ETC HFA40HF60

PD-20381
HFA40HF60
HEXFRED
TM
Ultrafast, Soft Recovery Diode
Features
VR = 600V
(ISOLATED BASE)
• Reduced RFI and EMI
• Reduced Snubbing
• Extensive Characterization of Recovery Parameters
• Hermetic
• Surface Mount
VF = 1.75V
Qrr = 290nC
CATHODE
di(rec)M/dt = 400A/µs
ANODE
Description
TM
HEXFRED diodes are optimized to reduce losses and
EMI/RFI in high frequency power conditioning systems.
An extensive characterization of the recovery behavior
for different values of current, temperature and di/dt
simplifies the calculations of losses in the operating
conditions. The softness of the recovery eliminates the
need for a snubber in most applications. These devices
are ideally suited for power converters, motors drives and
other applications where switching losses are significant
portion of the total losses.
SMD-1
Absolute Maximum Ratings (per Leg)
Parameter
VR
IF @ TC = 100°C
IFSM @ TC = 25°C
PD @ TC = 25°C
TJ
TSTG
D.C. Reverse Voltage
Continuous Forward Current 
Single Pulse Forward Current ‚
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Max.
Units
600
22
225
83
-55 to +150
V
A
W
°C
Thermal - Mechanical Characteristics
Parameter
RθJC
Junction-to-Case, Single Leg Conducting
Weight
Typ.
Max.
Units
—
2.4
1.5
—
°C/W
g
Note:  D.C. = 50% rect. wave
‚ 1/2 sine wave, 60 Hz , P.W. = 8.33 ms
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6/30/99
HFA40HF60
Electrical Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
VBR
VFM
Min. Typ. Max. Units
Cathode Anode Breakdown Voltage
Max Forward Voltage
IRM
Max Reverse Leakage Current
CT
LS
Junction Capacitance
Series Inductance
600
—
—
—
—
—
—
—
—
—
1.63 1.75
2.07 2.25
1.52 1.64
—
10
—
1.0
56
59
2.8
—
V
V
µA
mA
pF
nH
Test Conditions
IR = 100µA
IF = 22A
IF = 45A
See Fig. 1
IF = 22A, TJ = 125°C
VR = VR Rated
See Fig. 2
TJ = 125°C, VR = 480V
VR = 200V
See Fig. 3
Measured from center of bond pad to
end of anode bonding wire
Dynamic Recovery Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
trr1
trr2
IRRM1
IRRM2
Qrr1
Qrr2
di(rec)M/dt1
di(rec)M/dt2
Min. Typ. Max. Units
Reverse Recovery Time
Peak Recovery Current
Reverse Recovery Charge
Peak Rate of Fall of Recovery Current
During tb
—
—
—
—
—
—
—
—
60
110
5.2
8.5
190
560
270
170
90
165
7.8
13
290
840
400
250
ns
A
nC
A/µs
Test Conditions
TJ = 25°C
See Fig.
TJ = 125°C
5
IF = 22A
TJ = 25°C
See Fig.
TJ = 125°C
6
VR = 200V
TJ = 25°C
See Fig.
TJ = 125°C
7
dif/dt = 200A/µs
TJ = 25°C
See Fig.
TJ = 125°C
8
Legend:
1 - Cathode
2 - N/C
3 - Anode
IR Case Style SMD-1
2
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HFA40HF60
R ev erse C u rre n t - I R (µ A )
1000
100
TJ = 1 50°C
TJ = 1 25°C
10
1
0.1
TJ = 25°C
0.01
TJ = -55°C
0.001
0.0001
0
10
200
400
600
R e ve rse V o lta g e - V R (V )
Fig. 2 - Typical Reverse Current vs. Reverse
Voltage
J un ctio n C a pa cita n ce - C T (pF )
Instantane ous Forward C u rrent - I F (A )
100
1000
T J = 1 50 °C
T J = 1 25 °C
1
1.0
2.0
TJ = 25°C
100
T J = 25 °C
0.0
A
3.0
4.0
Forward V olta ge D ro p - V FM (V )
Fig. 1 - Maximum Forward Voltage Drop
vs. Instantaneous Forward Current
10
1
10
100
1000
R ev ers e V olta ge - VR (V )
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage
Thermal Response (Z thJC )
10
1
D = 0.50
0.20
0.10
0.1
0.01
0.00001
P DM
0.05
0.02
0.01
t1
t2
SINGLE PULSE
(THERMAL RESPONSE)
0.0001
Notes:
1. Duty factor D = t 1 / t 2
2. Peak TJ = P DM x Z thJC + TC
0.001
0.01
0.1
1
10
t1 , Rectangular Pulse Duration (sec)
Fig. 4 - Maximum Thermal Impedance Zthjc Characteristics
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HFA40HF60
100
150
I F = 44A
I F = 22A
120
I F = 44 A
I F = 11A
I F = 2 2A
Irr- ( A)
I F = 11 A
trr- (nC)
90
10
60
30
VR = 2 0 0 V
T J = 1 2 5 °C
TJ = 2 5 ° C
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
0
100
d i f /d t - (A /µs )
1
100
1000
1000
d i f /d t - (A /µ s )
Fig. 5 - Typical Reverse Recovery vs. dif/dt
Fig. 6 - Typical Recovery Current vs. dif/dt
10000
2000
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
di (rec) M/dt- (A /µs)
1600
Qrr- (nC)
I F = 44 A
1200
I F = 2 2A
I F = 1 1A
800
1000
I F = 2 2A
I F = 1 1A
400
I F = 4 4A
0
100
di f /dt - (A /µs)
1000
Fig. 7 - Typical Stored Charge vs. dif/dt
4
100
100
1000
d i f /d t - (A /µ s )
Fig. 8 - Typical di(rec)M/dt vs. dif/dt
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HFA40HF60
3
t rr
IF
R E V E R S E R E C O V E R Y C IR C U IT
tb
ta
0
Q rr
VR = 200V
2
I RRM
4
0 .5 I R R M
d i(re c)M /d t
0.0 1 Ω
0 .7 5 I R R M
L = 7 0µ H
D .U .T .
d if/d t
ADJUST
D
G
5
IR F P 2 5 0
S
Fig. 9 - Reverse Recovery Parameter Test
Circuit
1
d i f /d t
1. dif/dt - Rate of change of current
through zero crossing
2. IRRM - Peak reverse recovery current
3. trr - Reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current
4. Qrr - Area under curve defined by trr
and IRRM
trr X IRRM
Qrr =
2
5. di(rec)M/dt - Peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and
Definitions
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http://www.irf.com/
Data and specifications subject to change without notice.
6/99
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