2.5 V to 5.5 V, 230 μA, Dual Rail-to-Rail, Voltage Output 8-/10-/12-Bit DACs AD5302/AD5312/AD5322 FEATURES GENERAL DESCRIPTION AD5302: Two 8-bit buffered DACs in 1 package A version: ±1 LSB INL, B version: ±0.5 LSB INL AD5312: Two 10-bit buffered DACs in 1 package A version: ±4 LSB INL, B version: ±2 LSB INL AD5322: Two 12-bit buffered DACs in 1 package A version: ±16 LSB INL, B version: ±8 LSB INL 10-lead MSOP Micropower operation: 300 μA @ 5 V (including reference current) Power-down to 200 nA @ 5 V, 50 nA @ 3 V 2.5 V to 5.5 V power supply Double-buffered input logic Guaranteed monotonic by design over all codes Buffered/Unbuffered reference input options 0 V to VREF output voltage Power-on-reset to 0 V Simultaneous update of DAC outputs via LDAC Low power serial interface with Schmitt-triggered inputs On-chip rail-to-rail output buffer amplifiers Qualified for automotive applications The AD5302/AD5312/AD5322 are dual 8-, 10-, and 12-bit buffered voltage output DACs in a 10-lead MSOP that operate from a single 2.5 V to 5.5 V supply, consuming 230 μA at 3 V. Their on-chip output amplifiers allow the outputs to swing railto-rail with a slew rate of 0.7 V/μs. The AD5302/AD5312/AD5322 utilize a versatile 3-wire serial interface that operates at clock rates up to 30 MHz and is compatible with standard SPI®, QSPI™, MICROWIRE™, and DSP interface standards. The references for the two DACs are derived from two reference pins (one per DAC). The reference inputs can be configured as buffered or unbuffered inputs. The outputs of both DACs can be updated simultaneously using the asynchronous LDAC input. The parts incorporate a power-on reset circuit, which ensures that the DAC outputs power-up to 0 V and remain there until a valid write takes place to the device. The parts contain a powerdown feature that reduces the current consumption of the devices to 200 nA at 5 V (50 nA at 3 V) and provides softwareselectable output loads while in power-down mode. The low power consumption of these parts in normal operation makes them ideally suited for portable battery-operated equipment. The power consumption is 1.5 mW at 5 V, 0.7 mW at 3 V, reducing to 1 μW in power-down mode. APPLICATIONS Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators FUNCTIONAL BLOCK DIAGRAM VDD VREF A AD5302/AD5312/AD5322 POWER-ON RESET INPUT REGISTER DAC REGISTER STRING DAC VOUTA BUFFER SYNC INTERFACE LOGIC DIN POWER-DOWN LOGIC INPUT REGISTER DAC REGISTER STRING DAC RESISTOR NETWORK VOUTB BUFFER RESISTOR NETWORK LDAC VREF B GND 00928-001 SCLK Figure 1. Rev. D Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2006-2011 Analog Devices, Inc. All rights reserved. AD5302/AD5312/AD5322 TABLE OF CONTENTS Features .............................................................................................. 1 Low Power Serial Interface ....................................................... 15 Applications....................................................................................... 1 Double-Buffered Interface ........................................................ 15 General Description ......................................................................... 1 Power-Down Modes ...................................................................... 16 Functional Block Diagram .............................................................. 1 Microprocessor Interfacing........................................................... 17 Revision History ............................................................................... 2 AD5302/AD5312/AD5322 to ADSP-2101/ADSP-2103 Interface ....................................................................................... 17 Specifications..................................................................................... 3 AC Specifications.......................................................................... 4 Timing Characteristics ................................................................ 5 Absolute Maximum Ratings............................................................ 7 ESD Caution.................................................................................. 7 Pin Configuration and Function Descriptions............................. 8 Terminology ...................................................................................... 9 Typical Performance Characteristics ........................................... 10 Functional Description .................................................................. 14 Digital-to-Analog Section ......................................................... 14 Resistor String ............................................................................. 14 AD5302/AD5312/AD5322 to 68HC11/68L11 Interface ...... 17 AD5302/AD5312/AD5322 to 80C51/80L51 Interface.......... 17 AD5302/AD5312/AD5322 to MICROWIRE Interface ........ 17 Applications Information .............................................................. 18 Typical Application Circuit....................................................... 18 Bipolar Operation Using the AD5302/AD5312/AD5322..... 18 Opto-Isolated Interface for Process Control Applications ... 19 Decoding Multiple AD5302/AD5312/AD5322s.................... 19 AD5302/AD5312/AD5322 as a Digitally Programmable Window Detector ....................................................................... 19 DAC Reference Inputs ............................................................... 14 Coarse and Fine Adjustment Using the AD5302/AD5312/AD5322 ....................................................... 20 Output Amplifier........................................................................ 14 Power Supply Bypassing and Grounding................................ 20 Power-On Reset .......................................................................... 14 Outline Dimensions ....................................................................... 21 Serial Interface ................................................................................ 15 Ordering Guide .......................................................................... 22 Input Shift Register..................................................................... 15 REVISION HISTORY 5/11—Rev. C to Rev. D Added Automotive Products Information ................. Throughout Updated Outline Dimensions ....................................................... 21 Changes to Ordering Guide .......................................................... 22 4/06—Rev. B to Rev. C Updated Format..................................................................Universal Updated Outline Dimensions ....................................................... 21 Changes to Ordering Guide .......................................................... 21 Updated Outline Dimensions....................................................... 21 Changes to Ordering Guide .......................................................... 21 8/03—Rev. 0 to Rev. A Changes to Features ..........................................................................1 Changes to Specifications.................................................................2 Changes to Absolute Maximum Ratings........................................4 Changes to Ordering Guide .............................................................4 Updated Outline Dimensions....................................................... 16 12/05—Rev. A to Rev. B Updated Format..................................................................Universal Rev. D | Page 2 of 24 AD5302/AD5312/AD5322 SPECIFICATIONS VDD = 2.5 V to 5.5 V, VREF = 2 V, RL = 2 kΩ to GND, CL = 200 pF to GND, all specifications TMIN to TMAX, unless otherwise noted. Table 1. 2 Parameter DC PERFORMANCE 3 , 4 AD5302 Resolution Relative Accuracy Differential Nonlinearity AD5312 Resolution Relative Accuracy Differential Nonlinearity AD5322 Resolution Relative Accuracy Differential Nonlinearity Offset Error Gain Error Lower Deadband Offset Error Drift 5 A Version 1 Min Typ Max Power Supply Rejection Ratio5 DC Crosstalk5 DAC REFERENCE INPUTS5 VREF Input Range Reference Feedthrough Channel-to-Channel Isolation OUTPUT CHARACTERISTICS5 Minimum Output Voltage 6 Maximum Output Voltage6 DC Output Impedance Short-Circuit Current Power-Up Time 8 ±0.15 ±0.02 ±0.5 ±0.25 Bits LSB LSB Guaranteed monotonic by design over all codes 10 ±0.5 ±0.05 ±4 ±0.5 10 ±0.5 ±0.05 ±2 ±0.5 Bits LSB LSB Guaranteed monotonic by design over all codes −5 −5 −60 −60 Bits LSB LSB % of FSR % of FSR mV ppm of FSR/°C ppm of FSR/°C dB 30 30 μV Pin Capacitance 12 ±2 ±0.2 ±0.4 ±0.15 10 −12 ±16 ±1 ±3 ±1 60 VDD VDD 1 0 ±8 ±1 ±3 ±1 60 >10 180 −90 −80 >10 180 −90 −80 V V MΩ kΩ dB dB 0.001 0.001 V min VDD − 0.001 0.5 50 20 2.5 5 VDD − 0.001 0.5 50 20 2.5 5 V max LOGIC INPUTS5 Input Current VIL, Input Low Voltage VIH, Input High Voltage Test Conditions/Comments ±1 ±0.25 1 0 VREF Input Impedance Unit 8 ±0.15 ±0.02 12 ±2 ±0.2 ±0.4 ±0.15 10 −12 Gain Error Drift5 Min B Version1 Typ Max VDD VDD ±1 0.8 0.6 0.5 2.4 2.1 2.0 Ω mA mA μs μs ±1 0.8 0.6 0.5 2.4 2.1 2.0 2 3.5 2 3.5 Rev. D | Page 3 of 24 μA V V V V V V pF Guaranteed monotonic by design over all codes See Figure 3 and Figure 4 See Figure 3 and Figure 4 See Figure 3 and Figure 4 ∆VDD = ±10% Buffered reference mode Unbuffered reference mode Buffered reference mode Unbuffered reference mode, input impedance = RDAC Frequency = 10 kHz Frequency = 10 kHz A measure of the minimum drive capability of the output amplifier A measure of the maximum drive capability of the output amplifier VDD = 5 V VDD = 3 V Coming out of power-down mode, VDD = 5 V Coming out of power-down mode, VDD = 3 V VDD = 5 V ± 10% VDD = 3 V ± 10% VDD = 2.5 V VDD = 5 V ± 10% VDD = 3 V ± 10% VDD = 2.5 V AD5302/AD5312/AD5322 2 Parameter POWER REQUIREMENTS VDD IDD (Normal Mode) VDD = 4.5 V to 5.5 V VDD = 2.5 V to 3.6 V A Version 1 Min Typ Max Min 2.5 2.5 IDD (Full Power-Down) VDD = 4.5 V to 5.5 V VDD = 2.5 V to 3.6 V 5.5 B Version1 Typ Max Unit Test Conditions/Comments 5.5 V IDD specification is valid for all DAC codes Both DACs active and excluding load currents Both DACs in unbuffered mode, VIH = VDD and VIL = GND; in buffered mode, extra current is typically × μA per DAC where x = 5 μA + VREF/RDAC 300 230 450 350 300 230 450 350 μA μA 0.2 0.05 1 1 0.2 0.05 1 1 μA μA 1 Temperature range: A, B version: –40°C to +105°C. See Terminology section. 3 DC specifications tested with the outputs unloaded. 4 Linearity is tested using a reduced code range: AD5302 (Code 8 to 248); AD5312 (Code 28 to 995); AD5322 (Code 115 to 3981). 5 Guaranteed by design and characterization, not production tested. 6 In order for the amplifier output to reach its minimum voltage, offset error must be negative. In order for the amplifier output to reach its maximum voltage, VREF = VDD and offset plus gain error must be positive. 2 AC SPECIFICATIONS VDD = 2.5 V to 5.5 V, RL = 2 kΩ to GND, CL = 200 pF to GND, all specifications TMIN to TMAX, unless otherwise noted. 1 Table 2. 3 Parameter Output Voltage Settling Time AD5302 AD5312 AD5322 Slew Rate Major-Code Transition Glitch Energy Digital Feedthrough Analog Crosstalk DAC-to-DAC Crosstalk Multiplying Bandwidth Total Harmonic Distortion A, B Version 2 Min Typ Max Unit 6 7 8 0.7 12 0.10 0.01 0.01 200 −70 μs μs μs V/μs nV-s nV-s nV-s nV-s kHz dB 8 9 10 Test Conditions/Comments VREF = VDD = 5 V ¼ Scale to ¾ Scale Change (0 × 40 to 0 × C0) ¼ Scale to ¾ Scale Change (0 × 100 to 0 × C300) ¼ Scale to ¾ Scale Change (0 × 400 to 0 × C00) 1 LSB Change Around Major Carry (011…11 to 100…00) VREF = 2 V ± 0.1 V p-p, Unbuffered Mode VREF = 2.5 V ± 0.1 V p-p, Frequency = 10 kHz 1 Guaranteed by design and characterization, not production tested. Temperature range: A, B version: −40°C to +105°C. 3 See Terminology section. 2 Rev. D | Page 4 of 24 AD5302/AD5312/AD5322 TIMING CHARACTERISTICS VDD = 2.5 V to 5.5 V, all specifications TMIN to TMAX, unless otherwise noted. 1, 2, 3 Table 3. Parameter t1 t2 t3 t4 t5 t6 t7 t8 t9 Limit at TMIN, TMAX (A, B Version) 33 13 13 0 5 4.5 0 100 20 20 t10 Unit ns min ns min ns min ns min ns min ns min ns min ns min ns min Conditions/Comments SCLK Cycle Time SCLK High Time SCLK Low Time SYNC to SCLK Active Edge Setup Time Data Setup Time Data Hold Time SCLK Falling Edge to SYNC Rising Edge Minimum SYNC High Time LDAC Pulse Width SCLK Falling Edge to LDAC Rising Edge ns min 1 Guaranteed by design and characterization, not production tested. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. 3 See Figure 2. 2 t1 SCLK t8 t3 t4 t2 t7 SYNC t6 DIN1 t5 DB15 DB0 t9 LDAC t10 1SEE 00928-002 LDAC INPUT SHIFT REGISTER SECTION. Figure 2. Serial Interface Timing Diagram Rev. D | Page 5 of 24 AD5302/AD5312/AD5322 GAIN ERROR PLUS OFFSET ERROR OUTPUT VOLTAGE IDEAL ACTUAL POSITIVE OFFSET ERROR DAC CODE DEADBAND AMPLIFIER FOOTROOM (1mV) 02928-004 NEGATIVE OFFSET ERROR Figure 3. Transfer Function with Negative Offset GAIN ERROR PLUS OFFSET ERROR OUTPUT VOLTAGE ACTUAL POSITIVE OFFSET ERROR DAC CODE Figure 4. Transfer Function with Positive Offset Rev. D | Page 6 of 24 00928-005 IDEAL AD5302/AD5312/AD5322 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted.1 Table 4. Parameter VDD to GND Digital Input Voltage to GND Reference Input Voltage to GND VOUTA, VOUTB to GND Operating Temperature Range Industrial (A, B Version) Storage Temperature Range Junction Temperature (TJ max) 10-Lead MSOP Power Dissipation θJA Thermal Impedance θJC Thermal Impedance Lead Temperature, Soldering Vapor Phase (60 sec) Infrared (15 sec) 1 Rating –0.3 V to +7 V –0.3 V to VDD + 0.3 V –0.3 V to VDD + 0.3 V –0.3 V to VDD + 0.3 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. –40°C to +105°C –65°C to +150°C +150°C (TJ max – TA)/θJA 206°C/W 44°C/W 215°C 220°C Transient currents of up to 100 mA do not cause SCR latch-up. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. D | Page 7 of 24 AD5302/AD5312/AD5322 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VDD 2 VREF B 3 VREF A 4 VOUTA 5 AD5302/ AD5312/ AD5322 TOP VIEW (Not to Scale) 10 GND 9 DIN 8 SCLK 7 SYNC 6 VOUTB 00928-003 LDAC 1 Figure 5. Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 Mnemonic LDAC 2 3 VDD VREFB 4 VREFA 5 6 7 VOUTA VOUTB SYNC 8 SCLK 9 DIN 10 GND Description Active Low Control Input. This pin transfers the contents of the input registers to their respective DAC registers. Pulsing LDAC low allows either or both DAC registers to be updated if the input registers have new data. This allows simultaneous updating of both DAC outputs. Power Supply Input. The parts can be operated from 2.5 V to 5.5 V, and the supply should be decoupled to GND. Reference Input Pin for DAC B. This is the reference for DAC B. It can be configured as a buffered or an unbuffered input, depending on the BUF bit in the control word of DAC B. It has an input range of 0 V to VDD in unbuffered mode and 1 V to VDD in buffered mode. Reference Input Pin for DAC A. This is the reference for DAC A. It can be configured as a buffered or an unbuffered input depending on the BUF bit in the control word of DAC A. It has an input range of 0 V to VDD in unbuffered mode and 1 V to VDD in buffered mode. Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation. Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation. Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is transferred in on the falling edges of the following 16 clocks. If SYNC is taken high before the 16th falling edge, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the device. Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be transferred at rates up to 30 MHz. The SCLK input buffer is powered down after each write cycle. Serial Data Input. This device has a 16-bit input shift register. Data is clocked into the register on the falling edge of the serial clock input. The DIN input buffer is powered down after each write cycle. Ground Reference Point for All Circuitry on the Part. Rev. D | Page 8 of 24 AD5302/AD5312/AD5322 TERMINOLOGY Relative Accuracy For the DAC, relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSB, from a straight line passing through the actual endpoints of the DAC transfer function. A typical INL vs. code plot can be seen in Figure 6. Differential Nonlinearity Differential nonlinearity (DNL) is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic by design. A typical DNL vs. code plot can be seen in Figure 9. Offset Error This is a measure of the offset error of the DAC and the output amplifier. It is expressed as a percentage of the full-scale range. Gain Error This is a measure of the span error of the DAC. It is the deviation in slope of the actual DAC transfer characteristic from the ideal expressed as a percentage of the full-scale range. Offset Error Drift This is a measure of the change in offset error with changes in temperature. It is expressed in (ppm of full-scale range)/°C. change (all 0s to all 1s and vice versa) while keeping LDAC high, then pulsing LDAC low, and monitoring the output of the DAC whose digital code is not changed. The area of the glitch is expressed in nV-sec. DAC-to-DAC Crosstalk This is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent output change of the other DAC. This includes both digital and analog crosstalk. It is measured by loading one of the DACs with a full-scale code change (all 0s to all 1s and vice versa) while keeping LDAC low and monitoring the output of the other DAC. The area of the glitch is expressed in nV-sec. DC Crosstalk This is the dc change in the output level of one DAC in response to a change in the output of the other DAC. It is measured with a full-scale output change on one DAC while monitoring the other DAC. It is expressed in μV. Power Supply Rejection Ratio (PSRR) This indicates how the output of the DAC is affected by changes in the supply voltage. PSRR is the ratio of the change in VOUT to a change in VDD for full-scale output of the DAC. It is measured in dB. VREF is held at 2 V and VDD is varied ±10%. Reference Feedthrough This is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated (that is, LDAC is high). It is expressed in dB. Gain Error Drift This is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C. Major-Code Transition Glitch Energy Major-code transition glitch energy is the energy of the impulse injected into the analog output when the code in the DAC register changes state. It is normally specified as the area of the glitch in nV-sec and is measured when the digital code is changed by 1 LSB at the major carry transition (011 . . . 11 to 100 . . . 00 or 100 . . . 00 to 011 . . . 11). Digital Feedthrough Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital input pins of the device, but is measured when the DAC is not being written to (SYNC held high). It is specified in nV-sec and is measured with a full-scale change on the digital input pins, that is, from all 0s to all 1s and vice versa. Analog Crosstalk This is the glitch impulse transferred to the output of one DAC due to a change in the output of the other DAC. It is measured by loading one of the input registers with a full-scale code Total Harmonic Distortion (THD) This is the difference between an ideal sine wave and its attenuated version using the DAC. The sine wave is used as the reference for the DAC and the THD is a measure of the harmonics present on the DAC output. It is measured in dB. Multiplying Bandwidth The amplifiers within the DAC have a finite bandwidth. The multiplying bandwidth is a measure of this. A sine wave on the reference (with full-scale code loaded to the DAC) appears on the output. The multiplying bandwidth is the frequency at which the output amplitude falls to 3 dB below the input. Channel-to-Channel Isolation Definition This is a ratio of the amplitude of the signal at the output of one DAC to a sine wave on the reference input of the other DAC. It is measured in dB. Rev. D | Page 9 of 24 AD5302/AD5312/AD5322 TYPICAL PERFORMANCE CHARACTERISTICS 1.0 0.3 TA = 25°C VDD = 5V TA = 25°C VDD = 5V 0.2 DNL ERROR (LSB) INL ERROR (LSB) 0.5 0 0.1 0 –0.1 –0.5 0 50 100 150 200 –0.3 250 00928-009 –1.0 00928-006 –0.2 0 50 100 Figure 6. AD5302 Typical INL Plot 0.6 TA = 25°C VDD = 5V 2 0.4 1 0.2 0 –1 TA = 25°C VDD = 5V 0 –0.2 0 200 400 600 800 00928-010 –0.6 1000 0 200 CODE 400 600 800 1000 CODE Figure 7. AD5312 Typical INL Plot 3 250 –0.4 00928-007 –2 –3 200 Figure 9. AD5302 Typical DNL Plot DNL ERROR (LSB) INL ERROR (LSB) 3 150 CODE CODE Figure 10. AD5312 Typical DNL Plot 1.0 TA = 25°C VDD = 5V TA = 25°C VDD = 5V 2 DNL ERROR (LSB) 0 –4 0 –0.5 –12 0 1000 2000 CODE 3000 –1.0 4000 Figure 8. AD5322 Typical INL Plot 00928-011 –8 00928-008 INL ERROR (LSB) 0.5 1 0 1000 2000 CODE 3000 Figure 11. AD5322 Typical DNL Plot Rev. D | Page 10 of 24 4000 AD5302/AD5312/AD5322 1.00 TA = 25°C VDD = 5V 0.75 VDD = 5V VDD = 3V 0.25 FREQUENCY ERROR (LSB) 0.50 MAX INL MAX DNL 0 MIN DNL –0.25 MIN INL –1.00 00928-012 –0.75 2 3 4 00928-015 –0.50 0 100 5 150 VREF (V) 0.75 250 IDD (µA) 300 350 400 Figure 15. IDD Histogram with VDD = 3 V and VDD = 5 V Figure 12. AD5302 INL and DNL Error vs. VREF 1.00 200 5 VDD = 5V VREF = 3V 5V SOURCE 4 MAX DNL MAX INL 0.25 0 –0.25 MIN INL –0.50 2 MIN DNL 3V SINK 5V SINK 00928-013 –1.00 –40 0 40 TEMPERATURE(°C) 80 –0 120 00928-016 1 –0.75 0 1 2 3 4 SINK/SOURCE CURRENT(mA) 6 5 Figure 16. Source and Sink Current Capability Figure 13. AD5302 INL Error and DNL Error vs. Temperature 1.0 3V SOURCE 3 VOUT(V) ERROR (LSB) 0.50 600 VDD = 5V VREF =2V TA = 25°C VDD = 5V 500 0.5 IDD (µA) GAIN ERROR 0 300 200 –0.5 OFFSET ERROR –1.0 –40 0 40 TEMPERATURE(°C) 80 0 120 Figure 14. Offset Error and Gain Error vs. Temperature 00928-017 100 00928-014 ERROR (%) 400 ZERO SCALE FULL SCALE Figure 17. Supply Current vs. Code Rev. D | Page 11 of 24 AD5302/AD5312/AD5322 600 VDD = 5V TA = 25°C BOTH DACS IN GAIN-OF-TWO MODE REFERENCE INPUTS BUFFERED 500 CH2 400 +25°C –40°C IDD(µA) CLK 300 +105°C 200 VOUT CH1 00928-018 00928-021 100 0 2.5 3.0 3.5 4.0 4.5 5.0 CH1 1V, CH2 5V, TIME BASE = 5µs/DIV 5.5 VDD(V) Figure 18. Supply Current vs. Supply Voltage 1.0 Figure 21. Half-Scale Setting (¼ to ¾ Scale Code Change) TA = 25°C BOTH DACS IN THREE-STATE CONDITION VDD IDD (µA) 0.8 0.6 –40°C 0.4 +25°C CH1 VOUTA 0.2 3.2 3.7 4.2 4.7 00928-022 00928-019 +105°C 0 2.7 CH2 CH1 1V, CH2 1V, TIME BASE = 20µs/DIV 5.2 VDD (V) Figure 19. Power-Down Current vs. Supply Voltage 700 Figure 22. Power-On Reset to 0 V TA = 25°C TA = 25°C 600 VOUT CH1 400 VDD = 5V 300 CH3 CLK 00928-023 VDD = 3V 200 00928-020 IDD (µA) 500 100 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 CH1 1V, CH3 5V, TIME BASE = 1µs/DIV 5.0 VLOGIC (V) Figure 23. Existing Power-Down to Midscale Figure 20. Supply vs. Logic Input Voltage Rev. D | Page 12 of 24 AD5302/AD5312/AD5322 2.50 VOUT (V) 2mV/DIV 2.49 00928-024 00928-026 2.48 2.47 500ns/DIV 1µs/DIV Figure 26. DAC-to-DAC Crosstalk Figure 24. AD5322 Major-Code Transition 1.0 10 TA = 25°C VDD = 5V –10 dB –20 –30 –40 –60 10 00928-025 –50 100 1k 10k 100k 1M 0.5 0 –0.5 –1.0 10M 00928-027 FULL SCALE ERROR (V) 0 0 1 2 3 4 VREF (V) FREQUENCY(Hz) Figure 25. Multiplying Bandwidth (Small-Signal Frequency Response) Rev. D | Page 13 of 24 Figure 27. Full-Scale Error vs. VREF (Buffered) 5 AD5302/AD5312/AD5322 FUNCTIONAL DESCRIPTION DIGITAL-TO-ANALOG SECTION The architecture of one DAC channel consists of a reference buffer and a resistor-string DAC followed by an output buffer amplifier. The voltage at the VREF pin provides the reference voltage for the DAC. Figure 28 shows a block diagram of the DAC architecture. Because the input coding to the DAC is straight binary, the ideal output voltage is given by VOUT = R R TO OUTPUT AMPLIFIER R R 00928-029 The AD5302/AD5312/AD5322 are dual resistor-string DACs fabricated on a CMOS process with resolutions of 8, 10, and 12 bits, respectively. They contain reference buffers and output buffer amplifiers, and are written to via a 3-wire serial interface. They operate from single supplies of 2.5 V to 5.5 V, and the output buffer amplifiers provide rail-to-rail output swing with a slew rate of 0.7 V/μs. Each DAC is provided with a separate reference input, which can be buffered to draw virtually no current from the reference source, or unbuffered to give a reference input range from GND to VDD. The devices have three programmable power-down modes, in which one or both DACs can be turned off completely with a high impedance output, or the output can be pulled low by an on-chip resistor. R Figure 29. Resistor String DAC REFERENCE INPUTS There is a reference input pin for each of the two DACs. The reference inputs are buffered but can also be configured as unbuffered. The advantage of the buffered input is the high impedance it presents to the voltage source driving it. However, if the unbuffered mode is used, the user can have a reference voltage as low as GND and as high as VDD because there is no restriction due to headroom and footroom of the reference amplifier. If there is a buffered reference in the circuit (for example, REF192), there is no need to use the on-chip buffers of the AD5302/AD5312/AD5322. In unbuffered mode, the impedance is still large (180 kΩ per reference input). VREF × D 2N where: The buffered/unbuffered option is controlled by the BUF bit in the control word (see the Serial Interface section for a description of the register contents). D = decimal equivalent of the binary code that is loaded to the DAC register: 0 to 255 for AD5302 (8 bits) 0 to 1023 for AD5312 (10 bits) 0 to 4095 for AD5322 (12 bits) N = DAC resolution. OUTPUT AMPLIFIER The output buffer amplifier is capable of generating output voltages to within 1 mV of either rail, which gives an output range of 0.001 V to VDD – 0.001 V when the reference is VDD. It is capable of driving a load of 2 kΩ in parallel with 500 pF to GND and VDD. The source and sink capabilities of the output amplifier can be seen in Figure 16. VREFA SWITCH CONTROLLED BY CONTROL LOGIC INPUT REGISTER DAC REGISTER RESISTOR STRING VOUTA 00928-028 REFERENCE BUFFER OUTPUT BUFFER AMPLIFIER Figure 28. Single DAC Channel Architecture RESISTOR STRING The resistor-string section is shown in Figure 29. It is simply a string of resistors, each of value R. The digital code loaded to the DAC register determines at what node on the string the voltage is tapped off to be fed into the output amplifier. The voltage is tapped off by closing one of the switches connecting the string to the amplifier. Because it is a string of resistors, it is guaranteed monotonic. The slew rate is 0.7 V/μs with a half-scale settling time to ±0.5 LSB (at eight bits) of 6 μs. See Figure 21. POWER-ON RESET The AD5302/AD5312/AD5322 are provided with a power-on reset function to power them up in a defined state. The poweron state is • Normal operation • Reference inputs unbuffered • Output voltage set to 0 V Both input and DAC registers are filled with zeros and remain so until a valid write sequence is made to the device. This is particularly useful in applications where it is important to know the state of the DAC outputs while the device is powering up. Rev. D | Page 14 of 24 AD5302/AD5312/AD5322 SERIAL INTERFACE The AD5302/AD5312/AD5322 are controlled over a versatile, 3-wire serial interface, which operates at clock rates up to 30 MHz and is compatible with SPI, QSPI, MICROWIRE, and DSP interface standards. INPUT SHIFT REGISTER The input shift register is 16 bits wide (see Figure 30 to Figure 32). Data is loaded into the device as a 16-bit word under the control of a serial clock input, SCLK. The timing diagram for this operation is shown in Figure 2. The 16-bit word consists of four control bits followed by 8, 10, or 12 bits of DAC data, depending on the device type. The first bit loaded is the MSB (Bit 15), which determines whether the data is for DAC A or DAC B. Bit 14 determines if the reference input is buffered or unbuffered. Bit 13 and Bit 12 control the operating mode of the DAC. Table 6. Control Bits Bit 15 Name A/B 14 BUF 13 12 PD1 PD0 Function 0: Data Written to DAC A 1: Data Written to DAC B 0: Reference Is Unbuffered 1: Reference Is Buffered Mode Bit Mode Bit Power-On Default N/A 0 0 0 falling edges of SCLK for 16 clock pulses. Any data and clock pulses after the 16th are ignored, and no further serial data transfers occur until SYNC is taken high and low again. SYNC can be taken high after the falling edge of the 16th SCLK pulse, observing the minimum SCLK falling edge to SYNC rising edge time, t7. After the end of serial data transfer, data is automatically transferred from the input shift register to the input register of the selected DAC. If SYNC is taken high before the 16th falling edge of SCLK, the data transfer is aborted and the input registers are not updated. When data has been transferred into both input registers, the DAC registers of both DACs can be simultaneously updated by taking LDAC low. LOW POWER SERIAL INTERFACE To reduce the power consumption of the device even further, the interface only powers up fully when the device is being written to. As soon as the 16-bit control word has been written to the part, the SCLK and DIN input buffers are powered down. They only power up again following a falling edge of SYNC. DOUBLE-BUFFERED INTERFACE BIT 0 (LSB) A/B BUF PD1 PD0 D7 D6 D5 D4 D3 D2 D1 D0 X X X X DATA BITS 00928-030 BIT 15 (MSB) Figure 30. AD5302 Input Shift Register Contents BIT 0 (LSB) A/B BUF PD1 PD0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X DATA BITS 00928-031 BIT 15 (MSB) Figure 31. AD5312 Input Shift Register Contents BIT 0 (LSB) A/B BUF PD1 PD0 D11 D10 D9 D8 D7 D6 D5 D4 D3 DATA BITS D2 D1 D0 00928-032 BIT 15 (MSB) Figure 32. AD5322 Input Shift Register Contents The remaining bits are DAC data bits, starting with the MSB and ending with the LSB. The AD5322 uses all 12 bits of DAC data, the AD5312 uses 10 bits and ignores the 2 LSB. The AD5302 uses eight bits and ignores the last four bits. The data format is straight binary, with all 0s corresponding to 0 V output, and all 1s corresponding to full-scale output (VREF – 1 LSB). The SYNC input is a level-triggered input that acts as a frame synchronization signal and chip enable. Data can only be transferred into the device while SYNC is low. To start the serial data transfer, SYNC should be taken low observing the minimum SYNC to SCLK active edge setup time, t4. After SYNC goes low, serial data is shifted into the device’s input shift register on the The AD5302/AD5312/AD5322 DACs all have double-buffered interfaces consisting of two banks of registers—input registers and DAC registers. The input register is connected directly to the input shift register and the digital code is transferred to the relevant input register on completion of a valid write sequence. The DAC register contains the digital code used by the resistor string. Access to the DAC register is controlled by the LDAC function. When LDAC is high, the DAC register is latched and the input register can change state without affecting the contents of the DAC register. However, when LDAC is brought low, the DAC register becomes transparent and the contents of the input register are transferred to it. This is useful if the user requires simultaneous updating of both DAC outputs. The user can write to both input registers individually and then, by pulsing the LDAC input low, both outputs update simultaneously. These parts contain an extra feature whereby the DAC register is not updated unless its input register has been updated since the last time that LDAC was brought low. Normally, when LDAC is brought low, the DAC registers are filled with the contents of the input registers. In the case of the AD5302/ AD5312/AD5322, the part only updates the DAC register if the input register has been changed since the last time the DAC register was updated, thereby removing unnecessary digital crosstalk. Rev. D | Page 15 of 24 AD5302/AD5312/AD5322 POWER-DOWN MODES The AD5302/AD5312/AD5322 have very low power consumption, dissipating only 0.7 mW with a 3 V supply and 1.5 mW with a 5 V supply. Power consumption can be further reduced when the DACs are not in use by putting them into one of three power-down modes, which are selected by Bit 13 and Bit 12 (PD1 and PD0) of the control word. Table 7 shows how the state of the bits corresponds to the mode of operation of that particular DAC. Table 7. PD1/PD0 Operating Modes PDO 0 1 0 1 The output is connected internally to GND through a 1 kΩ resistor, • The output is connected internally to GND through a 100 kΩ resistor, or • The output is left open-circuited (three-state). The output stage is illustrated in Figure 33. The bias generator, the output amplifier, the resistor string, and all other associated linear circuitry are shut down when the power-down mode is activated. However, the contents of the registers are unaffected when in power-down. The time to exit power-down is typically 2.5 μs for VDD = 5 V and 5 μs when VDD = 3 V. See Figure 23 for a plot. Operating Mode Normal Operation Power-Down (1 kΩ Load to GND) Power-Down (100 kΩ Load to GND) Power-Down (High Impedance Output) When both bits are set to 0, the DACs work normally with their normal power consumption of 300 μA at 5 V. However, for the three power-down modes, the supply current falls to 200 nA at 5 V (50 nA at 3 V). Not only does the supply current drop, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output impedance of the part is known while the part is in power-down mode and provides a defined input condition for whatever is connected to the output of the DAC amplifier. There are three different options. Rev. D | Page 16 of 24 AMPLIFIER RESISTORSTRING DAC VOUT POWER-DOWN CIRCUITRY RESISTOR NETWORK Figure 33. Output Stage During Power-Down 00928-033 PD1 0 0 1 1 • AD5302/AD5312/AD5322 MICROPROCESSOR INTERFACING AD5302/AD5312/AD5322 TO ADSP-2101/ADSP2103 INTERFACE AD5302/AD5312/AD5322 TO 80C51/80L51 INTERFACE Figure 34 shows a serial interface between the AD5302/AD5312/ AD5322 and the ADSP-2101/ADSP-2103. The ADSP-2101/ADSP2103 should be set up to operate in the SPORT transmit alternate framing mode. The ADSP-2101/ADSP-2103 sport is programmed through the SPORT control register and should be configured as follows: internal clock operation, active low framing, 16-bit word length. Transmission is initiated by writing a word to the Tx register after the SPORT has been enabled. The data is clocked out on each falling edge of the DSP’s serial clock and clocked into the AD5302/AD5312/AD5322 on the rising edge of the DSP’s serial clock. This corresponds to the falling edge of the DAC’s SCLK. Figure 36 shows a serial interface between the AD5302/AD5312/ AD5322 and the 80C51/80L51 microcontroller. The setup for the interface is as follows: TXD of the 80C51/80L51 drives SCLK of the AD5302/AD5312/AD5322, while RXD drives the serial data line of the part. The SYNC signal is again derived from a bit programmable pin on the port. In this case, port line P3.3 is used. When data is to be transmitted to the AD5302/ AD5312/AD5322, P3.3 is taken low. The 80C51/80L51 transmit data in 8-bit bytes only; thus only eight falling clock edges occur in the transmit cycle. To load data to the DAC, P3.3 is left low after the first eight bits are transmitted, and a second write cycle is initiated to transmit the second byte of data. P3.3 is taken high following the completion of this cycle. The 80C51/80L51 output the serial data in a format that has the LSB first. The AD5302/AD5312/AD5322 require their data with the MSB as the first bit received. The 80C51/80L51 transmit routine should take this into account. SCLK SYNC DIN SCLK 1ADDITIONAL PINS OMITTED FOR CLARITY 80C51/80L511 AD5302/ AD5312/ AD53221 Figure 34. AD5302/AD5312/AD5322 to ADSP-2101/ADSP-2103 Interface AD5302/AD5312/AD5322 TO 68HC11/68L11 INTERFACE Figure 35 shows a serial interface between the AD5302/AD5312/ AD5322 and the 68HC11/68L11 microcontroller. SCK of the 68HC11/68L11 drives the SCLK of the AD5302/AD5312/AD5322, while the MOSI output drives the serial data line of the DAC. The SYNC signal is derived from a port line (PC7). The setup conditions for correct operation of this interface are as follows: the 68HC11/68L11 should be configured so that its CPOL bit = 0 and its CPHA bit = 1. When data is being transmitted to the DAC, the SYNC line is taken low (PC7). When the 68HC11/ 68L11 are configured as above, data appearing on the MOSI output is valid on the falling edge of SCK. Serial data from the 68HC11/ 68L11 is transmitted in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. Data is transmitted MSB first. In order to load data to the AD5302/AD5312/AD5322, PC7 is left low after the first eight bits are transferred and a second serial write operation is performed to the DAC; PC7 is taken high at the end of this procedure. P3.3 SYNC TXD SCLK RXD DIN 1ADDITIONAL PINS OMITTED FOR CLARITY 00928-036 DT 00928-034 TFS Figure 36. AD5302/AD5312/AD5322 to 80C51/80L51 Interface AD5302/AD5312/AD5322 TO MICROWIRE INTERFACE Figure 37 shows an interface between the AD5302/AD5312/ AD5322 and any MICROWIRE-compatible device. Serial data is shifted out on the falling edge of the serial clock and is clocked into the AD5302/AD5312/AD5322 on the rising edge of the SK. AD5302/ AD5312/ AD53221 MICROWIRE1 CS SYNC SK SCLK SO DIN 1ADDITIONAL PINS OMITTED FOR CLARITY 00928-037 AD5302/ AD5312/ AD53221 ADSP-2101/ ADSP-21031 Figure 37. AD5302/AD5312/AD5322 to MICROWIRE Interface AD5302/ AD5312/ AD53221 68HC11/68L111 PC7 SYNC SCK SCLK DIN 1ADDITIONAL PINS OMITTED FOR CLARITY 00928-035 MOSI Figure 35. AD5302/AD5312/AD5322 to 68HC11/68L11 Interface Rev. D | Page 17 of 24 AD5302/AD5312/AD5322 APPLICATIONS INFORMATION 6V to 16V TYPICAL APPLICATION CIRCUIT The AD5302/AD5312/AD5322 can be used with a wide range of reference voltages, especially if the reference inputs are configured to be unbuffered, in which case the devices offer full, one-quadrant multiplying capability over a reference range of 0 V to VDD. More typically, the AD5302/AD5312/AD5322 can be used with a fixed, precision reference voltage. Figure 38 shows a typical setup for the AD5302/AD5312/AD5322 when using an external reference. If the reference inputs are unbuffered, the reference input range is from 0 V to VDD, but if the on-chip reference buffers are used, the reference range is reduced. Suitable references for 5 V operation are the AD780 and REF192 (2.5 V references). For 2.5 V operation, a suitable external reference would be the REF191, a 2.048 V reference. VDD = 2.5V to 5.5V AD780/REF192 WITH VDD = 5V OR REF191 WITH VDD = 2.5V VREF A 1µF AD5302/AD5312/ AD5322 SCLK DIN 00928-038 VOUTB GND SERIAL INTERFACE VOUT VDD 1µF GND VOUTA VREF A VREF B AD5302/AD5312/ AD5322 SCLK DIN VOUTB SYNC 00928-039 GND SERIAL INTERFACE Figure 39. Using a REF195 as Power and Reference to the AD5302/AD5312/AD5322 The AD5302/AD5312/AD5322 are designed for single-supply operation, but bipolar operation is also achievable using the circuit shown in Figure 40. This circuit is configured to achieve an output voltage range of –5 V < VOUT < +5 V. Rail-to-rail operation at the amplifier output is achievable using an AD820 or OP295 as the output amplifier. VOUTA VREF B SYNC 10µF BIPOLAR OPERATION USING THE AD5302/AD5312/AD5322 VDD VOUT 0.1µF VDD = 5V 6V to 16V 0.1µF Figure 38. AD5302/AD5312/AD5322 Using External Reference If an output range of 0 V to VDD is required when the reference inputs are configured as unbuffered (for example, 0 V to 5 V), the simplest solution is to connect the reference inputs to VDD. As this supply cannot be very accurate and can be noisy, the AD5302/AD5312/AD5322 can be powered from the reference voltage, for example, a 5 V reference such as the REF195, as shown in Figure 39. The REF195 outputs a steady supply voltage for the AD5302/AD5312/AD5322. The current required from the REF195 is 300 μA supply current and approximately 30 μA into each reference input. This is with no load on the DAC outputs. When the DAC outputs are loaded, the REF195 also needs to supply the current to the loads. The total current required (with a 10 kΩ load on each output) is R1 10kΩ +5V ±5V REF195 VDD VOUT VREF A/B –5V 1µF AD820/ OP295 AD5302/AD5312/ AD5322 SCLK DIN VOUTA/B SYNC GND SERIAL INTERFACE Figure 40. Bipolar Operation Using the AD5302/AD5312/AD5322 The output voltage for any input code can be calculated as follows: ⎡ (V × D / 2 N )× (R1 + R2 ) ⎤ VOUT = ⎢ REF ⎥ − VREF × (R2 / R1) R1 ⎣ ⎦ ⎛ 5V ⎞ ⎟ = 1.36 mA 360 μA + 2 ⎜ ⎜ 10 kΩ ⎟ ⎝ ⎠ The load regulation of the REF195 is typically 2 ppm/mA, which results in an error of 2.7 ppm (13.5 μV) for the 1.36 mA current drawn from it. This corresponds to a 0.0007 LSB error at eight bits and a 0.011 LSB error at 12 bits. 10µF VIN GND R2 10kΩ where: D is the decimal equivalent of the code loaded to the DAC. N is the DAC resolution. VREF is the reference voltage input. If VREF = 5 V, R1 = R2 = 1 kΩ, and VDD = 5 V: VOUT = (10 × D / 2 N ) − 5 V Rev. D | Page 18 of 24 00928-040 EXT REF VIN REF195 AD5302/AD5312/AD5322 OPTO-ISOLATED INTERFACE FOR PROCESS CONTROL APPLICATIONS Each AD5302/AD5312/AD5322 has a versatile 3-wire serial interface, making them ideal for generating accurate voltages in process control and industrial applications. Due to noise, safety requirements, or distance, it can be necessary to isolate the AD5302/AD5312/AD5322 from the controller. This can easily be achieved by using opto-isolators, which provide isolation in excess of 3 kV. The serial loading structure of the AD5302/ AD5312/AD5322 makes them ideally suited for use in optoisolated applications. Figure 41 shows an opto-isolated interface to the AD5302/AD5312/AD5322 where DIN, SCLK, and SYNC are driven from opto-couplers. The power supply to the part also needs to be isolated by using a transformer. On the DAC side of the transformer, a 5 V regulator provides the 5 V supply required for the AD5302/AD5312/AD5322. The 74HC139 is used as a 2-to-4 line decoder to address any of the DACs in the system. To prevent timing errors from occurring, the enable input should be brought to its inactive state while the coded address inputs are changing state. Figure 42 shows a diagram of a typical setup for decoding multiple AD5302/ AD5312/AD5322 devices in a system. AD5302/AD5312/AD5322 SCLK DIN SYNC DIN SCLK VDD VCC ENABLE CODED ADDRESS 1G 74HC139 1A AD5302/AD5312/AD5322 1Y0 1Y1 1Y2 1Y3 1B SYNC DIN SCLK DGND AD5302/AD5312/AD5322 SYNC DIN SCLK 5V REGULATOR AD5302/AD5312/AD5322 0.1µF SYNC DIN SCLK VDD Figure 42. Decoding Multiple AD5302/AD5312/AD5322 Devices in a System 10kΩ VDD SCLK AD5302/AD5312/AD5322 AS A DIGITALLY PROGRAMMABLE WINDOW DETECTOR VREF A VREF B VDD 10kΩ SYNC Figure 43 shows a digitally programmable upper-/lower-limit detector using the two DACs in the AD5302/AD5312/AD5322. The upper and lower limits for the test are loaded to DAC A and DAC B, which, in turn, set the limits on the CMP04. If the signal at the VIN input is not within the programmed window, an LED indicates the fail condition. AD5302/AD5312/ AD5322 VOUTA SYNC VOUTB VDD 5V 10kΩ DIN 0.1µF 10µF VIN DIN 00928-041 GND VREF Figure 41. AD5302/AD5312/AD5322 in an Opto-Isolated Interface DECODING MULTIPLE AD5302/AD5312/AD5322s The SYNC pin on the AD5302/AD5312/AD5322 can be used in applications to decode a number of DACs. In this application, all the DACs in the system receive the same serial clock and serial data, but only the SYNC to one of the devices is active at any one time, allowing access to two channels in this eight-channel system. SYNC DIN SCLK Rev. D | Page 19 of 24 1kΩ FAIL VDD VREF A VREF B 1kΩ PASS VOUTA AD5302/AD5312/ AD5322 SYNC 1/2 CMP04 PASS/FAIL DIN VOUTB SCLK GND 1/6 74HC05 Figure 43. Window Detector Using AD5302/AD5312/AD5322 00928-043 SCLK 00928-042 10µF POWER AD5302/AD5312/AD5322 POWER SUPPLY BYPASSING AND GROUNDING COARSE AND FINE ADJUSTMENT USING THE AD5302/AD5312/AD5322 In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. The printed circuit board on which the AD5302/AD5312/AD5322 is mounted should be designed so that the analog and digital sections are separated and confined to certain areas of the board. If the AD5302/ AD5312/AD5322 are in a system where multiple devices require an AGND-to-DGND connection, the connection should be made at one point only. The star ground point should be established as close as possible to the AD5302/AD5312/ AD5322. The part should have ample supply bypassing of 10 μF in parallel with 0.1 μF on the supply located as close as possible to the package, ideally right up against the device. The 10 μF capacitors are the tantalum bead type. The 0.1 μF capacitor should have low effective series resistance (ESR) and effective series inductance (ESI), similar to the common ceramic types that provide a low impedance path to ground at high frequencies that handle transient currents due to internal logic switching. The DACs in the AD5302/AD5312/AD5322 can be paired together to form a coarse and fine adjustment function, as shown in Figure 44. DAC A is used to provide the coarse adjustment while DAC B provides the fine adjustment. Varying the ratio of R1 and R2 changes the relative effect of the coarse and fine adjustments. With the resistor values and external reference shown, the output amplifier has unity gain for the DAC A output, so the output range is 0 V to 2.5 V − 1 LSB. For DAC B, the amplifier has a gain of 7.6 × 10–3, giving DAC B a range equal to 19 mV. The circuit is shown with a 2.5 V reference, but reference voltages up to VDD can be used. The op amps indicated allow a rail-to-rail output swing. VDD = 5V 0.1µF 10µF R3 R4 51.2kΩ 900Ω +5V VIN EXT REF VOUT VOUTA 1µF VOUT R1 390Ω AD820/ OP295 AD5302/AD5312/ AD5322 VREF B VOUTB R2 51.2kΩ GND 00928-044 GND VDD VREF A Figure 44. Coarse/Fine Adjustment The power supply lines of the AD5302/AD5312/AD5322 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching signals such as clocks should be shielded with digital ground to avoid radiating noise to other parts of the board, and should never be run near the reference inputs. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This reduces the effects of feedthrough through the board. A microstrip technique is by far the best, but is not always possible with a double-sided board. In this technique, the component side of the board is dedicated to ground while signal traces are placed on the solder side. Rev. D | Page 20 of 24 AD5302/AD5312/AD5322 OUTLINE DIMENSIONS 3.10 3.00 2.90 10 3.10 3.00 2.90 1 5.15 4.90 4.65 6 5 PIN 1 IDENTIFIER 0.50 BSC 0.95 0.85 0.75 15° MAX 1.10 MAX 0.30 0.15 6° 0° 0.23 0.13 COMPLIANT TO JEDEC STANDARDS MO-187-BA Figure 45. 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters Rev. D | Page 21 of 24 0.70 0.55 0.40 091709-A 0.15 0.05 COPLANARITY 0.10 AD5302/AD5312/AD5322 ORDERING GUIDE Model 1, 2 AD5302ARM AD5302ARM-REEL7 AD5302ARMZ AD5302ARMZ-REEL AD5302ARMZ-REEL7 AD5302BRM AD5302BRM-REEL AD5302BRM-REEL7 AD5302BRMZ AD5302BRMZ-REEL AD5302BRMZ-REEL7 AD5312ARM AD5312ARMZ AD5312ARMZ-REEL7 AD5312BRM AD5312BRM-REEL AD5312BRM-REEL7 AD5312BRMZ AD5312BRMZ-REEL AD5312BRMZ-REEL7 AD5322ARM AD5322ARM-REEL7 AD5322ARMZ AD5322ARMZ-REEL7 AD5322BRM AD5322BRM-REEL AD5322BRM-REEL7 AD5322BRMZ AD5322BRMZ-REEL AD5322BRMZ-REEL7 AD5312WARMZ-REEL7 1 2 Temperature Range −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C −40°C to +105°C Package Description 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP 10-Lead MSOP Package Option RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 RM-10 Branding D5A D5A D5A# D5A# D5A# D5B D5B D5B D5B# D5B# D5B# D6A D6A# D6A# D6B D6B D6B D6B# D6B# D6B# D7A D7A D6T D6T D7B D7B D7B D7B# D7B# D7B# D6A# Z = RoHS Compliant Part. W = Qualified for Automotive Applications. AUTOMOTIVE PRODUCTS The AD5312WARMZ-REEL7 model is available with controlled manufacturing to support the quality and reliability requirements of automotive applications. Note that this automotive model may have specifications that differ from the commercial models; therefore, designers should review the Specifications section of this data sheet carefully. Only the automotive grade product shown is available for use in automotive applications. Contact your local Analog Devices, Inc., account representative for specific product ordering information and to obtain the specific Automotive Reliability report for this model. Rev. D | Page 22 of 24 AD5302/AD5312/AD5322 NOTES Rev. D | Page 23 of 24 AD5302/AD5312/AD5322 NOTES ©2006-2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D00928-0-5/11(D) Rev. D | Page 24 of 24