PI6C185-01B 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 Precision 1-5 Clock Buffer Features Description High-speed, low-noise non-inverting 1-5 buffer The PI6C185-01B, a high-speed low-noise 1-5 non-inverting buffer designed for SDRAM clock buffer applications, is intended to be used with the PI6C10X clock generator for Intel Architecture-based Mobile systems. Switching speed up to 140 MHz Supports up to two SODIMMs At power up, all SDRAM outputs are enabled and active. The I2C Serial control may be used to individually activate/deactivate any of the five output drivers. Low skew (<250ps) between any two output clocks I2C Serial Configuration interface Multiple VDD, VSS pins for noise reduction Note: Purchase of I2C components from Pericom conveys a license to use them in an I2C system as defined by Philips. 3.3V power supply voltage 16-pin TSSOP (L) and QSOP (Q) packages Block Diagram Pin Configuration SDRAM0 Vdd SDRAM0 SDRAM1 Vss BUF_IN Vdd SDATA SCLK SDRAM1 BUF_IN SDRAM2 SDRAM3 1 2 3 4 5 6 7 8 16-Pin L, Q 16 15 14 13 12 11 10 9 Vdd SDRAM4 Vss Vdd SDRAM3 SDRAM2 Vss Vss SDRAM4 SDATA I2C SCLOCK I/O 1 PS8466 05/03/00 PI6C185-01B Precision 1-5 Clock Buffer 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 Pin Description Pin Signal Type Qty De s cription 2,3,11,12,15 SDRAM [0.4] I 5 Buffered Clock Outputs 5 BUF_IN I 1 Clock Buffer Input 7 SDATA I/O 1 Serial Data for I2C interface, internal pull- up 8 SCLK I 1 Serial Clock for I2C interface, internal pull- up 1,6,13,16 VDD Power 4 3.3V Power Supply 4,9,10,14 VSS Ground 4 Ground PI6C185-01B I2C Address Assignment A6 A5 A4 A3 A2 A1 A0 R/W 1 1 0 1 0 0 1 0 PI6C185-01B Serial Configuration Map Byte1: SDRAM Active/Inactive Register (1 = enable, 0 = disable) Byte0: SDRAM Active/Inactive Register (1 = enable, 0 = disable) Bit Pin # Bit 7 12 Bit 6 D e s cription Bit Pin# D e s cription SDRAM3 (Active/Inactive) Bit 7 - NC (Initialize to 0) 11 SDRAM2 (Active/Inactive) Bit 6 - NC (Initialize to 0) Bit 5 - NC (Initialize to 0) Bit 5 - NC (Initialize to 0) Bit 4 - NC (Initialize to 0) Bit 4 - NC (Initialize to 0) Bit 3 - NC (Initialize to 0) Bit 3 - NC (Initialize to 0) Bit 2 - NC (Initialize to 0) Bit 2 - NC (Initialize to 0) Bit 1 3 SDRAM1 (Active/Inactive) Bit 1 - NC (Initialize to 0) Bit 0 2 SDRAM0 (Active/Inactive) Bit 0 15 SDRAM4 (Active/Inactive) Note: Inactive means outputs are held LOW and are disabled from switching 2 PS8466 05/03/00 PI6C185-01B Precision 1-5 Clock Buffer 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 2-Wire I2C Control 1 The I2C interface permits individual enable/disable of each clock output and test mode enable. Each data transfer is initiated with a start condition and ended with a stop condition. The first byte after a start condition is always a 7-bit address byte followed by a read/write bit. (HIGH = read from addressed device, LOW = write to addressed device). If the device’s own address is detected, PI6C185-01B generates an acknowledge by pulling SDATA line LOW during ninth clock pulse, then accepts the following data bytes until another start or stop condition is detected. The PI6C185-01B, a slave receiver device, cannot be read back. Sub addressing is not supported. To change one of the control bytes, all preceding bytes must be sent Every byte put on the SDATA line must be 8-bits long (MSB first), followed by an acknowledge bit generated by the receiving device. 2 3 Following acknowledgement of the address byte (0D2H), two more bytes must be sent: During normal data transfers SDATA changes only when SCLK is LOW. Exceptions: A HIGH to LOW transition on SDATA while SCLK is HIGH indicates a “start” condition. A LOW to HIGH transition on SDATA while SCLK is HIGH is a “stop” condition and indicates the end of a data transfer cycle. 4 1. “Command Code” byte & 2. “Byte Count” byte. Although the data bits on these two bytes are “don’t care,” they must be sent and acknowledged. 5 Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) 6 Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Storage Temperature ...................................... 65°C to +150°C Ambient Temperature with Power Applied ........ 0°C to +70°C 3.3V Supply Voltage to Ground Potential ........... 0.5V to +4.6V DC Input Voltage .............................................. 0.5V to +4.6V Supply Current (VDD = +3.465V, CLOAD = Max.) Symbol Parame te r Te s t Condition M in. Typ. IDD Supply Current BUF_IN = 0 MHz IDD Supply Current BUF_IN = 66.66 MHz 70 IDD Supply Current BUF_IN = 100.0 MHz 120 IDD Supply Current BUF_IN = 133.3 MHz 200 M ax. 7 8 9 Units 3 10 mA 11 12 13 14 15 3 PS8466 05/03/00 PI6C185-01B Precision 1-5 Clock Buffer 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 DC Operating Specifications (VDD = +3.3V ±5%, TA = 0°C –70°C) Symbol Parame te r Condition M in. M ax. Units VDD 2.0 VDD +0.3 VSS 0.3 0.8 0 < VIN < VDD 5 +5 2.4 Input Voltage VIH Input High Voltage VIL Input Low Voltage IIL Input Leakage Current V µA VDD = 3.3V ±5% VOH Output High Voltage IOH = - 1mA VOL Output Low Voltage IOL = 1mA CIN Input Pin Capacitance 5 COUT Output pins Capacitance 6 LPIN Pin Inductance 7 nH 70 ºC TA Ambient Temperature V 0.4 No Airflow 0 pF SDRAM Clock Buffer Operating Specification Symbol Parame te r Condition IO H M IN Pull- up current VO U T = 2.0V IO H M A X Pull- up current VO U T = 3.135V IO LM IN Pull- down current VO U T = 1.0V IO LM A X Pull- down current VO U T = 0.4V M in. Typ. M ax. Units 40 36 mA 40 38 tR H SDRAM O utput rise edge rate SDRAM only 3.3V ±5% @0.4V- 2.4V 1.5 tF H SDRAM O utput fall edge rate SDRAM only 1.5 3.3V ±5% @2.4V- 0.4V 4 V/ns 4 AC Timing Symbol Parame te r 66 M Hz 100 M Hz 133 M Hz M in. M ax. M in. M ax. M in. M ax. 15.5 10.0 10.5 7.5 7.8 Units tSDKP SDRAM CLK period 15.0 tSDKH SDRAM CLK high time 5.6 3.3 1.0 tSDKL SDRAM CLK low time 5.3 3.1 1.0 tSDRISE SDRAM CLK rise time 1.5 4.0 1.5 4.0 1.5 4.0 tSDFALL SDRAM CLK fall time 1.5 4.0 1.5 4.0 1.5 4.0 tPLH SDRAM Buffer LH prop delay 1.0 5.5 1.0 5.5 1.0 5.5 tPHL SDRAM Buffer HL prop delay 1.0 5.5 1.0 5.5 1.0 5.5 tPZL,tPZH SDRAM Buffer Enable delay 1.0 8.0 1.0 8.0 1.0 8.0 tPLZ,tPHZ SDRAM Buffer Disable delay 1.0 8.0 1.0 8.0 1.0 8.0 Duty Cycle Measured at 1.5V 45 55 45 55 45 55 % tSDSKW SDRAM Output to Output Skew 250 ps 250 250 4 ns V/ns ns PS8466 05/03/00 PI6C185-01B Precision 1-5 Clock Buffer 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 1 Test Output Point Buffer 2 Test Load 3 tSDKP tSDKH 3.3V Clocking Interface (TTL) 2.4 4 1.5 0.4 5 tSDKL tSDRISE tSDFALL 6 Input 1.5V 1.5V Waveform tplh 7 tphl Output 1.5V Waveform 8 1.5V 9 Figure 1. Clock Waveforms 10 Minimum and Maximum Expected Capacitive Loads Clock SDRAM M in Load M ax Load 15 20 Units pF Note s SDRAM DIMM Specification 11 Notes: 1. Maximum rise/fall times are guaranteed at maximum specified load. 2. Minimum rise/fall times are guaranteed at minimum specified load. 3. Rise/fall times are specified with pure capacitive load as shown. Testing is done with an additional 500Ω resistor in parallel. 12 13 Design Guidelines to Reduce EMI 14 1. Place RS series resistors and CI capacitors as close as possible to the respective clock pins. Typical value for CI is 10pF. RS Series resistor value can be increased to reduce EMI provided that the rise and fall time are still within the specified values. 2. Minimize the number of “vias” of the clock traces. 3. Route clock traces over a continuous ground plane or over a continuous power plane. Avoid routing clock traces from plane to plane (refer to rule #2). 4. Position clock signals away from signals that go to any cables or any external connectors. 5 15 PS8466 05/03/00 PI6C185-01B Precision 1-5 Clock Buffer 12345678901234567890123456789012123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789012123456789012 PI6C185-01B 100/66 MHz Clock from Chipset SDRAM RS 5 SDRAM DIMM Spec. CI Figure 2. Design Guidelines 16-Pin TSSOP (L) Package 16-Pin QSOP (Q) Package 16 16 .150 .157 .169 .177 3.81 3.99 .015 x 45° 0.38 4.3 4.5 1 1 .193 .201 4.9 5.1 .004 .008 .047 max. 1.20 .007 .012 .002 .006 0.41 .016 1.27 .050 .008 0.203 REF 0.45 .018 0.75 .030 SEATING PLANE .0256 BSC 0.65 0.09 0.20 0.178 0.254 .007 .010 .189 .197 4.80 5.00 .228 .244 5.79 6.19 .053 1.35 .069 1.75 .252 BSC 6.4 SEATING PLANE 0.05 0.15 .025 BSC 0.635 0.19 0.30 .008 .012 0.203 0.305 .004 0.101 .010 0.254 X.XX DENOTES CONTROLLING X.XX DIMENSIONS IN MILLIMETERS X.XX DENOTES DIMENSIONS X.XX IN MILLIMETERS Ordering Information P/N De s cription PI6C185- 01BL TSSOP Package PI6C185- 01BQ QSOP Package Pericom Semiconductor Corporation 2380 Bering Drive • San Jose, CA 95131 • 1-800-435-2336 • Fax (408) 435-1100 • http://www.pericom.com 6 PS8466 05/03/00