HD74HC374/HD74HC534 Octal D-type Flip-Flops (with 3-state outputs) Octal D-type Flip-Flops (with inverted 3-state outputs) ADE-205-499 (Z) 1st. Edition Sep. 2000 Description These devices are positive edge triggered flip-flops. The difference between HD74HC374 and HD74HC534 is only that the former is a true outputs and the latter is a false outputs. Data at the D inputs, meeting the setup and hold time requirements, are transferred to the Q outputs on positive going transitions of the clock (CK) input. When a high logic level is applied to the output control (OC) input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the storage elements. Features • • • • • High Speed Operation: tpd (Clock to Q) = 18 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Function Table D HD74HC374 Q HD74HC534 Q L H H L L L L H Output Control Clock L L X No change No change H X X Z Z X : Z : irrelevant off (high-impedance) state of a 3-state output. HD74HC374/HD74HC534 Pin Arrangement HD74HC374 Output Control 1 20 VCC 1Q 2 19 8Q 1D 3 18 8D 2D 4 17 7D 2Q 5 16 7Q 3Q 6 15 6Q 3D 7 14 6D 4D 8 13 5D 4Q 9 12 5Q GND 10 11 Clock (Top view) HD74HC534 Output Control 1 20 VCC 1Q 2 19 8Q 1D 3 18 8D 2D 4 17 7D 2Q 5 16 7Q 3Q 6 15 6Q 3D 7 14 6D 4D 8 13 5D 4Q 9 12 5Q GND 10 11 Clock (Top view) 2 HD74HC374/HD74HC534 Absolute Maximum Ratings Item Symbol Rating Unit Supply voltage range VCC –0.5 to +7.0 V Input voltage VIN –0.5 to VCC + 0.5 V Output voltage VOUT –0.5 to VCC + 0.5 V DC current drain per pin I OUT ±35 mA DC current drain per VCC , GND I CC, I GND ±75 mA DC input diode current I IK ±20 mA DC output diode current I OK ±20 mA Power Dissipation per package PT 500 mW Storage temperature Tstg –65 to +150 °C Block Diagram HD74HC374 7D 6D 5D 4D 3D 2D 1D 8D D Q D Q D Q D Q D Q D Q D Q D Q C Q C Q C Q C Q C Q C Q C Q C Q Clock Output Control 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q 3 HD74HC374/HD74HC534 HD74HC534 7D 6D 5D 4D 3D 2D 1D 8D D Q D Q D Q D Q D Q D Q D Q D Q C Q C Q C Q C Q C Q C Q C Q C Q Clock Output Control 1Q 4 2Q 3Q 4Q 5Q 6Q 7Q 8Q HD74HC374/HD74HC534 DC Characteristics Ta = –40 to +85°C Ta = 25°C Item Symbol VCC (V) Min Typ Max Min Max Unit Input voltage VIH 2.0 1.5 — — 1.5 — V 4.5 3.15 — — 3.15 — 6.0 4.2 — — 4.2 — 2.0 — — 0.5 — 0.5 4.5 — — 1.35 — 1.35 6.0 — — 1.8 — 1.8 2.0 1.9 2.0 — 1.9 — 4.5 4.4 4.5 — 4.4 — 6.0 5.9 6.0 — 5.9 — 4.5 4.18 — — 4.13 — I OH = –6 mA 6.0 5.68 — — 5.63 — I OH = –7.8 mA 2.0 — 0.0 0.1 — 0.1 4.5 — 0.0 0.1 — 0.1 6.0 — 0.0 0.1 — 0.1 4.5 — — 0.26 — 0.33 I OL = 6 mA 6.0 — — 0.26 — 0.33 I OL = 7.8 mA VIL Output voltage VOH VOL Test Conditions V V V Vin = VIH or VIL I OH = –20 µA Vin = VIH or VIL I OL = 20 µA Off-state output current I OZ 6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL, Vout = VCC or GND Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND Quiescent supply current I CC 6.0 — — 4.0 40 µA Vin = VCC or GND, Iout = 0 µA — 5 HD74HC374/HD74HC534 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C Item Symbol VCC (V) Min Typ Max Min Max Unit Maximum clock f max 2.0 — — 6 — 5 MHz 4.5 — — 30 — 24 6.0 — — 35 — 28 Propagation delay t PHL 2.0 — — 140 — 175 time 4.5 — 18 28 — 35 6.0 — — 24 — 30 2.0 — — 150 — 190 4.5 — 11 30 — 38 6.0 — — 26 — 33 2.0 — — 150 — 190 4.5 — 14 30 — 38 6.0 — — 26 — 33 2.0 — — 150 — 190 4.5 — 13 30 — 38 6.0 — — 26 — 33 2.0 — — 150 — 190 4.5 — 16 30 — 38 6.0 — — 26 — 33 2.0 100 — — 125 — 4.5 20 1 — 25 — 6.0 17 — — 21 — 2.0 25 — — 31 — 4.5 5 1 — 6 — 6.0 5 — — 6 — 2.0 80 — — 100 — 4.5 16 6 — 20 — 6.0 14 — — 17 — frequency Output enable t PLH t ZL time t ZH Output disable t LZ time t HZ Setup time Hold time Pulse width t su th tw Output rise/fall t TLH 2.0 — — 60 — 75 time t THL 4.5 — 4 12 — 15 6.0 — — 10 — 13 — — 5 10 — 10 Input capacitance 6 Cin Test Conditions ns ns ns ns ns ns Data to Clock ns Clock to Data ns Clock or Output control ns pF HD74HC374/HD74HC534 Package Dimensions Unit: mm 24.50 25.40 Max 1 7.00 Max 11 6.30 20 10 1.30 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 1.27 Max 7.62 2.54 Min 5.08 Max 0.89 + 0.11 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Mass (reference value) DP-20N — Conforms 1.26 g Unit: mm 12.6 13 Max 11 1 10 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 20 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Mass (reference value) FP-20DA — Conforms 0.31 g 7 HD74HC374/HD74HC534 Unit: mm 12.8 13.2 Max 11 1 10 0.20 ± 0.10 0.935 Max *0.27 ± 0.05 0.25 ± 0.04 2.65 Max 7.50 20 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.25 10.40 +– 0.40 1.45 0° – 8° 0.57 0.70 +– 0.30 0.15 0.12 M Hitachi Code JEDEC EIAJ Mass (reference value) *Dimension including the plating thickness Base material dimension FP-20DB Conforms — 0.52 g Unit: mm 6.50 6.80 Max 11 1 10 4.40 20 0.65 *0.22+0.08 –0.07 0.20 ± 0.06 1.0 0.13 M 6.40 ± 0.20 *Dimension including the plating thickness Base material dimension 8 0.07 +0.03 –0.04 0.10 *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.65 Max 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Mass (reference value) TTP-20DA — — 0.07 g HD74HC374/HD74HC534 Cautions 1. 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Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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