ETC 74F574SJX

Revised October 2000
74F574
Octal D-Type Flip-Flop with 3-STATE Outputs
General Description
Features
The 74F574 is a high-speed, low power octal flip-flop with a
buffered common Clock (CP) and a buffered common
Output Enable (OE). The information presented to the D
inputs is stored in the flip-flops on the LOW-to-HIGH Clock
(CP) transition.
■ Inputs and outputs on opposite sides of package
allowing easy interface with microprocessors
This device is functionally identical to the 74F374 except
for the pinouts.
■ Useful as input or output port for microprocessors
■ Functionally identical to 74F374
■ 3-STATE outputs for bus-oriented applications
Ordering Code:
Order Number
Package Number
Package Description
74F574SC
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74F574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74F574PC
N20A
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbols
Connection Diagram
IEEE/IEC
© 2000 Fairchild Semiconductor Corporation
DS009567
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74F574 Octal D-Type Flip-Flop with 3-STATE Outputs
April 1988
74F574
Unit Loading/Fan Out
Pin Names
Description
U.L.
Input IIH/IIL
HIGH/LOW
Output IOH/IOL
D0–D7
Data Inputs
1.0/1.0
20 µA/−0.6 mA
CP
Clock Pulse Input (Active LOW)
1.0/1.0
20 µA/−0.6 mA
OE
3-STATE Output Enable Input (Active LOW)
1.0/1.0
20 µA/−0.6 mA
O0–O7
3-STATE Outputs
150/40 (33.3) −3 mA/24 mA (20 mA)
Functional Description
Function Table
The 74F574 consists of eight edge-triggered flip-flops with
individual D-type inputs and 3-STATE true outputs. The
buffered clock and buffered Output Enable are common to
all flip-flops. The eight flip-flops will store the state of their
individual D inputs that meet the setup and hold times
requirements on the LOW-to-HIGH Clock (CP) transition.
With the Output Enable (OE) LOW, the contents of the
eight flip-flops are available at the outputs. When OE is
HIGH, the outputs go to the high impedance state. Operation of the OE input does not affect the state of the flipflops.
Inputs
Internal Outputs
Function
OE
CP
H
H
H
H
L
L
L
L
D
Q
O
H
L
NC
Z
H
NC
Z
Hold
L
L
Z
Load
H
H
Z
Load
L
L
L
Data Available
H
H
H
Data Available
H
L
NC
NC
No Change in Data
H
H
NC
NC
No Change in Data
H
Hold
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Z = High Impedance
= LOW-to-HIGH Transition
NC = No Change
Logic Diagram
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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Recommended Operating
Conditions
Storage Temperature
−65°C to +150°C
Ambient Temperature under Bias
−55°C to +125°C
Free Air Ambient Temperature
Junction Temperature under Bias
−55°C to +150°C
Supply Voltage
0°C to +70°C
+4.5V to +5.5V
−0.5V to +7.0V
VCC Pin Potential to Ground Pin
Input Voltage (Note 2)
−0.5V to +7.0V
Input Current (Note 2)
−30 mA to +5.0 mA
Voltage Applied to Output
in HIGH State (with VCC = 0V)
Standard Output
−0.5V to VCC
3-STATE Output
−0.5V to +5.5V
Note 1: Absolute maximum ratings are values beyond which the device
may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
Current Applied to Output
in LOW State (Max)
twice the rated IOL (mA)
DC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
VOH
VOL
2.0
Units
VIH
Output HIGH
10% VCC
2.5
Voltage
10% VCC
2.4
5% VCC
2.7
5% VCC
2.7
Output LOW
V
Input HIGH
Input HIGH Current
Breakdown Test
ICEX
Output HIGH
Leakage Current
VID
Input Leakage
Test
IOD
Circuit Current
Input LOW Current
IOZH
Output Leakage Current
IOZL
Output Leakage Current
IOS
Output Short-Circuit Current
IZZ
Bus Drainage Test
ICCZ
Power Supply Current
IIN = −18 mA
Min
IOH = −3 mA
IOH = −1 mA
0.5
V
Min
IOL = 24 mA
5.0
µA
Max
VIN = 2.7V
7.0
µA
Max
VIN = 7.0V
50
µA
Max
VOUT = VCC
V
0.0
3.75
µA
0.0
−0.6
mA
Max
VIN = 0.5V
50
µA
Max
VOUT = 2.7V
4.75
Output Leakage
IIL
Recognized as a LOW Signal
Min
IOH = −3 mA
10% VCC
Current
IBVI
Conditions
Recognized as a HIGH Signal
IOH = −1 mA
Voltage
IIH
VCC
V
−60
55
3
IID = 1.9 µA
All Other Pins Grounded
VIOD = 150 mV
All Other Pins Grounded
−50
µA
Max
VOUT = 0.5V
−150
mA
Max
VOUT = 0V
500
µA
0.0V
VOUT = 5.25V
86
mA
Max
VO = HIGH Z
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74F574
Absolute Maximum Ratings(Note 1)
74F574
AC Electrical Characteristics
Symbol
Parameter
Min
TA = +25°C
TA = −55°C to +125°C
TA = 0°C to +70°C
VCC = +5.0V
VCC = +5.0V
VCC = +5.0V
CL = 50 pF
CL = 50 pF
CL = 50 pF
Typ
Max
Min
Max
Min
Max
fMAX
Maximum Clock Frequency
100
tPLH
Propagation Delay
2.5
tPHL
CP to On
2.5
5.3
8.5
2.5
9.5
2.5
8.5
tPZH
Output Enable Time
3.0
5.5
9.0
2.5
10.5
2.5
10.0
3.0
6.0
9.0
2.5
10.5
2.5
10.0
1.5
3.3
5.5
1.5
7.0
1.5
6.5
1.5
2.8
5.5
1.5
7.0
1.5
6.5
tPZL
tPHZ
Output Disable Time
tPLZ
60
5.3
8.5
2.5
70
9.5
2.5
Units
MHz
8.5
ns
ns
AC Operating Requirements
Symbol
Parameter
TA = +25°C
TA = −55°C to +125°C
VCC = +5.0V
VCC = +5.0V
Min
Max
Min
Max
TA = 0°C to +70°C
VCC = +5.0V
Min
tS(H)
Set-up Time, HIGH or LOW
2.5
3.0
2.5
tS(L)
Dn to CP
2.0
2.5
2.0
tH(H)
Hold Time, HIGH or LOW
2.0
2.0
2.0
2.0
tH(L)
Dn to CP
2.0
2.0
tW(H)
CP Pulse Width
5.0
5.0
5.0
tW(L)
HIGH or LOW
5.0
5.0
5.0
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Units
Max
ns
ns
74F574
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M20B
5
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74F574
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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6
74F574 Octal D-Type Flip-Flop with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N20A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
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SEMICONDUCTOR CORPORATION. As used herein:
2. A critical component in any component of a life support
device or system whose failure to perform can be reasonably expected to cause the failure of the life support
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1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
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to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the
user.
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