MC10H164 8-Line Multiplexer The MC10H164 is a MECL 10H part which is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increase in power supply current. The MC10H164 is designed to be used in data multiplexing and parallel to serial conversion applications. Full parallel gating provides equal delays through any data path. The MC10H164 incorporates an output buffer, eight inputs and an enable. A high on the enable forces the output low. The open emitter output allows the MC10H164 to be connected directly to a data bus. The enable line allows an easy means of expanding to more than 8 lines using additional MC10H164’s. • Propagation Delay, 1.0 ns Typical • Power Dissipation, 310 mW Typical (same as MECL 10K) • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible http://onsemi.com MARKING DIAGRAMS 16 CDIP–16 L SUFFIX CASE 620 MC10H164L AWLYYWW 1 16 PDIP–16 P SUFFIX CASE 648 MC10H164P AWLYYWW 1 1 LOGIC DIAGRAM A 7 VCC1 = VCC2 = VEE = B 9 C 10 PLCC–20 FN SUFFIX CASE 775 PIN 1 PIN 16 PIN 8 Enable 2 10H164 AWLYYWW Z 15 X0 6 A WL YY WW X1 5 X2 4 X3 3 = Assembly Location = Wafer Lot = Year = Work Week X4 11 TRUTH TABLE X5 12 X7 14 DIP PIN ASSIGNMENT VCC1 ENABLE 1 16 2 15 VCC2 Z X3 3 14 X7 X2 4 13 X6 X1 5 12 X5 X0 6 11 X4 A 7 10 C VEE 8 9 B March, 2000 – Rev. 7 A L H L H L H L H X Z X0 X1 X2 X3 X4 X5 X6 X7 L ORDERING INFORMATION Device Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 18 of the ON Semiconductor MECL Data Book (DL122/D). Semiconductor Components Industries, LLC, 2000 C L L L L H H H H X ENABLE L L L L L L L L H X6 13 ADDRESS INPUTS B L L H H L L H H X 1 Package Shipping MC10H164L CDIP–16 25 Units/Rail MC10H164P PDIP–16 25 Units/Rail MC10H164FN PLCC–20 46 Units/Rail Publication Order Number: MC10H164/D MC10H164 MAXIMUM RATINGS Symbol Rating Unit VEE VI Power Supply (VCC = 0) Characteristic –8.0 to 0 Vdc Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current – Continuous – Surge 50 100 mA TA Tstg Operating Temperature Range 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range – Plastic – Ceramic ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note 1.) 0° Symbol IE Characteristic Power Supply Current 25° 75° Min Max Min Max Min Max Unit – 83 – 75 – 83 mA µA IinH IinL Input Current High – 512 – 320 – 320 Input Current Low 0.7 – 0.7 – 0.7 – µA VOH VOL High Output Voltage –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc Low Output Voltage –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc VIH VIL High Input Voltage –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc Low Input Voltage –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc Propagation Delay Enable Data Address 0.4 0.7 1.0 1.45 2.4 2.8 0.4 0.8 1.1 1.5 2.5 2.9 0.5 0.9 1.2 1.7 2.6 3.2 Rise Time 0.5 1.5 0.5 1.6 0.5 1.7 ns Fall Time 0.5 1.5 0.5 1.6 0.5 1.7 ns AC PARAMETERS tpd tr tf ns 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50–ohm resistor to –2.0 volts. http://onsemi.com 2 MC10H164 TYPICAL APPLICATIONS FIGURE 1 – HIGH SPEED 16–BIT MULTIPLEXER/DEMULTIPLEXER Control Selection 15 14 13 12 11 10 9 8 S0 S1 CR A 7 6 5 4 3 2 1 0 MC10H136 B C D E1 C B A MC10H164 D0 E1 C B A MC10H164 E1 C B A MC10H161 MC10H164 D0 S0 S0 S1 S1 CR A CR MC10H136 B C D E0 MC10H161 MC10H162 E1 C B A Start/Stop 15 14 1312 11 10 9 8 FIGURE 2 – 1–OF–64 LINE MULTIPLEXER E A B C MC10H164 E A B C MC10H164 E MSB MC10H161 9 7 LSB Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 E E 3 Dout A B C MC10H164 http://onsemi.com Dout A B C MC10H164 E Dout A B C MC10H164 E Dout A B C MC10H164 The Bit chosen is dependent on six–bit code present on inputs 7, 9, 14 of the MC10H161 and the A, B, C inputs of the MC10H164. Dout A B C MC10H164 E Dout A B C MC10H164 14 Dout Dout E0 7 6 5 4 3 2 1 0 MC10H164 PACKAGE DIMENSIONS PLCC–20 FN SUFFIX PLASTIC PLCC PACKAGE CASE 775–02 ISSUE C 0.007 (0.180) M T L–M B Y BRK –N– U N S 0.007 (0.180) M T L–M S S N S D –L– –M– Z W 20 D 1 G1 X V 0.010 (0.250) S T L–M S N S VIEW D–D A 0.007 (0.180) M T L–M S N S R 0.007 (0.180) M T L–M S N S 0.007 (0.180) M T L–M H S N S Z K1 K C E F 0.007 (0.180) M T L–M S 0.004 (0.100) G J –T– VIEW S G1 0.010 (0.250) S T L–M S N S VIEW S SEATING PLANE NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– N S MC10H164 PACKAGE DIMENSIONS –A– 16 9 1 8 –B– CDIP–16 L SUFFIX CERAMIC DIP PACKAGE CASE 620–10 ISSUE T C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. L DIM A B C D E F G H K L M N –T– K N SEATING PLANE M E F J G D 16 PL 0.25 (0.010) 16 PL 0.25 (0.010) M T A T B M –A– 9 1 8 B F C L S –T– SEATING PLANE K H G D M J 16 PL 0.25 (0.010) M MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 ––– 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 S PDIP–16 P SUFFIX PLASTIC DIP PACKAGE CASE 648–08 ISSUE R 16 S INCHES MIN MAX 0.750 0.785 0.240 0.295 ––– 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 T A M http://onsemi.com 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MC10H164 Notes http://onsemi.com 6 MC10H164 Notes http://onsemi.com 7 MC10H164 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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