HD74LV00A Quad. 2-input NAND Gates ADE-205-240 (Z) 1st Edition March 1999 Description The HD74LV00A has four two-input NAND gates in a 14-pin package. Low-voltage and high-speed operation is suitable for the battery-powered products (e.g., notebook computers), and the low-power consumption extends the battery life. Features • • • • • • VCC = 2.0 V to 5.5 V operation All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VO (Max.) = 5.5 V (@VCC = 0 V) Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C) Typical VOH undershoot > 2.3 V (@VCC = 3.3 V, Ta = 25°C) Output current ±6 mA (@VCC = 3.0 V to 3.6 V), ±12 mA (@VCC = 4.5 V to 5.5 V) Function Table Inputs A B Output Y H H L L X H X L H Note: H:High level L:Low level X:Immaterial HD74LV00A Pin Arrangement 1A 1 14 VCC 1B 2 13 4B 1Y 3 12 4A 2A 4 11 4Y 2B 5 10 3B 2Y 6 9 GND 7 3A 8 3Y (Top view) Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage range VCC –0.5 to 7.0 V Input voltage range*1 VI –0.5 to 7.0 V Output voltage range*1, 2 VO –0.5 to VCC + 0.5 V Input clamp current IIK –20 mA VI < 0 Output clamp current IOK ±50 mA VO < 0 or VO > VCC Continuous output current IO ±25 mA VO = 0 to VCC Continuous current through VCC or GND ICC or IGND ±50 mA Maximum power dissipation at PT Ta = 25°C (in still air)*3 785 mW Storage temperature –65 to 150 –0.5 to 7.0 Tstg Conditions Output: H or L VCC: OFF 500 SOP TSSOP °C Notes:The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1.The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2.This value is limited to 5.5 V maximum. 3.The maximum package power dissipation was calculated using a junction temperature of 150°C. 2 HD74LV00A Recommended Operating Conditions Item Symbol Min Max Unit Supply voltage range VCC 2.0 5.5 V Input voltage range VI 0 5.5 V Output voltage range VO 0 VCC V Output current IOH — –50 µA VCC = 2.0 V — –2 mA VCC = 2.3 to 2.7 V — –6 VCC = 3.0 to 3.6 V — –12 VCC = 4.5 to 5.5 V IOL Input transition rise or fall rate ∆t /∆v Operating free-air temperature Ta Conditions — 50 µA VCC = 2.0 V — 2 mA VCC = 2.3 to 2.7 V — 6 VCC = 3.0 to 3.6 V — 12 VCC = 4.5 to 5.5 V 0 200 0 100 0 20 –40 85 ns/V VCC = 2.3 to 2.7 V VCC = 3.0 to 3.6 V VCC = 4.5 to 5.5 V °C Note: Unused or floating inputs must be held high or low. Logic Diagram A Y B DC Electrical Characteristics • Ta = –40 to 85°C • Item Symbol Input voltage VIH VIL Output voltage VOH VOL VCC (V)* Min 2.0 1.5 Typ Max Unit V — — 2.3 to 2.7 VCC × 0.7 — — 3.0 to 3.6 VCC × 0.7 — — 4.5 to 5.5 VCC × 0.7 — — 2.0 Test Conditions — — 0.5 2.3 to 2.7 — — VCC × 0.3 3.0 to 3.6 — — VCC × 0.3 4.5 to 5.5 — — VCC × 0.3 Min to Max VCC – 0.1 — — 2.3 2.0 — — IOH = –2 mA 3.0 2.48 — — IOH = –6 mA 4.5 3.8 — — IOH = –12 mA Min to Max — — 0.1 IOL = 50 µA V IOH = –50 µA 3 HD74LV00A Item Symbol VCC (V)* Min Typ Max Unit Test Conditions 2.3 — — 0.4 IOL = 2 mA 3.0 — — 0.44 IOL = 6 mA IOL = 12 mA 4.5 — — 0.55 Input current IIN 0 to 5.5 — — ±1 µA VIN = 5.5 V or GND Quiescent supply current ICC 5.5 — — 20 µA VIN = VCC or GND, IO = 0 Output leakage current IOFF 0 — — 5 µA VO = 5.5 V Input capacitance CIN 3.3 — 3.3 — pF VI = VCC or GND • Note:For conditions shown as Min or Max, use the appropriate values under recommended operating conditions. Switching Characteristics • VCC = 2.5 ± 0.2 V • Ta = –40 to 85°C Ta = 25°C Item Symbol Propagation tPLH delay time tPHL • • Min Typ Max Min Max Unit Test Conditions FROM (Input) TO (Output) — 7.1 12.9 1.0 15.0 ns CL = 15 pF A or B Y — 9.6 16.6 1.0 20.0 Test Conditions FROM (Input) TO (Output) CL = 15 pF A or B Y VCC = 3.3 ± 0.3 V Ta = –40 to 85°C Ta = 25°C Item Min Typ Max Min Propagation tPLH — 5.0 7.9 delay time — 6.9 11.4 1.0 • • Symbol tPHL 1.0 Max Unit 9.5 ns 13.0 CL = 50 pF VCC = 5.0 ± 0.5 V Ta = –40 to 85°C Ta = 25°C Item Symbol Propagation tPLH delay time tPHL 4 CL = 50 pF Min Typ Max Min Max Unit Test Conditions FROM (Input) TO (Output) — 3.6 5.5 1.0 6.5 ns CL = 15 pF A or B Y — 4.9 7.5 1.0 8.5 CL = 50 pF HD74LV00A Operating Characteristics • CL = 50 pF • Ta = 25°C Item Symbol VCC (V) Min Typ Max Unit Test Conditions Power dissipation capacitance CPD 3.3 — 9.5 — pF f = 10 MHz 5.0 — 11.0 — Test Conditions Noise Characteristics • CL = 50 pF • Ta = 25°C VCC (V) Min Typ Max Unit Quiet output, VOL (P) maximum dynamic VOL 3.3 — 0.2 0.8 V Quiet output, VOL (V) minimum dynamic VOL 3.3 — –0.1 –0.8 Quiet output, VOH (V) minimum dynamic VOH 3.3 — 3.1 — High-level VIH (D) dynamic input voltage 3.3 2.31 — — Low-level VIL (D) dynamic inout voltage 3.3 — — 0.99 Item Symbol V Test Circuit Measurement point CL* Note: CL includes the probe and fig capacitance. 5 HD74LV00A • Waveform – 1 tr tf 90% 50% VCC Input VCC 90% 50% VCC 10% 10% 0V t PHL t PLH VOH In phase output 50% VCC 50% VCC VOL t PHL t PLH VOH 50% VCC Out of phase output 50% VCC VOL Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 3 ns, t f ≤ 3 ns 2. The output are measured one at a time with one transition per measurement. Package Dimensions Unit: mm 10.06 10.5 Max 8 5.5 14 1 0.10 ± 0.10 1.42 Max 1.27 0.42 ± 0.08 0.40 ± 0.06 0.22 ± 0.05 0.20 ± 0.04 2.20 Max 7 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M Dimension including the plating thickness Base material dimension 6 Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DA — Conforms 0.23 g HD74LV00A Unit: mm 8.65 9.05 Max 8 1 7 *0.22 ± 0.03 0.20 ± 0.03 0.635 Max 1.75 Max 3.95 14 0.10 6.10 +– 0.30 1.08 *0.42 ± 0.08 0.40 ± 0.06 0.11 0.14 +– 0.04 0° – 8° 1.27 0.67 0.60 +– 0.20 0.15 0.25 M Hitachi Code JEDEC EIAJ Weight (reference value) *Dimension including the plating thickness Base material dimension FP-14DN Conforms Conforms 0.13 g Unit: mm 4.40 5.00 5.30 Max 14 8 1 7 0.65 0.22 0.20 ± 0.06 1.0 0.13 M 6.40 ± 0.20 0.10 Dimension including the plating thickness Base material dimension 0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.83 Max 0.07 +0.03 –0.04 +0.08 –0.07 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) TTP-14D — — 0.05 g 7 HD74LV00A Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as in aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safe devices, so that the equipment incorporating the Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Straße 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 8