Revised September 2000 74F219 64-Bit Random Access Memory with 3-STATE Outputs General Description Features The 74F219 is a high-speed 64-bit RAM organized as a 16word by 4-bit array. Address inputs are buffered to minimize loading and are fully decoded on-chip. The outputs are 3-STATE and are in the high-impedance state whenever the Chip Select (CS) input is HIGH. The outputs are active only in the Read mode. This device is similar to the 74F189 but features non-inverting, rather than inverting, data outputs. ■ 3-STATE outputs for data bus applications ■ Buffered inputs minimize loading ■ Address decoding on-chip ■ Diode clamped inputs minimize ringing ■ Available in SOIC (300 mil only) Ordering Code: Order Number Package Number Package Description 74F219SC M16B 16-Lead Small Outline Intergrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74F219SJ M16D 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74F219PC N16E 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol © 2000 Fairchild Semiconductor Corporation Connection Diagram DS009500 www.fairchildsemi.com 74F219 64-Bit Random Access Memory with 3-STATE Outputs June 1988 74F219 Unit Loading/Fan Out Pin Names Description U.L. Input IIH/IIL HIGH/LOW Output IOH/IOL A0–A3 Address Inputs 1.0/1.0 20 µA/−0.6 mA CS Chip Select Input (Active LOW) 1.0/2.0 20 µA/−1.2 mA WE Write Enable Input (Active LOW) 1.0/1.0 20 µA/−0.6 mA D0–D3 Data Inputs O0–O3 3-STATE Data Outputs 1.0/1.0 20 µA/−0.6 mA 150/40 (33.3) −3 mA/24 mA (20 mA) Function Table Inputs Operation CS L L Write High Impedance L H Read True Stored Data H X Inhibit High Impedance H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Block Diagram www.fairchildsemi.com Condition of Outputs WE 2 Recommended Operating Conditions Storage Temperature −65°C to +150°C Ambient Temperature under Bias −55°C to +125°C Free Air Ambient Temperature Junction Temperature under Bias −55°C to +150°C Supply Voltage 0°C to +70°C +4.5V to +5.5V −0.5V to +7.0V VCC Pin Potential to Ground Pin Input Voltage (Note 2) −0.5V to +7.0V Input Current (Note 2) −30 mA to +5.0 mA Voltage Applied to Output in HIGH State (with VCC = 0V) Standard Output −0.5V to VCC 3-STATE Output −0.5V to +5.5V Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Current Applied to Output in LOW State (Max) twice the rated IOL (mA) DC Electrical Characteristics Symbol Min Parameter Typ Max Input HIGH Voltage VIL Input LOW Voltage 0.8 V VCD Input Clamp Diode Voltage −1.2 V VOH VOL 2.0 Units VIH Output HIGH 10% VCC 2.5 Voltage 10% VCC 2.4 5% VCC 2.7 5% VCC 2.7 Output LOW VCC V Conditions Recognized as a HIGH Signal Recognized as a LOW Signal Min IIN = −18 mA IOH = −1 mA IOH = −3 mA V Min 0.5 V Min IOL = 24 mA 5.0 µA Max VIN = 2.7V 7.0 µA Max VIN = 7.0V 50 µA Max VOUT = VCC V 0.0 µA 0.0 mA Max µA Max VOUT = 2.7V IOH = −1 mA IOH = −3 mA 10% VCC Voltage IIH Input HIGH Current IBVI Input HIGH Current Breakdown Test ICEX Output HIGH Leakage Current VID Input Leakage Test IOD 4.75 Output Leakage 3.75 Circuit Current IIL Input LOW −0.6 Current −1.2 IOZH Output Leakage Current IOZL Output Leakage Current IOS Output Short-Circuit Current IZZ Bus Drainage Test ICC Power Supply Current 50 −60 37 3 IID = 1.9 µA All Other Pins Grounded VIOD = 150 mV All Other Pins Grounded VIN = 0.5V (An, WE, Dn) VIN = 0.5V (CS) −50 µA Max VOUT = 0.5V −150 mA Max VOUT = 0V 500 µA 0.0V VOUT = 5.25V 55 mA Max www.fairchildsemi.com 74F219 Absolute Maximum Ratings(Note 1) 74F219 AC Electrical Characteristics Symbol Parameter TA = +25°C TA = −55°C to +125°C TA = 0°C to +70°C VCC = +5.0V VCC = +5.0V VCC = +5.0V CL = 50 pF CL = 50 pF CL = 50 pF Min Typ Max Min Max Min Max tPLH Access Time, HIGH or LOW 10.0 18.5 26.0 9.0 32.0 10.0 27.0 tPHL An to On 8.0 13.5 19.0 8.0 23.0 8.0 20.0 tPZH Access Time, HIGH or LOW 3.5 6.0 8.5 3.5 10.5 3.5 9.5 tPZL CS to On 5.0 9.0 13.0 5.0 15.0 5.0 14.0 tPHZ Disable Time, HIGH or LOW 2.0 4.0 6.0 2.0 8.0 2.0 7.0 tPLZ CS to On 3.0 5.5 8.0 2.5 10.0 3.0 9.0 tPZH Write Recovery Time 6.5 20.0 28.0 6.5 37.5 6.5 29.0 tPZL HIGH or LOW, WE to On 6.5 11.0 15.5 6.5 17.5 6.5 16.5 tPHZ Disable Time, HIGH or LOW 4.0 7.0 10.0 3.5 12.0 4.0 11.0 tPLZ WE to On 5.0 9.0 13.0 5.0 15.0 5.0 14.0 Units ns ns ns AC Operating Requirements Symbol Parameter TA = +25°C TA = −55°C to +125°C VCC = +5.0V VCC = +5.0V Min Max Min Max TA = 0°C to +70°C VCC = +5.0V Min tS(H) Setup Time, HIGH or LOW 0 0 0 tS(L) An to WE 0 0 0 tH(H) Hold Time, HIGH or LOW 2.0 2.0 2.0 tH(L) An to WE 2.0 2.0 2.0 tS(H) Setup Time, HIGH or LOW 10.0 11.0 10.0 tS(L) Dn to WE 10.0 11.0 10.0 tH(H) Hold Time, HIGH or LOW 0 2.0 0 0 2.0 0 0 0 0 6.0 7.5 6.0 6.0 15.0 6.0 tH(L) Dn to WE tS(L) Setup Time, LOW tH(L) Hold Time, LOW tW(L) WE Pulse Width, LOW CS to WE CS to WE www.fairchildsemi.com Units Max ns ns ns 4 ns 74F219 Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead Small Outline Intergrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide Package Number M16B 5 www.fairchildsemi.com 74F219 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M16D www.fairchildsemi.com 6 74F219 64-Bit Random Access Memory with 3-STATE Outputs Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide Package Number N16E Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. www.fairchildsemi.com 7 www.fairchildsemi.com