AD ADG1439BCPZ

Serially Controlled, ±15 V/+12 V/±5 V, 8-Channel/
4-Channel, iCMOS Multiplexers/Matrix Switches
ADG1438/ADG1439
FEATURES
FUNCTIONAL BLOCK DIAGRAM
ADG1438
ADG1439
S1
S1A
DA
S4A
D
S1B
DB
S4B
APPLICATIONS
INPUT SHIFT
REGISTER
Relay replacement
Audio and video routing
Automatic test equipment
Data acquisition systems
Temperature measurement systems
Avionics
Battery-powered systems
Communication systems
Medical equipment
INPUT SHIFT
REGISTER
SDO
SCLK SYNC DIN RESET
Figure 1.
SDO
SCLK SYNC DIN RESET
08496-002
S8
08496-001
Serial interface up to 50 MHz
SDO daisy-chaining option
9.5 Ω on resistance @ 25°C
1.6 Ω on-resistance flatness
Fully specified at ±15 V/+12 V/±5 V
3 V logic-compatible inputs
Rail-to-rail operation
20-lead TSSOP and 20-lead ,4 mm × 4 mm LFCSP packages
Figure 2.
GENERAL DESCRIPTION
The ADG1438 and ADG1439 are CMOS analog matrix switches
with a serially controlled 3-wire interface. The ADG1438 is an
8-channel matrix switch, and the ADG1439 is a dual 4-channel
matrix switch.
The ADG1438/ADG1439 use a versatile 3-wire serial interface
that operates at clock rates of up to 50 MHz and is compatible
with standard SPI, QSPI™, MICROWIRE™, and DSP interface
standards. The output of the shift register, SDO, enables a
number of the ADG1438/ADG1439 parts to be daisy-chained.
On power-up, the internal shift register contains all zeros, and
all switches are in the off state.
Each switch conducts equally well in both directions when on,
making these parts suitable for both multiplexing and demultiplexing applications. Because each switch is turned on or off by
a separate bit, these parts can also be configured as a type of
switch array, where any, all, or none of the eight switches can be
closed at any time. The input signal range extends to the supply
rails. All channels exhibit break-before-make switching action,
preventing momentary shorting when switching channels.
The ultralow on resistance and on-resistance flatness of these
switches make them ideal solutions for data acquisition and
gain switching applications where low distortion is critical.
iCMOS® construction ensures ultralow power dissipation,
making the parts ideally suited for portable and batterypowered instruments.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
50 MHz serial interface.
9.5 Ω on resistance.
1.6 Ω on-resistance flatness.
3 V logic-compatible digital input, VINH = 2.0 V, VINL = 0.8 V.
Table 1. Related Devices
Part No.
ADG1408/ADG1409
Description
Low on resistance, parallel
interface, 4-/8-channel ±15 V
multiplexers
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2009 Analog Devices, Inc. All rights reserved.
ADG1438/ADG1439
TABLE OF CONTENTS
Features .............................................................................................. 1 Thermal Resistance .................................................................... 10 Applications ....................................................................................... 1 ESD Caution................................................................................ 10 Functional Block Diagram .............................................................. 1 Pin Configurations and Function Descriptions ......................... 11 General Description ......................................................................... 1 Typical Performance Characteristics ........................................... 13 Product Highlights ........................................................................... 1 Test Circuits ..................................................................................... 16 Revision History ............................................................................... 2 Terminology .................................................................................... 18 Specifications..................................................................................... 3 Theory of Operation ...................................................................... 19 ±15 V Dual Supply ....................................................................... 3 Serial Interface ............................................................................ 19 12 V Single Supply ........................................................................ 5 Input Shift Register .................................................................... 19 ±5 V Dual Supply ......................................................................... 7 Power-On Reset .......................................................................... 19 Continuous Current per Channel .............................................. 8 Daisy-Chaining ........................................................................... 19 Timing Characteristics ................................................................ 9 Outline Dimensions ....................................................................... 20 Timing Diagram ........................................................................... 9 Ordering Guide .......................................................................... 20 Absolute Maximum Ratings.......................................................... 10 REVISION HISTORY
10/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 20
ADG1438/ADG1439
SPECIFICATIONS
±15 V DUAL SUPPLY
VDD = +15 V ± 10%, VSS = –15 V ± 10%, VL = 2.7 V to 5.5 V, GND = 0 V, unless otherwise noted.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Match Between
Channels (ΔRON)
On-Resistance Flatness (RFLAT(ON))
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Drain Off Leakage, ID (Off )
ADG1438
ADG1439
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
+25°C
−40°C to
+85°C
−40°C to
+125°C
VSS to VDD
9.5
11.5
0.55
14
1
1.6
1.5
1.9
2.15
±0.05
±0.15
±0.05
±0.25
±0.25
±0.01
±0.3
16
1.7
2.3
±1
±2
±3
±1.5
±12
±6
±3
±12
2.0
0.8
±0.001
±0.1
Digital Input Capacitance, CIN
LOGIC OUTPUTS (SDO)
Output Low Voltage, VOL 1
High Impedance Leakage Current
4
0.4
0.6
Ω max
Ω typ
Ω max
Ω typ
VDD = +13.5 V, VSS = −13.5 V, VS = ±10 V,
IS = −10 mA; see Figure 27.
VDD = +13.5 V, VSS = −13.5 V, VS = ±10 V,
IS = −10 mA.
VDD = +13.5 V, VSS = −13.5 V, VS = ±10 V,
IS = −10 mA.
Ω max
nA typ
nA max
nA typ
nA max
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
VDD = +16.5 V, VSS = −16.5 V.
VS = ±10 V, VD = ‫ט‬10 V; see Figure 28.
VS = ±10 V, VD = ‫ט‬10 V; see Figure 28.
VS = VD = ±10 V; see Figure 29.
VIN = VGND or VL.
ISINK = 3 mA.
ISINK = 6 mA.
4
55
ns typ
RL = 100 Ω, CL = 35 pF.
ns min
ns typ
ns max
pC typ
VS1 = VS2 = 10 V; see Figure 31.
RL = 100 Ω, CL = 35 pF.
VS = 10 V; see Figure 30.
VS = 0 V, RS = 0 Ω, CL = 1 nF;
see Figure 32.
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 33.
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 34.
RL = 110 Ω, 15 V p-p, f = 20 Hz to
20 kHz; see Figure 36.
0.001
30
Transition Time, tTRANSITION
V
Ω typ
Test Conditions/Comments
V max
V max
μA typ
μA max
pF typ
±1
High Impedance Output
Capacitance1
DYNAMIC CHARACTERISTICS1
Break-Before-Make Time Delay,
tBBM
Unit
Charge Injection
80
100
4
Off Isolation
−70
dB typ
Channel-to-Channel Crosstalk
−70
dB typ
Total Harmonic Distortion (THD + N)
0.057
% typ
120
130
Rev. 0 | Page 3 of 20
ADG1438/ADG1439
Parameter
−3 dB Bandwidth
ADG1438
ADG1439
Insertion Loss
CS (Off )
CD (Off )
ADG1438
ADG1439
CD, CS (On)
ADG1438
ADG1439
POWER REQUIREMENTS
IDD
+25°C
−40°C to
+85°C
−40°C to
+125°C
MHz typ
MHz typ
dB typ
9
pF typ
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 35.
f = 1 MHz.
58
28
pF typ
pF typ
f = 1 MHz.
f = 1 MHz.
286
139
pF typ
pF typ
f = 1 MHz.
f = 1 MHz.
VDD = +16.5 V, VSS = −16.5 V.
Digital inputs = 0 V or VL.
0.001
0.3
1
IL Active – 30 MHz
0.26
IL Active – 50 MHz
0.42
ISS
0.001
0.3
0.5
VDD/VSS
1
Test Conditions/Comments
RL = 50 Ω, CL = 5 pF; see Figure 35.
82
130
0.7
1
IL Inactive
Unit
0.35
0.55
1
±4.5/±16.5
Guaranteed by design, not subject to production test.
Rev. 0 | Page 4 of 20
μA typ
μA max
μA typ
μA max
mA typ
mA max
mA typ
mA max
μA typ
μA max
V min/Vmax
Digital inputs = 0 V or VL.
Digital inputs toggle between
0 V and VL.
Digital inputs toggle between
0 V and VL.
Digital inputs = 0 V or VL.
ADG1438/ADG1439
12 V SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, VL = 2.7 V to 5.5 V, GND = 0 V, unless otherwise noted.
Table 3.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Match Between
Channels (ΔRON)
On-Resistance Flatness (RFLAT(ON))
+25°C
−40°C to
+85°C
−40°C to +125°C
Unit
0 to VDD
V
Ω typ
18
21.5
0.55
26
1.2
1.6
28.5
1.8
5
6
6.9
7.3
±0.02
±0.15
±0.02
±1
Drain Off Leakage, ID (Off )
±0.25
±0.25
±0.05
±0.3
±3
±1.5
±12
±6
±3
±12
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
2.0
0.8
±0.001
±0.1
Digital Input Capacitance, CIN
LOGIC OUTPUTS (SDO)
Output Low Voltage, VOL 1
High Impedance Leakage Current
4
0.4
0.6
V min
V max
μA typ
μA max
pF typ
115
ns typ
60
Transition Time, tTRANSITION
nA max
nA max
nA typ
nA max
4
±1
High Impedance Output
Capacitance1
DYNAMIC CHARACTERISTICS1
Break-Before-Make Time Delay,
tBBM
nA max
nA typ
V max
V max
μA typ
μA max
pF typ
0.001
ns min
ns typ
ns max
pC typ
Charge Injection
155
195
7
Off Isolation
−70
dB typ
Channel-to-Channel Crosstalk
−70
dB typ
−3 dB Bandwidth
ADG1438
ADG1439
58
105
MHz typ
MHz typ
235
260
Rev. 0 | Page 5 of 20
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA.
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA.
Ω max
nA typ
±2
VDD = 10.8 V, VSS = 0 V; VS = 0 V to 10 V,
IS = −10 mA; see Figure 27.
Ω max
Ω typ
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
ADG1438
ADG1439
Channel On Leakage, ID, IS (On)
Ω max
Ω typ
Test Conditions/Comments
VDD = 10.8 V.
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 28.
VS = 1 V/10 V, VD = 10 V/1 V; see
Figure 28.
VS = VD = 1 V or 10 V; see Figure 29.
VIN = VGND or VL.
ISINK = 3 mA.
ISINK = 6 mA.
RL = 100 Ω, CL = 35 pF.
VS1 = VS2 = 8 V; see Figure 31.
RL = 100 Ω, CL = 35 pF.
VS = 8 V; see Figure 30.
VS = 6 V, RS = 0 Ω, CL = 1 nF;
see Figure 32.
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 33.
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 34.
RL = 50 Ω, CL = 5 pF; see Figure 35.
ADG1438/ADG1439
−40°C to
+85°C
Parameter
Insertion Loss
+25°C
1.3
−40°C to +125°C
CS (Off )
CD (Off )
ADG1438
ADG1439
CD, CS (On)
ADG1438
ADG1439
POWER REQUIREMENTS
IDD
14
pF typ
Test Conditions/Comments
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
see Figure 35.
f = 1 MHz.
86
42
pF typ
pF typ
f = 1 MHz.
f = 1 MHz.
295
145
pF typ
pF typ
f = 1 MHz.
f = 1 MHz.
VDD = 13.2 V.
Digital inputs = 0 V or VL.
0.001
1
IL Inactive
0.3
1
IL Active – 30 MHz
0.26
IL Active – 50 MHz
0.42
ISS
0.001
0.3
0.5
VDD
1
0.35
0.55
1
5/16.5
Guaranteed by design, not subject to production test.
Rev. 0 | Page 6 of 20
Unit
dB typ
μA typ
μA max
μA typ
μA max
mA typ
mA max
mA typ
mA max
μA typ
μA max
V min/Vmax
Digital inputs = 0 V or VL.
Digital inputs toggle between
0 V and VL.
Digital inputs toggle between
0 V and VL.
Digital inputs = 0 V or VL.
ADG1438/ADG1439
±5 V DUAL SUPPLY
VDD = +5 V ± 10%, VSS = −5 V ± 10%, VL = 2.7 V to VDD, GND = 0 V, unless otherwise noted.
Table 4.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
On-Resistance Match Between
Channels (ΔRON)
On-Resistance Flatness (RFLAT(ON))
+25°C
−40°C to
+85°C
−40°C to
+125°C
VSS to VDD
21
25
0.6
29
1.3
1.7
32
1.9
5.2
6.4
7.3
7.6
Unit
V
Ω typ
Ω max
Ω typ
Ω max
Ω typ
Drain Off Leakage, ID (Off )
ADG1438
ADG1439
Channel On Leakage, ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
High Impedance Leakage Current
±0.02
±0.15
±0.02
±0.25
±0.25
±0.05
±0.3
±1
±2
±3
±1.5
±12
±6
±3
±12
2.0
0.8
±0.001
4
0.4
0.6
0.001
±1
High Impedance Output
Capacitance1
DYNAMIC CHARACTERISTICS1
Break-Before-Make Time Delay, tBBM
4
150
80
Transition Time, tTRANSITION
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5V,
IS = −10 mA.
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5 V,
IS = −10 mA.
VDD = +5.5 V, VSS = −5.5 V.
±0.1
Digital Input Capacitance, CIN
LOGIC OUTPUTS (SDO)
Output Low Voltage, VOL 1
VDD = +4.5 V, VSS = −4.5 V, VS = ±4.5 V,
IS = −10 mA; see Figure 27.
Ω max
LEAKAGE CURRENTS
Source Off Leakage, IS (Off )
Test Conditions/Comments
Charge Injection
Off Isolation
Channel-to-Channel Crosstalk
Total Harmonic Distortion (THD + N)
200
230
5
−70
−70
0.14
−3 dB Bandwidth
ADG1438
ADG1439
Insertion Loss
CS (Off )
62
116
1.2
12
315
350
nA typ
nA max
nA typ
nA max
nA max
nA typ
nA max
V min
V max
μA typ
μA max
pF typ
VS = ±4.5 V, VD = ‫ט‬4.5 V; see Figure 28.
VS = VD = ±4.5 V; see Figure 29.
VIN = VGND or VL.
V max
V max
μA typ
μA max
pF typ
ISINK = 3 mA.
ISINK = 6 mA.
ns typ
ns min
ns typ
ns max
pC typ
dB typ
dB typ
% typ
RL = 100 Ω, CL = 35 pF.
VS1 = VS2 = 3 V; see Figure 31.
RL = 100 Ω, CL = 35 pF.
VS = 3 V; see Figure 30.
VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 32.
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 33.
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 34.
RL = 110 Ω, 5 V p-p, f = 20 Hz to 20 kHz;
see Figure 36.
RL = 50 Ω, CL = 5 pF; see Figure 35.
MHz typ
MHz typ
dB typ
pF typ
Rev. 0 | Page 7 of 20
VS = ±4.5 V, VD = ‫ט‬4.5 V; see Figure 28.
RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 35.
f = 1 MHz.
ADG1438/ADG1439
Parameter
CD (Off )
ADG1438
ADG1439
CD, CS (On)
ADG1438
ADG1439
POWER REQUIREMENTS
IDD
+25°C
−40°C to
+85°C
−40°C to
+125°C
Unit
Test Conditions/Comments
76
38
pF typ
pF typ
f = 1 MHz.
f = 1 MHz.
311
151
pF typ
pF typ
f = 1 MHz.
f = 1 MHz.
VDD = +5.5 V, VSS = −5.5 V.
Digital inputs = 0 V or VL.
0.001
1
IL Inactive
0.3
1
IL Active – 30 MHz
IL Active – 50 MHz
ISS
0.26
0.3
0.35
0.5
0.55
0.42
0.001
1
±4.5/±16.5
VDD/VSS
1
μA typ
μA max
μA typ
μA max
mA typ
mA max
mA typ
mA max
μA typ
μA max
V min/Vmax
Digital inputs = 0 V or VL.
Digital inputs toggle between 0 V and VL.
Digital inputs toggle between 0 V and VL.
Digital inputs = 0 V or VL.
Guaranteed by design, not subject to production test.
CONTINUOUS CURRENT PER CHANNEL
Table 5. ADG1438, One Channel On
Parameter
CONTINUOUS CURRENT PER CHANNEL 1
15 V Dual Supply
20-Lead TSSOP (θJA = 112.6°C/W)
20-Lead LFCSP (θJA = 30.4°C/W)
12 V Single Supply
20-Lead TSSOP (θJA = 112.6°C/W)
20-Lead LFCSP (θJA = 30.4°C/W)
5 V Dual Supply
20-Lead TSSOP (θJA = 112.6°C/W)
20-Lead LFCSP (θJA = 30.4°C/W)
1
25°C
85°C
125°C
Unit
169
295
97
139
48
55
mA max
mA max
161
281
93
135
47
54
mA max
mA max
Test Conditions/Comments
VDD = +13.5 V, VSS = −13.5 V
VDD = 10.8 V, VSS = 0 V
VDD = +4.5 V, VSS = −4.5 V
122
214
76
114
43
51
mA max
mA max
25°C
85°C
125°C
Unit
125
220
77
116
43
52
mA max
mA max
119
210
74
112
42
51
mA max
mA max
159
90
93
59
47
37
mA max
mA max
Guaranteed by design, not subject to production test.
Table 6. ADG1439, One Channel On Per Multiplexer
Parameter
CONTINUOUS CURRENT PER CHANNEL 1
15 V Dual Supply
20-Lead TSSOP (θJA = 112.6°C/W)
20-Lead LFCSP (θJA = 30.4°C/W)
12 V Single Supply
20-Lead TSSOP (θJA = 112.6°C/W)
20-Lead LFCSP (θJA = 30.4°C/W)
5 V Dual Supply
20-Lead TSSOP (θJA = 112.6°C/W)
20-Lead LFCSP (θJA = 30.4°C/W)
1
Test Conditions/Comments
VDD = +13.5 V, VSS = −13.5 V
VDD = 10.8 V, VSS = 0 V
VDD = +4.5 V, VSS = −4.5 V
Guaranteed by design, not subject to production test.
Rev. 0 | Page 8 of 20
ADG1438/ADG1439
TIMING CHARACTERISTICS
All input signals are specified with tR = tF = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2 (see Figure 3).
VDD = 4.5 V to 16.5 V; VSS = −16.5 V to 0 V; VL = 2.7 V to 5.5 V or VDD (whichever is less); GND = 0 V; all specifications TMIN to TMAX,
unless otherwise noted. 1
Table 7.
Parameter
t1 2
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11 3
t12
Limit at TMIN, TMAX
20
9
9
5
5
5
5
15
5
5
40
15
Unit
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns max
ns min
Conditions/Comments
SCLK cycle time
SCLK high time
SCLK low time
SYNC to SCLK active edge setup time
Data setup time
Data hold time
SCLK active edge to SYNC rising edge
Minimum SYNC high time
SYNC rising edge to next SCLK active edge ignored
SCLK active edge to SYNC falling edge ignored
SCLK rising edge to SDO valid
Minimum RESET pulse width
1
Guaranteed by design and characterization, not production tested.
Maximum SCLK frequency is 50 MHz at VDD = 4.5 V to 16.5 V; VSS = −16.5 V to 0 V; VL = 2.7 V to 5.5 V or VDD (whichever is less); GND = 0 V.
3
Measured with the 1 kΩ pull-up resistor to VL and 20 pF load. t11 determines the maximum SCLK frequency in daisy-chain mode.
2
TIMING DIAGRAM
t10
t1
t9
SCLK
t8
t2
t3
t4
t7
SYNC
t5
DIN
t6
DB7
DB0
08496-003
RESET
t12
Figure 3. Serial Write Operation
t1
SCLK
8
t8
t3
t4
16
t9
t2
t7
SYNC
t5
DIN
t6
DB7
DB0
DB0
DB7
INPUT WORD FOR DEVICE N + 1
INPUT WORD FOR DEVICE N
t11
DB0
DB7
UNDEFINED
INPUT WORD FOR DEVICE N
08496-004
SDO
Figure 4. Daisy-Chain Timing Diagram
Rev. 0 | Page 9 of 20
ADG1438/ADG1439
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 8.
Parameter
VDD to VSS
VDD to GND
VSS to GND
VL to GND
Analog Inputs 1
Digital Inputs1
Continuous Current, Sx or
Dx Pins
Peak Current, Sx or Dx Pins
(Pulsed at 1 ms, 10% Duty
Cycle Max)
TSSOP
LFCSP
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
Reflow Soldering Peak
Temperature (Pb-Free)
Time at Peak Temperature
1
Rating
35 V
−0.3 V to +25 V
+0.3 V to −25 V
−0.3 V to +7 V
VSS − 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
GND − 0.3 V to VL + 0.3 V or
30 mA, whichever occurs first
Table 5 and Table 6 specifications + 15%
300 mA
400 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Table 9. Thermal Resistance
Package Type
20 Lead TSSOP (4-Layer Board)
20-Lead LFCSP (4-Layer Board and
Exposed Paddle Soldered to VSS)
ESD CAUTION
−40°C to +125°C
−65°C to +150°C
150°C
260(+0/−5)°C
10 sec to 40 sec
Overvoltages at the analog and digital inputs are clamped by internal
diodes. Current should be limited to the maximum ratings given.
Rev. 0 | Page 10 of 20
θJA
112.6
30.4
θJC
50
N/A
Unit
°C/W
°C/W
ADG1438/ADG1439
19
VL
DIN 3
18
SDO
ADG1438
GND 4
20
19
18
17
16
20 SYNC
VDD 2
DIN
GND
S1
S2
S3
15
S5
S2 7
14
S6
S3 8
13
S7
S4 9
12
S8
D 10
11
NC
NC = NO CONNECT
PIN 1
INDICATOR
ADG1438
TOP VIEW
(Not to Scale)
15 RESET
14 VSS
13 S5
12 S6
11 S7
S4
NC
D
NC
S8
S1 6
08496-005
NC 5
1
2
3
4
5
6
7
8
9
10
17 RESET
TOP VIEW
(Not to Scale) 16
VSS
08496-106
SCLK 1
VDD
SCLK
SYNC
VL
SDO
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
Figure 5. ADG1438 Pin Configuration (TSSOP)
Figure 6. ADG1438 Pin Configuration (LFCSP)
Table 10. ADG1438 Pin Function Descriptions
Pin No.
TSSOP
LFCSP
1
19
Mnemonic
SCLK
2
3
20
1
VDD
DIN
4
5
6
7
8
9
10
11
12
13
14
15
16
2
7
3
4
5
6
8
9
10
11
12
13
14
GND
NC
S1
S2
S3
S4
D
NC
S8
S7
S6
S5
VSS
17
15
RESET
18
16
SDO
19
20
17
18
VL
SYNC
EPAD
Description
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial
clock input. Data can be transferred at rates of up to 50 MHz.
Most Positive Power Supply Potential.
Serial Data Input. This device has an 8-bit shift register. Data is clocked into the register on the
falling edge of the serial clock input.
Ground (0 V) Reference.
No Connect.
Source Terminal 1. Can be an input or an output.
Source Terminal 2. Can be an input or an output.
Source Terminal 3. Can be an input or an output.
Source Terminal 4. Can be an input or an output.
Drain Terminal. Can be an input or an output.
No Connect.
Source Terminal 8. Can be an input or an output.
Source Terminal 7. Can be an input or an output.
Source Terminal 6. Can be an input or an output.
Source Terminal 5. Can be an input or an output.
Most Negative Power Supply Potential. In single-supply applications, it can be connected
to ground.
Active Low Logic Input. When this pin is low, all switches are open, and the appropriate registers
are cleared to 0.
Serial Data Output. Can be used for daisy-chaining a number of these devices together or for
reading back the data in the shift register for diagnostic purposes. The serial data is transferred on
the rising edge of SCLK and is valid on the falling edge of the clock. This is an open-drain output
that should be pulled to the VL supply with an external 1 kΩ resistor.
Logic Power Supply Input. Operates from 2.7 V to 5.5 V.
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC
goes low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is
transferred in on the falling edges of the following clocks. Taking SYNC high updates the switch
condition.
The exposed pad is tied to the substrate, VSS.
Rev. 0 | Page 11 of 20
19
VL
DIN 3
18
SDO
ADG1439
20
19
18
17
16
20 SYNC
VDD 2
DIN
GND
S1A
S2A
S3A
15
S1B
S2A 7
14
S2B
S3A 8
13
S3B
S4A 9
12
S4B
DA 10
11
DB
NC = NO CONNECT
ADG1439
TOP VIEW
(Not to Scale)
15
14
13
12
11
RESET
VSS
S1B
S2B
S3B
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD TIED TO SUBSTRATE, VSS.
08496-107
NC 5
S1A 6
PIN 1
INDICATOR
S4A 6
DA 7
NC 8
DB 9
S4B 10
17 RESET
TOP VIEW
(Not to Scale) 16
VSS
GND 4
1
2
3
4
5
08496-108
SCLK 1
VDD
SCLK
SYNC
VL
SDO
ADG1438/ADG1439
Figure 7. ADG1439 Pin Configuration (TSSOP)
Figure 8. ADG1439 Pin Configuration (LFCSP)
Table 11. ADG1439 Pin Function Descriptions
Pin No.
TSSOP
LFCSP
1
19
Mnemonic
SCLK
2
3
20
1
VDD
DIN
4
5
6
7
8
9
10
11
12
13
14
15
16
2
8
3
4
5
6
7
9
10
11
12
13
14
GND
NC
S1A
S2A
S3A
S4A
DA
DB
S4B
S3B
S2B
S1B
VSS
17
15
RESET
18
16
SDO
19
20
17
18
VL
SYNC
EPAD
Description
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial
clock input. Data can be transferred at rates of up to 50 MHz.
Most Positive Power Supply Potential.
Serial Data Input. This device has an 8-bit shift register. Data is clocked into the register on the
falling edge of the serial clock input.
Ground (0 V) Reference.
No Connect.
Source Terminal 1A. Can be an input or an output.
Source Terminal 2A. Can be an input or an output.
Source Terminal 3A. Can be an input or an output.
Source Terminal 4A. Can be an input or an output.
Drain Terminal A. Can be an input or an output.
Drain Terminal B. Can be an input or an output.
Source Terminal 4B. Can be an input or an output.
Source Terminal 3B. Can be an input or an output.
Source Terminal 2B. Can be an input or an output.
Source Terminal 1B. Can be an input or an output.
Most Negative Power Supply Potential. In single-supply applications, it can be connected
to ground.
Active Low Logic Input. When this pin is low, all switches are open, and appropriate registers are
cleared to 0.
Serial Data Output. Can be used for daisy-chaining a number of these devices together or for
reading back the data in the shift register for diagnostic purposes. The serial data is transferred on
the rising edge of SCLK and is valid on the falling edge of the clock. This is an open-drain output
that should be pulled to the VL supply with an external 1 kΩ resistor.
Logic Power Supply Input. Operates from 2.7 V to 5.5 V.
Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC
goes low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is
transferred in on the falling edges of the following clocks. Taking SYNC high updates the switch
condition.
The exposed pad is tied to the substrate, VSS.
Rev. 0 | Page 12 of 20
ADG1438/ADG1439
TYPICAL PERFORMANCE CHARACTERISTICS
16
18
VDD = +10V
VSS = –10V
14
VDD = +13.5V
VSS = –13.5V
15
ON RESISTANCE (Ω)
VDD = +12V
VSS = –12V
10
8
6
VDD = +16.5V
VSS = –16.5V
VDD = +15V
VSS = –15V
4
12
TA = +125°C
TA = +85°C
9
TA = +25°C
6
TA = –40°C
3
VDD = +15V
VSS = –15V
TA = 25°C
IS = –10mA
0
–16.5 –13.5 –10.5 –7.5 –4.5
–1.5
4.5
1.5
7.5
10.5 13.5 16.5
VS, VD (V)
0
–15
0
5
10
15
Figure 12. On Resistance as a Function of VD (VS)
for Different Temperatures, 15 V Dual Supply
35
30
VDD = +3.V
VSS = –3.V
30
25
VDD = +5.0V
VSS = –5.0V
20
15
VDD = +5.5V
VSS = –5.5V
10
VDD = +7V
VSS = –7V
5
TA = +25°C
10
TA = –40°C
5
VDD = +5V
VSS = –5V
TA = 25°C
IS = –10mA
–5
TA = +85°C
15
–3
1
–1
3
5
7
VS, VD (V)
0
–5
–4
–3
–2
–1
0
1
2
3
4
5
08496-010
0
–7
TA = +125°C
20
12
08496-011
25
ON RESISTANCE (Ω)
VDD = +4.5V
VSS = –4.5V
08496-007
ON RESISTANCE (Ω)
–5
VS, VD (V)
Figure 9. On Resistance as a Function of VD (VS), Dual Supply
VS, VD (V)
Figure 10. On Resistance as a Function of VD (Vs), Dual Supply
Figure 13. On Resistance as a Function of VD (VS)
for Different Temperatures, 5 V Dual Supply
40
25
VDD = +5V
VSS = 0V
35
20
30
25
20
VDD = +10.8V
VSS = 0V
15
ON RESISTANCE (Ω)
VDD = +8V
VSS = 0V
VDD = +12V
VSS = 0V
TA = +125°C
15
TA = +85°C
TA = +25°C
10
TA = –40°C
10
5
0
VDD = +15V
VSS = 0V
TA = 25°C
IS = –10mA
0
1.5
3.0
4.5
6.0
7.5
9.0
5
VDD = +13.2V
VSS = 0V
10.5
12.0 13.5
VDD = +12V
VSS = 0V
15.0
VS, VD (V)
0
08496-008
ON RESISTANCE (Ω)
–10
08496-009
2
08496-006
ON RESISTANCE (Ω)
12
0
2
4
6
8
10
VS, VD (V)
Figure 11. On Resistance as a Function of VD (VS), Single Supply
Figure 14. On Resistance as a Function of VD (VS)
for Different Temperatures, 12 V Single Supply
Rev. 0 | Page 13 of 20
ADG1438/ADG1439
500
1.0
VDD = +15V
VSS = –15V
VBIAS = +10V/–10V
VL = 5.5V
ID (OFF) –+
400
IS (OFF) +–
IDD (µA)
0
IS (OFF) –+
–0.5
300
200
ID, IS (ON) – –
100
ID (OFF) +–
–1.5
0
20
40
60
80
100
120
TEMPERATURE (°C)
VL = 2.7V
0
0
0.5
1.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 18. IDD vs. Logic Level
50
10
TA = 25°C
40
6
CHARGE INJECTION (pC)
ID, IS (ON) ++
ID (OFF) –+
4
IS (OFF) +–
2
0
IS (OFF) –+
ID, IS (ON) ––
ID (OFF) +–
–4
0
20
40
60
80
TEMPERATURE (°C)
100
120
20
VDD = +12V
VSS = 0V
10
0
VDD = +15V
VSS = –15V
–10
–20
–30
–15
08496-016
–2
VDD = +5V
VSS = –5V
30
–10
–5
0
5
10
15
VS (V)
08496-019
VDD = +5V
VSS = –5V
VBIAS = +4.5V/–4.5V
8
Figure 19. Charge Injection vs. Source Voltage
Figure 16. Leakage Current as a Function of Temperature,
5 V Dual Supply
300
10
VDD = 12V
VSS = 0V
VBIAS = 1V/10V
8
ID, IS (ON) ++
250
6
200
4
TIME (ns)
ID (OFF) –+
IS (OFF) +–
2
IS (OFF) –+
VDD = +5V, VSS = –5V
150
100
VDD = +12V, VSS = 0V
0
–2
50
ID, IS (ON) ––
ID (OFF) +–
0
20
40
60
80
TEMPERATURE (°C)
100
120
0
08496-017
–4
VDD = +15V, VSS = –15V
–40
–20
0
20
40
60
80
100
TEMPERATURE (°C)
Figure 20. Transition Time vs. Temperature
Figure 17. Leakage Current as a Function of Temperature,
12 V Single Supply
Rev. 0 | Page 14 of 20
120
08496-120
LEAKAGE CURRENT (nA)
2.0
LOGIC LEVEL (V)
Figure 15. Leakage Current as a Function of Temperature,
15 V Dual Supply
LEAKAGE CURRENT (nA)
1.5
08496-018
–1.0
08496-015
LEAKAGE CURRENT (nA)
0.5
IDD PER LOGIC INPUT
TA= 25°C
ID, IS (ON) ++
ADG1438/ADG1439
0
0
TA = 25°C
VDD = +15V
VSS = –15V
–0.5
INSERTION LOSS (dB)
–40
–60
–80
–100
–1.0
TA = 25°C
VDD = +15V
VSS = –15V
–1.5
–2.0
–2.5
–3.0
–3.5
1k
10k
100k
1M
10M
100M
1G
FREQUENCY (Hz)
–4.0
08496-121
–120
1k
1M
10M
100M
Figure 24. ADG1438 On Response vs. Frequency
0
0.20
TA = 25°C
VDD = +15V
VSS = –15V
LOAD = 110Ω
TA = 25°C
0.18
0.16
VDD = 5V, VSS = –5V, VS = 5V p-p
0.14
–40
THD + N (%)
CROSSTALK (dB)
100k
FREQUENCY (Hz)
Figure 21. Off Isolation vs. Frequency
–20
10k
08496-124
OFF ISOLATION (dB)
–20
–60
–80
0.12
0.10
0.08
VDD = 15V, VSS = –15V, VS = 10V p-p
0.06
0.04
–100
100k
1M
10M
100M
1G
FREQUENCY (Hz)
0
08496-122
0
20
0
TA = 25°C
VDD = +15V
VSS = –15V
TA = 25°C
VDD = +15V
VSS = –15V
–20
NO DECOUPLING
CAPACITORS
–40
ACPSRR (dB)
–40
–60
–60
DECOUPLING
CAPACITORS
–80
–80
–100
–100
100k
1M
10M
100M
FREQUENCY (Hz)
1G
08496-123
CROSSTALK (dB)
15
Figure 25. THD + N vs. Frequency
0
–120
10k
10
FREQUENCY (kHz)
Figure 22. ADG1438 Crosstalk vs. Frequency
–20
5
Figure 23. ADG1439 Crosstalk vs. Frequency
–120
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 26. ACPSRR vs. Frequency
Rev. 0 | Page 15 of 20
10M
08496-127
–120
10k
08496-026
0.02
ADG1438/ADG1439
TEST CIRCUITS
V
A
IDS
D
A
VD
Figure 27. On Resistance
ID (ON)
ID (OFF)
VS
08496-020
VS
S
S
NC
NC = NO CONNECT
Figure 28. Off Leakage
VDD
VSS
VDD
VSS
SYNC
S1
50%
VS1
S2 TO S7
D
GND
VS1
VS8
RL
300Ω
CL
35pF
VOUT
90%
VOUT
90%
tOFF
* SIMILAR CONNECTION FOR ADG1439
08496-023
S8
tON
Figure 30. Switching Times, tON/tOFF
3V
VDD
VSS
VDD
VSS
SYNC
S1
0V
S2 TO S7
VS
S8
80%
ADG14381
80%
OUTPUT
D
OUTPUT
GND
100Ω
tBBM
1SIMILAR CONNECTION FOR ADG1439.
Figure 31. Break-Before-Make Delay, tBBM
Rev. 0 | Page 16 of 20
35pF
08496-024
VS1 = VS8
A
VD
Figure 29. On Leakage
50%
ADG1438*
D
08496-022
IS (OFF)
D
08496-021
S
ADG1438/ADG1439
VDD
VSS
VDD
VSS
3V
SYNC
ADG1438 1
RS
VOUT
S
D
VOUT
ΔVOUT
SWITCH OFF
INPUT LOGIC
GND
VS
SWITCH ON
CL
1nF
08496-025
QINJ = CL × ΔVOUT
1SIMILAR CONNECTION FOR ADG1439.
Figure 32. Charge Injection
VSS
VDD
0.1µF
NETWORK
ANALYZER
VSS
S
0.1µF
VDD
50Ω
50Ω
S
VS
50Ω
VS
D
RL
50Ω
ADG1438
GND
D
VOUT
VOUT
VS
08496-027
GND
INSERTION LOSS = 20 log
Figure 33. Off Isolation
VDD
RL
50Ω
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
VSS
0.1µF
VDD
VDD
VSS
VSS
0.1µF
0.1µF
S1
D
S2
VS
VOUT
Figure 35. Insertion Loss
0.1µF
VOUT
RL
50Ω
ADG1438
OFF ISOLATION = 20 log
NETWORK
ANALYZER
NETWORK
ANALYZER
VSS
08496-029
VDD
VSS
0.1µF
VDD
R
50Ω
RS
S
ADG1438
IN
GND
ADG1438
GND
08496-028
VOUT
VS
VS
V p-p
D
VIN
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
AUDIO PRECISION
VSS
Figure 34. Channel-to-Channel Crosstalk
RL
10kΩ
Figure 36. THD + Noise
Rev. 0 | Page 17 of 20
VOUT
08496-030
VDD
0.1µF
ADG1438/ADG1439
TERMINOLOGY
tBBM
Off time measured between the 80% point of both switches
when switching from one address state to another.
RON
Ohmic resistance between Terminal D and Terminal S.
ΔRON
Difference between the RON of any two channels.
RFLAT(ON)
Flatness that is defined as the difference between the maximum
and minimum values of on resistance as measured over the
specified analog signal range..
IS (Off)
Source leakage current when the switch is off.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
IDD
Positive supply current.
ID (Off)
Drain leakage current when the switch is off.
ISS
Negative supply current.
ID, IS (On)
Channel leakage current when the switch is on.
VD (VS)
Analog voltage on Terminal D (drain terminal) and Terminal S
(source terminals, S1 to S8).
CS (Off)
Channel input capacitance for off condition.
Off Isolation
A measure of unwanted signal coupling through an off channel.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
Bandwidth
Frequency at which the output is attenuated by 3 dB.
CD (Off)
Channel output capacitance for off condition.
On Response
Frequency response of the on switch.
CD, CS (On)
On switch capacitance.
Total Harmonic Distortion (THD + N)
Ratio of the harmonic amplitude plus noise of the signal to the
fundamental.
CIN
Digital input capacitance.
tON (EN)
Delay time between the 50% and 90% points of the digital input
and the switch on condition.
tOFF (EN)
Delay time between the 50% and 90% points of the digital input
and the switch off condition.
tTRANSITION
Delay time between the 50% and 90% points of the digital input
and the switch on condition when switching from one address
state to another.
AC Power Supply Rejection Ratio (ACPSRR)
A measure of the ability of a part to avoid coupling noise and
spurious signals that appear on the supply voltage pin to the
output of the switch. The dc voltage on the device is modulated
by a sine wave of 0.62 V p-p. The ratio of the amplitude of signal on
the output to the amplitude of the modulation is the ACPSRR
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Insertion Loss
The loss due to the on resistance of the switch.
Rev. 0 | Page 18 of 20
ADG1438/ADG1439
THEORY OF OPERATION
The ADG1438 and ADG1439 are serially controlled, 8-channel
and dual 4-channel matrix switches, respectively. While
providing the normal multiplexing and demultiplexing
functions, these devices also provide the user with more
flexibility as to where a signal can be routed. Each of the eight
bits of the 8-bit write corresponds to one switch of the device.
Logic 1 in a particular bit position turns the switch on, whereas
Logic 0 turns the switch off. Because each switch is
independently controlled by an individual bit, this provides the
option of having any, all, or none of the switches on. This
feature may be particularly useful in the demultiplexing
application where the user may wish to direct one signal from
the drain to a number of outputs (sources). Care must be taken,
however, in the multiplexing situation where a number of
inputs may be shorted together (separated only by the small on
resistance of the switch).
SERIAL INTERFACE
The ADG1438/ADG1439 has a 3-wire serial interface (SYNC,
SCLK, and DIN pins) that is compatible with SPI, QSPI, and
MICROWIRE interface standards, as well as most DSPs (see
Figure 3 for a timing diagram of a typical write sequence).
The write sequence begins by bringing the SYNC line low. This
enables the input shift register. Data from the DIN line is clocked
into the 8-bit input shift register on the falling edge of SCLK.
The serial clock frequency can be as high as 50 MHz, making
the ADG1438/ADG1439 compatible with high speed DSPs.
Data can be written to the shift register in more or fewer than
eight bits. In each case, the shift register retains the last eight
bits that are written. When all eight bits are written into the
shift register, the SYNC line is brought high again. The switches
are updated with the new configuration, and the input shift
register is disabled. With SYNC held high, the input shift
register is disabled so that further data or noise on the DIN line
has no effect on the shift register.
Data appears on the SDO pin on the rising edge of SCLK,
suitable for daisy-chaining or readback, delayed by eight bits.
INPUT SHIFT REGISTER
The input shift register is eight bits wide, as shown in Table 12 and
Table 13. Each bit controls one switch. These data bits are
transferred to the switch register on the rising edge of SYNC.
Table 12. ADG1438 Input Shift Register Bit Map1
MSB
DB7
S8
1
DB6
S7
DB5
S6
DB4
S5
DB3
S4
DB2
S3
DB1
S2
LSB
DB0
S1
Logic 0 = switch off, and Logic 1 = switch on.
Table 13. ADG1439 Input Shift Register Bit Map1
MSB
DB7
S4B
1
DB6
S3B
DB5
S2B
DB4
S1B
DB3
S4A
DB2
S3A
DB1
S2A
LSB
DB0
S1A
Logic 0 = switch off, and Logic 1 = switch on.
POWER-ON RESET
The ADG1438/ADG1439 contain a power-on reset circuit. On
power-up of the device, all switches are off, and the internal
shift register is filled with zeros and remains so until a valid
write takes place.
The part also has a RESET pin. When the RESET pin is low, all
switches are off, and the appropriate registers are cleared to 0.
DAISY-CHAINING
For systems that contain several switches, the SDO pin can be
used to daisy-chain several devices together. The SDO pin can
also be used for diagnostic purposes and to provide serial
readback where the user wants to read back the switch contents.
The SDO pin is an open-drain output that should be pulled to
the VL supply with an external resistor.
The SCLK is continuously applied to the input shift register
when SYNC is low. If more than eight clock pulses are applied,
the data ripples out of the shift register and appears on the SDO
line. This data is clocked out on the rising edge of SCLK and is
valid on the falling edge. By connecting this line to the DIN
input on the next switch in the chain, a multiswitch interface is
constructed. Each switch in the system requires eight clock
pulses; therefore, the total number of clock cycles must equal
8N, where N is the total number of devices in the chain.
When the serial transfer to all devices is complete, SYNC is
taken high. This prevents any further data from being clocked
into the input shift register.
The serial clock can be a continuous or a gated clock. A continuous SCLK source can be used only if SYNC can be held low
for the correct number of clock cycles. In gated clock mode, a
burst clock containing the exact number of clock cycles must be
used, and SYNC must be taken high after the final clock to latch
the data. Gated clock mode reduces power consumption by
reducing the active clock time.
Rev. 0 | Page 19 of 20
ADG1438/ADG1439
OUTLINE DIMENSIONS
6.60
6.50
6.40
20
11
4.50
4.40
4.30
6.40 BSC
1
10
PIN 1
0.65
BSC
1.20 MAX
0.15
0.05
0.30
0.19
COPLANARITY
0.10
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 37. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
0.60 MAX
4.00
BSC SQ
0.60 MAX
15
PIN 1
INDICATOR
20
16
1
PIN 1
INDICATOR
3.75
BSC SQ
0.50
BSC
2.65
2.50 SQ
2.35
EXPOSED
PAD
(BOTTOM VIEW)
5
1.00
0.85
0.80
SEATING
PLANE
12° MAX
0.80 MAX
0.65 TYP
0.30
0.23
0.18
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
11
10
6
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
090408-B
TOP VIEW
0.50
0.40
0.30
Figure 38. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG1438BRUZ 1
ADG1438BRUZ-REEL71
ADG1438BCPZ-REEL71
ADG1439BRUZ1
ADG1439BRUZ-REEL71
ADG1439BCPZ-REEL71
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Z = RoHS Compliant Part.
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08496-0-10/09(0)
Rev. 0 | Page 20 of 20
Package Option
RU-20
RU-20
CP-20-4
RU-20
RU-20
CP-20-4