ETC HPND-0002

Small Signal RF PIN Diode Chips
for Hybrid Integrated Circuits
Technical Data
HPND-0001
HPND-0002
Features
Description
• Thermocompression/
Thermosonically Bondable
These PIN/NIP diode chips are
specifically designed for hybrid
applications requiring thermosonic or thermocompression
bonding techniques. The top
metallization is a layer of gold for
a tarnish free surface that allows
either thermosonic or
thermocompression bonding
techniques. The bottom metallization is also gold, suitable for
epoxy or eutectic die attach
method.
• Ideal for Hybrid Integrated
Circuits
• Gold Metallization
• Silicon Nitride Passivation
• Uniform Electrical
Characteristics
• Batch Matched Versions
Available
• Planar Construction
Applications
These small signal, general
purpose PIN/NIP diode chips are
optimized for various analog and
digital applications such as
switches, digital phase shifters,
pulse and amplitude modulators,
limiters, leveling, and attenuating.
Outline 01B
Chip Dimensions
D
X
X
Y
FOR EPOXY OR EUTECTIC
DIE ATTACH
PART NO. HPNDDIMENSIONS
-0001
-0002
0.25
D
0.20
(10)
(8)
(0.03) (1)
X
0.51
0.38
(0.05) (2)
(20)
(15)
Y
0.15
0.15
(0.03) (1)
(6)
(6)
CATHODE
TOP CONTACT CATHODE
ANODE
ANODE
BOTTOM
CONTACT
DIMENSIONS IN MILLIMETERS (1/1000 INCH).
2-93
5965-9143E
Maximum Ratings
Junction Operating and Storage
Temperature Range ...................................................... -65°C to +150°C
TA = 25°C
PD Power Dissipation ................................................................ 250 mW
(Measured in an infinite heat sink derated linearly
to zero at 150°C.)
Operation in excess of any one of these conditions may result in
permanent damage to this device.
Electrical Specifications at TA = 25°C
Typical Parameters
Chip for
Epoxy or
Eutectic
Die Attach
HPND-
Nearest
Nearest
Equivalent
Equivalent
Surface Mount Axial Lead
Part No.
Part No.
HSMP5082-
Minimum
Breakdown
Voltage
VBR (V)
Maximum
Capacitance
Cj (pF)
Series
Resistance
RS (Ω)
Typical
Carrier
Lifetime
τ (ns)
Typical Reverse
Recovery
Time
trr (ns)
500
0001
3800
3080
100
0.20
2.0
1800
0002
3810
3081
100
0.20
3.5
1500
300
VR = VBR
Measure
IR ≤ 10 mA
VR = 50 V
*VR = 20 V
f = 1.0 MHz
IF = 100 mA
*IF = 10 mA
IF = 50 mA
IR = 250 mA
*IF = 10 mA
*IR = 6 mA
IF = 20 mA
VR = 10 V
90% Recovery
Test
Conditions
Assembly and Handling
Procedures for PIN Chips
1. Storage
Devices should be stored in a dry
nitrogen purged dessicator or
equivalent.
2. Cleaning
If required, surface contamination
may be removed with electronic
grade solvents. Typical solvents,
such as freon (T.F. or T.M.C.),
acetone, deionized water, and
methanol, or their locally approved equivalents, can be used
singularly or in combinations.
Typical cleaning times per solvent
are one to three minutes. DI water
and methanol should be used (in
that order) in the final cleans.
Final drying can be accomplished
by placing the cleaned dice on
clean filter paper and drying with
an infrared lamp for 5-10 minutes.
Acids such as hydrofluoric (HF),
nitric (HNO3), and hydrochloric
(HCl) should not be used.
The effects of cleaning methods/
solutions should be verified on
small samples prior to submitting
the entire lot.
Following cleaning, dice should
be either used in assembly
(typically within a few hours) or
stored in clean containers in a
reducing atmosphere or a vacuum
chamber.
3. Die Attach
a. Eutectic
Eutectic die attach can be accomplished by “scrubbing” the die
with/without a preform on the
header to combine with the
silicon in the die. Temperature is
approximately 400°C, with
2-94
heating times of 5-10 seconds.
(Note–times and temperature
utilized may vary depending on
the type, composition, and heat
capacity of the header or substrate used.) This method is
recommended for the HPND-000X
series.
b. Epoxy
For epoxy die-attach, conductive
silver-filled epoxies are recommended. This method can be used
for all Hewlett-Packard PIN chips.
4. Wire Bonding
Either ultrasonic, thermosonic or
thermocompression bonding
techniques can be employed.
Suggested wire is pure gold, 0.7 to
1.5 mil diameter.