NL27WZ02 Dual 2-Input NOR Gate The NL27WZ02 is a high performance dual 2–input NOR Gate operating from a 2.3 V to 5.5 V supply. • • • • • • • • • Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5 V Designed for 2.3 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible – Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ02 Chip Complexity: FET = 112 http://onsemi.com MARKING DIAGRAM 8 8 1 L3 US8 US SUFFIX CASE 493–01 D 1 D = Date Code A1 1 8 VCC B1 2 7 Y1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Y2 6 3 B2 A1 1 B1 GND 5 4 A2 Y1 A2 Y2 B2 Figure 1. Pinout (Top View) Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin Function Input 1 A1 2 B1 A B Y 3 Y2 L L H 4 GND L H L 5 A2 H L L 6 B2 H H L 7 Y1 8 VCC Semiconductor Components Industries, LLC, 2001 June, 2001 – Rev. 2 Output Y=A+B 1 Publication Order Number: NL27WZ02/D NL27WZ02 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage 0.5 to 7.0 V VI DC Input Voltage 0.5 to 7.0 V VO DC Output Voltage 0.5 to 7.0 V IIK DC Input Diode Current VI < GND 50 mA IOK DC Output Diode Current VO < GND 50 mA IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias JA Thermal Resistance PD Power Dissipation in Still Air at 85C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V ILatch–Up Latch–Up Performance Above VCC and Below GND at 85C (Note 5) 500 mA (Note 1) 260 C 150 C 250 C/W 250 mW Level 1 Oxygen Index: 28 to 34 UL 94 V–0 @ 0.125 in Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 2–ounce copper trace with no air flow. 2. Tested to EIA/JESD22–A114–A. 3. Tested to EIA/JESD22–A115–A. 4. Tested to JESD22–C101–A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free–Air Temperature t/V Input Transition Rise or Fall Rate Operating Data Retention Only Min Max Unit 2.3 1.5 5.5 5.5 V (Note 6) 0 5.5 V (HIGH or LOW State) 0 VCC V 40 85 C 0 0 0 20 10 5 ns/V VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V 6. Unused inputs may not be left open. All inputs must be tied to a high–logic voltage level or a low–logic input voltage level. http://onsemi.com 2 NL27WZ02 DC ELECTRICAL CHARACTERISTICS VCC Symbol Parameter Condition VIH High–Level Input Voltage VIL Low–Level Input Voltage VOH High–Level Output Voltage VIN = VIL or VIL VOL Low–Level Output Voltage VIN = VIH 40C TA 85C TA = 25C (V) Min 2.3 to 5.5 0.7 VCC Typ Max Min Max 0.7 VCC 2.3 to 5.5 0.3 VCC V 0.3 VCC IOH = 100 A 2.3 to 5.5 VCC – 0.1 VCC VCC – 0.1 IOH = –8 mA 2.3 1.9 2.1 1.9 IOH = –12 mA 2.7 2.2 2.4 2.2 IOH = –16 mA 3.0 2.4 2.7 2.4 IOH = –24 mA 3.0 2.3 2.5 2.3 IOH = –32 mA 4.5 3.8 4.0 3.8 IOL = 100 A 2.3 to 5.5 Unit V V 0.1 0.1 IOL = 8 mA 2.3 0.20 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 0 to 5.5 0.1 1.0 A 0 1 10 A 5.5 1 10 A IIN Input Leakage Current VIN = VCC or GND IOFF Power Off–Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND V AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Fi (Figure 3 and d 4)) 40C TA 85C TA = 25C Condition (V) Min Typ Max Min Max Unit RL = 1 M CL = 15 pF 2.5 0.2 1.2 3.3 5.4 1.2 5.8 ns RL = 1 M CL = 15 pF 3.3 0.3 0.8 2.5 3.8 0.8 4.1 1.2 3.1 4.6 1.2 5.0 0.5 2.0 3.0 0.5 3.3 0.8 2.4 3.7 0.8 4.0 RL = 500 CL = 50 pF RL = 1 M CL = 15 pF 5.0 0.5 RL = 500 CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit 2.5 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 9 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 11 CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance (N (Note 7)) 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no–load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ02 tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% 50% INPUT 10% 10% tPHL OUTPUT GND RL tPLH CL VOH OUTPUT Y 50% 50% A 1–MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NL27WZ02US Logic Circuit Indicator No. of Gates per Package Temp Range Identifier NL 2 7 Technology Device Function Package Suffix WZ 02 US http://onsemi.com 4 Tape and Reel Suffix Package Type Tape and Reel Size US8 178 mm, 3000 Unit NL27WZ02 CAVITY TAPE TOP TAPE TAPE TRAILER (Connected to Reel Hub) NO COMPONENTS 160 mm MIN COMPONENTS TAPE LEADER NO COMPONENTS 400 mm MIN DIRECTION OF FEED Figure 5. Tape Ends for Finished Goods TAPE DIMENSIONS mm 4.00 1.50 TYP 4.00 2.00 1.75 3.50 0.25 0.30 8.00 + – 0.10 1 1.00 ± 0.25 TYP DIRECTION OF FEED Figure 6. Carrier Tape Specifications http://onsemi.com 5 NL27WZ02 t MAX 1.5 mm MIN A 13.0 mm ±0.2 mm 50 mm MIN 20.2 mm MIN FULL RADIUS G Figure 7. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix A Max G t Max 8 mm US 178 mm 8.4 mm, +1.5 mm, –0.0 14.4 mm DIRECTION OF FEED BARCODE LABEL POCKET Figure 8. Reel Winding Direction http://onsemi.com 6 HOLE NL27WZ02 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493–01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION A" DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055") PER SIDE. 4. DIMENSION B" DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSION. INTER-LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055") PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076-0. 0203 MM. (300-800 INCH). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002"). –X– A 8 J –Y– 5 DETAIL E B L 1 4 R S G P U C –T– SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M T X Y R 0.10 TYP V M F DETAIL E 3.8 0.5 TYP ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ ÉÉÉ 1.8 TYP 1.0 http://onsemi.com 7 0.3 TYP (mm) DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0 6 5 10 0.28 0.44 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0 6 5 10 0.011 0.017 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC NL27WZ02 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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PUBLICATION ORDERING INFORMATION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: [email protected] JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: [email protected] ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. N. American Technical Support: 800–282–9855 Toll Free USA/Canada http://onsemi.com 8 NL27WZ02/D