® DAC1220 DAC 122 0 For most current data sheet and other product information, visit www.burr-brown.com 20-Bit Low Power DIGITAL-TO-ANALOG CONVERTER FEATURES APPLICATIONS ● 20-BIT MONOTONICITY GUARANTEED OVER –40°C to +85°C ● LOW POWER: 2.5mW ● PROCESS CONTROL ● ATE PIN ELECTRONICS ● VOLTAGE OUTPUT ● SMART TRANSMITTERS ● SETTLING TIME: 2ms to 0.012% ● PORTABLE INSTRUMENTS ● CLOSED-LOOP SERVO-CONTROL ● MAX LINEARITY ERROR: ±0.0015% ● ON-CHIP CALIBRATION DESCRIPTION The DAC1220 features a synchronous serial interface. In single-converter applications, the serial interface can be accomplished with just two wires, allowing low-cost isolation. For multiple converters, a CS signal allows for selection of the appropriate D/A converter. The DAC1220 is a 20-bit digital-to-analog (D/A) converter offering 20-bit monotonic performance over the specified temperature range. It utilizes delta-sigma technology to achieve inherently linear performance in a small package at very-low power. The resolution of the device can be programmed to 20 bits for fullscale, settling to 0.003% within 15ms typical, or 16 bits for full-scale, settling to 0.012% within 2ms max. The output range is two times the external reference voltage. On-chip calibration circuitry dramatically reduces low offset and gain errors. XOUT XIN The DAC1220 has been designed for closed-loop control applications in the industrial process control market and high-resolution applications in the test and measurement market. It is also ideal for remote applications, battery-powered instruments, and isolated systems. The DAC1220 is available in a SSOP-16 package. AVDD VREF AGND Clock Generator Microcontroller Instruction Register Command Register Data Register Offset Register Full-Scale Register SDIO SCLK Second-Order ∆∑ Modulator Second-Order Continuous Time Post Filter C1 VOUT C2 Modulator Control Serial Interface CS First-Order Switched Capacitor Filter DVDD DGND International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 Twx: 910-952-1111 • Internet: http://www.burr-brown.com/ • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 ® © 1998 Burr-Brown Corporation SBAS082 PDS-1418B 1 Printed in U.S.A. April , 2000 SPECIFICATIONS All specifications TMIN to TMAX, AVDD = DVDD = +5V, fXIN = 2.5MHz, VREF = +2.5V, and 16-bit mode, unless otherwise noted. DAC1220E PARAMETER CONDITIONS MIN TYP MAX UNITS 16 Bits 20-Bit Mode 20 Bits ACCURACY Monotonicity Monotonicity ±1(1) Linearity Error Unipolar Offset Error(2) ±4 VOUT = 20mV Unipolar Offset Error Drift(3) Bipolar Zero Offset Error(2) 1 VOUT = VREF Bipolar Zero Offset Drift(3) ±1 LSB 1 ppm/°C ±10 Power Supply Rejection Ratio at DC, dB = –20log(∆VOUT/∆VDD) LSB ppm/°C Gain Error(2) Gain Error Drift(3) LSB LSB 2 ppm/°C 60 dB ANALOG OUTPUT Output Voltage(4) 0 2 • VREF V 0.5 mA Output Current Capacitive Load 500 pF Short-Circuit Current ±20 mA Short-Circuit Duration GND or V DD Indefinite DYNAMIC PERFORMANCE Settling Time(5) Output Noise Voltage To ±0.012% 1.8 20-Bit Mode, to ±0.003% 15 ms 0.1Hz to 10Hz 1 µVrms 2 ms REFERENCE INPUT Input Voltage 2.25 Input Impedance 2.5 2.75 100 V kΩ DIGITAL INPUT/OUTPUT Logic Family TTL-Compatible CMOS Logic Levels (all except XIN) VIH 2.0 DVDD +0.3 VIL –0.3 0.8 VOH IOH = –0.8mA VOL IOL = 1.6mA 3.6 XIN Frequency Range (fXIN) 0.5 User Programmable V V Input-Leakage Current Data Format V 0.4 V ±10 µA 2.5 MHz 5.25 V Offset Two’s Complement or Straight Binary POWER SUPPLY REQUIREMENTS Power Supply Voltage 4.75 Supply Current Analog Current 360 µA Digital Current 140 µA µA Analog Current 20-Bit Mode 460 Digital Current 20-Bit Mode 140 Power Dissipation 2.5 µA 3.5 mW 20-Bit Mode 3.0 mW Sleep Mode 0.45 mW TEMPERATURE RANGE Specified Performance –40 +85 °C NOTES: (1) Valid from AGND + 20mV to AVDD – 20mV, in the 16-bit mode. (2) Applies after calibration, in 16-bit mode. (3) Re-calibration can remove these errors. (4) Ideal output voltage, does not take into account gain and offset error. (5) Valid from AGND +20mV to AVDD –20mV. Outside of this range, settling time may be twice the value indicated. For 16-bit mode, C1 = 2.2nF, C2 = 0.22nF; for 20-bit mode, C1 = 10nF, C2 = 3.3nF. ® DAC1220 2 PIN CONFIGURATION PIN DESCRIPTIONS Top View SSOP DVDD 1 16 SCLK XOUT 2 15 SDIO XIN 3 14 CS DGND 4 13 AGND DAC1220E AVDD 5 12 VREF DNC 6 11 VOUT DNC 7 10 C2 DNC 8 9 C1 PIN NAME DESCRIPTION 1 DVDD Digital Supply, +5V nominal 2 XOUT System Clock Output (for Crystal) 3 XIN 4 DGND 5 AVDD Analog Supply, +5V nominal 6 DNC Do Not Connect 7 DNC Do Not Connect 8 DNC 9 C1 Filter Capacitor, see text. 10 C2 Filter Capacitor, see text. 11 VOUT Analog Output Voltage 12 VREF Reference Input 13 AGND 14 CS System Clock Input Digital Ground Do Not Connect Analog Ground Chip Select Input 15 SDIO Serial Data Input/Output 16 SCLK Clock Input for Serial Data Transfer ELECTROSTATIC DISCHARGE SENSITIVITY ABSOLUTE MAXIMUM RATINGS(1) AVDD to DVDD ................................................................................... ±0.3V AVDD to AGND ........................................................................ –0.3V to 6V DVDD to DGND ....................................................................... –0.3V to 6V AGND to DGND ............................................................................... ±0.3V VREF Voltage to AGND .......................................................... 2.0V to 3.0V Digital Input Voltage to DGND .............................. –0.3V to DVDD + 0.3V Digital Output Voltage to DGND ........................... –0.3V to DVDD + 0.3V Package Power Dissipation ............................................. (TJMAX – TA)/θJA Maximum Junction Temperature (TJMAX) ..................................... +150°C Thermal Resistance, θJA SSOP-16 ................................................................................ 200°C/W Lead Temperature (soldering, 10s) ............................................... +300°C This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. PACKAGE/ORDERING INFORMATION PRODUCT MAXIMUM LINEARITY ERROR (LSB) DAC1220E " PACKAGE PACKAGE DRAWING NUMBER SPECIFICATION TEMPERATURE RANGE ±1 SSOP-16 322 –40°C to +85°C " " " " ORDERING NUMBER(1) TRANSPORT MEDIA DAC1220E DAC1220E/2K5 Rails Tape and Reel NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “DAC1220E/2K5” will get a single 2500-piece Tape and Reel. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. ® 3 TYPICAL PERFORMANCE CURVES At TA = +25°C, AVDD = DVDD = +5.0V, fXIN = 2.5MHz, VREF = 2.5V, C1 = 2.2nF and C2 = 0.22nF, calibrated mode, unless otherwise specified. LARGE-SIGNAL SETTLING TIME POWER SUPPLY REJECTION RATIO vs FREQUENCY 60 5.0 4.5 4.0 3.5 40 3.0 (V) PSRR (dB) 50 30 2.5 2.0 20 1.5 400mVp-p Ripple Mid-Range Output 10 1.0 0.5 0 0.0 10 100 1k 10k 0 1 Frequency (Hz) 2 3 4 Time (ms) OUTPUT NOISE VOLTAGE vs FREQUENCY LINEARITY ERROR vs CODE 10 10k –40°C 8 Linearity Error (ppm) Noise (nV/√Hz) 1k 100 10 +25°C +85°C 6 4 2 0 –2 1 10 100 1k 10k 100k 0 1M 20000 30000 40000 Code Frequency (Hz) ® DAC1220 10000 4 50000 60000 70000 THEORY OF OPERATION ANALOG OPERATION The DAC1220 is a precision, high dynamic range, selfcalibrating, 20-bit, delta-sigma digital-to-analog converter. It contains a second-order delta-sigma modulator, a firstorder switched-capacitor filter, a second-order continuoustime post filter, a microcontroller including the Instruction, Command and Calibration registers, a serial interface, and a clock generator circuit. The system clock is divided down to provide the sample clock for the modulator. The sample clock is used by the modulator to convert the multi-bit digital input into a one-bit digital output stream. The use of a 1-bit DAC provides inherent linearity. The digital output stream is then converted into an analog signal via the 1-bit DAC and then filtered by the 1st-order switched capacitor filter. The design topology provides low system noise and good power-supply rejection. The modulator frequency of the delta-sigma D/A converter is controlled by the system clock. The output of the switched-capacitor filter feeds into the continuous time filter. The continuous time filter uses external capacitors connected between the C1, C2, VREF, and VOUT pins to adjust the settling time. The connections for the capacitors are shown in Figure 1 (C1 connects between the VREF and C1 pins, and C2 connects between the VOUT and C2 pins). The DAC1220 also includes complete onboard calibration that can correct for internal offset and gain errors. The calibration registers are fully readable and writable. This feature allows for system calibration. The various settings, modes, and registers of the DAC1220 are read or written via a synchronous serial interface. This interface operates as an externally clocked interface. DEFINITION OF TERMS Differential Nonlinearity Error—The differential nonlinearity error is the difference between an actual step width and the ideal value of 1 LSB. If the step width is exactly 1 LSB, the differential nonlinearity error is zero. A differential nonlinearity specification of less than 1 LSB guarantees monotonicity. DAC1220 VREF 12 VOUT 11 C2 10 C1 9 C2 C1 Drift—The drift is the change in a parameter over temperature. Full-Scale Range (FSR)—This is the magnitude of the typical analog output voltage range which is 2 • VREF. For example, when the converter is configured with a 2.5V reference, the full-scale range is 5.0V. FIGURE 1. External Capacitor Connections. CAPACITOR Gain Error—This error represents the difference in the slope between the actual and ideal transfer functions. Linearity Error—The linearity error is the deviation of the actual transfer function from an ideal straight line between the data end points. 16-BIT MODE 20-BIT MODE C1 2.2nF 10nF C2 0.22nF 3.3nF TABLE I. External Capacitor Values. CALIBRATION The DAC1220 offers a self-calibration mode which automatically calibrates the output offset and gain. The calibration is performed once and then normal operation is resumed. In general, calibration is recommended immediately after power-on and whenever there is a “significant” change in the operating environment. The amount of change which should cause a re-calibration is dependent on the application. Where high accuracy is important, re-calibration should be done on changes in temperature and power supply. Least Significant Bit (LSB) Weight—This is the ideal change in voltage that the analog output will change with a change in the digital input code of 1 LSB. Monotonicity—Monotonicity assures that the analog output will increase or stay the same for increasing digital input codes. Offset Error—The offset error is the difference between the expected and actual output, when the output is zero. The value is calculated from measurements made when VOUT = 20mV. After a calibration has been accomplished, the Offset Calibration Register (OCR) and the Full-Scale Calibration Register (FCR) contain the results of the calibration. Note that the values in the calibration registers will vary from configuration-to-configuration and from part to part. Settling Time—The settling time is the time it takes the output to settle to its new value after the digital code has been changed. fXIN—The frequency of the crystal oscillator or CMOScompatible input signal at the XIN input of the DAC1220. ® 5 Self-Calibration Output Mode A self-calibration is performed after the bits “01” have been written to the Command Register Operation Mode bits (MD1 through MD0) and a “1” has been written to the Command Register sample-and-hold bit (SH). This initiates a self-calibration on the next clock cycle. The offset correction code is determined by a repeated sequence of autozeroing the calibration comparator to the offset reference and then comparing the DAC output to the offset reference value. The end result is then averaged, Offset Two’s Complement adjusted, and placed in the OCR. The gain correction is done in a similar fashion except the correction is done against VREF to eliminate common-mode errors. The FCR result represents the gain code and is not Offset Two’s Complement adjusted. The DAC1220 can operate in either 16-bit mode or 20-bit mode. The mode is determined by setting (20-bit) or clearing (16-bit) the RES bit in the CMR register. The output of the DAC1220 can be synchronously reset. By setting the CLR bit in the CMR, the data input register is cleared to zero. This will result in an output of 0V when DF = 1 or VREF when DF = 0, assuming no calibration errors. The settling time is determined by the DISF, RES, and ADPT bits of the command register. The default state of DISF = 0 and ADPT = 0 enables fast settling, unless the output step is small (≈ 40mV). However, the DAC1220 can be forced to always use fast settling if the ADPT bit is set to 1. If DISF is set to 1, all fast settling is disabled. The SH bit of the CMR register determines if C2 is internally connected to VREF. By clearing the SH bit, C2 is disconnected from VREF. The CRST bit of the CMR register can be used to reset the offset and calibration registers. By setting the CRST bit, the contents of the calibration register are reset to 0. The calibration function takes between 300ms and 500ms to complete (for fXIN = 2.5MHz). Once calibration is initiated, further writing of register bits is disabled until calibration completes. The status of calibration can be verified by reading the status of the Command Register Operation Mode bits (MD1 through MD0). These bits will return to normal mode “00” when calibration is complete. REFERENCE INPUT Self-calibration can be done with the output isolated or connected. This is done by setting (output connected) or clearing (output isolated) the CALPIN bit in the CMR register. The reference input voltage of 2.5V can be directly connected to VREF. The recommended reference circuit for the DAC1220 is shown in Figure 2. +5V +5V 0.10µF 7 100kΩ 2 6 1 10kΩ 3 + REF1004-2.5 10µF 0.10µF 100Ω To VREF Pin OPA336 + 10µF 0.1µF 4 FIGURE 2. Recommended External Voltage Reference Circuit for Best Low Noise Operation with the DAC1220. ® DAC1220 6 DIGITAL OPERATION R/W (Read/Write) Bit—For a write operation to occur, this bit of the INSR must be 0. For a read, this bit must be 1, as follows: SYSTEM CONFIGURATION The DAC1220 is controlled by 8-bit instruction codes (INSR) and 16-bit command codes (CMR) via the serial interface, which is externally clocked. R/W The DAC1220 Microcontroller (MC) consists of an ALU and a register bank. The MC has three states: power-on reset, calibration, and normal operation. In the power-on reset state, the MC resets all the registers to their default states. In the calibration state, the MC performs offset and gain selfcalibration. In the normal state, the MC performs D/A conversions. The DAC1220 has five internal registers, as shown in Table II. Two of these, the Instruction Register (INSR) and the Command Register (CMR), control the operation of the converter. The Instruction register utilizes an 8-bit instruction code to control the serial interface to determine whether the next operation is either a read or a write, to control the word length and to select the appropriate register to read/write. Communication with the DAC1220 is controlled via the INSR. The INSR is written as the first part of each serial communication. The instruction that is sent determines what type of communication will occur next. It is not possible to read the INSR. The Command register has a 16bit command code to set up the DAC1220 operation mode, resolution mode, settling mode and data format. The Data Input Register (DIR) contains the value for the next conversion. The Offset and Full-Scale Calibration Registers (OCR and FCR) contain data used for correcting the internal conversion value after it is placed into the DIR. The data in these two registers may be the result of a calibration routine, or they may be values which have been written directly via the serial interface. INSR DIR CMR OCR FCR Instruction Register Data Input Register Command Register Offset Calibration Register Full-Scale Calibration Register Read MB1 MB0 0 0 1 Byte 0 1 2 Bytes 1 0 3 Bytes A3 – A0 (Address) Bits—These four bits select the beginning register location that will be read from or written to, as shown in Table III. Each subsequent byte will be read from or written to the next higher location (increment address). If the BD bit in the Command register is set, each subsequent byte will be read from or written to the next lower location (decrement address). This bit does not affect INSR register or the write operation for the CMR register. If the next location is reserved in Table III, the results are unknown. Reading or writing continues until the number of bytes specified by MB1 and MB0 have been transferred. TABLE II. DAC1220 Registers. Instruction Register (INSR) Each serial communication starts with the 8 bits of the INSR being sent to the DAC1220. The read/write bit, the number of bytes n, and the starting register address are defined, as shown in Table III. When the n bytes have been transferred, the instruction is complete. A new communication cycle is initiated by sending a new INSR (under restrictions outlined in the Interfacing section). R/W Write 1 MB1, MB0 (Multiple Bytes) Bits—These two bits are used to control the word length (number of bytes) of the read or write operation, as follows: 8 Bits 24 Bits 16 Bits 24 Bits 24 Bits MSB 0 A3 A2 A1 A0 0 0 0 0 Data Input Register Byte 2 MSB 0 0 0 1 Data Input Register Byte 1 0 0 1 0 Data Input Register Byte 0 LSB 0 0 1 1 Reserved 0 1 0 0 Command Register Byte 1 MSB 0 1 0 1 Command Register Byte 0 LSB 0 1 1 0 Reserved 0 1 1 1 Reserved 1 0 0 0 Offset Cal Register Byte 2 MSB 1 0 0 1 Offset Cal Register Byte 1 1 0 1 0 Offset Cal Register Byte 0 LSB 1 0 1 1 Reserved 1 1 0 0 Full-Scale Cal Register Byte 2 MSB 1 1 0 1 Full-Scale Cal Register Byte 1 1 1 1 0 Full-Scale Cal Register Byte 0 LSB 1 1 1 1 Reserved TABLE IV. A3 - A0 Addressing. LSB MB1 MB0 0 A3 A3 A1 A0 TABLE III. Instruction Register. ® 7 Command Register (CMR) RES (Resolution) Bit—The Resolution bit selects either 16-bit or 20-bit resolution. The CMR controls all of the functionality of the DAC1220. The new configuration is latched in on the negative transition of SCLK for the last bit of the last byte of data being written to the command register. The organization of the CMR is comprised of 16 bits of information in 2 bytes of 8 bits each. MSB RES 0 1 CALPIN SH RES CLR DF 0 1 0 CRST 0 BD MSB MD1 MD0 Byte 0 LSB DISF Default CLR (Clear) Bit—The CLR bit synchronously resets the data input register to zero. The analog output will be based on the DF bit—if 1, the output will be 0V; if 0, the output will be VREF. Byte 1 ADPT 16-Bit 20-Bit CLR NOTE: In order to obtain optimal performance, the default bit states for the Command Register should be used (refer to Table VI). The only exception is the SH bit—the default bit state is 0, however, the bit should be set to 1 for optimal performance. 0 1 Default DF (Data Format) Bit—The DF bit controls the format of the input data, shown in hexadecimal (either Offset Two’s Complement or Straight Binary), as shown: TABLE V. Command Register. ADPT (Adaptive Filter Disable) Bit—The ADPT bit determines if the adaptive filter is enabled or disabled. When the Adaptive Filter is enabled, the DAC1220 does fast settling only when there is an output step of larger than ≈ 40mV. For small changes in the data, fast settling is not necessary. When ADPT = 1, the Adaptive Filter is disabled and the DAC1220 will not look at the size of a step to determine the necessity of using fast settling. In either case, fast settling can be defeated if DISF = 1. Input Code ADPT 0 1 OFF ON Offset Two's Complement DF = 0 (default) Straight Binary DF = 1 VOUT 8000 0000 7FFF 0000 8000 FFFF 0 VREF 2 • VREF DISF (Disable Fast Settling) Bit—The DISF bit disables the fast settling option. If this bit is zero, the fast settling performance is determined by the ADPT bit, the RES bit, and the ADPT bit. Enabled (default) Disabled CALPIN (Calibration Pin) Bit—The Calibration Pin bit determines if the output is isolated or connected during calibration. DISF 0 1 Fast Settling (default) Disable Fast Settling CALPIN 0 Output Isolated 1 Output Connected Default BD (Byte Order) Bit—The BD bit controls the order in which bytes of data are transferred (either most significant byte first (MSBF) or least significant byte first (LSBF)), as shown: SH (Sample/Hold) Bit —The Sample-and-Hold bit determines if C2 is internally connected to VREF. For best performance, it is recommended to set this bit to 1. BD bit: 0 (default) register 1 0 (default) read 1 write SH INSR write only write only MSBF MSBF 0 1 CMR DIR OCR FCR MSBF MSBF MSBF MSBF LSBF LSBF LSBF LSBF MSBF MSBF MSBF MSBF MSBF LSBF LSBF LSBF Disconnected Connected Default Recommended CRST (Calibration Reset) Bit—The CRST bit resets the offset and full-scale calibration registers. Care must be observed in reading the Command Register if the state of the BD bit is unknown. If a two byte read is started at address 0100 with BD = 0, it will read the contents at address 0100, then 0101. However, if BD = 1, it will read from 0100, then 0011. If the BD bit is unknown, all reads of the command register are best performed as read commands of one byte. CRST 0 1 OFF Reset Default ® DAC1220 8 MSB (Bit Order) Bit—The MSB bit controls the order in which bits within a byte of data are read or written (either most significant bit first or least significant bit first) as follows: Full-Scale Calibration Register (FCR) The FCR is a 24-bit register which contains the full-scale correction factor that is applied to the digital input before it is transferred to the modulator. The contents of this register will be the result of a self-calibration, or written to by the user. MSB 0 1 MSB-First LSB-First Default The FCR is both readable and writable via the serial interface. For applications requiring an accurate system calibration, a system calibration can be performed, the results averaged, and a more precise value written back to the FCR. MD1 - MD0 (Operating Mode) Bits—The Operating Mode bits control the calibration functions of the DAC1220. The Normal mode is used to perform conversions. The SelfCalibration mode is a one-step calibration sequence that calibrates both the offset and full scale. MD1 MD0 0 0 1 1 0 1 0 1 The actual FCR value after calibration will change from part to part and with configuration, temperature, and power supply. In addition, be aware that the contents of the FCR are not used to directly correct the digital input. Rather, the correction is a function of the FCR value. This function is linear and two known points can be used as a basis for interpolating intermediate values for the FCR. The contents of the FCR are in unsigned binary format. This is not affected by the DF bit in the Command register. Normal Mode Self-Cal Sleep X Offset Calibration Register (OCR) MSB The OCR is a 24-bit register containing the offset correction factor that is used to apply a correction to the digital input before it is transferred to the modulator. The results of the self-calibration process will be written to this register. The OCR is both readable and writable via the serial interface. For applications requiring a more accurate calibration, a calibration can be performed, the results averaged, and a more precise offset calibration value written back to the OCR. FCR23 FCR15 FCR7 OCR21 OCR20 FCR14 FCR13 FCR6 FCR5 OCR18 OCR17 OCR14 OCR13 OCR12 OCR6 OCR5 OCR4 FCR16 FCR12 FCR11 FCR10 FCR9 FCR8 FCR4 FCR3 FCR2 FCR1 FCR0 LSB OCR16 DIR23 Byte 2 DIR22 DIR21 DIR20 DIR19 DIR18 DIR17 DIR16 DIR11 DIR10 DIR9 DIR8 DIR3 DIR2 DIR1 DIR0 Byte 1 OCR11 OCR10 OCR9 Byte 0 OCR7 FCR17 The DIR is a 24-bit register which contains the digital input value (see Table VIII). The register is latched on the falling edge of the last bit of the last byte sent. The contents of the DIR are then loaded into the modulator. This means that the DIR register can be updated after sending 1, 2, or 3 bytes, which is determined by the MB1 and MB0 bits in the Instruction Register. The contents of the DIR can be Offset Two’s Complement or Straight Binary. Byte 1 OCR15 FCR18 Data Input Register (DIR) MSB OCR19 FCR19 TABLE VII. Full-Scale Calibration Register. Byte 2 OCR22 FCR20 Byte 0 The results of calibration are averaged, Offset Two's Complement adjusted, and placed in the OCR. MSB FCR21 Byte 1 The actual OCR value after calibration will change from part to part and with configuration, temperature, and power supply. In addition, be aware that the contents of the OCR are not used to directly correct the digital input. Rather, the correction is a function of the OCR value. This function is linear and two known points can be used as a basis for interpolating intermediate values for the OCR. OCR23 Byte 2 FCR22 OCR8 DIR15 DIR14 DIR13 DIR7 DIR6 DIR5 LSB OCR3 OCR2 OCR1 DIR12 Byte 0 OCR0 TABLE VI. Offset Calibration Register. DIR4 LSB TABLE VIII. Data Input Register. ® 9 SLEEP MODE Reset, Power-On Reset and Brown-Out The Sleep Mode is entered after the bit combination 10 has been written to the CMR Operation Mode bits (MD1 and MD0). This mode ends when these bits are changed to a value other than 10. The DAC1220 contains an internal power-on reset circuit. If the power supply ramp rate is greater than 50mV/ms, this circuit will be adequate to ensure the device powers up correctly. Due to oscillator settling considerations, communication to and from the DAC1220 should not occur for at least 25ms after power is stable. If this requirement cannot be met or if the circuit has brownout considerations, the timing diagram of Figure 3 can be used to reset the DAC1220. This accomplishes the reset by controlling the duty cycle of the SCLK input. Communication with the DAC1220 can continue during Sleep Mode. When a new mode (other than Sleep) has been entered, the DAC1220 will execute a very brief internal power-up sequence of the analog and digital circuitry. In addition, the settling of the external VREF and other circuitry must be taken into account to determine the amount of time required to resume normal operation. Sleep mode is the default state after power on or reset. The output is high impedance during sleep mode. I/O Recovery The output is turned off in sleep mode. If serial communication stops during an instruction or data transfer for longer than 100ms (for fXIN = 2.5MHz), the DAC1220 will reset its serial interface. This will not affect the internal registers. The main controller must not continue the transfer after this event, but must restart the transfer from the beginning. This feature is very useful if the main controller can be reset at any point. After reset, simply wait 200ms (for fXIN = 2.5MHz) before starting serial communication. Isolation SERIAL INTERFACE The DAC1220 includes a flexible serial interface which can be connected to microcontrollers and digital signal processors in a variety of ways. Along with this flexibility, there is also a good deal of complexity. This section describes the trade-offs between the different types of interfacing methods in a top-down approach—starting with the overall flow and control of serial data, moving to specific interface examples, and then providing information on various issues related to the serial interface. The serial interface of the DAC1220 provides for simple isolation methods. An example of an isolated two-wire interface is shown in Figure 4. t1: > 512 • tXIN < 800 • tXIN Reset On Falling Edge t2 t2: > 10 • tXIN t2 t3: > 1024 • tXIN < 1800 • tXIN SCLK t1 t3 t4 t4: ≥ 2048 • tXIN < 2400 • tXIN FIGURE 3. Resetting the DAC1220. Isolated Power DVDD DAC1220 C1 12pF 1 DVDD SCLK 16 2 XOUT SDIO 15 3 XIN CS 14 4 DGND AGND 13 5 AVDD VREF 12 6 DNC VOUT 11 7 DNC C2 10 8 DNC C1 9 XTAL C2 12pF AVDD P1.1 Opto Coupler P1.0 VREF 8051 = Isolated VOUT C2 C1 = DGND = AGND FIGURE 4. Isolation for Two-Wire Interface ® DAC1220 Opto Coupler 10 Using CS TIMING The serial interface may make use of the CS signal, or this input may simply be tied LOW. There are several issues associated with choosing to do one or the other. The CS signal does not directly control the tri-state condition of the SDIO output. These signals are normally in the tri-state condition. They only become active when serial data is being transmitted from the DAC1220. If the DAC1220 is in the middle of a serial transfer and the SDIO is an output, taking CS HIGH will not tri-state the output signal. The maximum serial clock frequency cannot exceed the DAC1220 XIN frequency divided by 10. Table IX and Figures 5 through 9 define the basic digital timing characteristics of the DAC1220. Figure 5 and the associated timing symbols apply to the XIN input signal. Figures 6 through 9 and associated timing symbols apply to the serial interface signals (SCLK, SDIO, and CS). The serial interface is discussed in detail in the Serial Interface section. If there are multiple serial peripherals utilizing the same serial I/O lines and communication may occur with any peripheral at any time, the CS signal must be used. The CS signal is then used to enable communication with the DAC1220. SYMBOL DESCRIPTION MIN MAX UNITS fXIN XIN Clock Frequency 1 NOM 2.5 MHz tXIN XIN Clock Period 400 1000 t1 XIN Clock High 0.4 • tXIN ns t2 XIN Clock LOW 0.4 • tXIN ns t3 SCLK HIGH 5 • tXIN ns t4 SCLK LOW 5 • tXIN ns t5 Data In Valid to SCLK Falling Edge (Setup) 40 ns t6 SCLK Falling Edge to Data In Not Valid (Hold) 20 ns t7 Data Out Valid After Rising Edge of SCLK (Hold) 0 t8 SCLK Rising Edge to New Data Out Valid (Delay)(1) t9 Falling Edge of Last SCLK for INSR to Rising Edge of First SCLK for Register Data 13 • tXIN t10 Falling Edge of CS to Rising Edge of SCLK 11 • tXIN t11 Falling Edge of Last SCLK for INSR to SDIO as Output 8 • tXIN t12 SDIO as Output to Rising Edge of First SCLK for Register Data t13 Falling Edge of Last SCLK for Register Data to SDIO Tri-State 4 • tXIN t14 Falling Edge of Last SCLK for Register Data to Rising Edge of First SCLK of next INSR (CS Tied LOW) 41 • tXIN ns t15 Rising Edge of CS to Falling Edge of CS (Using CS) 22 • tXIN ns ns ns 50 ns ns ns ns 10 • tXIN 4 • tXIN ns ns 6 • tXIN ns NOTE: (1) With 10pF load. TABLE IX. Digital Timing Characteristics. ® 11 t3 t4 tXIN t1 t5 SCLK t2 t6 XIN t7 SDIO t8 FIGURE 5. XIN Clock Timing. FIGURE 6. Serial Input/Output Timing. t9 t14 SCLK SDIO IN7 IN1 IN0 INM IN1 IN0 IN7 OUT1 OUT0 IN7 Write Register Data SDIO IN7 IN1 IN0 OUTM Read Register Data FIGURE 7. Serial Interface Timing (CS LOW). t15 CS t10 t10 t9 SCLK IN7 SDIO IN1 IN0 INM IN1 IN0 IN7 OUTM OUT1 OUT0 IN7 Write Register Data IN7 SDIO IN1 IN0 Read Register Data FIGURE 8. Serial Interface Timing (using CS). CS t11 t10 SCLK t12 t13 IN7 SDIO IN0 OUT MSB t9 SDIO is an input SDIO is an output FIGURE 9. SDIO Input to Output Transition Timing. ® DAC1220 12 OUT0 From Read flowchart To Write flowchart Start Writing Start Reading CS taken HIGH for t15 periods minimum (or CS tied LOW) CS taken HIGH for t15 periods minimum (or CS tied LOW) CS state CS state HIGH LOW CS state External device generates 8 serial clock cycles and transmits instruction register data via SDIO LOW HIGH No End CS state External device generates 8 serial clock cycles and transmits instruction register data via SDIO LOW External device generates n serial clock cycles and transmits specified register data via SDIO More instructions? HIGH HIGH LOW SDIO input to output transition External device generates n serial clock cycles and receives specified register data via SDIO Yes Is next instruction a read? No SDIO transitions to tri-state condition Yes To Read flowchart More instructions? No End Yes Is next instruction a Write? No Yes To Write flowchart FIGURE 10. Flowchart for Writing and Reading Register Data. ® 13 LAYOUT GROUNDING POWER SUPPLIES The analog and digital sections of the design should be carefully and cleanly partitioned. Each section should have its own ground plane with no overlap between them. AGND should be connected to the analog ground plane, as well as all other analog grounds. DGND should be connected to the digital ground plane, and all digital signals referenced to this plane. The DAC1220 requires the digital supply (DVDD) to be no greater than the analog supply (AVDD) +0.3V. In the majority of systems, this means that the analog supply must come up first, followed by the digital supply and VREF. Failure to observe this condition could cause permanent damage to the DAC1220. The DAC1220 pinout is such that the converter is cleanly separated into an analog and digital portion. This should allow simple layout of the analog and digital sections of the design. Inputs to the DAC1220, such as SDIO or VREF, should not be present before the analog and digital supplies are on. Violating this condition could cause latch-up. If these signals are present before the supplies are on, series resistors should be used to limit the input current. For a single converter system, AGND and DGND of the DAC1220 should be connected together, underneath the converter. Do not join the ground planes. Instead, connect the two with a moderate signal trace. For multiple converters, connect the two ground planes at one location, as central to all of the converters as possible. In some cases, experimentation may be required to find the best point to connect the two planes together. The printed circuit board can be designed to provide different analog/digital ground connections via short jumpers. The initial prototype can be used to establish which connection works best. The best scheme is to power the analog section of the design and AVDD of the DAC1220 from one +5V supply, and the digital section (and DVDD) from a separate +5V supply. The analog supply should come up first. This will ensure that SCLK, SDIO, CS and VREF do not exceed AVDD, that the digital inputs are present only after AVDD has been established, and that they do not exceed DVDD. The analog supply should be well regulated and low noise. For designs requiring very high resolution from the DAC1220, power supply rejection will be a concern. See the “PSRR vs Frequency” curve in the Typical Performance Curves section of this data sheet for more information. DECOUPLING Good decoupling practices should be used for the DAC1220 and for all components in the design. All decoupling capacitors, and specifically the 0.1µF ceramic capacitors, should be placed as close as possible to the pin being decoupled. A 1µF to 10µF capacitor, in parallel with a 0.1µF ceramic capacitor, should be used to decouple AVDD to AGND. At a minimum, a 0.1µF ceramic capacitor should be used to decouple DVDD to DGND, as well as for the digital supply on each digital component. The requirements for the digital supply are not as strict. However, high frequency noise on DVDD can capacitively couple into the analog portion of the DAC1220. This noise can originate from switching power supplies, very fast microprocessors, or digital signal processors. If one supply must be used to power the DAC1220, the AVDD supply should be used to power DVDD. This connection can be made via a 10Ω resistor which, along with the decoupling capacitors, will provide some filtering between DVDD and AVDD. In some systems, a direct connection can be made. Experimentation may be the best way to determine the appropriate connection between AVDD and DVDD. ® DAC1220 14 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated