TLV1117 www.ti.com SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 ADJUSTABLE AND FIXED LOW-DROPOUT VOLTAGE REGULATOR Check for Samples: TLV1117 FEATURES 1 • 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V, and AdjustableOutput Voltage Options Output Current of 800 mA DCY (SOT-223) PACKAGE (TOP VIEW) OUTPUT INPUT OUTPUT ADJ/GND • • • Specified Dropout Voltage at Multiple Current Levels 0.2% Line Regulation Maximum 0.4% Load Regulation Maximum KCT / KCS (TO-220) PACKAGE (TOP VIEW) DRJ (QFN) PACKAGE (TOP VIEW) ADJ/GND 1 VIN(1) 2 VIN(1) VIN(1) 8 NC 7 VOUT(2) 3 6 VOUT(2) 4 5 VOUT(2) VOUT OUTPUT • INPUT OUTPUT ADJ/GND (1) VIN pins (2, 3, 4) must be connected together. (2) VOUT pins (5, 6, 7) must be connected together. INPUT OUTPUT ADJ/GND KVU (TO-252) PACKAGE (TOP VIEW) OUTPUT OUTPUT KTT (TO-263) PACKAGE (TOP VIEW) INPUT OUTPUT ADJ/GND DESCRIPTION/ORDERING INFORMATION The TLV1117 is a positive low-dropout voltage regulator designed to provide up to 800 mA of output current. The device is available in 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V, and adjustable-output voltage options. All internal circuitry is designed to operate down to 1-V input-to-output differential. Dropout voltage is specified at a maximum of 1.3 V at 800 mA, decreasing at lower load currents. The TLV1117 is designed to be stable with tantalum and aluminum electrolytic output capacitors having an ESR between 0.2 Ω and 10 Ω. Unlike pnp-type regulators, in which up to 10% of the output current is wasted as quiescent current, the quiescent current of the TLV1117 flows into the load, increasing efficiency. The TLV1117C device is characterized for operation over the virtual junction temperature range of 0°C to 125°C, and the TLV1117I device is characterized for operation over the virtual junction temperature range of –40°C to 125°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2013, Texas Instruments Incorporated TLV1117 SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. TLV1117C ORDERING INFORMATION (1) TA PACKAGE (2) VO TYP ORDERABLE PART NUMBER TOP-SIDE MARKING Reel of 1000 TLV1117-15CDRJR ZYH Tube of 80 TLV1117-15CDCY Reel of 2500 TLV1117-15CDCYR TO-252 – KVU Reel of 2500 TLV1117-15CKVUR ZE15 QFN – DRJ Reel of 1000 TLV1117-18CDRJR ZYK Tube of 80 TLV1117-18CDCY Reel of 2500 TLV1117-18CDCYR TO-252 – KVU Reel of 2500 TLV1117-18CKVUR ZE18 QFN – DRJ Reel of 1000 TLV1117-25CDRJR ZYM Tube of 80 TLV1117-25CDCY Reel of 2500 TLV1117-25CDCYR TO-252 – KVU Reel of 2500 TLV1117-25CKVUR ZE25 QFN – DRJ Reel of 1000 TLV1117-33CDRJR ZYP Tube of 80 TLV1117-33CDCY Reel of 2500 TLV1117-33CDCYR TO-252 – KVU Reel of 2500 TLV1117-33CKVUR ZE33 QFN – DRJ Reel of 1000 TLV1117-50CDRJR ZE50 Tube of 80 TLV1117-50CDCY Reel of 2500 TLV1117-50CDCYR TO-252 – KVU Reel of 2500 TLV1117-50CKVUR ZE50 QFN – DRJ Reel of 1000 TLV1117CDRJR ZYS Tube of 80 TLV1117CDCY Reel of 2500 TLV1117CDCYR TO-220 – KCS Tube of 50 TLV1117CKCS TLV1117C TO-220 – KCT Tube of 50 TLV1117CKCT TLV1117C TO-252 – KVU Reel of 2500 TLV1117CKVUR TV1117 TO-263 – KTT Reel of 500 TLV1117CKTTR TLV1117C QFN – DRJ 1.5 V 1.8 V 2.5 V 0°C to 125°C 3.3 V 5V SOT-223 – DCY SOT-223 – DCY SOT-223 – DCY SOT-223 – DCY SOT-223 – DCY SOT-223 – DCY ADJ (1) (2) 2 T2 T4 T6 V3 VT V4 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 TLV1117 www.ti.com SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 TLV1117I ORDERING INFORMATION (1) TA PACKAGE (2) VO TYP ORDERABLE PART NUMBER TOP-SIDE MARKING Reel of 1000 TLV1117-15IDRJR ZYJ Tube of 80 TLV1117-15IDCY Reel of 2500 TLV1117-15IDCYR TO-252 – KVU Reel of 2500 TLV1117-15IKVUR ZF15 QFN – DRJ Reel of 1000 TLV1117-18IDRJR ZYL Tube of 80 TLV1117-18IDCY Reel of 2500 TLV1117-18IDCYR TO-252 – KVU Reel of 2500 TLV1117-18IKVUR ZF18 QFN – DRJ Reel of 1000 TLV1117-25IDRJR ZYN Tube of 80 TLV1117-25IDCY Reel of 2500 TLV1117-25IDCYR TO-252 – KVU Reel of 2500 TLV1117-25IKVUR ZF25 QFN – DRJ Reel of 1000 TLV1117-33IDRJR ZYR Tube of 80 TLV1117-33IDCY Reel of 2500 TLV1117-33IDCYR TO-252 – KVU Reel of 2500 TLV1117-33IKVUR ZF33 QFN – DRJ Reel of 1000 TLV1117-50IDRJR ZF50 Tube of 80 TLV1117-50IDCY Reel of 2500 TLV1117-50IDCYR TO-252 – KVU Reel of 2500 TLV1117-50IKVUR ZF50 QFN – DRJ Reel of 1000 TLV1117IDRJR ZYT Tube of 80 TLV1117IDCY Reel of 2500 TLV1117IDCYR TO-220 – KCS Tube of 50 TLV1117IKCS TLV1117I TO-252 – KVU Reel of 2500 TLV1117IKVUR TY1117 TO-263 – KTT Reel of 500 TLV1117IKTTR TLV1117I QFN – DRJ 1.5 V 1.8 V 2.5 V –40°C to 125°C 3.3 V 5V SOT-223 – DCY SOT-223 – DCY SOT-223 – DCY SOT-223 – DCY SOT-223 – DCY SOT-223 – DCY ADJ (1) (2) T3 T5 T8 VS VU V2 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 3 TLV1117 SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com FUNCTIONAL BLOCK DIAGRAM VIN Thermal Limit − + Current Limit + − VOUT GND/ADJ (Fixed-Voltage Version) GND/ADJ (Adjustable Version) 4 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 TLV1117 www.ti.com SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN VIN Continuous input voltage TJ Operating virtual-junction temperature Tstg Storage temperature range (1) MAX –65 UNIT 16 V 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION TLV1117 THERMAL METRIC (1) (2) (3) PowerFlex UNITS KTE (3 PINS) KTP (3 PINS) DRJ (8 PINS) DCY (4 PINS) KVU (3 PINS) KCS/KCT (3 PINS) KTT (3 PINS) θJA Junction-to-ambient thermal resistance 38.6 49.2 38.3 104.3 50.9 30.1 27.5 θJCtop Junction-to-case (top) thermal resistance 34.7 60.6 36.5 53.7 57.9 44.6 43.2 θJB Junction-to-board thermal resistance 3.2 3.1 60.5 5.7 34.8 1.2 17.3 ψJT Junction-to-top characterization parameter 5.9 8.7 0.2 3.1 6 5 2.8 ψJB Junction-to-board characterization parameter 3.1 3 12 5.5 23.7 1.2 9.3 θJCbot Junction-to-case (bottom) thermal resistance 3 3 4.7 n/a 0.4 0.4 0.3 θJP Thermal resistance between the die junction and the bottom of the exposed pad. 2.7 1.4 1.78 n/a n/a 3 1.94 (1) (2) (3) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. RECOMMENDED OPERATING CONDITIONS VIN IO TJ (1) Input voltage MIN (1) MAX TLV1117 2.7 15 TLV1117-15 2.9 15 TLV1117-18 3.2 15 TLV1117-25 3.9 15 TLV1117-33 4.7 15 TLV1117-50 6.4 Output current Operating virtual-junction temperature TLV1117I V 15 0.8 TLV1117C UNIT 0 125 –40 125 A °C The input-to-output differential across the regulator should provide for some margin against regulator operation at the maximum dropout (for a particular current value). This margin is needed to account for tolerances in both the input voltage (lower limit) and the output voltage (upper limit). The absolute minimum VIN for a desired maximum output current can be calculated by the following: VIN(min) = VOUT(max) + VDO(max at rated current) Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 5 TLV1117 SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com TLV1117C ELECTRICAL CHARACTERISTICS TJ = 0°C to 125°C, all typical values are at TJ = 25°C (unless otherwise noted) TEST CONDITIONS (1) PARAMETER Reference voltage, VREF VIN – VOUT = 2 V, IOUT = 10 mA, TJ = 25°C VIN – VOUT = 1.4 V to 10 V, IOUT = 10 mA to 800 mA VIN = 3.5 V, IOUT = 10 mA, TJ = 25°C VIN = 2.9 V to 10 V, IOUT = 0 to 800 mA VIN = 3.8 V, IOUT = 10 mA, TJ = 25°C VIN = 3.2 V to 10 V, IOUT = 0 to 800 mA VIN = 4.5 V, IOUT = 10 mA, TJ = 25°C Output voltage, VOUT VIN = 3.9 V to 10 V, IOUT = 0 to 800 mA VIN = 5 V, IOUT = 10 mA, TJ = 25°C VIN = 4.75 V to 10 V, IOUT = 0 to 800 mA VIN = 7 V, IOUT = 10 mA, TJ = 25°C VIN = 6.5 V to 12 V, IOUT = 0 to 800 mA Line regulation Load regulation Dropout voltage, VDO (2) TLV1117 TLV1117-15 TLV1117-18 TLV1117-25 TLV1117-33 TLV1117-50 MIN TYP MAX 1.238 1.25 1.262 1.225 1.25 1.27 1.485 1.5 1.515 1.455 1.5 1.545 1.782 1.8 1.818 1.746 1.8 1.854 2.475 2.5 2.525 2.450 2.5 2.550 3.267 3.3 3.333 3.235 3.3 3.365 4.950 5.0 5.050 4.900 5.0 5.100 0.035 0.2 IOUT = 10 mA, VIN – VOUT = 1.5 V to 13.75 V TLV1117 IOUT = 0 mA, VIN = 2.9 V to 10 V TLV1117-15 1 6 IOUT = 0 mA, VIN = 3.2 V to 10 V TLV1117-18 1 6 IOUT = 0 mA, VIN = 3.9 V to 10 V TLV1117-25 1 6 IOUT = 0 mA, VIN = 4.75 V to 15 V TLV1117-33 1 6 IOUT = 0 mA, VIN = 6.5 V to 15 V TLV1117-50 IOUT = 10 mA to 800 mA, VIN – VOUT = 3 V TLV1117 IOUT = 0 to 800 mA, VIN = 2.9 V 1 10 0.2 0.4 TLV1117-15 1 10 IOUT = 0 to 800 mA, VIN = 3.2 V TLV1117-18 1 10 IOUT = 0 to 800 mA, VIN = 3.9 V TLV1117-25 1 10 IOUT = 0 to 800 mA, VIN = 4.75 V TLV1117-33 1 10 IOUT = 0 to 800 mA, VIN = 6.5 V TLV1117-50 1 15 UNIT V % mV % mV IOUT = 100 mA 1.1 1.2 IOUT = 500 mA 1.15 1.25 IOUT = 800 mA 1.2 1.3 1.2 1.6 1.7 5 mA 5 10 mA 0.01 0.1 %/W 80 120 μA 5 μA Current limit VIN – VOUT = 5 V, TJ = 25°C (3) Minimum load current VIN = 15 V TLV1117 Quiescent current VIN ≤ 15 V All fixed-voltage options Thermal regulation 30-ms pulse, TA = 25°C Ripple rejection VIN – VOUT = 3 V, Vripple = 1 Vpp, f = 120 Hz ADJ pin current 0.8 60 75 V A dB Change in ADJ pin current VIN – VOUT = 1.4 V to 10 V, IOUT = 10 mA to 800 mA 0.2 Temperature stability TJ = full range 0.5 % Long-term stability 1000 hrs, No load, TA = 125°C 0.3 % Output noise voltage (% of VOUT) f = 10 Hz to 100 kHz 0.003 % (1) (2) (3) 6 All characteristics are measured with a 10-μF capacitor across the input and a 10-μF capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Dropout is defined as the VIN to VOUT differential at which VOUT drops 100 mV below the value of VOUT, measured at VIN = VOUT(nom) + 1.5 V. Current limit test specified under recommended operating conditions Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 TLV1117 www.ti.com SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 TLV1117I ELECTRICAL CHARACTERISTICS TJ = –40°C to 125°C, all typical values are at TJ = 25°C (unless otherwise noted) TEST CONDITIONS (1) PARAMETER Reference voltage, VREF VIN – VOUT = 2 V, IOUT = 10 mA, TJ = 25°C VIN – VOUT = 1.4 V to 10 V, IOUT = 10 mA to 800 mA VIN = 3.5 V, IOUT = 10 mA, TJ = 25°C VIN = 2.9 V to 10 V, IOUT = 0 to 800 mA VIN = 3.8 V, IOUT = 10 mA, TJ = 25°C VIN = 3.2 V to 10 V, IOUT = 0 to 800 mA VIN = 4.5 V, IOUT = 10 mA, TJ = 25°C Output voltage, VOUT VIN = 3.9 V to 10 V, IOUT = 0 to 800 mA VIN = 5 V, IOUT = 10 mA, TJ = 25°C VIN = 4.75 V to 10 V, IOUT = 0 to 800 mA VIN = 7 V, IOUT = 10 mA, TJ = 25°C VIN = 6.5 V to 12 V, IOUT = 0 to 800 mA Line regulation Load regulation Dropout voltage, VDO (2) TLV1117 TLV1117-15 TLV1117-18 TLV1117-25 TLV1117-33 TLV1117-50 MIN TYP MAX 1.238 1.25 1.262 1.200 1.25 1.29 1.485 1.5 1.515 1.44 1.5 1.56 1.782 1.8 1.818 1.728 1.8 1.872 2.475 2.5 2.525 2.4 2.5 2.6 3.267 3.3 3.333 3.168 3.3 3.432 4.95 5.0 5.05 4.80 5.0 5.20 0.035 0.3 IOUT = 10 mA, VIN – VOUT = 1.5 V to 13.75 V TLV1117 IOUT = 0 mA, VIN = 2.9 V to 10 V TLV1117-15 1 10 IOUT = 0 mA, VIN = 3.2 V to 10 V TLV1117-18 1 10 IOUT = 0 mA, VIN = 3.9 V to 10 V TLV1117-25 1 10 IOUT = 0 mA, VIN = 4.75 V to 15 V TLV1117-33 1 10 IOUT = 0 mA, VIN = 6.5 V to 15 V TLV1117-50 IOUT = 10 mA to 800 mA, VIN – VOUT = 3 V TLV1117 IOUT = 0 to 800 mA, VIN = 2.9 V 1 15 0.2 0.5 TLV1117-15 1 15 IOUT = 0 to 800 mA, VIN = 3.2 V TLV1117-18 1 15 IOUT = 0 to 800 mA, VIN = 3.9 V TLV1117-25 1 15 IOUT = 0 to 800 mA, VIN = 4.75 V TLV1117-33 1 15 IOUT = 0 to 800 mA, VIN = 6.5 V TLV1117-50 1 20 UNIT V % mV % mV IOUT = 100 mA 1.1 1.3 IOUT = 500 mA 1.15 1.35 IOUT = 800 mA 1.2 1.4 1.2 1.6 1.7 5 mA 5 15 mA 0.01 0.1 %/W 80 120 μA 10 μA Current limit VIN – VOUT = 5 V, TJ = 25°C (3) Minimum load current VIN = 15 V TLV1117 Quiescent current VIN ≤ 15 V All fixed-voltage options Thermal regulation 30-ms pulse, TA = 25°C Ripple rejection VIN – VOUT = 3 V, Vripple = 1 Vpp, f = 120 Hz ADJ pin current 0.8 60 75 V A dB Change in ADJ pin current VIN – VOUT = 1.4 V to 10 V, IOUT = 10 mA to 800 mA 0.2 Temperature stability TJ = full range 0.5 % Long-term stability 1000 hrs, No load, TA = 125°C 0.3 % Output noise voltage (% of VOUT) f = 10 Hz to 100 kHz 0.003 % (1) (2) (3) All characteristics are measured with a 10-μF capacitor across the input and a 10-μF capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Dropout is defined as the VIN to VOUT differential at which VOUT drops 100 mV below the value of VOUT, measured at VIN = VOUT(nom) + 1.5 V. Current limit test specified under recommended operating conditions Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 7 TLV1117 SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com TYPICAL CHARACTERISTICS SHORT-CIRCUIT CURRENT vs (VIN – VOUT) LOAD REGULATION 0 1.8 TJ = 255C DLoad = 800 mA −0.05 1.4 TJ = 1255C −0.1 1.2 DVOUT (%) Short-Circuit Current (A) 1.6 1 0.8 −0.15 −0.2 0.6 −0.25 0.4 −0.3 0.2 0 0 3 6 9 12 −0.35 −50 15 −25 0 Input/Output Differential (V) 25 50 75 100 125 Temperature (5C) RIPPLE REJECTION vs LOAD CURRENT (ADJ VERSION) RIPPLE REJECTION vs FREQUENCY (ADJ VERSION) 80 90 70 80 60 70 Ripple Rejection (dB) Ripple Rejection (dB) f = 120 Hz 50 40 30 20 60 50 40 30 20 10 10 0 10 100 1k Frequency (Hz) 10k 100k 0 0 200 400 600 800 Load (mA) 8 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 TLV1117 www.ti.com SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 TYPICAL CHARACTERISTICS (continued) ADJ PIN CURRENT vs TEMPERATURE 2 150 1.5 140 130 1 ADJ Pin Current (mA) 0.5 0 −0.5 −1 110 100 90 80 −1.5 −2 −50 120 70 −25 0 25 50 75 100 125 60 −50 150 Temperature (5C) TLV1117-33 LOAD TRANSIENT RESPONSE 0.2 2.6 100 2.4 90 1.8 1.6 1.4 −0.1 CIN = 10 mF COUT = 10-mF Tantalum −0.2 VIN = 4.8 V Preload = 0.1 A 1.2 1 0.8 0.6 −0.3 0.4 Load Current 0.2 −0.4 −0.5 −60 −40 −20 0 20 Output Voltage Deviation (mV) 2 0 25 50 75 100 125 150 7 Input Voltage 6 80 Load Current (A) Output Voltage Deviation (V) Output-Voltage Deviation 0 Temperature (5C) TLV1117-33 LINE TRANSIENT RESPONSE 2.2 0.1 −25 70 5 60 50 40 30 CIN = 0.1 mF COUT = 10-mF Tantalum IOUT = 0.1 A 4 3 20 Input Voltage (V) Output Voltage Variation (%) TEMPERATURE STABILITY Output-Voltage Deviation 10 2 0 0 −10 −0.2 −20 −40 −20 Time (ms) 1 0 20 40 60 80 100 120 140 Time (ms) Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 9 TLV1117 SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) DROPOUT VOLTAGE vs LOAD CURRENT 1.4 1.2 TJ = 255C Dropout Voltage (V) 1 0.8 TJ = 1255C 0.6 0.4 0.2 0 0 100 200 300 400 500 600 700 800 Load Current (mA) 10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 TLV1117 www.ti.com SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 APPLICATION INFORMATION 1N4002 (See Note D) TLV1117 − ADJ INPUT VI OUTPUT VO ADJ/GND 10 µF (see Note C) IADJ VREF 100 µF (see Note A) CADJ (see Note B) VOUT is calculated as: ǒ R1 Ǔ VOUT + V REF 1 ) R2 ) (IADJ R1 R2 R2) Because IADJ typically is 55 µA, it is negligible in most applications. A. Output capacitor selection is critical for regulator stability. Larger COUT values benefit the regulator by improving transient response and loop stability. B. CADJ can be used to improve ripple rejection. If CADJ is used, a COUT that is larger in value than CADJ must be used. C. CIN is recommended if TLV1117 is not located near the power-supply filter. D. An external diode is recommended to protect the regulator if the input instantaneously is shorted to GND. E. This device is designed to be stable with tantalum and aluminum electrolytic output capacitors having an ESR between 0.2 Ω and 10 Ω. Figure 1. Basic Adjustable Regulator Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 11 TLV1117 SLVS561K – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision J (April 2013) to Revision K • 12 Page Added additional package options. ....................................................................................................................................... 1 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: TLV1117 PACKAGE OPTION ADDENDUM www.ti.com 31-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLV1117-15CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T2 TLV1117-15CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T2 TLV1117-15CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T2 TLV1117-15CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T2 TLV1117-15CDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYH TLV1117-15CDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYH TLV1117-15CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE15 TLV1117-15IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T3 TLV1117-15IDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T3 TLV1117-15IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T3 TLV1117-15IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T3 TLV1117-15IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 ZF15 TLV1117-18CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T4 TLV1117-18CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T4 TLV1117-18CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T4 TLV1117-18CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T4 TLV1117-18CDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYK Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 31-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLV1117-18CDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYK TLV1117-18CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE18 TLV1117-18IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T5 TLV1117-18IDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T5 TLV1117-18IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T5 TLV1117-18IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T5 TLV1117-18IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYL TLV1117-18IDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYL TLV1117-18IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 ZF18 TLV1117-25CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T6 TLV1117-25CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T6 TLV1117-25CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T6 TLV1117-25CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 T6 TLV1117-25CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE25 TLV1117-25IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T8 TLV1117-25IDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T8 TLV1117-25IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T8 TLV1117-25IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 T8 Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 31-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLV1117-25IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYN TLV1117-25IDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYN TLV1117-25IKCS PREVIEW TO-220 KCS 3 50 TBD Call TI Call TI -40 to 125 TLV1117-33CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V3 TLV1117-33CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V3 TLV1117-33CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V3 TLV1117-33CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V3 TLV1117-33CDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYP TLV1117-33CDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYP TLV1117-33CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE33 TLV1117-33IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 (V3 ~ VS) TLV1117-33IDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 (V3 ~ VS) TLV1117-33IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VS TLV1117-33IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VS TLV1117-33IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYR TLV1117-33IDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYR TLV1117-33IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 ZF33 TLV1117-50CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 Addendum-Page 3 VT Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 31-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLV1117-50CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 VT TLV1117-50CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 VT TLV1117-50CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 VT TLV1117-50CDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZE50 TLV1117-50CDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZE50 TLV1117-50CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 ZE50 TLV1117-50IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VU TLV1117-50IDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VU TLV1117-50IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VU TLV1117-50IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 VU TLV1117-50IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZF50 TLV1117-50IDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZF50 TLV1117-50IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 ZF50 TLV1117CDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V4 TLV1117CDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V4 TLV1117CDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V4 TLV1117CDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR 0 to 125 V4 TLV1117CDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYS Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 31-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLV1117CDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 0 to 125 ZYS TLV1117CKCS ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 TLV1117C TLV1117CKCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 TLV1117C TLV1117CKCT ACTIVE TO-220 KCT 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 125 TLV1117C TLV1117CKTER OBSOLETE PFM KTE 3 TBD Call TI Call TI 0 to 125 TLV1117C TLV1117CKTPR OBSOLETE PFM KTP 2 TBD Call TI Call TI 0 to 125 TV1117 TLV1117CKTPRG3 OBSOLETE PFM KTP 2 TBD Call TI Call TI 0 to 125 TV1117 TLV1117CKTTR ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR 0 to 125 TLV1117C TLV1117CKTTRG3 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR 0 to 125 TLV1117C TLV1117CKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR 0 to 125 TV1117 TLV1117IDCY ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 V2 TLV1117IDCYG3 ACTIVE SOT-223 DCY 4 80 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 V2 TLV1117IDCYR ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 V2 TLV1117IDCYRG3 ACTIVE SOT-223 DCY 4 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 V2 TLV1117IDRJR ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYT TLV1117IDRJRG4 ACTIVE SON DRJ 8 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZYT TLV1117IKCS ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 125 TLV1117I TLV1117IKCSE3 ACTIVE TO-220 KCS 3 50 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 125 TLV1117I TLV1117IKTER OBSOLETE PFM KTE 3 TBD Call TI Call TI -40 to 125 TLV1117I TLV1117IKTPR OBSOLETE PFM KTP 2 TBD Call TI Call TI -40 to 125 TY1117 Addendum-Page 5 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 31-Oct-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLV1117IKTPRG3 OBSOLETE PFM KTP 2 TBD Call TI Call TI -40 to 125 TY1117 TLV1117IKTTR ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 125 TLV1117I TLV1117IKTTRG3 ACTIVE DDPAK/ TO-263 KTT 3 500 Green (RoHS & no Sb/Br) CU SN Level-3-245C-168 HR -40 to 125 TLV1117I TLV1117IKVURG3 ACTIVE TO-252 KVU 3 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 TY1117 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 6 Samples PACKAGE OPTION ADDENDUM www.ti.com 31-Oct-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 7 PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TLV1117-15CDCYR Package Package Pins Type Drawing SPQ SOT-223 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-15CDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117-15CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117-15IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-15IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117-18CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-18CDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117-18CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117-18IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-18IDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117-18IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117-25CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-25CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117-25IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-25IDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117-33CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-33CDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117-33CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TLV1117-33IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 TLV1117-33IDRJR SON DRJ 8 1000 180.0 12.4 4.25 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 7.4 1.9 8.0 12.0 Q3 4.25 1.15 8.0 12.0 Q2 TLV1117-33IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117-50CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-50CDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117-50CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117-50IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117-50IDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117-50IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117CDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117CDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117CKTTR DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.6 15.8 4.9 16.0 24.0 Q2 TLV1117CKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 TLV1117IDCYR SOT-223 DCY 4 2500 330.0 12.4 7.05 7.4 1.9 8.0 12.0 Q3 TLV1117IDRJR SON DRJ 8 1000 180.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TLV1117IKTTR DDPAK/ TO-263 KTT 3 500 330.0 24.4 10.6 15.8 4.9 16.0 24.0 Q2 TLV1117IKVURG3 TO-252 KVU 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV1117-15CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-15CDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117-15CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117-15IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-15IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117-18CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-18CDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117-18CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117-18IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-18IDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117-18IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117-25CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-25CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117-25IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-25IDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117-33CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-33CDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117-33CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117-33IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-33IDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117-33IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117-50CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-50CDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117-50CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117-50IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117-50IDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117-50IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117CDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117CDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117CKTTR DDPAK/TO-263 KTT 3 500 340.0 340.0 38.0 TLV1117CKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 TLV1117IDCYR SOT-223 DCY 4 2500 340.0 340.0 38.0 TLV1117IDRJR SON DRJ 8 1000 210.0 185.0 35.0 TLV1117IKTTR DDPAK/TO-263 KTT 3 500 340.0 340.0 38.0 TLV1117IKVURG3 TO-252 KVU 3 2500 340.0 340.0 38.0 Pack Materials-Page 3 MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 3,70 (0.146) 3,30 (0.130) 7,30 (0.287) 6,70 (0.264) Gauge Plane 1 2 0,84 (0.033) 0,66 (0.026) 2,30 (0.091) 4,60 (0.181) 1,80 (0.071) MAX 3 0°–10° 0,10 (0.004) M 0,25 (0.010) 0,75 (0.030) MIN 1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,08 (0.003) 0,10 (0.0040) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPFM001E – OCTOBER 1994 – REVISED JANUARY 2001 KTE (R-PSFM-G3) PowerFLEX PLASTIC FLANGE-MOUNT 0.375 (9,52) 0.080 (2,03) 0.070 (1,78) 0.365 (9,27) 0.360 (9,14) 0.050 (1,27) 0.040 (1,02) 0.350 (8,89) 0.220 (5,59) NOM 0.010 (0,25) NOM Thermal Tab (See Note C) 0.360 (9,14) 0.350 (8,89) 0.295 (7,49) NOM 0.320 (8,13) 0.310 (7,87) 0.420 (10,67) 0.410 (10,41) 1 3 0.025 (0,63) 0.031 (0,79) 0.100 (2,54) Seating Plane 0.004 (0,10) 0.010 (0,25) M 0.005 (0,13) 0.001 (0,03) 0.200 (5,08) 0.041 (1,04) 0.031 (0,79) 0.010 (0,25) NOM Gage Plane 3°– 6° 0.010 (0,25) 4073375/F 12/00 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC MO-169 PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 MECHANICAL DATA MPSF001F – JANUARY 1996 – REVISED JANUARY 2002 KTP (R-PSFM-G2) PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE 0.080 (2,03) 0.070 (1,78) 0.243 (6,17) 0.233 (5,91) 0.228 (5,79) 0.218 (5,54) 0.050 (1,27) 0.040 (1,02) 0.010 (0,25) NOM 0.130 (3,30) NOM 0.215 (5,46) NOM 0.247 (6,27) 0.237 (6,02) Thermal Tab (See Note C) 0.287 (7,29) 0.277 (7,03) 0.381 (9,68) 0.371 (9,42) 0.100 (2,54) 0.090 (2,29) 0.032 (0,81) MAX Seating Plane 0.090 (2,29) 0.180 (4,57) 0.004 (0,10) 0.005 (0,13) 0.001 (0,02) 0.031 (0,79) 0.025 (0,63) 0.010 (0,25) M 0.010 (0,25) NOM Gage Plane 0.047 (1,19) 0.037 (0,94) 0.010 (0,25) 2°–ā6° 4073388/M 01/02 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC TO-252 variation AC. PowerFLEX is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated