APPLICATIONS POWER SEMICONDUCTORS Mario Feldvoss ● Andreas Karl IGBT modules of the second generation: Econopacks shrink frequency converters Siemens has developed technically superior, but low-cost packages for second-generation IGBTs in the power range from 0.75 to 75 kW. The new Econopacks reduce space requirements by two-thirds and weight by threequarters. modules is reduced by a factor of three, their weight by as much as a factor of four. A three-phase full bridge for 100 A in an Econopack 3 (type BSM100GD120DN2) for example, weighs only 300 grams in comparison with the 1260 grams of three conventional half-bridge modules. These modules are currently available as three-phase full bridges (six-packs) for reverse voltages of 600 and 1200 V and as tripacks (Table 1). Modules for 6 u 20 A to 6 u 50 A at 600 V, and for 6 x 10 A to 6 u 50 A at 1200 V are available in Econopack 2 packages. The modules for the power range 6 u 75 to 6 u 100 A or 3 u 150 A to 3 u 200 A at 1200 V are all housed in Econopack 3 packages. Assembly times slashed s well as capacitors and heat sinks, insulated gate bipolar transistors (IGBTs) for power control have a major impact on cost in the design of frequency converters. In conventional IGBTs configured as half-bridges or single switches, the package accounts for a considerable share of component costs. IGBT technology of the second generation allows more switching elements to be squeezed into a package without power dissipation leading to significantly higher chip temperatures. The Econopack 2 and Econopack 3 packages of technically superior design (Fig. 1) can withstand higher temperature and load variations than conventional modules. What’s more, they cost less and take up less space. The Econopack packages have solderable pins, so assembly time can be reduced by a factor of eight in comparison with conventional screw and plug-in contacts, e.g. from 320 to 40 seconds for a 50 A full-bridge circuit. The drive pins and power terminals are located on opposite sides of the package. The concept of solderability throughout and the separate pin arrangement in conjunction with a wide range of variants reduce layout costs considerably. The clearances and leakage paths between the pins are such that modules soldered onto the circuit board comply with relevant safety requirements such as UL 840, UL 508C, IEV 335, VDE 0110 and VDE 160. Compact, lightweight packages Custom configurability Thanks to the compact design of Econopacks, the space requirement of IGBT Beyond this, the switches contained in the module can be individually configured or A 6 connected in parallel. In the Econopack 2, for example, the 50 A six-pack of type BSM50GD120DN2 can also be used as a 150 A half-bridge by shorting output pins U, V and W. The same applies to modules in the Econopack 3. Thanks to its pin configuration, this package also allows designers to connect several full bridges in parallel (Fig. 2) and thus double the power. The collector current does not have to be reduced because the saturation voltage of the IGBT has a positive temperature coefficient. The gate drop resistor integrated into the IGBT chips ensures uniform current distribution at turn-on when the various IGBTs are driven. The tripack solution in the Econopack 3 also offers the option of connecting its three Fig. 1 Second-generation IGBTs in Econopack 2 (top) and Econopack 3 (bottom) packages reduce the space requirements and weight of frequency converters Components XXXI (1996) No. 3 APPLICATIONS POWER SEMICONDUCTORS Collectoremitter voltage VCE in V Collector current Econopack 1 Six-pack Econopack 2 Six-pack Econopack 3 Six-pack Tripack IC in A 600 600 10 15 BSM10GD60DN2 BSM15GD60DN2 600 600 20 30 BSM20GD60DN2 BSM30GD60DN2 600 1200 50 10 BSM50GD60DN2 BSM10GD120DN2 1200 1200 15 25 BSM15GD120DN2 BSM25GD120DN2 1200 1200 35 50 BSM35GD120DN2 BSM50GD120DN2 1200 1200 75 100 1200 1200 150 200 BSM75GD120DN2 BSM100GD120DN2 BSM150GD120DN2 BSM200GD120DN2 Table 1 IGBTs in Econopack packages cover the current ranges from 10 to 50 A at 600 V and from 10 to 200 A at 1200 V U 18 19 17 16 15 19 20 14 P 21 13 N 1 2 3 4 5 6 7 8 9 10 17 16 W 15 18 19 17 16 15 20 14 20 14 P 21 13 21 13 N 11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12 P 13/21 1 2 V 18 19 5 6 17 9 10 P 1 2 15 3 7 11 3 4 14/20 8 12 4 19 U 5 6 17 9 10 7 11 8 12 15 V 1 2 19 5 6 3 7 4 8 17 9 10 15 W 11 12 N N Fig. 2 Thanks to carefully designed pinning of the Econopack 3 package (left), two full bridges (right) can be connected in parallel without major layout expenditure separate switches in parallel and thus tripling the permitted collector current. Its versatility as a six-pack or half-bridge, as a tripack or single switch, reduces logistics and storage costs. Second-generation IGBT modules in Econopack 2 and Econopack 3 packages thus give designers of frequency converters flexible, low-cost and easy-to-process building blocks for a wide power range and h variety of applications. Check #3-96-1 (HL) on Reader Service Card Components XXXI (1996) No. 3 Mario Feldvoss Dipl.-Ing. (FH), studied power engineering at Lübeck and joined Siemens in 1986. He initially worked on development of power semiconductor technologies. Since 1990, Mr. Veldfoss (35) has been involved in definition, development and support for IGBT modules. Andreas Karl Dipl.-Ing. (FH), studied telecommunications in Regensburg and joined the Siemens Semiconductor Group as a designer of magnetic field sensors in 1992. In 1995, after working as an applications engineer on power semiconductors, he went into product marketing for IGBT modules. 7