HCMOS Compatible, High CMR, 10 MBd Optocouplers Technical Data HCPL-261A HCPL-263A HCPL-261N HCPL-263N Features • HCMOS/LSTTL/TTL Performance Compatible • 1000 V/µs Minimum Common Mode Rejection (CMR) at VCM = 50 V (HCPL261A Family) and 15 kV/µs Minimum CMR at VCM = 1000 V (HCPL-261N Family) • High Speed: 10 MBd Typical • AC and DC Performance Specified over Industrial Temperature Range - 40°C to +85°C • Available in 8 Pin DIP, SOIC-8 Packages • Safety Approval UL Recognized per UL1577 2500 V rms for 1 minute and 5000 V rms for 1 minute (Option 020) CSA Approved VDE 0884 Approved with VIORM = 630 V peak for HCPL-261A/261N Option 060 • Computer-Peripheral Interface • Digital Isolation for A/D, D/A Conversion • Switching Power Supplies • Instrumentation Input/Output Isolation • Ground Loop Elimination • Pulse Transformer Replacement Description The HCPL-261A family of optically coupled gates shown on this data sheet provide all the benefits of the industry standard 6N137 family with the added benefit of HCMOS compatible input current. This allows direct interface to all common circuit topologies without additional LED buffer or drive components. The AlGaAs LED used allows lower drive currents and reduces degradation by using the latest LED technology. On the single channel parts, an enable output allows the detector to be strobed. The output of the detector IC is an open collector schottkyclamped transistor. The internal shield provides a minimum common mode transient immunity of 1000 V/µs for the HCPL-261A family and 15000 V/µs for the HCPL-261N family. Functional Diagram HCPL-261A/261N HCPL-061A/061N HCPL-263A/263N HCPL-063A/063N ANODE 1 1 8 VCC VE CATHODE 1 2 7 VO1 6 VO CATHODE 2 3 6 VO2 5 GND ANODE 2 4 5 GND NC 1 8 VCC ANODE 2 7 CATHODE 3 NC 4 Applications • Low Input Current (3.0 mA) HCMOS Compatible Version of 6N137 Optocoupler • Isolated Line Receiver • Simplex/Multiplex Data Transmission HCPL-061A HCPL-063A HCPL-061N HCPL-063N SHIELD TRUTH TABLE (POSITIVE LOGIC) LED ON OFF ON OFF ON OFF ENABLE H H L L NC NC OUTPUT L H H H L H SHIELD TRUTH TABLE (POSITIVE LOGIC) LED ON OFF OUTPUT L H The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is required. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. 2 Selection Guide Minimum CMR dV/dt (V/µs) VCM (V) Input OnCurrent (mA) NA NA 5 8-Pin DIP (300 Mil) Output Enable Single Channel Package YES 6N137[1] Dual Channel Package 50 HCPL-2630[1] HCPL-2601[1] YES 1,000 HCPL-2611[1] YES HCPL-2602[1] 3,500 300 YES HCPL-2612[1] 1,000 50 YES HCPL-261A 3 1,000 1,000 50 HCPL-261N HCNW2611[1] HCPL-063A HCPL-061N NO 12.5 HCNW2601[1] HCPL-0661[1] HCPL-263A YES Single and Dual Channel Packages HCPL-061A NO 1,000[2] Single Channel Package HCNW137[1] HCPL-0611[1] NO 50 Hermetic HCPL-0631[1] HCPL-4661[1] 1,000 Widebody (400 Mil) HCPL-0630[1] HCPL-2631[1] YES Dual Channel Package HCPL-0601[1] NO 10,000 Single Channel Package HCPL-0600[1] NO 5,000 Small-Outline SO-8 HCPL-263N HCPL-063N [3] HCPL-193X[1] HCPL-56XX[1] HCPL-66XX[1] Notes: 1. Technical data are on separate Agilent publications. 2. 15 kV/µs with VCM = 1 kV can be achieved using Agilent application circuit. 3. Enable is available for single channel products only, except for HCPL-193X devices. Ordering Information Specify Part Number followed by Option Number (if desired). Example: HCPL-261A#XXX 020 = 5000 V rms/1 minute UL Rating Option* 060 = VDE 0884 VIORM = 630 Vpeak Option** 300 = Gull Wing Surface Mount Option*** 500 = Tape and Reel Packaging Option Option data sheets available. Contact your Agilent sales representative or authorized distributor for information. *For HCPL-261A/261N/263A/263N (8-pin DIP products) only. **For HCPL-261A/261N only. Combination of Option 020 and Option 060 is not available. ***Gull wing surface mount option applies to through hole parts only. HCPL-263A/263N HCPL-063A/063N ICC Schematic 1 HCPL-261A/261N HCPL-061A/061N IF 8 IF1 IO1 + ICC 8 2+ IO 6 VCC VO 7 VCC VO1 VF1 – 2 SHIELD 3 VF 3 IF2 IO2 – – SHIELD IE 5 7 VE USE OF A 0.1 µF BYPASS CAPACITOR CONNECTED BETWEEN PINS 5 AND 8 IS RECOMMENDED (SEE NOTE 16). 6 GND VO2 VF2 + 4 SHIELD 5 GND 3 HCPL-261A/261N/263A/263N Outline Drawing Pin Location (for reference only) 9.40 (0.370) 9.90 (0.390) 8 7 6 5 TYPE NUMBER OPTION CODE* A XXXXZ DATE CODE 1 2 3 0.20 (0.008) 0.33 (0.013) 7.36 (0.290) 7.88 (0.310) YYWW PIN ONE 6.10 (0.240) 6.60 (0.260) 5° TYP. 4 1.78 (0.070) MAX. 1.19 (0.047) MAX. DIMENSIONS IN MILLIMETERS AND (INCHES). 4.70 (0.185) MAX. 0.51 (0.020) MIN. * MARKING CODE LETTER FOR OPTION NUMBERS. "L" = OPTION 020 "V" = OPTION 060 OPTION NUMBERS 300 AND 500 NOT MARKED. 2.92 (0.115) MIN. 0.76 (0.030) 1.40 (0.056) 0.65 (0.025) MAX. 2.28 (0.090) 2.80 (0.110) Figure 1. 8-Pin Dual In-Line Package Device Outline Drawing. PIN LOCATION (FOR REFERENCE ONLY) 9.65 ± 0.25 (0.380 ± 0.010) 8 7 6 1.02 (0.040) 1.19 (0.047) 5 4.83 TYP. (0.190) 6.350 ± 0.25 (0.250 ± 0.010) 1 2 3 9.65 ± 0.25 (0.380 ± 0.010) 4 1.19 (0.05) 1.78 (0.07) 9.65 ± 0.25 (0.380 ± 0.010) 1.780 (0.070) MAX. 1.19 (0.047) MAX. 7.62 ± 0.25 (0.300 ± 0.010) 0.20 (0.008) 0.33 (0.013) 4.19 MAX. (0.165) 1.080 ± 0.320 (0.043 ± 0.013) 2.540 (0.100) BSC 0.635 ± 0.130 (0.025 ± 0.005) 0.635 ± 0.25 (0.025 ± 0.010) DIMENSIONS IN MILLIMETERS (INCHES). TOLERANCES (UNLESS OTHERWISE SPECIFIED): xx.xx = 0.01 xx.xxx = 0.005 LEAD COPLANARITY MAXIMUM: 0.102 (0.004) Figure 2. Gull Wing Surface Mount Option #300. 0.38 (0.015) 0.64 (0.025) 12° NOM. 4 HCPL-061A/061N/063A/063N Outline Drawing 8 7 6 5 5.994 ± 0.203 (0.236 ± 0.008) XXX YWW 3.937 ± 0.127 (0.155 ± 0.005) TYPE NUMBER (LAST 3 DIGITS) DATE CODE PIN ONE 1 2 3 4 0.406 ± 0.076 (0.016 ± 0.003) 1.270 BSG (0.050) * 5.080 ± 0.127 (0.200 ± 0.005) 7° 3.175 ± 0.127 (0.125 ± 0.005) 45° X 0.432 (0.017) 0 ~ 7° 0.228 ± 0.025 (0.009 ± 0.001) 1.524 (0.060) 0.203 ± 0.102 (0.008 ± 0.004) * TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH) 0.305 MIN. (0.012) 5.207 ± 0.254 (0.205 ± 0.010) DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX. Figure 3. 8-Pin Small Outline Package Device Drawing. TEMPERATURE – °C Solder Reflow Temperature Profile (HCPL-06XX and Gull Wing Surface Mount Option 300 Parts) 260 240 220 200 180 160 140 120 100 80 60 40 20 0 ∆T = 145°C, 1°C/SEC ∆T = 115°C, 0.3°C/SEC ∆T = 100°C, 1.5°C/SEC 0 1 2 3 4 5 6 7 8 9 10 11 12 TIME – MINUTES Note: Use of Nonchlorine Activated Fluxes is Recommended. Regulatory Information The HCPL-261A and HCPL-261N families have been approved by the following organizations: CSA Approved under CSA Component Acceptance Notice #5, File CA 88324. UL Recognized under UL 1577, Component Recognition Program, File E55361. VDE Approved according to VDE 0884/06.92. (HCPL-261A/261N Option 060 only) 5 Insulation and Safety Related Specifications Parameter Minimum External Air Gap (External Clearance) Minimum External Tracking (External Creepage) Minimum Internal Plastic Gap (Internal Clearance) Tracking Resistance (Comparative Tracking Index) Isolation Group 8-Pin DIP (300 Mil) SO-8 Symbol Value Value Units L(101) 7.1 4.9 mm L(102) CTI 7.4 4.8 mm 0.08 0.08 mm 200 200 Volts IIIa IIIa Conditions Measured from input terminals to output terminals, shortest distance through air. Measured from input terminals to output terminals, shortest distance path along body. Through insulation distance, conductor to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. DIN IEC 112/ VDE 0303 Part 1 Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 – surface mount classification is Class A in accordance with CECC 00802. VDE 0884 Insulation Related Characteristics (HCPL-261A/261N Option 060 ONLY) Description Installation classification per DIN VDE 0110/1.89, Table 1 for rated mains voltage ≤ 300 V rms for rated mains voltage ≤ 450 V rms Climatic Classification Pollution Degree (DIN VDE 0110/1.89) Maximum Working Insulation Voltage Input to Output Test Voltage, Method b* VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial Discharge < 5 pC Input to Output Test Voltage, Method a* VIORM x 1.5 = VPR, Type and sample test, tm = 60 sec, Partial Discharge < 5 pC Highest Allowable Overvoltage* (Transient Overvoltage, tini = 10 sec) Safety Limiting Values (Maximum values allowed in the event of a failure, also see Figure 18, Thermal Derating curve.) Case Temperature Input Current Output Power Insulation Resistance at TS, VIO = 500 V Symbol Characteristic Units VIORM I-IV I-III 55/85/21 2 630 V peak VPR 1181 V peak VPR 945 V peak VIOTM 6000 V peak TS IS,INPUT PS,OUTPUT RS 175 230 600 ≥ 109 °C mA mW Ω *Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884), for a detailed description. Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application. 6 Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature Average Input Current Reverse Input Voltage Supply Voltage Enable Input Voltage Output Collector Current (Each Channel) Output Power Dissipation (Each Channel) Output Voltage (Each channel) Lead Solder Temperature (Through Hole Parts Only) Solder Reflow Temperature Profile (Surface Mount Parts Only) Symbol Min. Max. Units TS -55 125 °C TA -40 +85 °C IF(AVG) 10 mA VR 3 Volts VCC -0.5 7 Volts VE -0.5 5.5 Volts IO 50 mA PO 60 mW VO -0.5 7 Volts 260°C for 10 s, 1.6 mm Below Seating Plane Note 1 2 3 See Package Outline Drawings section Recommended Operating Conditions Parameter Input Voltage, Low Level Input Current, High Level Power Supply Voltage High Level Enable Voltage Low Level Enable Voltage Fan Out (at RL = 1 kΩ) Output Pull-up Resistor Operating Temperature Symbol VFL IFH VCC VEH VEL N RL TA Min. -3 3.0 4.5 2.0 0 330 -40 Max. 0.8 10 5.5 VCC 0.8 5 4k 85 Units V mA Volts Volts Volts TTL Loads Ω °C 7 Electrical Specifications Over recommended operating temperature (TA = -40°C to +85°C) unless otherwise specified. Parameter High Level Output Current Low Level Output Voltage Symbol IOH VOL 0.4 0.6 High Level Supply Current ICCH 7 9 10 15 Low Level Supply Current ICCL 8 12 13 21 High Level Enable Current** Low Level Enable Current** Input Forward Voltage Temperature Coefficient of Forward Voltage Input Reverse Breakdown Voltage Input Capacitance IEH -0.6 -1.6 IEL -0.9 -1.6 mA 1.3 1.6 V VF Min. Typ.* 3.1 1.0 ∆VF/∆TA BVR CIN Max. 100 -1.25 3 Units Test Conditions µA VCC = 5.5 V, VO = 5.5 V, VF = 0.8 V, VE = 2.0 V V VCC = 5.5 V, IOL = 13 mA (sinking), IF = 3.0 mA, VE = 2.0 V mA VE = 0.5 V** VCC = 5.5 V IF = 0 mA Dual Channel Products*** mA VE = 0.5 V** VCC = 5.5 V IF = 3.0 mA Dual Channel Products*** mA VCC = 5.5 V, VE = 2.0 V V 60 pF *All typical values at TA = 25°C, VCC = 5 V **Single Channel Products only (HCPL-261A/261N/061A/061N) ***Dual Channel Products only (HCPL-263A/263N/063A/063N) 5, 8 4, 18 4 VCC = 5.5 V, VE = 0.5 V IF = 4 mA mV/°C IF = 4 mA 5 Fig. Note 4 18 IR = 100 µA f = 1 MHz, VF = 0 V 6 4 4 4 8 Switching Specifications Over recommended operating temperature (TA = -40°C to +85°C) unless otherwise specified Parameter Input Current Threshold High to Low Propagation Delay Time to High Output Level Propagation Delay Time to Low Output Level Pulse Width Distortion Symbol ITHL tPLH tPHL Min. Typ.* Max. Units Test Conditions Fig. Note 1.5 3.0 mA VCC = 5.5 V, VO = 0.6 V, 7, 10 18 IO >13 mA (Sinking) 52 100 ns IF = 3.5 mA 9, 11, 4, 9, VCC = 5.0 V, 12 18 VE = Open, CL = 15 pF, 53 100 ns 9, 11, 4, 10, RL = 350 Ω 12 18 PWD |tPHL - tPLH| Propagation Delay Skew tPSK Output Rise Time tR Output Fall Time tF Propagation Delay tEHL Time of Enable from VEH to VEL Propagation Delay tELH Time of Enable from VEL to VEH 11 45 ns 9, 13 17, 18 60 42 12 19 ns ns ns ns 24 11, 18 9, 14 4, 18 9, 14 4, 18 15, 12 16 30 ns IF = 3.5 mA VCC = 5.0 V, VEL = 0 V, VEH = 3 V, CL = 15 pF, RL = 350 Ω 15, 16 12 *All typical values at TA = 25°C, VCC = 5 V. Common Mode Transient Immunity Specifications, All values at TA = 25°C Parameter Output High Level Common Mode Transient Immunity Device Symbol Min. HCPL-261A |CMH| 1 HCPL-061A HCPL-263A HCPL-063A HCPL-261N 1 HCPL-061N HCPL-263N 15 HCPL-063N Output Low HCPL-261A |CML| 1 Level Common HCPL-061A Mode Transient HCPL-263A Immunity HCPL-063A HCPL-261N 1 HCPL-061N HCPL-263N 15 HCPL-063N Typ. Max. Units Test Conditions 5 kV/µs VCM = 50 V VCC = 5.0 V, RL = 350 Ω, IF = 0 mA, TA = 25°C 5 kV/µs VCM = 1000 V VO(MIN) = 2 V 25 5 5 25 kV/µs Fig. Note 17 4, 13, 15, 18 Using Agilent App Circuit kV/µs VCM = 50 V VCC = 5.0 V, RL = 350 Ω, IF = 3.5 mA, VO(MAX) = 0.8 V T kV/µs VCM = 1000 V A = 25°C 4, 13, 15 17 4, 14, 15, 18 kV/µs 20 Using Agilent App Circuit 20 4, 14, 15 9 Package Characteristics All Typicals at TA = 25°C Parameter Input-Output Momentary Withstand Voltage** Input-Output Resistance Input-Output Capacitance Input-Input Insulation Leakage Current Resistance (Input-Input) Capacitance (Input-Input) Sym. VISO Package* Min. 2500 OPT 020† 5000 Typ. Max. Units V rms RI-O 1012 Ω CI-O 0.6 pF II-I Dual Channel 0.005 µA RI-I Dual Channel 1011 Ω CI-I Dual 8-pin DIP Dual SO-8 0.03 0.25 pF Test Conditions RH ≤ 50%, t = 1 min., TA = 25°C VI-O = 500 Vdc f = 1 MHz, TA = 25°C RH ≤ 45%, t = 5 s, VI-I = 500 V Fig. Note 5, 6 5, 7 4, 8 4, 8 19 19 f = 1 MHz 19 *Ratings apply to all devices except otherwise noted in the Package column. **The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.” †For 8-pin DIP package devices (HCPL-261A/261N/263A/263N) only. Notes: 1. Peaking circuits may be used which produce transient input currents up to 30 mA, 50 ns maximum pulse width, provided the average current does not exceed 10 mA. 2. 1 minute maximum. 3. Derate linearly above 80°C free-air temperature at a rate of 2.7 mW/°C for the SOIC-8 package. 4. Each channel. 5. Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together. 6. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 3000 VRMS for 1 second (leakage detection current limit, II-O ≤ 5 µA). This test is performed before the 100% production test for partial discharge (method b) shown in the VDE 0884 Insulation Characteristics Table, if applicable. 7. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 6000 VRMS for 1 second (leakage detection current limit, II-O ≤ 5 µA). 8. Measured between the LED anode and cathode shorted together and pins 5 through 8 shorted together. 9. The t PLH propagation delay is measured from the 1.75 mA point on the falling edge of the input pulse to the 1.5 V point on the rising edge of the output pulse. 10. The t PHL propagation delay is measured from the 1.75 mA point on the rising edge of the input pulse to the 1.5 V point on the falling edge of the output pulse. 11. Propagation delay skew (tPSK ) is equal to the worst case difference in t PLH and/or tPHL that will be seen between any two units under the same test conditions and operating temperature. 12. Single channel products only (HCPL261A/261N/061A/061N). 13. Common mode transient immunity in a Logic High level is the maximum tolerable |dVCM/dt| of the common mode pulse, VCM, to assure that the output will remain in a Logic High state (i.e., Vo > 2.0 V). 14. Common mode transient immunity in a Logic Low level is the maximum tolerable |dVCM/dt| of the common mode pulse, VCM, to assure that the output will remain in a Logic Low state (i.e., VO < 0.8 V). 15. For sinusoidal voltages (|dVCM /dt|)max = πf CM VCM(P-P). 16. Bypassing of the power supply line is required with a 0.1 µF ceramic disc capacitor adjacent to each optocoupler as shown in Figure 19. Total lead length between both ends of the capacitor and the isolator pins should not exceed 10 mm. 17. Pulse Width Distortion (PWD) is defined as the difference between tPLH and tPHL for any given device. 18. No external pull up is required for a high logic state on the enable input of a single channel product. If the VE pin is not used, tying VE to VCC will result in improved CMR performance. 19. Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. For dual channel parts only. 15 VCC = 5.5 V VO = 5.5 V VE = 2 V VF = 0.8 V 10 5 0 -60 -40 -20 20 0 60 40 80 100 80 100.0 IF – INPUT FORWARD CURRENT – mA IOL – LOW LEVEL OUTPUT CURRENT – mA IOH – HIGH LEVEL OUTPUT CURRENT – µA 10 VCC = 5 V VE = 2 V VOL = 0.6 V IF = 3.5 mA 60 40 20 0 -60 -40 -20 TA – TEMPERATURE – °C 20 0 40 60 80 100 TA – TEMPERATURE – °C Figure 4. Typical High Level Output Current vs. Temperature. 10.0 TA = 85 °C TA = 40 °C 1.0 TA = 25 °C 0.1 0.01 1.0 1.1 IF + VF – 1.3 1.4 1.2 VF – FORWARD VOLTAGE – V Figure 5. Low Level Output Current vs. Temperature. Figure 6. Typical Diode Input Forward Current Characteristic. VOL – LOW LEVEL OUTPUT VOLTAGE – V HCPL-261A fig 5 VO – OUTPUT VOLTAGE – V 5.0 4.0 RL = 350 Ω 3.0 RL = 1 kΩ 2.0 RL = 4 kΩ 1.0 0 0 0.5 1.0 1.5 2.0 0.6 VCC = 5.5 V VE = 2 V IF = 3.0 mA 0.5 IO = 16 mA IO = 12.8 mA 0.4 0.3 IO = 9.6 mA IO = 6.4 mA 0.2 -60 -40 -20 0 20 40 Figure 7. Typical Output Voltage vs. Forward Input Current. IF INPUT MONITORING NODE +5 V 1 VCC 8 2 7 3 6 4 5 0.1 µF BYPASS RL *CL RM 80 100 Figure 8. Typical Low Level Output Voltage vs. Temperature. HCPL-261A/261N PULSE GEN. Z O = 50 Ω t f = t r = 5 ns 60 TA – TEMPERATURE – °C IF – FORWARD INPUT CURRENT – mA GND OUTPUT VO MONITORING NODE *CL IS APPROXIMATELY 15 pF WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. I F = 3.5 mA INPUT IF 90% 90% VOH I F = 1.75 mA t PHL OUTPUT VO Figure 9. Test Circuit for tPHL and tPLH . 10% 10% t PLH VOL 1.5 V trise tfall 1.5 120 1.5 RL = 350 Ω RL = 1 kΩ 1.0 RL = 4 kΩ 0.5 VCC = 5 V VO = 0.6 V 0 -60 -40 -20 0 20 40 60 100 80 60 20 PWD – ns 30 20 RL = 1 kΩ RL = 350 Ω 20 40 60 TA – TEMPERATURE – °C Figure 13. Typical Pulse Width Distortion vs. Temperature. 80 100 tr, tf – RISE, FALL TIME – ns VCC = 5 V IF = 3.5 mA 0 0 VCC = 5 V IF = 3.5 mA 20 40 60 80 100 Figure 11. Typical Propagation Delay vs. Temperature. 160 RL = 4 kΩ 0 -60 -40 -20 TPLH RL = 350 k TA – TEMPERATURE – °C 60 10 TPHL RL = 350 Ω, 1 kΩ, 4 kΩ 0 -60 -40 -20 80 100 Figure 10. Typical Input Threshold Current vs. Temperature. 40 TPLH RL = 1 k 40 TA – TEMPERATURE – °C 50 120 TPLH RL = 4 k 140 VCC = 5 V IF = 3.5 mA trise tfall RL = 4 kΩ 120 60 RL = 1 kΩ 40 RL = 350 Ω 20 0 -60 -40 -20 RL = 350 Ω, 1 kΩ, 4 kΩ 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 14. Typical Rise and Fall Time vs. Temperature. tp – PROPAGATION DELAY – ns 2.0 tp – PROPAGATION DELAY – ns ITH – INPUT THRESHOLD CURRENT – mA 11 100 TPLH RL = 4 kΩ 80 TPLH RL = 1 kΩ 60 TPLH RL = 350 Ω 40 TPHL RL = 350 Ω, 1 kΩ, 4 kΩ 20 0 VCC = 5 V TA = 25 °C 0 2 4 6 8 10 12 IF – PULSE INPUT CURRENT – mA Figure 12. Typical Propagation Delay vs. Pulse Input Current. PULSE GEN. Z O = 50 Ω t f = t r = 5 ns INPUT VE MONITORING NODE HCPL-261A/261N 3.5 mA IF +5 V VCC 8 1 0.1 µF BYPASS 2 7 3 6 RL OUTPUT VO MONITORING NODE *C L 4 GND 5 tE – ENABLE PROPAGATION DELAY – ns 12 120 VCC = 5 V VEH = 3 V VEL = 0 V 90 IF = 3.5 mA tELH, RL = 4 kΩ 60 tELH, RL = 1 kΩ tELH, RL = 350 Ω 30 tEHL, RL = 350 Ω, 1k Ω, 4 kΩ 0 -60 -40 -20 0 20 40 60 80 100 TA – TEMPERATURE – °C Figure 16. Typical Enable Propagation Delay vs. Temperature. HCPL261A/-261N/-061A/-061N Only. *CL IS APPROXIMATELY 15 pF WHICH INCLUDES PROBE AND STRAY WIRING CAPACITANCE. 3.0 V INPUT VE 1.5 V t EHL t ELH OUTPUT VO 1.5 V HCPL-261A/261N V CM 1 VCC 8 2 7 3 6 4 GND 5 IF A B VFF +5 V 0.1 µF BYPASS 350 Ω OUTPUT VO MONITORING NODE OUTPUT POWER – PS, INPUT CURRENT – IS Figure 15. Test Circuit for tEHL and tELH. 800 HCPL-261A/261N OPTION 060 ONLY PS (mW) 700 IS (mA) 600 500 400 300 200 100 0 0 25 50 75 100 125 150 175 200 TS – CASE TEMPERATURE – °C PULSE GEN. Z O = 50 Ω + _ Figure 18. Thermal Derating Curve, Dependence of Safety Limiting Value with Case Temperature per VDE 0884. VCM (PEAK) VCM VO 0V 5V SWITCH AT A: IF = 0 mA CM H VO (min.) SWITCH AT B: IF = 3.5 mA VO VO (max.) 0.5 V CM L Figure 17. Test Circuit for Common Mode Transient Immunity and Typical Waveforms. 13 SINGLE CHANNEL PRODUCTS Application Information Common-Mode Rejection for HCPL-261A/HCPL-261N Families: Figure 20 shows the recommended drive circuit for the HCPL-261N/-261A for optimal common-mode rejection performance. Two main points to note are: 1. The enable pin is tied to VCC rather than floating (this applies to single-channel parts only). 2. Two LED-current setting resistors are used instead of one. This is to balance ILED variation during commonmode transients. GND BUS (BACK) VCC BUS (FRONT) N.C. ENABLE (IF USED) 0.1µF OUTPUT 1 N.C. N.C. ENABLE (IF USED) 0.1µF N.C. OUTPUT 2 10 mm MAX. (SEE NOTE 16) DUAL CHANNEL PRODUCTS GND BUS (BACK) VCC BUS (FRONT) OUTPUT 1 0.1µF OUTPUT 2 10 mm MAX. (SEE NOTE 16) Figure 19. Recommended Printed Circuit Board Layout. * HCPL-261A/261N 1 VCC 357 Ω (MAX.) 357 Ω (MAX.) 74LS04 OR ANY TOTEM-POLE OUTPUT LOGIC GATE 8 VCC+ 0.01 µF 350 Ω 2 7 3 6 VO 5 GND 4 SHIELD * GND1 GND2 * HIGHER CMR MAY BE OBTAINABLE BY CONNECTING PINS 1, 4 TO INPUT GROUND (GND1). Figure 20. Recommended Drive Circuit for HCPL-261A/-261N Families for HighCMR (Similar for HCPL-263A/-263N). *Higher CMR May Be Obtainable by Connecting Pins 1, 4 to Input Ground (Gnd1). If the enable pin is left floating, it is possible for common-mode transients to couple to the enable pin, resulting in common-mode failure. This failure mechanism only occurs when the LED is on and the output is in the Low State. It is identified as occurring when the transient output voltage rises above 0.8 V. Therefore, the enable pin should be connected to either VCC or logic-level high for best common-mode performance with the output low (CMRL). This failure mechanism is only present in single-channel parts (HCPL-261N, -261A, -061N, -061A) which have the enable function. Also, common-mode transients can capacitively couple from the LED anode (or cathode) to the output-side ground causing current to be shunted away from the LED (which can be bad if the LED is on) or conversely cause current to be injected into the LED (bad if the LED is meant to be off). Figure 21 shows the parasitic capacitances which exists between LED 14 anode/cathode and output ground (CLA and CLC). Also shown in Figure 21 on the input side is an AC-equivalent circuit. Table 1 indicates the directions of ILP and ILN flow depending on the direction of the common-mode transient. For transients occurring when the LED is on, common-mode rejection (CMRL, since the output is in the “low” state) depends upon the amount of LED current drive (IF). For conditions where IF is close to the switching threshold (ITH), CMRL also depends on the extent which ILP and I LN balance each other. In other words, any condition where common-mode transients cause a momentary decrease in IF (i.e. when dVCM /dt>0 and |IFP| > |IFN|, referring to Table 1) will cause common-mode failure for transients which are fast enough. CMR with Other Drive Circuits CMR performance with drive circuits other than that shown in Figure 20 may be enhanced by following these guidelines: 1. Use of drive circuits where current is shunted from the LED in the LED “off” state (as shown in Figures 22 and 23). This is beneficial for good CMRH. 2. Use of IFH > 3.5 mA. This is good for high CMRL. Using any one of the drive circuits in Figures 22-24 with IF = 10 mA will result in a typical CMR of 8 kV/µs for the HCPL261N family, as long as the PC board layout practices are followed. Figure 22 shows a 1 8 2 7 1/2 RLED Likewise for common-mode transients which occur when the LED is off (i.e. CMRH, since the output is “high”), if an imbalance between ILP and I LN results in a transient IF equal to or greater than the switching threshold of the optocoupler, the transient “signal” may cause the output to spike below 2 V (which constitutes a CMRH failure). circuit which can be used with any totem-pole-output TTL/ LSTTL/HCMOS logic gate. The buffer PNP transistor allows the circuit to be used with logic devices which have low currentsinking capability. It also helps maintain the driving-gate powersupply current at a constant level to minimize ground shifting for other devices connected to the input-supply ground. When using an open-collector TTL or open-drain CMOS logic gate, the circuit in Figure 23 may be used. When using a CMOS gate to drive the optocoupler, the circuit shown in Figure 24 may be used. The diode in parallel with the RLED speeds the turn-off of the optocoupler LED. VCC+ 0.01 µF 350 Ω ILP 1/2 RLED 3 CLA ILN 6 VO 15 pF CLC 4 5 GND SHIELD – + VCM Figure 21. AC Equivalent Circuit for HCPL-261X. VCC By using the recommended circuit in Figure 20, good CMR can be achieved. (In the case of the -261N families, a minimum CMR of 15 kV/µs is guaranteed using this circuit.) The balanced ILED-setting resistors help equalize ILP and I LN to reduce the amount by which ILED is modulated from transient coupling through CLA and CLC. HCPL-261X 420 Ω (MAX) 74L504 (ANY TTL/CMOS GATE) 2N3906 (ANY PNP) 1 2 LED 3 4 Figure 22. TTL Interface Circuit for the HCPL-261A/261N Families. 15 VCC VCC HCPL-261X 820 Ω 1 2 74HC00 (OR ANY OPEN-COLLECTOR/ OPEN-DRAIN LOGIC GATE) HCPL-261A/261N 1 1N4148 LED 3 2 750 Ω 74HC04 (OR ANY TOTEM-POLE OUTPUT LOGIC GATE) LED 3 4 4 Figure 23. TTL Open-Collector/Open Drain Gate Drive Circuit for HCPL-261A/-261N Families. Figure 24. CMOS Gate Drive Circuit for HCPL-261A/261N Families. Table 1. Effects of Common Mode Pulse Direction on Transient ILED If dVCM /dt Is: positive (>0) negative (<0) then ILP Flows: away from LED anode through CLA toward LED anode through CLA Propagation Delay, PulseWidth Distortion and Propagation Delay Skew Propagation delay is a figure of merit which describes how quickly a logic signal propagates through a system. The propagation delay from low to high (tPLH) is the amount of time required for an input signal to propagate to the output, causing the output to change from low to high. Similarly, the propagation delay from high to low (tPHL) is the amount of time required for the input signal to propagate to the output, causing the output to change from high to low (see Figure 9). Pulse-width distortion (PWD) results when tPLH and tPHL differ in value. PWD is defined as the difference between tPLH and tPHL and often determines the and ILN Flows: away from LED cathode through CLC toward LED cathode through CLC If |I LP| < |ILN|, LED IF Current Is Momentarily: increased If |I LP| > |ILN|, LED IF Current Is Momentarily: decreased decreased increased maximum data rate capability of a transmission system. PWD can be expressed in percent by dividing the PWD (in ns) by the minimum pulse width (in ns) being transmitted. Typically, PWD on the order of 20-30% of the minimum pulse width is tolerable; the exact figure depends on the particular application (RS232, RS422, T-1, etc.). Propagation delay skew, tPSK, is an important parameter to consider in parallel data applications where synchronization of signals on parallel data lines is a concern. If the parallel data is being sent through a group of optocouplers, differences in propagation delays will cause the data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delay is large enough it will determine the maximum rate at which parallel data can be sent through the optocouplers. Propagation delay skew is defined as the difference between the minimum and maximum propagation delays, either tPLH or tPHL, for any given group of optocouplers which are operating under the same conditions (i.e., the same drive current, supply voltage, output load, and operating temperature). As illustrated in Figure 25, if the inputs of a group of optocouplers are switched either ON or OFF at the same time, tPSK is the difference between the shortest propagation delay, either tPLH or t PHL, and the longest propagation delay, either tPLH or tPHL. As mentioned earlier, tPSK can determine the maximum parallel data transmission rate. Figure 26 is the timing diagram of a typical parallel data application with both the clock and the data lines being sent through optocouplers. The figure shows data and clock signals at the inputs and outputs of the optocouplers. To obtain the maximum data transmission rate, both edges of the clock signal are being used to clock the data; if only one edge were used, the clock signal would need to be twice as fast. Propagation delay skew represents the uncertainty of where an edge might be after being sent through an optocoupler. Figure 26 shows that there will be uncertainty in both the data and the clock lines. It is important that these two areas of uncertainty not overlap, otherwise the clock signal might arrive before all of the data outputs have settled, or some of the data outputs may start to change before the clock signal has arrived. From these considerations, the absolute minimum pulse width that can be sent through optocouplers in a parallel application is twice tPSK. A cautious design should use a slightly longer pulse width to ensure that any additional uncertainty in the rest of the circuit does not cause a problem. IF 50% 1.5 V VO TPHL IF 50% TPLH VO 1.5 V t PSK Figure 25. Illustration of Propagation Delay Skew – tPSK. DATA INPUTS CLOCK DATA OUTPUTS t PSK CLOCK t PSK Figure 26. Parallel Data Transmission Example. The tPSK specified optocouplers offer the advantages of guaranteed specifications for propagation delays, pulse-width distortion, and propagation delay skew over the recommended temperature, input current, and power supply ranges. www.semiconductor.agilent.com Data subject to change. Copyright © 1999 Agilent Technologies Obsoletes 5965-3593E 5968-1087E (11/99)