19-2086; Rev 0; 7/01 +3.3V, 10.3Gbps Limiting Amplifier ____________________________Features ♦ Single +3.3V Power Supply The MAX3971 is designed to work with the MAX3970, a 10.3Gbps transimpedance amplifier (TIA). The limiting amplifier operates on a single +3.3V supply and consumes only 155mW. The part functions over a 0°C to +85°C temperature range. It also has a disable function that allows the outputs to be squelched if required by the application. The MAX3971 is offered in either die form or in a compact 4mm x 4mm, 20-pin QFN plastic package. ♦ 3.4psp-p Deterministic Jitter ♦ 155mW Power Consumption ♦ 9.5mVp-p Input Sensitivity ♦ 800mVp-p Input Overload ♦ Dice and 4mm x 4mm QFN Package Availability ♦ Output Disable Feature Applications Ordering Information 10Gigabit Ethernet Optical Receivers PART TEMP. RANGE VSR OC-192 Receivers MAX3971UGP 0°C to +85°C 20 QFN* PIN-PACKAGE 10Gigabit Fibre Channel Receivers MAX3971U/D 0°C to +85°C Dice** *Exposed pad **Dice are designed to operate over a 0°C to +110°C junction temperature (TJ) range, but are tested and guaranteed at TA = +25°C. Pin Configuration appears at end of data sheet. Typical Application Circuit +3.3V 0.1µF SUPPLY FILTER +3.3V CZ- CZ+ VCC1 VCC2 VCC3 GNDIN+ 0.1µF TIA OUT+ IN+ 100Ω 0.1µF 0.1µF 0.1µF 100Ω OUT- INGNDIN- MAX3970 MAX3971 DISABLE ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX3971 General Description The MAX3971 is a compact, low-power, 10.3Gbps limiting amplifier. It accepts signals over a wide range of input voltage levels and provides constant-level output voltages with controlled edge speeds. It functions as a data quantizer. The output of the amplifier is a 250mVp-p differential CML signal with a 100Ω differential termination. MAX3971 +3.3V, 10.3Gbps Limiting Amplifier ABSOLUTE MAXIMUM RATINGS Supply Voltage, VCC1, VCC2, VCC3 ......................-0.5V to +5.0 V Voltage at IN+, IN-, DISABLE, CZ+, CZ-, OUT+, OUT-........................+0.5V to (VCC + 0.5V) Differential Voltage Between CZ+ and CZ- ...........................±1V Differential Voltage Between IN+ and IN-...........................±2.5V Continuous Power Dissipation (TA = +85°C) 20-Pin QFN (derate 20mW/°C above +85°C) .................1.3W Operating Ambient Temperature Range .............-40°C to +85°C Storage Temperature Range .............................-55°C to +150°C Die Attach Temperature...................................................+400°C Lead Temperature (soldering, 10s) .................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +3.0V to +3.6V, TA = 0°C to +85°C. Typical values are at VCC = +3.3V, output load = 50Ω to VCC, TA = +25°C, unless otherwise noted. Data mark density is 50%.) PARAMETER SYMBOL Supply Current ICC Small-Signal Bandwidth BW Low-Frequency Cutoff CONDITIONS MIN Random Jitter tr, tf Input Sensitivity VIN-min Input Overload VIN-max mA 40 20mVp-p input, K28.5 pattern at 10.3Gbps (Note 1) 4.7 14 800mVp-p input, K28.5 pattern at 10.3Gbps (Note 1) 3.4 7 20mVp-p to 800mVp-p (Note 2) 0.7 1.0 20% to 80%, OUT+, OUT- 20 BER = 1E-12, 223 - 1PRBS, 10.3Gbps RIN Single-ended DISABLE high VOD2 DISABLE low Data Output Common-Mode Voltage VCM Output Resistance ROUT 42 190 42 Data Output Offset when DISABLE is High mVp-p 52 58 1 50 250 400 52 0.05 2 Ω mVp-p V 58 Ω mVp-p 1 mA 1.4 V 2.8 DISABLE INPUT Low Voltage Note 2: ps mVp-p 75 High = VCC, low = GND psRMS 30 VCC 0.75 Single-ended psp-p 9.5 800 VOD1 kHz Gbps 8 Differential Data Output-Voltage Swing Note 1: GHz 160 10mVp-p input, K28.5 pattern at 10.3Gbps (Note 1) Data Input Resistance DISABLE INPUT High Voltage UNITS 85 10 Deterministic Jitter DISABLE Input Current MAX 47 10 CZ = 0.1µF Data Rate Transition Time, Output TYP V Deterministic jitter is measured with a K28.5 pattern (0011 1110 1011 0000 0101). It is the peak-to-peak deviation from the ideal time crossings, measured at the zero-level crossings of the differential output. Random jitter is measured with the minimum input signal applied. To achieve a bit error rate of 10-12, the peak-to-peak random jitter is 14.1 times the RMS random jitter. _______________________________________________________________________________________ +3.3V, 10.3Gbps Limiting Amplifier OUTPUT EYE DIAGRAM (INPUT SIGNAL = 800mVp-p, AT 10.3Gbps) SUPPLY CURRENT vs. TEMPERATURE MAX3971 toc02 MAX3971 toc03 MAX3971 toc01 70 65 SUPPLY CURRENT (mA) OUTPUT EYE DIAGRAM (INPUT SIGNAL = 9mVp-p, AT 10.3Gbps) 60 55 50mV/div 50mV/div 50 45 40 0 10 20 30 40 50 60 70 80 20ps/div 20ps/div DETERMINISTIC JITTER vs. TEMPERATURE (800mVp-p INPUT K28.5 PATTERN AT 10.3Gbps) DETERMINISTIC JITTER vs. TEMPERATURE (10mVp-p INPUT K28.5 PATTERN AT 10.3Gbps) 90 (1) VCC = +3.0V, INPUT = 800mVp-p (2) VCC = +3.6V, INPUT = 800mVp-p JITTER (psp-p) TIME (ps) 21 (1) (2) 20 19 0 10 20 30 40 50 60 70 80 90 (1) VCC = +3.0V (2) VCC = +3.6V (1) (2) 0 10 20 30 40 50 60 70 80 8.0 7.8 7.6 7.4 7.2 7.0 6.8 6.6 6.4 6.2 6.0 5.8 5.6 5.4 5.2 5.0 90 (1) VCC = +3.0V (2) VCC = +3.6V (1) (2) 0 10 20 30 40 50 60 70 TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C) INPUT SENSITIVITY vs. TEMPERATURE (FOR BIT ERROR RATIO OF 1E-12) INPUT RETURN (S11) INPUT SIGNAL = -20dBm OUTPUT RETURN (S22) INPUT SIGNAL = -20dBm 90 MAX3971 toc09 0 80 10 MAX3971 toc08 10 MAX3971 toc07 11 0 10 -10 9 GAIN (dB) -10 GAIN (dB) SIGNAL INPUT LEVEL (mVp-p) 5.0 4.8 4.6 4.4 4.2 4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 MAX3971 toc06 MAX3971 toc04 22 JITTER (psp-p) TRANSITION TIME vs. TEMPERATURE (20%–80%) MAX3971 toc05 TEMPERATURE (°C) -20 -20 -30 -30 -40 -40 8 7 -50 -50 10 20 30 40 50 60 TEMPERATURE (°C) 70 80 90 100 2100 4100 6100 FREQUENCY (MHz) 8100 10,100 100 2100 4100 6100 FREQUENCY (MHz) 8100 10,100 _______________________________________________________________________________________ 3 MAX3971 Typical Operating Characteristics (VCC = +3.3V, output load = 50Ω to VCC, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VCC = +3.3V, output load = 50Ω to VCC, TA = +25°C, unless otherwise noted.) COMMON-MODE REJECTION RATIO vs. FREQUENCY POWER-SUPPLY REJECTION RATIO vs. FREQUENCY 50 MAX3971 toc11 60 MAX3971 toc10 60 50 40 CMMR (dB) 40 PSRR (dB) MAX3971 +3.3V, 10.3Gbps Limiting Amplifier 30 30 20 20 10 10 0 0 1 10 100 1000 1 10 100 1000 10,000 FREQUENCY (MHz) FREQUENCY (MHz) Pin Description 4 PIN NAME 1 GNDIN+ 2 FUNCTION IN+ Input Ground for Shielding Input Signal IN+. Not connected internally. Noninverting Input Signal 3 IN- Inverting Input Signal 4 GNDIN- Input Ground for Shielding Input Signal IN-. Not connected internally. 5, 7, 9, 10 N.C. No Connection. Leave unconnected. 6, 8, 11 GND Ground 12, 15 VCC3 Output Circuitry Power Supply 13 OUT- Inverting Output of Amplifier 14 OUT+ 16 DISABLE 17 VCC2 Power Supply to Circuitry Other than Input and Output Circuits 18 CZ+ Filter Capacitor for Offset Correction. Attach other side of a capacitor to pin 19. See Detailed Description. Noninverting Output of Amplifier When High, the Outputs are Disabled 19 CZ- 20 VCC1 See pin 18. CP CORNER PIN Ground. The corner pins are connected to the exposed pad through the lead frame. If the corner pins are not soldered to the same node as the exposed pad, ensure that the solder mask is located below them so that unintentional connections do not occur. EP EXPOSED PAD Exposed Pad. Must be soldered to supply ground for proper electrical and thermal operation. Input Circuitry Power Supply _______________________________________________________________________________________ +3.3V, 10.3Gbps Limiting Amplifier Figure 1 is a functional diagram of the MAX3971 limiting amplifier.The signal path consists of an input buffer followed by a gain stage and output amplifier. A feedback loop provides offset correction by driving the average value of the differential output to zero. Gain Stage and Offset Correction The limiting amplifier provides approximately 50dB gain. This large gain makes the amplifier susceptible to small DC offsets, which cause deterministic jitter. A low-frequency loop is integrated into the limiting amplifier to reduce output offset, typically to less than 2mV. The external capacitor CZ is required to set the low-frequency cutoff for the offset correction loop and for stability. The time constant of the loop is set by the CZ CZ- MAX3971 GNDIN+ OFFSET CORRECTION AMP CZ+ DISABLE OUT+ OUTPUT AMPLIFIER GAIN 50dB IN- CML Input Circuit The input buffer is designed to accept CML input signals such as the output from the MAX3970 transimpedance amplifier. An equivalent circuit for the input is shown in Figure 2. DC-coupling the inputs is not recommended since this will prevent the part’s offset correction circuitry from working properly. Thus, AC-coupling capacitors are required on the input. CML Output Circuit An equivalent circuit for the output network is shown in Figure 3. It consists of a pair of 50Ω resistors connected to VCC driven by the collectors of an output differential transistor pair (Q1 and Q2). The differential output signals are clamped by transistors Q3 and Q4 when the DISABLE input is high. Disable Function LOWPASS FILTER IN+ INPUT AMPLIFIER product of an equivalent 20kΩ on-chip resistor and the value of the off-chip capacitor, CZ. For stable operation, the minimum value of CZ is 0.01µF. To minimize pattern-dependent jitter, CZ should be as large as possible. For 10Gigabit Ethernet applications, the typical value of CZ is 0.1µF. Keep CZ as close to the package as possible. A logic signal can be applied to the DISABLE pin to squelch the output signal. When the output is disabled, an offset is added to the output, preventing the following stage from oscillating (if DC-coupled). OUT- GNDIN- Figure 1. Functional Diagram VCC3 VCC1 GNDIN+ 50Ω 50Ω 50Ω 50Ω OUT+ OUT- IN+ DISABLE Q3 Q4 Q1 Q2 ESD STRUCTURES INDATA GNDIN- ESD STRUCTURES Figure 2. CML Input Equivalent Circuit Figure 3. CML Input Equivalent Circuit Showing Clamping Circuit for Squelching the Output Signal _______________________________________________________________________________________ 5 MAX3971 Detailed Description and Applications Information Layout Considerations Circuit board layout and design can significantly affect the MAX3971’s performance. Use good high-frequency techniques, including fixed-impedance transmission lines for the high-frequency data signal. Use a multilayer board with solid ground plane. Minimize the inductance between MAX3971 and the ground plane. The MAX3971 uses three power supply pins, VCC1, VCC2, and VCC3. The input circuitry of the MAX3971 is supplied by VCC1. The output drivers have a separate supply VCC3, which usually has large pulsing currents. All other circuitry is powered by VCC2. It is possible to simply connect the three pins together. However, better isolation of the input circuitry is ensured by using a supply filter. For optimal isolation, Figure 4 shows a possible supply filtering circuit. Element L, a ferrite bead, provides isolation between a noisy VCC3 and the sensitive VCC1. +3.3V L C = 0.001µF SUPPLY FILTER C = 0.001µF VCC1 C = 0.001µF VCC2 VCC3 MAX3971 Figure 4. Power-Supply Filter CZ- CZ+ VCC2 DISABLE CP VCC1 Pin Configuration 20 19 18 17 16 CP 1 15 VCC3 IN+ 2 14 OUT+ IN- 3 GNDIN- 4 12 VCC3 N.C. 5 11 GND 8 9 10 N.C. N.C. 7 GND 6 SUBSTRATE: Electrically Isolated 13 OUT- MAX3971 N.C. CP Chip Information TRANSISTOR COUNT: 1803 PROCCESS: SiGe Bipolar GNDIN+ GND MAX3971 +3.3V, 10.3Gbps Limiting Amplifier CP 20 QFN 6 _______________________________________________________________________________________ +3.3V, 10.3Gbps Limiting Amplifier VCC1 CZ- CZ+ VCC2 DISABLE GNDIN+ VCC3 IN+ OUT+ IN- OUT0.045" (1.15mm) GNDIN- VCC3 N.C. GND GND N.C. GND N.C. N.C. 0.049" (1.25mm) _______________________________________________________________________________________ 7 MAX3971 Chip Topography +3.3V, 10.3Gbps Limiting Amplifier MAX3971 Chip Topography (continued) MAX3971 8 PIN NUMBER X DIMENSION (MICRONS) Y DIMENSION (MICRONS) 1 0 672 2 0 546 3 0 420 4 0 294 5 0 168 6 163.8 0 7 289.8 0 8 415.8 0 9 541.8 0 10 667.8 0 11 884.8 168 12 884.8 294 13 884.8 420 14 884.8 546 15 884.8 672 16 667.8 772.8 17 541.8 772.8 18 415.8 772.8 19 289.8 772.8 20 163.8 772.8 • All dimensions are in microns. • Pad dimensions: PASSIVATION OPENING: 94.4microns × 94.4microns METAL: 102.4microns × 102.4microns • All measurements specify the lower left corner of the pad 20 19 18 17 16 HD01Z 15 1 Y 14 2 13 3 MAX3971 12 4 5 (0,0) 11 X 6 7 8 9 10 _______________________________________________________________________________________ +3.3V, 10.3Gbps Limiting Amplifier 12, 16,20, 24L QFN.EPS _______________________________________________________________________________________ 9 MAX3971 Package Information +3.3V, 10.3Gbps Limiting Amplifier MAX3971 Package Information (continued) Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 10 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2001 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.