Fully Accurate 12-/14-/16-Bit VOUT DAC SPI Interface 2.7 V to 5.5 V in a TSSOP AD5025/45/65 Preliminary Technical Data Low power Dual 12-/14-/16 bit DAC, ± 1LSB INL Individual Voltage reference pins Rail-to-rail operation 2.7 V to 5.5 V power supply Power-on reset to zero scale or midscale Power down to 400 nA @ 5 V, 200 nA @ 3 V 3 power-down functions Per channel power-down Low glitch upon power up Hardware Power Down lock Out Capability Hardware LDAC with LDAC override function CLR Function to programmable code SDO daisy-chaining option 14 lead TSSOP APPLICATIONS Process control Data acquisition systems Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators Functional Block Diagrams VDD VREFA VREFB LDAC SCLK SYNC INPUT REGISTER DAC REGISTER DAC A BUFFER VOUTA INPUT REGISTER DAC REGISTER DAC B BUFFER VOUTB INTERFACE LOGIC DIN PDL AD5025/AD5045R/AD5065 POWER-ON RESET SDO LDAC CLR GND POWER-DOWN LOGIC POR 0000-001 FEATURES Figure 1.AD5025/45/65 Table 1. Related Devices Part No. AD5666 AD5066 AD5064/44/24 AD5063/62 AD5061 AD5060/40 Description Quad,16-bit buffered D/A,16 LSB INL, TSSOP Quad,16-bit unbuffered D/A,1 LSB INL, TSSOP Quad 16-bit nanoDAC, 1 LSB INL, TSSOP 16-bit nanoDAC, 1 LSB INL, MSOP 16-/14bit nanoDAC, 4 LSB INL, SOT-23 16-/14bit nanoDAC, 1 LSB INL, SOT-23 GENERAL DESCRIPTION The AD5025/45/65 are low power, dual 12-/14-/16-bit buffered voltage-out DACs offering relative accuracy specs of 1 LSB INL with individual reference pins and can operate from a single 2.7 V to 5.5 V supply. The AD5025/45/65 64 parts also offer a differential accuracy specification of ±1 LSB. The parts use a versatile 3-wire, low power Schmitt trigger serial interface that operates at clock rates up to 50 MHz and is compatible with standard SPI®, QSPI™, MICROWIRE™, and DSP interface standards. The reference for the AD5025/45 and AD5065 are supplied from an external pin. A reference buffer is also provided on-chip. The AD5025/45/64 incorporates a power-on reset circuit that ensures the DAC output powers up zero scale or midscale and remains there until a valid write takes place to the device. The AD5025/45/65 contain a power-down feature that reduces the current consumption of the device to typically 330 nA at 5 V and provides software selectable output loads while in power-down mode. The parts are put into power-down mode over the serial interface. Total unadjusted error for the parts is <2 mV. Both parts exhibit very low glitch on power-up. The outputs of all DACs can be updated simultaneously using the LDAC function, with the added functionality of user-selectable DAC channels to simultaneously update. There is also an asynchronous CLR that clears all DACs to a software-selectable code—0 V, midscale, or full scale. The Part also features a power down lockout pin PDL, which can be used to prevent the DAC from entering power down under any circumstances over the serial interface. PRODUCT HIGHLIGHTS 1. Dual channel available in 14-lead TSSOP package with individual Voltage reference pins. 2. 12-/14-/-16 bit accurate, 1 LSB INL. 3. Low glitch on power-up. 4. High speed serial interface with clock speeds up to 50 MHz. 5. Three power-down modes available to the user. 6. Reset to known output voltage (zero scale or midscale). 7. Power Down lockout capability. Rev. PrB Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2007 Analog Devices, Inc. All rights reserved. AD5025/45/65 Preliminary Technical Data TABLE OF CONTENTS REVISION HISTORY Rev. PrB | Page 2 of 33 Preliminary Technical Data AD5025/45/65 SPECIFICATIONS VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND, 2.2V ≤VREFIN ≤. VDD unless otherwise specified. All specifications TMIN to TMAX, unless otherwise noted. Table 2. B Grade1 Parameter STATIC PERFORMANCE2 Resolution Min Typ Max 16 14 12 Relative Accuracy 0.5 0.5 0.5 0.5 0.5 0.5 Differential Nonlinearity Total Unadjusted Error Tue Power-Up Time DC PSRR Wideband SFDR REFERENCE INPUTS Reference Input Range Reference Current Reference Input Impedance LOGIC INPUTS3 Input Current4 Bits AD5065 AD5045 AD5025 AD5065 TA = -40°C to +105°C AD5065 TA = -40°C to +125°C AD5045 TA = -40°C to +105°C AD5045 TA = -40°C to +125°C AD5025 TA = -40°C to +105°C AD5025 TA = -40°C to +125°C AD5065/45/25: Guaranteed monotonic by design AD5065/45/25 TA = -40°C to +105°C AD5065/45/25 TA = -40°C to +125°C All 0s loaded to DAC register LSB LSB LSB ±2.5 –80 0.5 LSB 0.5 LSB/m A LSB −1 ±1 0.5 OUTPUT CHARACTERISTICS3 Output Voltage Range Capacitive Load Stability DC Output Impedance (Normal mode) DC Output Impedance (output connected to 100kΩ network) (output connected to 1kΩ network) Short-Circuit Current Conditions/Comments LSB mV mV mV μV/°C % FSR % FSR ppm dB 0.2 0.2 1 ±2 −0.2 Offset Error Offset Error Drift Full-Scale Error Gain Error Gain Temperature Coefficient DC Power Supply Rejection Ratio DC Crosstalk ±1 ±1.5 ±1 ±1.5 ±1 ±1.5 ±1 ±2 ±2 9 Unit 0 VDD All 1s loaded to DAC register Of FSR/°C VDD ± 10% Due to single-channel full-scale output change, RL = 2 kΩ to GND or VDD Due to load current change Due to powering down (per channel) 1 0.5 V pF Ω 100 kΩ DAC in Power Down mode Output impedance tolerance ± 20Ω 1 kΩ Output impedance tolerance ± 400Ω 60 45 4.5 -92 -67 mA mA μs dB dB DAC = full scale, o/p shorted to Gnd DAC = zero scale, o/p shorted to VDD Coming out of power-down mode VDD = 5 V VDD±10%, DAC = full scale Output frequency = 10Khz VDD 50 V μA KΩ Per DAC channel VREF = VDD = 5.5 V Per DAC channel ±3 μA All digital inputs 2.2 30 120 RL = 2 kΩ, RL = 100 kΩ and RL = ∞ Rev. PrB | Page 3 of 33 AD5025/45/65 Preliminary Technical Data B Grade1 Parameter Input Low Voltage, VINL Input High Voltage, VINH Pin Capacitance LOGIC OUTPUTS (SDO)3 Output Low Voltage, VOL Output High Voltage, VOH High Impedance Leakage Current High Impedance Output Capacitance POWER REQUIREMENTS VDD IDD (Normal Mode)5 VDD = 4.5 V to 5.5 V IDD (All Power-Down Modes)6 VDD = 4.5 V to 5.5 V Min Typ Max 0.8 Unit V V pF Conditions/Comments VDD = 5 V VDD = 5 V 0.4 V ISINK = 2 mA ISOURCE = 2 mA ±0.25 μA 2 4 VDD − 1 2 2.7 pF 5.5 V 3.2 4 mA 0.4 1 μA All digital inputs at 0 or VDD DAC active, excludes load current VIH = VDD and VIL = GND VIH = VDD and VIL = GND 11 Temperature range is −40°C to +105°C, typical at 25°C. Linearity calculated using a reduced code range of 512 to 65,024. Output unloaded. Guaranteed by design and characterization; not production tested. 4 Total current flowing into all pins. 5 . Interface inactive. All DACs active. DAC outputs unloaded 6 . All four DACs powered down 2 3 Rev. PrB | Page 4 of 33 Preliminary Technical Data AD5025/45/65 AC CHARACTERISTICS VDD = 2.7 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND, VREFIN =4.096V unless otherwise specified . All specifications TMIN to TMAX, unless otherwise noted. Table 3. Parameter1, 2 Output Voltage Settling Time Min Typ 5 Max Unit μs Output Voltage Settling Time 14 μs Slew Rate Digital-to-Analog Glitch Impulse Reference Feedthrough SDO Feedthrough Digital Feedthrough Digital Crosstalk Analog Crosstalk DAC-to-DAC Crosstalk AC Crosstalk AC PSRR Multiplying Bandwidth Total Harmonic Distortion Output Noise Spectral Density 1.5 4 −90 3 0.1 0.5 6 6.5 6 TBD 340 −80 64 60 6 V/μs nV-s dB nV-s nV-s nV-s nV-s nV-s nV-s Output Noise kHz dB nV/√Hz nV/√Hz μV p-p Conditions/Comments3 ¼ to ¾ scale settling to ±1 LSB,RL = 5kΩ single channel update including DAC calibration sequence ¼ to ¾ scale settling to ±1 LSB,RL = 5kΩ all channel update including DAC calibration sequence 1 LSB change around major carry VREF = 2 V ± 0.1 V p-p, frequency = 10 Hz to 20 MHz Daisy-chain mode; SDO load is 10 pF VREF = 2 V ± 0.2 V p-p VREF = 2 V ± 0.1 V p-p, frequency = 10 kHz DAC code = 0x8400, 1 kHz DAC code = 0x8400, 10 kHz 0.1 Hz to 10 Hz 1 Guaranteed by design and characterization; not production tested. See the Terminology section. 3 Temperature range is −40°C to + 105°C, typical at 25°C. 2 Rev. PrB | Page 5 of 33 AD5025/45/65 Preliminary Technical Data TIMING CHARACTERISTICS All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. See Figure 3 and Figure 5. VDD = 2.7 V to 5.5 V. All specifications TMIN to TMAX, unless otherwise noted. Table 4. Parameter t11 t2 t3 t4 t5 t6 t7 t8 t8 t9 t10 t11 t12 t13 t14 t15 t162, 3 t173 t183 t193 t20 Limit at TMIN, TMAX VDD = 2.7 V to 5.5 V 20 10 10 16.5 5 5 0 1.9 10.5 16.5 0 20 20 10 10 10.6 22 5 8 0 20 Unit ns min ns min ns min ns min ns min ns min ns min us min us min ns min ns min ns min ns min ns min ns min us min ns max ns min ns min ns min ns min Conditions/Comments SCLK cycle time SCLK high time SCLK low time SYNC to SCLK falling edge set-up time Data set-up time Data hold time SCLK falling edge to SYNC rising edge Minimum SYNC high time (single channel update) Minimum SYNC high time ( all channel update) SYNC rising edge to SCLK fall ignore SCLK falling edge to SYNC fall ignore LDAC pulse width low SCLK falling edge to LDAC rising edge CLR pulse width low SCLK falling edge to LDAC falling edge CLR pulse activation time SCLK rising edge to SDO valid SCLK falling edge to SYNC rising edge SYNC rising edge to SCLK rising edge SYNC rising edge to LDAC falling edge PDL pulse width activation time 1 Maximum SCLK frequency is 50 MHz at VDD = 2.7 V to 5.5 V. Guaranteed by design and characterization; not production tested. Measured with the load circuit of Figure 16. t16 determines the maximum SCLK frequency in daisy-chain mode. 3 Daisy-chain mode only. 2 2mA VOH (MIN) CL 50pF 2mA IOH 05298-002 TO OUTPUT PIN IOL Figure 2. Load Circuit for Digital Output (SDO) Timing Specifications Rev. PrB | Page 6 of 33 Preliminary Technical Data AD5025/45/65 Figure 3. Serial Write Operation t1 SCLK 32 t7 t3 t4 64 t18 t2 t17 SYNC t8 DIN t9 DB31 DB0 DB0 DB31 INPUT WORD FOR DAC N + 1 INPUT WORD FOR DAC N t16 DB0 DB31 SDO UNDEFINED INPUT WORD FOR DAC N t11 05298-004 LDAC t19 Figure 4. Daisy-Chain Timing Diagram Rev. PrB | Page 7 of 33 AD5025/45/65 Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 5. Parameter VDD to GND Digital Input Voltage to GND VOUT to GND VREF to GND Operating Temperature Range Industrial Storage Temperature Range Junction Temperature (TJ MAX) TSSOP Package Power Dissipation θJA Thermal Impedance Reflow Soldering Peak Temperature SnPb Pb Free Rating −0.3 V to +7 V −0.3 V to VDD + 0.3 V −0.3 V to VDD + 0.3 V −0.3 V to VDD + 0.3 V −40°C to +125°C −65°C to +150°C +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (TJ MAX − TA)/θJA 150.4°C/W 240°C 260°C ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. PrB | Page 8 of 33 Preliminary Technical Data AD5025/45/65 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS LDAC 1 14 SYNC 2 13 DIN 12 PDL 3 VrefA 4 VOUTA 5 AD5065/45/35 TOP VIEW (Not to Scale) 11 GND 10 VOUTB POR 6 9 VrefB SDO 8 CLR 7 0000-006 VDD SCLK Figure 5. 14-Lead TSSOP (RU-14) Table 6. Pin Function Descriptions Pin No. 1 Mnemonic LDAC 2 SYNC 3 VDD 4 5 6 VREFA VOUTA POR 7 SDO 8 CLR 9 10 11 12 VREFB VOUTB GND PDL 13 DIN 14 SCLK Description Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data. This allows all DAC outputs to simultaneously update. Alternatively, this pin can be tied permanently low. Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is transferred in on the falling edges of the next 32 clocks. If SYNC is taken high before the 32nd falling edge, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the device. Power Supply Input. These parts can be operated from 2.7 V to 5.5 V, and the supply should be decoupled with a 10 μF capacitor in parallel with a 0.1 μF capacitor to GND. Dac A reference input .This is the reference voltage input pin for Dac A. Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation. Power-on Reset Pin. Tying this pin to GND powers up the part to 0 V. Tying this pin to VDD powers up the part to midscale. Serial Data Output. Can be used for daisy-chaining a number of these devices together or for reading back the data in the shift register for diagnostic purposes. The serial data is transferred on the rising edge of SCLK and is valid on the falling edge of the clock. Asynchronous Clear Input. The CLR input is falling edge sensitive. When CLR is low, all LDAC pulses are ignored. When CLR is activated, the input register and the DAC register are updated with the data contained in the CLR code register—zero, midscale, or full scale. Default setting clears the output to 0 V. Dac B reference input .This is the reference voltage input pin for Dac B. Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation. Ground Reference Point for All Circuitry on the Part. The PDL pin is used to ensure hardware shutdown lockout of the device under any circumstance. A Logic 1 at the PLO pin will cause the device to behave as normal. The user may successfully enter software power down over the serial interface while logic 1 is applied to the PDL pin. If a logic 0 is applied to this pin, it will ensure that the device cannot enter software power down under any circumstances. If the device had previously been placed in software power down mode, a high to low transition at the PDL pin will cause the DAC(s) to exit power down and the output the last code in the dac register before the device entered software power down. Serial Data Input. This device has a 32-bit shift register. Data is clocked into the register on the falling edge of the serial clock input. Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be transferred at rates of up to 50 MHz. Rev. PrB | Page 9 of 33 AD5025/45/65 Preliminary Technical Data TYPICAL PERFORMANCE CHARACTERISTICS TBD Figure 6. INL TBD Figure 7. DNL TBD Figure 8. TUE Rev. PrB | Page 10 of 33 Preliminary Technical Data AD5025/45/65 TBD Figure 9. INL vs. Reference Input Voltag TBD Figure 10. DNL vs. Reference Input Voltage TBD Figure 11. TUE vs. Reference Input Voltage Rev. PrB | Page 11 of 33 AD5025/45/65 Preliminary Technical Data TBD Figure 12. Gain Error and Full-Scale Error vs. Temperature TBD Figure 13. Offset Error vs. Temperature TBD Figure 14. Gain Error and Full-Scale Error vs. Supply Voltage Rev. PrB | Page 12 of 33 Preliminary Technical Data AD5025/45/65 TBD Figure 15. Zero-Scale Error and Offset Error vs. Supply Voltage TBD Figure 16. IDD Histogram VDD = 3.0 V TBD Figure 17. IDD Histogram VDD = 5.0 V Rev. PrB | Page 13 of 33 AD5025/45/65 Preliminary Technical Data Figure 18. Headroom at Rails vs. Source and Sink TBD Figure 19. Source and Sink Current Capability with VDD = 3 V TBD Figure 20. Source and Sink Current Capability with VDD = 5 V Rev. PrB | Page 14 of 33 Preliminary Technical Data AD5025/45/65 TBD Figure 21. Supply Current vs. Code TBD Figure 22. Supply Current vs. Temperature TBD Figure 23. Supply Current vs. Supply Voltage Rev. PrB | Page 15 of 33 AD5025/45/65 Preliminary Technical Data Figure 24. Supply Current vs. Logic Input Voltage Figure 25. Full-Scale Settling Time TBD Figure 26. Power-On Reset to 0 V Rev. PrB | Page 16 of 33 Preliminary Technical Data AD5025/45/65 TBD Figure 27. Power-On Reset to Midscale TBD Figure 28. Exiting Power-Down to Midscale TBD Figure 29. Digital-to-Analog Glitch Impulse (See Figure 34) Rev. PrB | Page 17 of 33 AD5025/45/65 Preliminary Technical Data TBD Figure 30. Analog Crosstalk TBD Figure 31. DAC-to-DAC Crosstalk TBD Figure 32. 0.1 Hz to 10 Hz Output Noise Plot Rev. PrB | Page 18 of 33 Preliminary Technical Data AD5025/45/65 TBD Figure 33. Typical Supply Current vs. Frequency @ 5.5 V1 TBD Figure 34. Digital-to-Analog Glitch Energy TBD Figure 35. Noise Spectral Density, Internal Reference Rev. PrB | Page 19 of 33 AD5025/45/65 Preliminary Technical Data TBD Figure 36. Total Harmonic Distortion TBD Figure 37. Settling Time vs. Capacitive Load TBD Figure 38. Hardware CLR TBD Figure 39. Multiplying Bandwidth Rev. PrB | Page 20 of 33 Preliminary Technical Data AD5025/45/65 TBD Figure 40.Typical output slew rate Rev. PrB | Page 21 of 33 AD5025/45/65 Preliminary Technical Data THEORY OF OPERATION D/A SECTION OUTPUT AMPLIFIER The AD5025/45/65 are single 12-/14 and 16-bit, serial input, voltage output DACs. The parts operate from supply voltages of 2.7 V to 5.5 V. Data is written to the AD5025/45/65 in a 32-bit word format via a 3-wire serial interface. The AD5025/45 and AD5065 incorporate a power-on reset circuit that ensures the DAC output powers up to a known out-put state (midscale or zero-scale, see the Ordering Guide). The devices also have a software power-down mode that reduces the typical current consumption to less than 1 μa. The output buffer amplifier can generate rail-to-rail voltages on its output, which gives an output range of 0 V to VDD. The amplifier is capable of driving a load of 2 kΩ in parallel with 1,000 pF to GND. The source and sink capabilities of the output amplifier can be seen in (TBD) and (TBD). The slew rate is 1.5 V/μs with a ¼ to ¾ scale settling time of 10 μs. Because the input coding to the DAC is straight binary, the ideal output voltage when using an external reference is given by The AD5025/45/65 has a 3-wire serial interface (SYNC, SCLK, and DIN) that is compatible with SPI, QSPI, and MICROWIRE interface standards as well as most DSPs. See Figure 3 for a timing diagram of a typical write sequence. D VOUT = VREFIN × ⎛⎜ N ⎞⎟ 2 ⎝ ⎠ SERIAL INTERFACE STANDALONE MODE The ideal output voltage when using and internal reference is given by D VOUT = 2×V REFOUT × ⎛⎜ N ⎞⎟ ⎝ 2 ⎠ where: D = decimal equivalent of the binary code that is loaded to the DAC register. 0 to 65,535 for AD5065 (16 bits).N = the DAC resolution. DAC ARCHITECTURE The DAC architecture of the AD5065 consists of two matched DAC sections. A simplified circuit diagram is shown in Figure 41. The four MSBs of the 16-bit data word are decoded to drive 15 switches, E1 to E15. Each of these switches connects one of 15 matched resistors to either GND or VREF buffer output. The remaining 12 bits of the data word drive switches S0 to S11 of a 12-bit voltage mode R-2R ladder network. The write sequence begins by bringing the SYNC line low. Data from the DIN line is clocked into the 32-bit shift register on the falling edge of SCLK. The serial clock frequency can be as high as 50 MHz, making the AD5025/45/65 compatible with high speed DSPs. On the 32nd falling clock edge, the last data bit is clocked in and the programmed function is executed, that is, a change in DAC register contents and/or a change in the mode of operation. At this stage, the SYNC line can be kept low or be brought high. In either case, it must be brought high for a minimum of 15 ns before the next write sequence so that a falling edge of SYNC can initiate the next write sequence. Because the SYNC buffer draws more current when VIN = 2 V than it does when VIN = 0.8 V, SYNC should be idled low between write sequences for even lower power operation of the part. As is mentioned previously, however, SYNC must be brought high again just before the next write sequence. VOUT 2R 2R 2R 2R 2R 2R 2R S0 S1 S11 E1 E2 E15 Table 7. Command Definitions 12-BIT R-2R LADDER FOUR MSBs DECODED INTO 15 EQUAL SEGMENTS 047762-027 VREF C3 0 0 0 Command C2 C1 0 0 0 0 0 1 C0 0 1 0 Figure 42. Dac Ladder Structure REFERENCE BUFFER The AD5025/45 and AD5065 operate with an external reference. Each of the two onboard dac’s will have a dedicated voltage reference pin. In either case the reference input pin has an input range of 2 V to VDD. This input voltage is then used to provide a buffered reference for the DAC core. 0 0 0 0 0 1 1 1 Rev. PrB | Page 22 of 33 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 1 Description Write to Input Register n Update DAC Register n Write to Input Register n, update all (software LDAC) Write to and update DAC Channel n Power down/power up DAC Load clear code register Load LDAC register Reset (power-on reset) Set up DCEN register (Daisy chain enable) Set up DIO direction and Value Reserved Preliminary Technical Data AD5025/45/65 Table 8. Address Commands Address (n) A3 0 0 0 0 1 A2 0 0 0 0 1 A1 0 0 1 1 1 A0 0 1 0 1 1 Selected DAC Channel DAC A DAC B Reserved Reserved All DACs Rev. PrB | Page 23 of 33 AD5025/45/65 Preliminary Technical Data INPUT SHIFT REGISTER SYNC INTERRUPT The AD5025/45/65 input shift register is 32 bits wide (see Figure 43). The first four bits are don’t cares. The next four bits are the command bits, C3 to C0 (see Table 8), followed by the 4 bit DAC address bits, A3 to A0 (see Table 9) and finally the bit data-word. The data-word comprises either 12-/14 or 16-bit input code followed by 8-/6 or 4 don’t care bits for the AD5025/45/65 (see Figure 43). These data bits are transferred to the DAC register on the 32nd falling edge of SCLK. In a normal write sequence, the SYNC line is kept low for at least 32 falling edges of SCLK, and the DAC is updated on the 32nd falling edge. However, if SYNC is brought high before the 32nd falling edge, this acts as an interrupt to the write sequence. The shift register is reset, and the write sequence is seen as invalid. Neither an update of the DAC register contents nor a change in the operating mode occurs (see Figure 46). DB31 (MSB) X DB0 (LSB) X X X C3 C2 C1 C0 A3 A2 A1 A0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X COMMAND BITS 05298-025 DATA BITS ADDRESS BITS Figure 43. AD5065 Input Register Content DB31 (MSB) X X DB0 (LSB) X X C3 C2 C1 C0 A3 A2 A1 A0 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X COMMAND BITS 05298-025 DATA BITS ADDRESS BITS Figure 44. AD5045 Input Register Content DB31 (MSB) X X X C3 C2 C1 C0 A3 A2 A1 A0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X X X COMMAND BITS 05298-025 DATA BITS ADDRESS BITS Figure 45. AD5025 Input Register Content SCLK SYNC DIN DB31 DB0 INVALID WRITE SEQUENCE: SYNC HIGH BEFORE 32ND FALLING EDGE DB31 DB0 VALID WRITE SEQUENCE, OUTPUT UPDATES ON THE 32ND FALLING EDGE Figure 46. SYNC Interrupt Facility Rev. PrB | Page 24 of 33 05298-026 X DB0 (LSB) Preliminary Technical Data AD5025/45/65 2. If a PDL is generated, whilst the DAC(s) are in power down mode, then the DAC (s) will come out of power down ( i.e. all power down registers get reset to 0000 ) to the last valid stored DAC value. As long, as PDL remains active software power down is disabled. DAISY-CHAINING For systems that contain several DACs, or where the user wishes to read back the DAC contents for diagnostic purposes, the SDO pin can be used to daisy-chain several devices together and provide serial read-back. 3. After the PDL is taken from a low to a high state, then all DAC channels will remain in normal mode and the user will have to re-issue a software power down command to the control register in order to power down the required channels.. The daisy-chain mode is enabled through a software executable DCEN (Daisy Chain Enable) command. Command 1000 is reserved for this DCEN function (see Table 7). The daisy-chain mode is enabled by setting a bit (DB1) in the DCEN register. The default setting is standalone mode, where Bit DCEN = 0. Table 9 shows how the state of the bits corresponds to the mode of operation of the device. 4. Transitioning the PDL from a low to a high will disable the feature immediately. 5. if PLO and CLR are generated at the same time, then CLR signal will cause the dac register to change as per the Clear Content Register and then DACs will come out of Power Down. The SCLK is continuously applied to the input shift register when SYNC is low. If more than 32 clock pulses are applied, the data ripples out of the shift register and appears on the SDO line. This data is clocked out on the rising edge of SCLK and is valid on the falling edge. By connecting this line to the DIN input on the next DAC in the chain, a multi-DAC interface is constructed. Each DAC in the system requires 32 clock pulses; therefore, the total number of clock cycles must equal 32N, where N is the total number of devices in the chain. When the serial transfer to all devices is complete, SYNC is taken high. This prevents any further data from being clocked into the input shift register. If SYNC is taken high before 32 clocks are clocked into the part, it is considered an invalid frame and the data is discarded. The serial clock can be continuous or a gated clock. A continuous SCLK source can be used only if the SYNC can be held low for the correct number of clock cycles. In gated clock mode, a burst clock containing the exact number of clock cycles must be used, and SYNC must be taken high after the final clock to latch the data. POWER DOWN LOCKOUT The AD5025/45/65 contains a 1-bit digital input pin PDL. When activated, the power down lock out pin (PDL) disables software shutdown under any circumstances The user should hardwire the PDL pin to a logic low ( thus preventing subsequent software power down) or logic high (the part can be placed in power down mode over the serial interface). Should the user decide to transition the PDL pin from logic high to a logic low during a valid write sequence, the device will respond immediately and the current write sequence will be aborted. Points to note about the PDL feature is that 1. if a PDL is generated ( i.e. a high to low transition) while a valid write sequence is ongoing then the write will be aborted. The user will need to re write the current write command again. 6. ifPLO, CLR and LDAC are generated at same time then CLR will have higher precedence over LDAC and PLO this case will be same as case 2 mentioned above. 7. The user is recommended to hardwire the pin to a logic high or low thereby either enabling or disabling the feature. POWER-ON RESET The AD5025/45/65 contains a power-on reset circuit that controls the output voltage during power-up. By connecting the POR pin low, the AD5025/45/65 output powers up to 0 V; by connecting the POR pin high, the AD5025/45/65 output powers up to mid-scale. The output remains powered up at this level until a valid write sequence is made to the DAC. This is useful in applications where it is important to know the state of the output of the DAC while it is in the process of powering up. There is also a software executable reset function that resets the DAC to the power-on reset code. Command 0111 is reserved for this reset function (see Table 7). Any events on LDAC or CLR during power-on reset are ignored. POWER-DOWN MODES The AD5025/45/65 contains four separate modes of operation. Command 0100 is reserved for the power-down function (see Table 7). These modes are software-programmable by setting two bits, Bit DB9 and Bit DB8, in the control register (refer to Table 12). Table 11 shows how the state of the bits corresponds to the mode of operation of the device. Any or all DACs (DAC A and DAC B) can be powered down to the selected mode by setting the corresponding four bits (DB3, DB2, DB1, DB0) to 1. See Table 12 for the contents of the input shift register during power-down/power-up operation. Rev. PrB | Page 25 of 33 AD5025/45/65 Preliminary Technical Data When both Bit DB9 and Bit DB8, in the control register are set to 0, the part works normally with its normal power consumption of TBD at 5 V. However, for the three power-down modes, the supply current falls to TBD at 5 V (TBD at 3 V). Not only does the supply current fall, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output impedance of the part is known while the part is in powerdown mode. There are three different options. The output is connected internally to GND through either a 1 kΩ or a 100 kΩ resistor, or it is left open-circuited (three-state). The output stage is illustrated in Figure 47. The bias generator, output amplifier, resistor string, and other associated linear circuitry are shut down when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power-down. The time to exit power-down is typically 2.5 μs for VDD = 5 V and VDD = 3 V (see Figure 28). Any combination of DACs can be powered up by setting PD1 and PD0 to 0 (normal operation). The output powers up to the value in the input register (LDAC Low) or to the value in the DAC register before powering down (LDAC high). Rev. PrB | Page 26 of 33 Preliminary Technical Data AD5025/45/65 Table 9. DCEN (Daisy-Chain Enable) Register (DB1) 0 1 (DB0) 0 0 Action Standalone mode (default) DCEN mode Table 10. 32-Bit Input Shift Register Contents for Daisy-Chain Enable and Reference Set-Up Function MSB DB31 to DB28 X Don’t cares DB27 DB26 DB25 DB24 1 0 0 0 Command bits (C3 to C0) DB23 X DB22 DB21 DB20 X X X Address bits (A3 to A0) DB2 to DB19 X Don’t cares LSB DB1 DB0 1/0 1/0 DCEN register Table 11. Modes of Operation DB9 0 DB8 0 0 1 1 1 0 1 Operating Mode Normal operation Power-down modes 1 kΩ to GND 100 kΩ to GND Three-state Table 12. 32-Bit Input Shift Register Contents for Power-Up/Power-Down Function MSB DB31 to DB28 X Don’t cares LSB DB27 0 DB26 1 DB25 0 DB24 0 Command bits (C2 to C0) DB23 X DB22 X DB21 X DB20 X Address bits (A3 to A0)— don’t cares DB10 to DB19 X Don’t cares DB9 PD1 DB8 PD0 Power-down mode Figure 47. Output Stage During Power-Down Rev. PrB | Page 27 of 33 DB4 to DB7 X DB3 DB2 X X Don’t cares Power-down/power-up channel selection— set bit to 1 to select DB1 DAC B DB0 DAC A AD5025/45/65 Preliminary Technical Data CLEAR CODE REGISTER The AD5025/45/65 has a hardware CLR pin that is an asynchronous clear input. The CLR input is falling edge sensitive. Bringing the CLR line low clears the contents of the input register and the DAC registers to the data contained in the user-configurable CLR register and sets the analog outputs accordingly. (see Table 13) This function can be used in system calibration to load zero scale, midscale, or full scale to all channels together. These clear code values are userprogrammable by setting two bits, Bit DB1 and Bit DB0, in the control register (see Table 13). The default setting clears the outputs to 0 V. Command 0101 is reserved for loading the clear code register (see Table 7). The part exits clear code mode on the 32nd falling edge of the next write to the part. If CLR is activated during a write sequence, the write is aborted. The CLR pulse activation time—the falling edge of CLR to when the output starts to change—is typically TBD ns. However, if outside the DAC linear region, it typically takes TBD ns after executing CLR for the output to start changing (see Figure 38). See Table 14 for contents of the input shift register during the loading clear code register operation LDAC FUNCTION The outputs of all DACs can be updated simultaneously using the hardware LDAC pin. Synchronous LDAC: After new data is read, the DAC registers are updated on the falling edge of the 32nd SCLK pulse. LDAC can be permanently low or pulsed as in Figure 3 Asynchronous LDAC: The outputs are not updated at the same time that the input registers are written to. When LDAC goes low, the DAC registers are updated with the contents of the input register. Alternatively, the outputs of all DACs can be updated simultaneously using the software LDAC function by writing to Input Register n and updating all DAC registers. Command 0010 is reserved for this software LDAC function. An LDAC register gives the user extra flexibility and control over the hardware LDAC pin. This register allows the user to select which combination of channels to simultaneously update when the hardware LDAC pin is executed. Setting the LDAC bit register to 0 for a DAC channel means that this channel’s update is controlled by the LDAC pin. If this bit is set to 1, this channel updates synchronously; that is, the DAC register is updated after new data is read, regardless of the state of the LDAC pin. It effectively sees the LDAC pin as being tied low. (See Table 15 for the LDAC register mode of operation.) This flexibility is useful in applications where the user wants to simultaneously update select channels while the rest of the channels are synchronously updating. Writing to the DAC using command 0110 loads the 4-bit LDAC register (DB3 to DB0). The default for each channel is 0; that is, the LDAC pin works normally. Setting the bits to 1 means the DAC channel is updated regardless of the state of the LDAC pin. See Table 16 for the contents of the input shift register during the load LDAC register mode of operation. POWER SUPPLY BYPASSING AND GROUNDING When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The printed circuit board containing the AD5666 should have separate analog and digital sections. If the AD5666 is in a system where other devices require an AGND-to-DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD5025/45/65. The power supply to the AD5025/45/65 should be bypassed with 10 μF and 0.1 μF capacitors. The capacitors should physically be as close as possible to the device, with the 0.1 μF capacitor ideally right up against the device. The 10 μF capacitors are the tantalum bead type. It is important that the 0.1 μF capacitor has low effective series resistance (ESR) and low effective series inductance (ESI), such as is typical of common ceramic types of capacitors. This 0.1 μF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching. The power supply line should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects through the board. The best board layout technique is the microstrip technique, where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a 2-layer board. Rev. PrB | Page 28 of 33 Preliminary Technical Data AD5025/45/65 Table 13. Clear Code Register DB1 CR1 0 0 1 1 Clear Code Register DB0 CR0 0 1 0 1 Clears to Code 0x0000 0x8000 0xFFFF No operation Table 14. 32-Bit Input Shift Register Contents for Clear Code Function MSB DB31 to DB28 X Don’t cares DB27 DB26 DB25 DB24 0 1 0 1 Command bits (C3 to C0) DB23 X DB22 DB21 DB20 X X X Address bits (A3 to A0) DB2 to DB19 X Don’t cares LSB DB1 DB0 1/0 1/0 Clear code register (CR1 to CR0) Table 15. LDAC Overwrite Definition Load DAC Register LDAC Bits (DB3 to DB0) LDAC Pin LDAC Operation 0 1 Determined by LDAC pin DAC channels update, overrides the LDAC pin. DAC channels see LDAC as 0. 1/0 X—don’t care Table 16. 32-Bit Input Shift Register Contents for LDAC Overwrite Function MSB DB31 to DB28 X Don’t cares LSB DB27 0 DB26 DB25 DB24 1 1 0 Command bits (C3 to C0) DB23 DB22 DB21 X X X Address bits (A3 to A0)— don’t cares DB20 X Rev. PrB | Page 29 of 33 DB4 to DB19 X Don’t cares DB3 X DB2 DB1 DB0 X DAC B DAC A Setting LDAC bit to 1 override LDAC pin AD5025/45/65 Preliminary Technical Data serial write operation is performed to the DAC. PC7 is taken high at the end of this procedure. AD5025/45/65 to Blackfin® ADSP-BF53X Interface Figure 48 shows a serial interface between the AD5025/45/65 and the Blackfin ADSP-BF53X microprocessor. The ADSP BF53X processor family incorporates two dual-channel synchronous serial ports, SPORT1 and SPORT0, for serial and multiprocessor communications. Using SPORT0 to connect to the AD5025/45/65, the setup for the interface is as follows: DT0PRI drives the DIN pin of the AD5025/45/65, while TSCLK0 drives the SCLK of the parts. The SYNC is driven from TFS0. DTOPRI DIN TSCLK0 SCLK 1ADDITIONAL 1 SYNC PINS OMITTED FOR CLARITY. 80C51/80L511 Figure 48. AD5025/45/65 to Blackfin ADSP-BF53X Interface AD5065/ AD5045/ AD5025 1 AD5025/45/65 to 68HC11/68L11 Interface P3.3 SYNC Figure 49 shows a serial interface between the AD5025/45/65 and the 68HC11/68L11 microcontroller. SCK of the 68HC11/68L11 drives the SCLK of the AD5025/45/65, and the MOSI output drives the serial data line of the DAC. TxD SCLK RxD DIN 1ADDITIONAL PC7 SYNC SCK SCLK MOSI PINS OMITTED FOR CLARITY. Figure 50. AD5025/45/65 to 80C512/80L51 Interface 1 AD5025/45/65 to MICROWIRE Interface Figure 51 shows an interface between the AD5025/45/65 and any MICROWIRE-compatible device. Serial data is shifted out on the falling edge of the serial clock and is clocked into the AD5025/45/65 on the rising edge of the SCLK. DIN 1ADDITIONAL PINS OMITTED FOR CLARITY. 0000-050 68HC11/68L111 AD5065/ AD5045/ AD5025/ MICROWIRE1 Figure 49. AD5025/45/65 to 68HC11/68L11 Interface The SYNC signal is derived from a port line (PC7). The setup conditions for correct operation of this interface are as follows: The 68HC11/68L11 is configured with its CPOL bit as 0, and its CPHA bit as 1. When data is being transmitted to the DAC, the SYNC line is taken low (PC7). When the 68HC11/ 68L11 is configured as described previously, data appearing on the MOSI output is valid on the falling edge of SCK. Serial data from the 68HC11/68L11 is transmitted in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. Data is transmitted MSB first. To load data to the AD5025/45/65, PC7 is left low after the first eight bits are transferred, and a second Rev. PrB | Page 30 of 33 AD5065/ AD5045/ AD5025 CS SYNC SK DIN SO SCLK 1 1ADDITIONAL PINS OMITT ED FOR CLARITY. Figure 51. AD5025/45/654 to MICROWIRE Interface 0000-049 TFS0 AD5065/ AD5045/ AD5025 Figure 50 shows a serial interface between the AD5024/44/64 and the 80C51/80L51 microcontroller. The setup for the interface is as follows: TxD of the 80C51/ 80L51 drives SCLK of the AD5025/45/65, and RxD drives the serial data line of the part. The SYNC signal is again derived from a bit-programmable pin on the port. In this case, Port Line P3.3 is used. When data is to be transmitted to the AD5025/45/65, P3.3 is taken low. The 80C51/80L51 transmit data in 8-bit bytes only; thus, only eight falling clock edges occur in the transmit cycle. To load data to the DAC, P3.3 is left low after the first eight bits are transmitted, and a second write cycle is initiated to transmit the second byte of data. P3.3 is taken high following the completion of this cycle. The 80C51/80L51 output the serial data in a format that has the LSB first. The AD5025/45/65 must receive data with the MSB first. The 80C51/80L51 transmit routine should take this into account. 0000-049 ADSP-BF53x1 AD5024/44/64 to 80C51/80L51 Interface 0000-052 MICROPROCESSOR INTERFACING Preliminary Technical Data AD5025/45/65 APPLICATIONS USING A REFERENCE AS A POWER SUPPLY FOR THE AD5025/45/65 This is an output voltage range of ±5 V, with 0x0000 corresponding to a −5 V output, and 0xFFFF corresponding to a +5 V output. Because the supply current required by the AD5025/45/65 is extremely low, an alternative option is to use a voltage reference to supply the required voltage to the parts (see Figure 52). This is especially useful if the power supply is quite noisy or if the system supply voltages are at some value other than 5 V or 3 V, for example, 15 V. The voltage reference outputs a steady supply voltage for the AD5025, AD5045 and AD5065. If the low dropout REF195 is used, it must supply 500 μA of current to the AD5025/ AD5045 / AD5065, with no load on the output of the DAC. When the DAC output is loaded, the REF195 also needs to supply the current to the load. The total current required (with a 5 kΩ load on the DAC output) is R2 = 10kΩ +5V +5V R1 = 10kΩ AD820/ OP295 VDD 10µF SCLK 5V VDD AD5065/ AD5045/ AD5025 VOUT = 0V TO 5V 0000-053 DIN 0000-053 USING THE AD5025/45/65 WITH A GALVANICALLY ISOLATED INTERFACE 15V SYNC –5V Figure 53. Bipolar Operation with the AD5025/45/65 The load regulation of the REF195 is typically 2 ppm/mA, which results in a 3 ppm (15 μV) error for the 1.5 mA current drawn from it. This corresponds to a 0.196 LSB error. THREE-WIRE SERIAL INTERFACE AD5025/45/65 THREE-WIRE SERIAL INTERFACE 500 μA + (5 V/5 kΩ) = 1.5 mA REF195 0.1µF ±5V VOUT In process control applications in industrial environments, it is often necessary to use a galvanically isolated interface to protect and isolate the controlling circuitry from any hazardous common-mode voltages that can occur in the area where the DAC is functioning. iCoupler® provides isolation in excess of 2.5 kV. The AD5025/45/65 uses a 3-wire serial logic interface, so the ADuM1300 three-channel digital isolator provides the required isolation (see Figure 54). The power supply to the part also needs to be isolated, which is done by using a transformer. On the DAC side of the transformer, a 5 V regulator provides the 5 V supply required for the AD5025/45/65. Figure 52. REF195 as Power Supply to the AD5025/45/65 5V REGULATOR BIPOLAR OPERATION USING THE AD5025/45/65 The AD5025/45/65 has been designed for single-supply operation, but a bipolar output range is also possible using the circuit in Figure 53. The circuit gives an output voltage range of ±5 V. Rail-to-rail operation at the amplifier output is achievable using an AD820 or an OP295 as the output amplifier. The output voltage for any input code can be calculated as follows: ⎡ ⎛ D ⎞ ⎛ R1 + R2 ⎞ ⎛ R2 ⎞⎤ VO = ⎢VDD × ⎜ ⎟×⎜ ⎟ − VDD × ⎜ ⎟⎥ R1 65,536 ⎝ ⎠ ⎝ R1 ⎠⎦ ⎝ ⎠ ⎣ 10µF POWER SCLK VIA VOA ADuM1300 SCLK 0.1µF VDD AD5025/45/65 SDI VIB VOB SYNC DATA VIC VOC DIN VOUT GND 0000-055 where D represents the input code in decimal (0 to 65,535). With VDD = 5 V, R1 = R2 = 10 kΩ, Figure 54. AD5025/45/65 with a Galvanically Isolated Interface ⎛ 10 × D ⎞ VO = ⎜ ⎟ −5V ⎝ 65,536 ⎠ Rev. PrB | Page 31 of 33 AD5025/45/65 Preliminary Technical Data OUTLINE DIMENSIONS 5.10 5.00 4.90 14 8 4.50 4.40 4.30 6.40 BSC 1 7 PIN 1 0.65 BSC 1.05 1.00 0.80 0.20 0.09 1.20 MAX 0.15 0.05 0.30 0.19 SEATING COPLANARITY PLANE 0.10 0.75 0.60 0.45 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AB-1 Figure 55. 14-Lead Thin Shrink Small Outline Package [TSSOP] (RU-14) Dimensions shown in millimeters 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 PIN 1 1.20 MAX 0.15 0.05 0.65 BSC 0.30 0.19 COPLANARITY 0.10 0.20 0.09 SEATING PLANE 8° 0° COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 56. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters Rev. PrB | Page 32 of 33 0.75 0.60 0.45 Preliminary Technical Data AD5025/45/65 ORDERING GUIDE Model AD5065BRUZ-11 AD5065BRUZ-1REEL71 AD5045BRUZ1 AD5045BRUZ-REEL71 AD5025BRUZ1 AD5025BRUZ-REEL71 Eval-AD5065 EBZ1 Eval-AD5045 EBZ1 Eval-AD5025 EBZ1 1 Temperature Range −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C Package Description 14-Lead TSSOP 14-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP Evaluation board Evaluation board Evaluation board Package Option RU-14 RU-14 RU-16 RU-16 RU-16 RU-16 Z = Pb-free part. ©2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06844-0-6/07(PrB) Rev. PrB | Page 33 of 33 Power-On Reset to Code Zero Zero Zero Zero Zero Zero Accuracy ±1 LSB INL ±1 LSB INL ±1 LSB INL ±1 LSB INL ±1 LSB INL ±1 LSB INL Resolution 16 bits 16 bits 14 bits 14 bits 12 bits 12 bits