TI TLK10034

TLK10034
www.ti.com
SLLSEC7 – AUGUST 2012
QUAD-CHANNEL XAUI/10GBASE-KR TRANSCEIVER
Check for Samples: TLK10034
FEATURES
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Quad Channel Multi-Rate Transceiver
Supports 10GBASE-KR, XAUI, and 1GBASEKX Ethernet Standards
Supports all CPRI and OBSAI Data Rates up to
10 Gbps
Supports Multi-Rate SERDES Operation with
up to 10.3125Gbps Data Rate on the High
Speed Side and up to 5Gbps on the Low
Speed Side
Differential CML I/Os on Both High Speed and
Low Speed Sides
Interface to Backplanes, Passive and Active
Copper Cables, or SFP+ Optical Modules
Selectable Reference Clock per Channel with
Multiple Output Clock Options
Loopback Capability on Both High Speed and
Low Speed Sides
Supports Data Retime Operation
Supports PRBS, CRPAT, CJPAT, High- /Low/Mixed-Frequency Patterns, and KR PseudoRandom Pattern Generation and Verification,
Square-Wave Generation
Two Power Supplies: 1.0V, and 1.5 or 1.8V
Nominal
No Power Supply Sequencing Requirements
Transmit De-emphasis and Receive Adaptive
Equalization to Allow Extended
Backplane/Cable Reach on Both High Speed
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and Low Speed Sides
Programmable Transmit Output Swing on Both
High Speed and Low Speed Sides
Loss of Signal (LOS) Detection
Supports 10G-KR Link Training, Forward Error
Correction, Auto-Negotiation
Jumbo Packet Support
JTAG; IEEE 1149.1 /1149.6 Test Interface
Industry Standard MDIO Clause 45 and 22
Control Interfaces
65nm Advanced CMOS Technology
Industrial Ambient Operating Temperature
(–40°C to 85°C)
Power Consumption: 825mW per Channel
(Nominal)
Device Package: 19mm x 19mm, 324-pin
PBGA, 1-mm Ball-Pitch
APPLICATIONS
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10GBASE-KR Compliant Backplane Links
10 Gigabit Ethernet Switch, Router, and
Network Interface Cards
10 Gigabit Ethernet Blade Servers
Proprietary Cable/Backplane Links
High-Speed Point- to-Point Transmission
Systems
XAUI
CHANNEL A
10GBASE-KR
CHANNEL A
XGXS
TLK10034
10GBASE-KR
CHANNEL B
MAC
XGXS
XGXS
10GBASE-KR
CHANNEL C
XAUI
CHANNEL C
BACKPLANE
XAUI
CHANNEL B
10GBASE-KR
CHANNEL D
XGXS
XAUI
CHANNEL D
MDC MDIO
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TLK10034
SLLSEC7 – AUGUST 2012
www.ti.com
DESCRIPTION
The TLK10034 is a quad-channel multi-rate transceiver intended for use in high-speed bi-directional point-topoint data transmission systems. This device supports three primary modes. It can be used as a XAUI to
10GBASE-KR transceiver, as a general-purpose 8b/10b multi-rate 4:1, 2:1, or 1:1 serializer/deserializer, or can
be used in 1G-KX mode.
While operating in the 10GBASE-KR mode, the TLK10034 performs serialization of the 8B/10B encoded XAUI
data stream presented on its low speed (LS) side data inputs. The serialized 8B/10B encoded data is presented
on the high speed (HS) side outputs in 64B/66B encoding format. Likewise, the TLK10034 performs
deserialization of 64B/66B encoded data streams presented on its high speed side data inputs. The deserialized
64B/66B data is presented in 8B/10B format on the low speed side outputs. Link Training is supported in this
mode as well as Forward Error Correction (FEC) for extended length applications.
While operating in the General Purpose SERDES mode, the TLK10034 performs 2:1 and 4:1 serialization of the
8B/10B encoded data streams presented on its low speed (LS) side data inputs. The serialized 8B/10B encoded
data is presented on the high speed (HS) side outputs. Likewise, the TLK10034 performs 1:2 and 1:4
deserialization of 8B/10B encoded data streams presented on its high speed side data inputs. The deserialized
8B/10B encoded data is presented on the low speed side outputs. Depending on the serialization/deserialization
ratio, the low speed side data rate can range from 0.5Gbps to 5Gbps and the high speed side data rate can
range from 1Gbps to 10Gbps. 1:1 retime mode is also supported but limited to 1Gbps to 5Gbps rates.
The TLK10034 also supports 1G-KX (1.25Gbps) mode with PCS (CTC) capabilities. This mode can be enabled
via software provisioning or via auto negotiation. If software provisioning is used, data rates up to 3.125 Gbps are
supported.
Both low speed and high speed side data inputs and outputs are of differential current mode logic (CML) type
with integrated termination resistors.
The TLK10034 provides flexible clocking schemes to support various operations. They include the support for
clocking with an externally-jitter-cleaned clock recovered from the high speed side. The device is also capable of
performing clock tolerance compensation (CTC) in 10GBASE-KR and 1G-KX modes, allowing for asynchronous
clocking.
The TLK10034 provides low speed side and high speed side loopback modes for self-test and system diagnostic
purposes.
The TLK10034 has built-in pattern generators and verifiers to help in system tests. The device supports
generation and verification of various PRBS, High, Low, Mixed, CRPAT long/short, CJPAT, and KR pseudorandom test patterns and square wave generation. The types of patterns supported on the low speed and high
speed side are dependent on the operational mode chosen.
The TLK10034 has an integrated loss of signal (LOS) detection function on both high speed and low speed
sides. LOS is asserted in conditions where the input differential voltage swing is less than the LOS assert
threshold.
In the 10GBASE-KR mode, the lane alignment for each channel is achieved through the standard XAUI lane
alignment scheme. In the General Purpose SERDES mode the low speed side lane alignment for each channel
is achieved through a proprietary lane alignment scheme. The upstream link partner device needs to implement
the lane alignment scheme for the correct link operation. Normal link operation resumes only after lane alignment
is achieved.
The four TLK10034 channels are fully independent. They can be operated with different reference clocks, at
different data rates, and with different serialization/deserialization ratios.
The low speed side of the TLK10034 is ideal for interfacing with an FPGA or ASIC capable of handling lower-rate
serial data streams. The high speed side is ideal for interfacing with remote systems through optical fibers,
electrical cables, or backplane interfaces. The TLK10034 supports operation with SFP and SFP+ optical
modules, as well as 10GBASE-KR compatible backplane systems.
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Copyright © 2012, Texas Instruments Incorporated
TLK10034
www.ti.com
SLLSEC7 – AUGUST 2012
PHYSICAL CHARACTERISTICS
Block Diagram
Various interfaces of the TLK10034 device are shown in Figure 1 for Channel A. The implementation of all four
channels is identical. The block diagrams for the transmit and receive data paths are shown in Figure 2. This
low-power transceiver consists of two serializer/deserializer (SERDES) blocks, one on the low speed side and
the other on the high speed side. The core logic block that lies between the two SERDES blocks carries out all
the logic functions including channel synchronization, lane alignment, 8B/10B and 64B/66B encoding/decoding,
as well as test pattern generation and verification.
The TLK10034 provides a management data input/output (MDIO) interface as well as a JTAG interface for
device configuration, control, and monitoring. Detailed description of the TLK10034 pin functions is provided in
TLK10034 data manual.
INA 0P /N
INA 1P /N
INA 2P /N
OU TA1 P/N
OU TA2 P/N
HSTXAP/N
DATA PATH
(Channel A)
INA 3P /N
OU TA0 P/N
High
Speed
Outputs
Low
Speed
Inputs
Low
Speed
Outputs
High
Speed
Inputs
HSRXAP/N
OU TA3 P/N
LS 0_CLK OUT P/N
LS 1_ CLK OUT P/N
REF C LK0 P/N
HSRXA_CLKOUTP/N
HST X0_ CLK OUTP/N
CLOCKS
HST X1_ CLK OUTP/N
REF C LK1 P/N
REFCLK _SEL
PRTAD[ 4:0]
LO SA
MDIO
LS_OK_OUT_A
MDC
MDIO
LS_OK_IN_A
CONTROL,
STATUS, TEST
ST
MODE_SEL
PDTRX_N
TDO
RESET_N
TMS
TESTEN
JTAG
PRBSEN
TRST_N
TCK
PRBS_PASS
TDI
GPI[2:0]
Figure 1. TLK10034 Interfaces
Copyright © 2012, Texas Instruments Incorporated
3
TLK10034
SLLSEC7 – AUGUST 2012
www.ti.com
Figure 2. A Simplified One Channel Block Diagram of the TLK10034 Data Paths
4
Copyright © 2012, Texas Instruments Incorporated
Request Complete Data Manual at:
[email protected]
PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2012
PACKAGING INFORMATION
Orderable Device
TLK10034AAJ
Status
(1)
ACTIVE
Package Type Package
Drawing
FCBGA
AAJ
Pins
Package Qty
324
84
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
SNAGCU
MSL Peak Temp
(3)
Samples
(Requires Login)
Level-4-260C-72 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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