5.5 V NOTES 1 Temperature range is as follows: B Version: –40°C to +85°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. –2– REV. PrD PRELIMINARY TECHNICAL DATA 1(VDD = 3V ± 10%, VSS = 0V, GND = 0 V, unless otherwise noted) ADG726/ADG732 SPECIFICATIONS B Version –40°C +25oC to +85°C Parameter ANALOG SWITCH Analog Signal Range On-Resistance (R ON) 0 V to VDD 6 11 On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage I S (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH ±0.01 ±1 ±0.01 ±1 ±0.01 ±1 12 0.4 1.2 3 ±5 ±5 ±10 typ max typ max max typ max typ max typ max Test Conditions/Comments VS = 0 V to VDD, IDS = 10 mA; Test Circuit 1 VS = 0 V to VDD , IDS = 10 mA VS = 0 V to VDD, IDS = 10 mA VDD = 3.3 V VS = 3 V/1 V, VD = 1 V/3 V; Test Circuit 2 VS = 1 V/3 V, VD = 3 V/1 V; Test Circuit 3 VS = VD = +1 V or +3 V; Test Circuit 4 V min V max 0.005 ±0.1 DYNAMIC CHARACTERISTICS tTRANSITION V Ω Ω Ω Ω Ω nA nA nA nA nA nA 2.0 0.8 C IN, Digital Input Capacitance Units 5 µA typ µA max pF typ VIN = VINL or VINH 2 Break-Before-Make Time Delay, t D 30 t ON(EN, WR) 40 t OFF(EN) 20 Charge Injection ±5 ns typ ns max ns typ ns min ns typ ns max ns typ ns max pC typ Off Isolation -60 dB typ Channel to Channel Crosstalk -60 dB typ -3 dB Bandwidth C S (OFF) C D (OFF) ADG726 ADG732 CD, CS (ON) ADG726 ADG732 10 13 MHz typ pF typ RL = 300 Ω, CL = 35 pF Test Circuit 5 VS1 = 2 V/0 V, VS32 = 0 V/2 V RL = 300 Ω, CL = 35 pF; VS = 2 V, Test Circuit 6 RL = 300 Ω, CL = 35 pF; VS = 2 V, Test Circuit 7 RL = 300 Ω, CL = 35 pF; VS = 2 V, Test Circuit 8 VS = 0 V, RS = 0 Ω, CL = 1 nF; Test Circuit 9 RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 10 RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 11 RL = 50 Ω, CL = 5 pF, Test Circuit 10 f = 1 MHz 180 360 pF typ pF typ f = 1 MHz f = 1 MHz 200 400 pF typ pF typ f = 1 MHz f = 1 MHz 10 µA typ µA max 45 75 1 70 28 POWER REQUIREMENTS IDD 20 NOTES 1 Temperature ranges are as follows: B Version: –40°C to +85°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. REV. PrD –3– VDD = +3.3 V Digital Inputs = 0 V or +3.3 V PRELIMINARY TECHNICAL DATA 1 Dual Supply ADG726/ADG732–SPECIFICATIONS (V = +2.5 V ±10%, V = -2.5 V ±10%, GND = 0 V, unless otherwise noted) DD SS B Version –40°C +25oC to +85°C Parameter ANALOG SWITCH Analog Signal Range On-Resistance (R ON) VSS to VDD 3.5 5.5 On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) 6 0.3 0.8 0.5 1.2 LEAKAGE CURRENTS Source OFF Leakage I S (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH V Ω Ω Ω Ω Ω Ω typ max typ max typ max VS = VSS to VDD, IDS = 10 mA; Test Circuit 1 VS = VSS to VDD, IDS = 10 mA VS = VSS to VDD, IDS = 10 mA VDD = +2.75 V, VSS = -2.75 V VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V; Test Circuit 2 VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V; Test Circuit 3 VS = VD = +2.25 V/-1.25 V, Test Circuit 4 ±10 1.7 0.7 V min V max µA typ µA max pF typ VIN = VINL or VINH ±0.1 RL = 300 Ω, CL = 35 pF Test Circuit 5 VS1 = 1.5 V/0 V,VS32 = 0 V/1.5 V RL = 300 Ω, CL = 35 pF; VS = 1.5 V, Test Circuit 6 RL = 300 Ω, CL = 35 pF; VS = 1.5 V, Test Circuit 7 RL = 300 Ω, CL = 35 pF; VS = 1.5 V, Test Circuit 8 VS = 0 V, RS = 0 Ω, CL = 1 nF; Test 9 RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 10 RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 11 RL = 50 Ω, CL = 5 pF, Test Circuit 10 ±5 ±5 5 typ max typ max typ max Test Conditions/Comments nA nA nA nA nA nA 0.005 C IN, Digital Input Capacitance DYNAMIC CHARACTERISTICS tTRANSITION ±0.01 ±1 ±0.01 ±1 ±0.01 ±1 Units 2 40 Break-Before-Make Time Delay, t D 15 t ON(EN, WR) 32 t OFF(EN) 16 Charge Injection Off Isolation ±8 -60 ns typ ns max ns typ ns min ns typ ns max ns typ ns max pC typ dB typ Channel to Channel Crosstalk -60 dB typ -3 dB Bandwidth C S (OFF) C D (OFF) ADG726 ADG732 CD, CS (ON) ADG726 ADG732 10 13 MHz typ pF typ 180 360 pF typ pF typ f = 1 MHz f = 1 MHz 200 400 pF typ pF typ f = 1 MHz f = 1 MHz 10 µA µA µA µA 60 1 50 26 POWER REQUIREMENTS IDD 20 ISS 10 20 typ max typ max VDD = +2.75 V Digital Inputs = 0 V or +2.75 V VSS = -2.75 V Digital Inputs = 0 V or +2.75 V NOTES 1 Temperature range is as follows: B Version: –40°C to +85°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. –4– REV. PrD PRELIMINARY TECHNICAL DATA ADG726/ADG732 TIMING CHARACTERISTICS1,2, 3 Parameter Limit at TMIN, TMAX Units Conditions/Comments t1 t2 t3 t4 t5 t6 0 0 20 10 5 2 ns ns ns ns ns ns CS to WR Setup Time CS to WR Hold Time WR pulse width Time between WR cycles Address, Enable Setup Time Address, Enable Hold Time min min min min min min NOTES 1 See Figure 1. 2 All input signals are specified with tr =tf = 5ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. 3 Guaranteed by design and characterisation, not production tested. Specifications subject to change without notice. CS t2 t1 t4 t3 WR t5 t6 A0, A1, A2, A3, (A4) EN Figure 1. Timing Diagram Figure 1 shows the timing sequence for latching the switch address and enable inputs. The latches are level sensitive; therefore, while WR is held low, the latches are transparent and the switches respond to the address and enable inputs. This input data is latched on the rising edge of WR. The ADG726 has two CS inputs. This enables the part to be used either as a dual 16-1 channel multiplexer or a differential 16 channel multiplexer. If a differential output is required, tie CSA and CSB together. REV. PrD –5– PRELIMINARY TECHNICAL DATA ADG726/ADG732 ABSOLUTE MAXIMUM RATINGS 1 (TA = +25°C unless otherwise noted) VDD to VSS VDD to GND VSS to GND Analog Inputs2 +7 V –0.3 V to +7 V +0.3 V to -7 V VSS - 0.3 V to VDD +0.3 Vor 30 mA, Whichever Occurs First Digital Inputs 2 -0.3V to VDD +0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D 60mA (Pulsed at 1 ms, 10% Duty Cycle max) Continuous Current, S or D 30mA Operating Temperature Range Industrial (B Version) –40°C to +85°C Storage Temperature Range –65°C to +150°C Junction Temperature +150°C TBD°C/W 48 lead CSP θJA Thermal Impedance 48 lead TQFP θJA Thermal Impedance TBD°C/W Lead Temperature, Soldering (10seconds) 300°C IR Reflow, Peak Temperature +220°C NOTES 1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at A, WR, RS, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG726/ADG732 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE Model Temperature Range ADG726BCP ADG726BSU ADG732BCP ADG732BSU -40 -40 -40 -40 o C C o C o C o to to to to +85 +85 +85 +85 o C C o C o C o Package Description Package Option Chip Thin Chip Thin CP-48 SU-48 CP-48 SU-48 Scale Quad Scale Quad Package (CSP) Flatpack Package (CSP) Flatpack NC = NO CONNECT PIN 1 INDICATOR ADG732 TOP VIEW VDD 13 VDD 14 A0 15 A1 16 A2 17 A3 18 A4 19 CS 20 WR 21 EN 22 GND 23 VSS 24 S12 1 S11 2 S10 3 S9 4 S8 5 S7 6 S6 7 S5 8 S4 9 S3 10 S2 11 S1 12 S12A 1 S11A 2 S10A 3 S9A 4 S8A 5 S7A 6 S6A 7 S5A 8 S4A 9 S3A 10 S2A 11 S1A 12 36 S28 35 S27 34 S26 33 S25 32 S24 31 S23 30 S22 29 S21 28 S20 27 S19 26 S18 25 S17 NC = NO CONNECT –6– PIN 1 INDICATOR ADG726 TOP VIEW 36 S12B 35 S11B 34 S10B 33 S9B 32 S8B 31 S7B 30 S6B 29 S5B 28 S4B 27 S3B 26 S2B 25 S1B VDD 13 VDD 14 A0 15 A1 16 A2 17 A3 18 CSA 19 CSB 20 WR 21 EN 22 GND 23 VSS 24 48 S13 47 S14 46 S15 45 S16 44 NC 43 D 42 NC 41 NC 40 S32 39 S31 38 S30 37 S29 48 S13A 47 S14A 46 S15A 45 S16A 44 NC 43 DA 42 NC 41 DB 40 S16B 39 S15B 38 S14B 37 S13B PIN CONFIGURATIONS CSP & TQFP REV. PrD PRELIMINARY TECHNICAL DATA ADG726/ADG732 Table 1. ADG726 Truth Table A3 A2 A1 A0 E N CSA CSB WR ON Switch X X X 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 X X X 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 X X X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 X X X 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X X 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 L->H X 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Retains previous switch condition No Change in Switch condition NONE S1A - DA, S1B - DB S2A - DA, S2B - DB S3A - DA, S3B - DB S4A - DA, S4B - DB S5A - DA, S5B - DB S6A - DA, S6B - DB S7A - DA, S7B - DB S8A - DA, S8B - DB S9A - DA, S9B - DB S10A - DA, S10B - DB S11A - DA, S11B - DB S12A - DA, S12B - DB S13A - DA, S13B - DB S14A - DA, S14B - DB S15A - DA, S15B - DB S16A - DA, S16B - DB 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Table 2. ADG732 Truth Table A4 A3 A2 A1 A0 EN CS WR Switch Condition X X X 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 X X X 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 X X X 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 X X X 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 X X X 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X X 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Retains previous switch condition No Change in Switch Condition NONE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 X = Don’t Care REV. PrD 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 L->H X 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 –7– PRELIMINARY TECHNICAL DATA ADG726/ADG732 TERMINOLOGY VDD VSS IDD ISS GND S D IN VD (VS) RON ∆R ON RFLAT(ON) I S (OFF) I D (OFF) ID, IS (ON) VINL VINH IINL(IINH) C S (OFF) C D (OFF) C D ,C S (ON) CIN tTRANSITION t ON(EN) t OFF(EN) tOPEN Most positive power supply potential. Most Negative power supply in a dual supply application. In single supply applications, connect to GND. Positive supply current. Negative supply current. Ground (0 V) reference. Source terminal. May be an input or output. Drain terminal. May be an input or output. Logic control input. Analog voltage on terminals D, S Ohmic resistance between D and S. On resistance match between any two channels, i.e. RONmax - RONmin Flatness is defined as the difference between the maximum and minimum value of on-resistance as mea sured over the specified analog signal range. Source leakage current with the switch “OFF.” Drain leakage current with the switch “OFF.” Channel leakage current with the switch “ON.” Maximum input voltage for logic “0”. Minimum input voltage for logic “1”. Input current of the digital input. “OFF” switch source capacitance. Measured with reference to ground. “OFF” switch drain capacitance. Measured with reference to ground. “ON” switch capacitance. Measured with reference to ground. Digital input capacitance. Delay time measured between the 50% and 90% points of the digital inputs and the switch “ON” condi tion when switching from one address state to another. Delay time between the 50% and 90% points of the EN digital input and the switch “ON” condition. Delay time between the 50% and 90% points of the EN digital input and the switch “OFF” condition. “OFF” time measured between the 80% points of both switches when switching from one address state to another. A measure of the glitch impulse transferred from the digital input to the analog output during switching. Charge Injection Off Isolation A measure of unwanted signal coupling through an “OFF” switch. Crosstalk A measure of unwanted signal is coupled through from one channel to another as a result of parasitic capacitance. On Response The Frequency response of the “ON” switch. Insertion Loss The loss due to the ON resistance of the switch. –8– REV. PrD PRELIMINARY TECHNICAL DATA ADG726/ADG732 TYPICAL PERFORMANCE CHARACTERISTICS TBD TBD TBD TPC 1. On Resistance as a Function of VD(VS) for for Single Supply TPC 4. On Resistance as a Function of VD(VS) for Different Temperatures, Single Supply TPC 7. Leakage Currents as a function of VD(VS) TBD TBD TBD TPC 2. On Resistance as a Function of VD(VS) for Dual Supply TPC 5. On Resistance as a Function of VD(VS) for Different Temperatures, Dual Supply TPC 8. Leakage Currents as a function of VD(VS) TBD TBD TBD TPC 3. On Resistance as a Function of VD(VS) for Different Temperatures, Single Supply TPC 6. Leakage Currents as a function of VD(VS) TPC 9. Leakage Currents as a function of Temperature REV. PrD –9– PRELIMINARY TECHNICAL DATA ADG726/ADG732 TBD TBD TBD TPC 10. Leakage Currents as a Function of Temperature TPC 13. TON/TOFF Times vs. Temperature TPC 16. On Response vs. Frequency TBD TBD TPC 11. Supply Currents vs. Input Switching Frequency TPC 14. Off Isolation vs. Frequency TBD TBD TPC 12. Charge Injection vs. Source Voltage TPC 15. Crosstalk vs. Frequency –10– REV. PrD PRELIMINARY TECHNICAL DATA ADG726/ADG732 Test Circuits I DS VDD VSS V DD V SS V1 S1 ID (OFF) D S2 D S S32 VS EN GND VS A VD +0.8V R O N = V 1/IDS Test Circuit 3. ID (OFF) Test Circuit 1. On Resistance. IS (OFF) VDD VSS V DD V SS S1 D S32 V DD V SS VS VSS V DD A4 50Ω ADG732* GND 3V V SS S1 ADDRESS DRIVE (VIN ) VS1 VS32 S32 VS1 D EN CS GND WR 50% 50% 0V S2 THRU S31 A0 90% VOUT CL 35pF RL 300 Ω V OUT 90% VS32 tTRANSITION * SIMILAR CONNECTION FOR ADG726 tTRANSITION Test Circuit 5. Switching Time of Multiplexer, tTRANSITION. A4 VIN 50Ω V DD VSS VDD VSS S1 3V ADDRESS DRIVE (VIN) VS 0V S2 THRU S31 A0 ADG732* S32 VS D EN CS GND WR VOUT RL 300Ω CL 35pF VOUT 80% 80% t OPEN *SIMILAR CONNECTION FOR ADG726 Test Circuit 6. Break Before Make Delay, tOPEN. REV. PrD VD EN Test Circuit 4. ID (ON) Test Circuit 2. IS (OFF). VDD A +2.4V EN GND ID (ON) D S32 +0.8V VD VIN VSS S1 S2 VS VDD –11– PRELIMINARY TECHNICAL DATA ADG726/ADG732 VDD VSS VDD VSS A4 3V S1 0V S2 THRU S32 A0 50% WR VS ADG732* CS D VOUT WR VCS CL 35pF RL 300Ω EN GND SWITCH OUTPUT VO tON (WR) 20% 0V VWR tOFF (WR) *SIMILAR CONNECTION FOR ADG726 80% Test Circuit 7. Write Turn-On and Turn Off Time, tON , tOFF (WR). VDD VSS V DD VSS A4 3V S1 VS 0V S2 THRU S32 A0 tOFF (EN ) tON (EN ) ADG732* EN D VOUT CL 35pF RL 300Ω CS GND WR VEN 50% 50% EN SWITCH OUTPUT VO 10% 90% 0V *SIMILAR CONNECTION FOR ADG726 Test Circuit 8. Enable Delay, tON(EN), tOFF(EN) VDD VSS V A4 DD VSS A0 S RS 3V +2.4V RS ADG732* 0V D VOUT EN VS LOGIC INPUT (VIN) CL 1nF V OUT VIN QINJ = CL x ∆ VOUT ∆ VOUT *SIMILAR CONNECTION FOR ADG726 Test Circuit 9. Charge Injection. VDD VSS VDD VSS A4 VDD VSS S1 A0 ADG732* S32 EN** A4 VDD VSS S1 NETWORK ANALYZER S2 RL 50 Ω NETWORK ANALYZER 50 Ω ADG732* S32 VS D CS GND WR A0 50 Ω 50Ω VS D VOUT EN CS GND WR *SIMILAR CONNECTION FOR ADG726 ** CONNECT TO 2.4V FOR CROSSTALK MEASUREMENTS OFF ISOLATION = 20LOG10(VOUT/VS) RL 50 Ω VOUT *SIMILAR CONNECTION FOR ADG726 CHANNEL TO CHANNEL CROSSTALK= 20LOG 10(VOUT /VS) INSERTION LOSS = 20LOG10 VOUT WITH SWITCH ( ) VOUT WITHOUT SWITCH Test Circuit 11. Channel-to-Channel Crosstalk. Test Circuit 10. OFF Isolation and Bandwidth. –12– REV. PrD PRELIMINARY TECHNICAL DATA ADG726/ADG732 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 48-Lead CSP (CP-48) 0.024 (0.60) 0.017 (0.42) 0.009 (0.24) 0.024 (0.60) 0.017 (0.42) 37 0.009 (0.24) 0.276(7.0) BSC SQ PIN 1 INDICATOR 0.010 (0.25) MIN 48 1 36 0.266 (6.75) BSC SQ TOP VIEW 0.020 (0.50) 0.016 (0.40) 0.012 (0.30) o 0.207 (5.25) 0.201 (5.10) SQ 0.195 (4.95) BOTTOM VIEW 25 24 12 13 0.217 (5.5) REF 0.028 (0.70) MAX 0.026 (0.65) NOM 0.002 (0.05) 0.0004 (0.01) 0.012 (0.30) 0.020 (0.50) 0.008(0.20) 0.0 (0.0) BSC 0.009 (0.23) REF 0.007 (0.18) 12 MAX 0.035 (0.90) MAX 0.033 (0.85) NOM CONTROLLING DIMENSIONS ARE IN MILLIMETERS 48-Lead TQFP (SU-48) 0.047 (1.20) MAX 0.276 (7.0) BSC 0.018 (0.45) 37 48 36 1 0.276 (7.0) BSC SEATING PLANE TOP VIEW (PINS DOWN) 0.006 (0.15) 0.002 (0.05) 0° – 7° 12 0° MIN 0.008 (0.20) 0.004 (0.09) REV. PrD 13 0.019 (0.5) BSC –13– 25 24 0.011 (0.27) 0.006 (0.17) 0.354 (9.00) BSC 0.030 (0.75) 0.354 (9.00) BSC 0.041 (1.05) 0.037 (0.95)