PC352 PC352 Opaque*, Mini-flat Package, High Resistance to Noise Type Photocoupler ■ Features ■ Outline Dimensions 1. Opaque type, mini-flat package PC352 (1-channel) 2. High resistance to noise due to high common mode rejection voltage (VCM : TYP. 1.5kV) 3. Subminiature type (The volume is smaller than that of our conventional DIP type by as far as 30%.) 4. Isolatin voltage between input and output PC352•••Viso(rms) : 3.75kV 5. Recognized by UL, file No. E64380 * Employs double transfer mold technology (Unit : mm) 3.6±0.3 2.54±0.25 3 4.4±0.2 4 3 5 2 1 0.4±0.1 2 Anode mark ■ Applications 5.3±0.3 Epoxy resin 1. Programmable controllers 2.6±0.2 Package specification Taping reel diameter 370mm (3 000 pcs) Taping reel diameter 178mm (750 pcs) 0.1±0.1 ■ Package Specifications Model No. PC352N PC352NT 0.2±0.05 45° 0.5+0.4 −0.2 6° 7.0+0.2 −0.7 Internal connection diagram ■ Absolute Maximum Ratings 1 4 (Ta=25˚C) Unit mA A V mW V V mA mW mW ˚C ˚C kV ˚C *1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig.2 to 5 *2 Pulse width≤100µs, Duty ratio:0.01, Refer to Fig.6 *3 AC for 1min., 40 to 60% RH, f=60Hz *4 For 10s Notice 2 3 3 2 4 Anode Cathode Emitter Collector 0.2mm or more Parameter Symbol Rating *1 Forward current IF 50 *2 Peak forward current 1 IFM Input VR 6 Reverse voltage *1 P 70 Power dissipation *1 Collector-emitter voltage VCEO 35 6 Emitter-collector voltage VECO Output Collector current IC 50 *1 Collector dissipation 150 PC *1 Total power dissipation 170 Ptot Operating temperature Topr −30 to +100 Tstg −40 to +125 Storage temperature *3 Isolation voltage Viso(rms) 3.75 *4 Soldering temperature TSOL 260 1 Soldering area In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ PC352 ■ Electro-optical Characteristics Input MIN. − − − TYP. 1.2 − 30 MAX. 1.4 10 200 Unit V µA Terminal capacitance Conditions IF =20mA VR =4V V =0, f =1kHz Collector dark current ICEO VCE =20V, IF =0 − − 100 nA BVCEO IC =0.1mA, IF =0 35 − − V Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Collector-emitter saturation voltage Output Transfer characteristics (Ta=25˚C) Symbol VF IR Ct Parameter Forward voltage Reverse current pF BVECO IE =10µA, IF =0 6 − − V IC IF =5mA, VCE =5V 4.5 − 24 mA VCE(sat) IF =20mA, IC =1mA − 0.1 0.2 V Isolation resistance RISO 5×1010 1×1011 − Ω Floating capacitance Cf − 0.6 1.0 pF Cut-off frequency fc DC500V 40 to 60%RH V =0, f =1MHz VCE =5V, IC =2mA RL =100Ω, −3dB 15 80 − tr tf VCE =2V, IC =2mA RL =100Ω − − 4 5 18 20 µs µs CMR IF =0, RL =470Ω Vnp =100mV VCM=1.5kV(peak) 10 − − kV/µs Rise time Fall time Response time *5 Common mode rejection voltage *5 Refer to Fig.1 Fig.1 Test Circuit for Common Mode Rejection Voltage (dV/dt) VCM RL VCM Vnp 1) VCC VCM : High wave pulse RL=470Ω VCC=9V VO Vcp Vnp (Vcp Nearly = dV/dt×Cf×RL) 1) Vcp : Voltage which is generated by displacement current in floating capacitance between primary and secondary side. PC352 Fig.2 Forward Current vs. Ambient Temperature Fig.3 Diode Power Dissipation vs. Ambient Temperature 100 Diode power dissipation P (mW) Forward current IF (mA) 50 40 30 20 10 0 −30 0 25 50 55 75 100 80 70 60 40 20 0 −30 125 0 Fig.4 Collector Power Dissipation vs. Ambient Temperature 75 100 125 250 Total power dissipation Ptot (mW) Collector power dissipation PC (mW) 50 55 Fig.5 Total Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 −30 0 25 50 75 100 200 170 150 100 50 0 −30 125 0 Ambient temperature Ta (°C) 2000 25 50 75 100 125 Ambient temperature Ta (°C) Fig.6 Peak Forward Current vs. Duty Ratio Fig.7 Forward Current vs. Forward Voltage 500 Pulse width≤100µs Ta=25°C Ta=75˚C 200 1000 Forward current IF (mA) Peak forward current IFM (mA) 25 Ambient temperature Ta (°C) Ambient temperature Ta (°C) 500 200 100 50 50˚C 25˚C 0˚C 100 − 25˚C 50 20 10 5 2 20 1 10 5 10 −3 2 5 10 −2 2 Duty ratio 5 10 −2 2 5 1 0 0.5 1.0 1.5 2.0 2.5 Forward voltage VF (V) 3.0 3.5 PC352 Fig.8 Current Transfer Ratio vs. Forward Current Fig.9 Collector Current vs. Collector-emitter Voltage 500 40 VCE =5V IF=30mA 400 Collector current IC (mA) Current transfer ratio CTR (%) Ta=25˚C 35 Ta=25˚C 300 200 100 20mA 30 P C ( MAX.) 10mA 25 20 15 5mA 10 5 0 1 2 10 5 20 0 0 50 Forward current IF (mA) 3 4 5 6 7 8 9 10 Collector-emitter voltage VCE (V) Fig.10 Relative Current Transfer Ratio vs. Ambient Temperature Fig.11 Collector-emitter Saturation Voltage vs. Ambient Temperature 150 0.16 IF=5mA VCE =5V IF=20mA 0.14 IC=1mA Collector-emitter saturation voltage VCE (sat) (V) Relative current transfer ratio (%) 2 1 100 50 0.12 0.10 0.08 0.06 0.04 0.02 0 −30 0 25 50 75 100 0 −30 125 Ambient temperature Ta (°C) Fig.12 Collector Dark Current vs. Ambient Temperature 10 500 VCE =2V 200 IC=2mA 100 Ta=25˚C 10 −8 10 −9 50 Response time (µs) Collector dark current ICEO (A) VCE =20V −7 100 Fig.13 Response Time vs. Load Resistance −6 10 0 20 40 60 80 Ambient temperaturet Ta (°C) 10 −10 10 10 tf 5 td tr 2 ts 1 0.5 −11 −12 10 −30 20 0 20 40 60 80 100 120 140 Ambient temperature Ta (°C) 0.2 0.1 0.01 0.1 1 Load resistance RL (kΩ) 10 50 PC352 Fig.14 Test Circuit for Response Time Fig.15 Voltage Gain vs Frequency VCC RL 0 Output Input Output Input Voltage gain AV (dB) RD VCE =5V IC=2mA Ta=25˚C 10% ts tf td tr 90% −5 100Ω −10 RL =10kΩ −15 1kΩ −20 0.5 Fig.16 Collector-emitter Saturation Voltage vs. Forward Current Collector-emitter saturation voltage VCE (sat) (V) Ta =25˚C IC =0.5mA 10 2 5 20 50 Frequency Response f (kHz) 100 Fig.17 Reflow Soldering 230°C 1mA 6 3mA 200°C 5 5mA 4 180°C 7mA 3 2 25°C 1 0 30s 1min 0 1 2 4 6 3 5 Forward current IF (mA) 7 8 9 200 Only one time soldering is recommended within the temperature profile shown below. 8 7 1 10 2min 1.5min 1min 500 Application Circuits NOTICE ●The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. ●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. ●Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). ●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. ●If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. ●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. ●Contact and consult with a SHARP representative if there are any questions about the contents of this publication. 115