UC5170C Octal Line Driver FEATURES DESCRIPTION • Eight Single Ended Line Drivers in One Package • Meets EIA Standards EIA232E/V.28, EIA423A and CCITT V.10/X.26 The UC5170C is a single-ended octal line driver designed to meet both standard modem control applications (EIA232E/V.28), and long line drive applications (EIA423A/V.10/X.26). The slew rate for all eight drivers is controlled by a single external resistor. The slew rate and output levels in Low Mode are independent of the power variations. • Single External Resistor Controls Slew Rate • Wide Supply Voltage Range • Tri-State Outputs • Output Short-Circuit Protection Mode selection is easily accomplished by taking the select pins (MS+ and MS-) to ground for low output mode (EIA232E/V.28 and EIA423A/V.10) or to their respective supplies for high mode (EIA232E/V.28). High mode should only by used to drive adapters that take power from the control lines, or applications using high threshold receivers. ABSOLUTE MAXIMUM RATINGS (Note 1) V+ (Pin 20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V V- (Pin 11). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15V PLCC Power Dissipation, TA = 25°C (Note 2) . . . . . . 1000 mW DIP Power Dissipation, TA = 25°C (Note 2) . . . . . . . . 1250 mW Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1.5V to +7V Output Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . −12V to +12V Slew Rate Resistor . . . . . . . . . . . . . . . . . . . . . . . . . . 2k to 10kΩ Storage Temperature . . . . . . . . . . . . . . . . . . . −65°C to +150°C Note 1: All voltages are with respect to ground, pin 18. Note 2: Consult Packaging Section of Databook for thermal limitations and considerations of packages. FUNCTIONAL TABLE INPUTS EN 0 0 1 DATA 0 1 X OUTPUTS HIGH EIA-232E(2) (V+)-3V (V-)-3V High Z Note 2: Minimum output swings. CONNECTION DIAGRAMS N PACKAGE (TOP VIEW) SLUS248A - JULY 1995 - REVISED MAY 2004 Q PACKAGE (TOP VIEW) LOW EIA423A+EIA232E 5V to 6V −5V to -6V High Z UC5170C DC ELECTRICAL CHARACTERISTICS: Unless otherwise stated these specifications hold for | V+ | = | V - | = 10V, 0 < TA < +70°C, MS+ = MS− = 0V, RSRA = +10k, TA =TJ. PARAMETERS SYMBOL TEST CONDITIONS MIN TYP MAX UNITS POWER SUPPLY REQUIREMENTS V+ Range 9 V- Range 15 -9 V+ Supply Current I+ RL = Infinite En = 0V V- Supply Current I- RL = Infinite En = 0V 25 -23 V -15 V 42 -42 mA mA INPUTS High Level Input Voltage VIH Low Level Input Voltage VIL 2.0 V 0.8 V Input Clamp Voltage VIK II = -15 mA -1.1 -1.8 V High Level Input Current IIH VIH = 2.4V 0.25 40 µA Low Level Input Current IIL VIL = 0.4V VOH VIN = 0.8V En = 0.8V 4.5 VIN = 2.0V RL = Inf. -5.0 En = 0.8V RL = 3k OUTPUTS High Level (Low Mode) Output Voltage (EIA423A/V.10, EIA232E/V.28) -8.0 RL = Inf. 5.0 5.3 6.0 V RL = 3k 5.0 5.3 6.0 V 5.2 6.0 V -5.3 -6.0 V RL = 450 Low Level (Low Mode) Output Voltage VOL (EIA423A/V.10,EIA232E/V.28) µA -200 RL = 450 -5.0 -5.3 -6.0 V -4.5 -5.2 -6.0 V Output Balance (EIA423A/V.10) VBAL RL = 450 VOH - VOL = VBAL 0.2 0.4 V High Level (High Mode) Output Voltage VOH VIN = 0.8V RL = Inf., MS+ = V+, MS- = VEn = 0.8V RL = 3k, MS+ = V+, MS- = V- 7.0 7.0 7.6 7.6 10 10 V V VOL VIN = 2.0V RL = Inf., MS+ = V+, MS- =V- -7.0 -7.7 -10 V En = 0.8V -7.0 -7.7 -10 V (EIA232E/V.28) Low Level (High Mode) Output Voltage (EIA232E, V.28) Off-State Output Current IOZ RL = 3k, MS+ = V+, MS- = VEn = 2.0V, VO = ±6V, V+ = 15V, V- = -15V Short-Circuit Current IOS VIN = 0V, En = 0V -25 -50 mA VIN = 5V, En = 0V 25 40 mA AC ELECTRICAL CHARACTERISTICS: PARAMETERS -100 100 µA at | V+ | = | V - | = 10V, 0 < TA < +70°C, MS+ = MS− = 0V, TA =TJ. SYMBOL TEST CONDITIONS MIN TYP 6.65 9.5 Output Slew Rate tR RSRA = 2k tF RL = 450, CL = 50pF 6.65 Output Slew Rate tR RSRA = 10k 1.33 tF RL = 450, CL = 50pF 1.33 Propagation Output to tHz RSRA = 10k High Impedance tLz Propagation High Impedance to tzH Output tzL MAX UNITS 12.3 V/µs 10 12.3 V/µs 1.9 2.45 V/µs 2.2 2.45 V/µs 0.3 1.0 µs RL = 450, CL = 50pF 0.5 2.0 µs RSRA = 10k 6.0 17 µs RL = 450, CL = 50pF 7.0 17 µs 2 UC5170C AC PARAMETER TEST CIRCUIT AND WAVEFORMS AC CHARACTERISTICS Low Output Driver tR & tF (10-90%) EIA232E + EIA423A Mode Driver Slew Rate APPLICATION INFORMATION Slew Rate Programming Max. Data Rate = 300/t (For data rates 1k to 100k bit/s) Slew rate for the UC5170C is set up by a single external resistor connected between the SRA pin and ground. Slew rate adjustments can be approximated by using the following formula: Max. Cable Length (feet) = 100 x t (Max. length 4000 feet) V ⁄ µs = where t is the transition time from 10% to 90% of the output swing in microseconds. For data rates below 1k bit/s t may be up to 300 microseconds. 20 (RSRA in k Ω) RSRA Output Voltage Programming The UC5170C has two programmable output modes, either a low voltage mode which meets EIA423A, EIA232E/V.28/V.10 specifications, or the high output mode which meets the EIA232E, V.28 specifications. The slew rate resistor can vary between 2k and 10k which allows slew rates between 10 to 2.2V/µs, respectively. The relationship between slew rate and RSRA is shown in the typical characteristics. The high output mode provides greater output swings, minimum of 3V below and supply rails for driving higher, attenuated lines. This mode is selected by connecting the mode select pins to their respected supplies, MS+ to V+ and MS- to V-. Waveshaping of the output lets the user control the level of interference (near-end crosstalk) that may be coupled to adjacent circuits in an interconnection. The recommended output characteristics for cable length and data rates can be found in EIA standard EIA423A +V.10. Approximations of these standards are given by the following equations: The low output mode provides a controlled output swing and is accomplished by connecting both mode select pins to ground. 3 UC5170C APPLICATIONS Filter connectors or transzorbs should be used to reduce the RFI/EMI, protecting the system from static (ESD), and electrical overstress (EOS). A filter connector or capacitor will reduce the ESD pulse by 90% typically. A cable dragged across a carpet and connected to a system can easily be charged to over 25,00 volts. This is a metal to metal contact when the cable is connected to the system (no resistance), currents exceed 80 amps with less than a nanosecond rise time. A transzorb provides two functions, the device capacitance inherently acts as a filter capacitor, and the device clamps the ESD and EOS pulses which would pass through the capacitor and destroy the devices. The recommended transzorb for the UC5170C is P6KEIOCA. SPECIFIC LAYOUT NOTES The UC5170C layout must have bulk bypassing close to the device. Peak slew current is greater than 500mA when all eight drivers slew at once in the same direction. Some applications mount the UC5170C on a bulkhead or isolated plane for RFI/FCC/VDE reasons. If bulk bypassing is not used, the -10V supply may go above -8.5 volts, causing the slew rate control circuit to become unstable. The UC5170C can have output oscillation at 100kHz if the +10V supply is applied before the -10V supply. This has been a problem in some terminal designs where the +10V was developed from the flyback, which can result in a 500ms difference in the application of the supplies at power up. GENERAL LAYOUT NOTES The drivers and receivers should be mounted close to the system common ground point, with the ground reference tied to the common point to reduce RFI/EMI. *Transzorb is a trademark of General Semiconductor Industries. 4 PACKAGE OPTION ADDENDUM www.ti.com 2-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty UC5170CJ OBSOLETE UC5170CN OBSOLETE CDIP J 28 UC5170CQ ACTIVE PLCC FN 28 UC5170CQTR OBSOLETE PLCC FN 28 UTR 37 Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) TBD Call TI Call TI TBD Call TI Call TI Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR UC5170CQ TBD Call TI Call TI UC5170CQ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 2-Jun-2013 Addendum-Page 2 MECHANICAL DATA MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997 J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN B 13 24 C 1 12 0.065 (1,65) 0.045 (1,14) Lens Protrusion (Lens Optional) 0.010 (0.25) MAX 0.175 (4,45) 0.140 (3,56) 0.090 (2,29) 0.060 (1,53) A Seating Plane 0.018 (0,46) MIN 24 PINS ** DIM ”A” ”B” ”C” NARR 0.125 (3,18) MIN 0.022 (0,56) 0.014 (0,36) 0.100 (2,54) 0.012 (0,30) 0.008 (0,20) 28 WIDE NARR 40 32 WIDE NARR WIDE NARR WIDE MAX 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) MIN 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) MAX 1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53) MIN 1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61) MAX 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) MIN 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 4040084/C 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin). This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPLC004A – OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. 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