AD ADP8863ACPZ-R7

Charge Pump, 7-Channel
Fun Lighting LED Driver
ADP8863
FEATURES
TYPICAL OPERATING CIRCUIT
VALS
PHOTO
SENSOR
D1
D2
D3
D4
D5
D6
D7 CMP_IN
VIN
CIN
1µF
0.1µF
VOUT
COUT
1µF
VDDIO
C1+
ADP8863
nRST
C1–
nINT
C1
1µF
C2+
SDA
C2–
SCL
GND1
GND2
C2
1µF
08392-001
Automated blinking and funlight timing for each LED driver
16 programmable fade in and fade out times
0.1 sec to 5.5 sec
Selectable linear, square, or cubic fade rates
7 independent and programmable LED drivers
7 drivers capable of 30 mA (maximum)
1 driver also capable of 60 mA (maximum)
Programmable maximum current limit (128 levels)
Separate and independent controls for backlight LEDs
Backlight fade override
Up to two built-in comparator inputs with programmable
modes for ambient light sensing
Charge pump with automatic gain selection of 1×, 1.5×, and
2× for maximum efficiency
Standby mode for <1 μA current consumption
I2C-compatible interface for all programming
Dedicated reset pin and built-in power-on reset (POR)
Short-circuit, overvoltage, and overtemperature protection
Internal soft start to limit inrush currents
Input-to-output isolation during faults or shutdown
Operation down to VIN = 2.5 V with undervoltage lockout
(UVLO) at VIN = 2.0 V
Small lead frame chip scale package (LFCSP)
Figure 1.
APPLICATIONS
LED indication
Funlight indicator lighting
Keypad backlighting
RGB LED color generation and mixing
General backlighting of small format displays
GENERAL DESCRIPTION
The ADP8863 combines a powerful charge pump driver with
advanced autonomous LED lighting features. It allows as
many as seven LEDs to be independently driven up to 30 mA
(maximum). The seventh LED can also be driven to 60 mA
(maximum). All LEDs are programmable for maximum current
and fade in/fade out times via the I2C interface.
Additionally, automated blinking routines can be independently
programmed and enabled for all seven LED channels. These
LEDs can also be combined into groups to reduce the processor
instructions.
This entire configuration is driven by a two-capacitor charge pump
with gains of 1×, 1.5×, and 2×. The charge pump is capable of
driving a maximum IOUT of 240 mA from a supply of 2.5 V to
5.5 V. The device includes a variety of safety features including
short-circuit, overvoltage, and overtemperature protection.
These features allow easy implementation of a safe and robust
design. Additionally, input inrush currents are limited via an
integrated soft start combined with controlled input-to-output
isolation.
The ADP8863 is available in a compact lead frame chip scale
package (LFCSP).
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2010 Analog Devices, Inc. All rights reserved.
ADP8863
TABLE OF CONTENTS
Features .............................................................................................. 1 Automated RGB Color Fades ................................................... 15 Applications ....................................................................................... 1 Backlight Operating Levels ....................................................... 16 Typical Operating Circuit ................................................................ 1 Backlight Turn On/Turn Off/Dim ........................................... 16 General Description ......................................................................... 1 Automatic Dim and Turn Off Timers ..................................... 16 Revision History ............................................................................... 2 Fade Override ............................................................................. 17 Specifications..................................................................................... 3 Ambient Light Sensing .............................................................. 17 I C Timing Diagram .................................................................... 4 Automatic Backlight Adjustment ............................................. 18 Absolute Maximum Ratings............................................................ 5 Using the ADP8863 to Drive Additional LEDs...................... 19 Maximum Temperature Ranges ................................................. 5 Operating LEDs from Alternative Supplies ............................ 20 Thermal Resistance ...................................................................... 5 Short-Circuit Protection Mode ................................................ 21 ESD Caution .................................................................................. 5 Overvoltage Protection .............................................................. 21 Pin Configuration and Function Descriptions ............................. 6 Thermal Shutdown/Overtemperature Protection ................. 21 Typical Performance Characteristics ............................................. 7 Interrupts ..................................................................................... 21 Theory of Operation ...................................................................... 11 Applications Information .............................................................. 23 2
Power Stage.................................................................................. 12 Layout Guidelines....................................................................... 23 Operating Modes ........................................................................ 13 I C Programming and Digital Control ........................................ 24 LED Groupings ........................................................................... 14 Backlight Register Descriptions ............................................... 29 LED Current Settings ................................................................. 14 Independent Sink Register Descriptions................................. 36 Automated Fade In and Fade Out ............................................ 14 Comparator Register Descriptions .......................................... 44 Independent Sink Control......................................................... 15 Outline Dimensions ....................................................................... 48 RGB Color Generation .............................................................. 15 Ordering Guide .......................................................................... 48 2
REVISION HISTORY
4/10—Revision 0: Initial Version
Rev. 0 | Page 2 of 48
ADP8863
SPECIFICATIONS
VIN = 3.6 V, SCL = 2.7 V, SDA = 2.7 V, nINT = open, nRST = 2.7 V, CMP_IN = 0 V, VD1:D7 = 0.4 V, Capacitor C1 = 1 μF, Capacitor C2 = 1 μF,
COUT = 1 μF, typical values are at TA = 25°C and are not guaranteed, minimum and maximum limits are guaranteed from TA = −40°C to
+85°C, unless otherwise noted.
Table 1.
Parameter
SUPPLY
Input Voltage
Operating Range
Start-Up Level
Low Level
VIN(START) Hysteresis
UVLO Noise Filter
Quiescent Current
Prior to VIN(START)
During Standby
After Startup and Switching
OSCILLATOR
Switching Frequency
Duty Cycle
OUTPUT CURRENT CONTROL
Maximum Drive Current
D1 to D7
TJ = 25°C
TJ = −40°C to +85°C
D7 Only (60 mA Setting)
TJ = 25°C
TJ = −40°C to +85°C
LED Current Source Matching 1
All Current Sinks
D2 to D7 Current Sinks
Leakage Current on LED Pins
Equivalent Output Resistance
Gain = 1×
Gain = 1.5×
Gain = 2×
Regulated Output Voltage
AUTOMATIC GAIN SELECTION
Minimum Voltage
Gain Increases
Minimum Current Sink Headroom
Voltage
Gain Delay
AMBIENT LIGHT SENSING
COMPARATORS
Ambient Light Sensor Current
DAC Bit Step
Threshold L2 Level
Threshold L3 Level
FAULT PROTECTION
Start-Up Charging Current Source
Symbol
VIN
VIN(START)
VIN(STOP)
VIN(HYS)
tUVLO
IQ
IQ(START)
IQ(STBY)
IQ(ACTIVE)
Test Conditions/Comments
ID7(60 mA)
IMATCH
IMATCH7
IMATCH6
ID1:D7(LKG)
ROUT
Typ
2.5
VIN increasing
VIN decreasing
After startup
1.75
VIN = VIN(START) − 100 mV
VIN = 3.6 V, Bit nSTBY = 0, SCL = SDA = 0 V
VIN = 3.6 V, Bit nSTBY = 1, IOUT = 0 mA,
gain = 2×
fSW
D
ID1:D7(MAX)
Min
2.05
1.97
80
10
10
0.3
4.5
Max
Unit
5.5
2.30
V
V
V
mV
μs
1.0
7.2
μA
μA
mA
0.8
1
50
1.32
MHz
%
26.2
24.4
30
34.1
34.1
mA
mA
52.5
48.8
60
67
67
mA
mA
0.5
%
%
μA
5.5
Ω
Ω
Ω
V
VD1:D7 = 0.4 V
Bit SCR = 0 in the ISC7 register
VD7 = 0.4 V, Bit SCR = 1 in the ISC7 register
VD1:D7 = 0.4 V
VD2:D7 = 0.4 V
VIN = 5.5 V, VD1:D7 = 2.5 V, Bit nSTBY = 1
2.0
1.5
VOUT(REG)
VIN = 3.6 V, IOUT = 100 mA
VIN = 3.1 V, IOUT = 100 mA
VIN = 2.5 V, IOUT = 100 mA
VIN = 3 V, gain = 2×, IOUT = 10 mA
0.5
3.0
3.8
4.9
VHR(UP)
VHR(MIN)
Decrease VD1:D7 until the gain switches up
IDX = IDX(MAX) × 95%
tGAIN
The delay after gain has changed and
before gain is allowed to change again
IALS
CMP_IN = VD6 = 2.8 V, Bit CMP2_SEL = 1
IL2BIT
IL3BIT
IL2BIT = IALS/250
IL3BIT = IALS/2000
ISS
VIN = 3.6 V, VOUT = 0.8 × VIN
Rev. 0 | Page 3 of 48
4.3
162
200
180
276
100
0.70
1.08
μs
1.33
4.3
0.54
2.5
3.75
mV
mV
mA
μA
μA
5.5
mA
ADP8863
Parameter
Output Voltage Threshold
Exit Soft Start
Short-Circuit Protection
Output Overvoltage Protection
Activation Level
OVP Recovery Hysteresis
Thermal Shutdown
Threshold
Hysteresis
Isolation from Input to Output
During Fault
Time to Validate a Fault
I2C INTERFACE
Operating VDDIO Voltage
Logic Low Input 2
Logic High Input 3
2
I C TIMING SPECIFICATIONS
Delay from Reset Deassertion to
I2C Access
SCL Frequency
SCL High Time
SCL Low Time
Setup Time
Data
Repeated Start
Stop Condition
Hold Time
Data
Start/Repeated Start
Bus Free Time (Stop and Start
Conditions)
Rise Time (SCL and SDA)
Fall Time (SCL and SDA)
Pulse Width of Suppressed Spike
Capacitive Load per Bus Line
1
2
3
Symbol
VOUT
VOUT(START)
VOUT(SC)
VOVP
Test Conditions/Comments
Min
Typ
VOUT rising
VOUT falling
VOVP(HYS)
TSD
TSD(HYS)
IOUTLKG
V
V
5.8
500
V
mV
150
20
°C
°C
μA
1.5
2
VIN = 3.6 V
VIN = 3.6 V
Guaranteed by design
μs
5.5
0.6
V
V
V
20
μs
400
1.30
tRESET
fSCL
tHIGH
tLOW
0.6
1.3
kHz
μs
μs
tSU, DAT
tSU, STA
tSU, STO
100
0.6
0.6
ns
μs
μs
tHD, DAT
tHD, STA
tBUF
0
0.6
1.3
0.9
μs
μs
μs
tR
tF
tSP
CB
20 + 0.1 CB
20 + 0.1 CB
0
300
300
50
400
ns
ns
ns
pF
Current source matching is calculated by dividing the difference between the maximum and minimum current from the sum of the maximum and minimum.
VIL is a function of the input voltage. See Figure 15 in the Typical Performance Characteristics section for typical values over operating ranges.
VIH is a function of the input voltage. See Figure 15 in the Typical Performance Characteristics section for typical values over operating ranges.
I2C TIMING DIAGRAM
SDA
tLOW
tR
tF
tSU, DAT
tF
tHD, STA
tSP
tBUF
tR
SCL
S
Unit
0.92 × VIN
0.55 × VIN
VIN = 5.5 V, VOUT = 0 V, Bit nSTBY = 0
tFAULT
VDDIO
VIL
VIH
Max
tHD, DAT
tHIGH
tSU, STA
Sr
P
S
08392-002
S = START CONDITION
Sr = REPEATED START CONDITION
P = STOP CONDITION
tSU, STO
Figure 2. I2C Interface Timing Diagram
Rev. 0 | Page 4 of 48
ADP8863
ABSOLUTE MAXIMUM RATINGS
MAXIMUM TEMPERATURE RANGES
Table 2.
Parameter
VIN, VOUT
D1, D2, D3, D4, D5, D6, and D7
CMP_IN
nINT, nRST, SCL, and SDA
Output Short-Circuit Duration
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
ESD (Electrostatic Discharge)
Human Body Model (HBM)
Charged Device Model (CDM)
1
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
Indefinite
–40°C to +85°C1
–40°C to +125°C
–65°C to +150°C
JEDEC J-STD-020
±3 kV
±1.5 kV
The maximum operating junction temperature (TJ(MAX)) takes precedence
over the maximum operating ambient temperature (TA(MAX)). See the
Maximum Temperature Ranges section for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The maximum operating junction temperature (TJ(MAX)) takes
precedence over the maximum operating ambient temperature
(TA(MAX)). Therefore, in situations where the ADP8863 is
exposed to poor thermal resistance and high power dissipation
(PD), the maximum ambient temperature may need to be
derated. In these cases, the maximum ambient temperature can
be calculated with the following equation:
TA(MAX) = TJ(MAX) − (θJA × PD(MAX))
THERMAL RESISTANCE
θJA (junction to air) is specified for the worst-case conditions,
that is, a device soldered in a circuit board for surface-mount
packages. The θJA, θJB (junction to board), and θJC (junction to
case) are determined according to JESD51-9 on a 4-layer
printed circuit board (PCB) with natural convection cooling.
For the LFCSP package, the exposed pad must be soldered to
the GND1 and/or GND2 terminal(s) on the board.
Table 3. Thermal Resistance
Package Type
20-Lead LFCSP_WQ
ESD CAUTION
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to ground.
Rev. 0 | Page 5 of 48
θJA
49.5
θJC
5.3
Unit
°C/W
ADP8863
16 D7
17 D6
19 D5
18 CMP_IN
20 D4
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
15 GND1
D3 1
D2 2
14 VIN
ADP8863
D1 3
13 VOUT
TOP VIEW
(Not to Scale)
SCL 4
12 C2+
nRST 5
NOTES
1. CONNECT THE EXPOSED PADDLE
TO GND1 AND/OR GND2.
08392-003
9
C1–
C2– 10
8
GND2
6
nINT
SDA 7
11 C1+
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
14
3
2
1
20
19
17
16
18
Mnemonic
VIN
D1
D2
D3
D4
D5
D6
D7
CMP_IN
13
11
9
12
10
15
8
6
5
VOUT
C1+
C1−
C2+
C2−
GND1
GND2
nINT
nRST
7
4
21
SDA
SCL
EPAD
Description
Input Voltage, 2.5 V to 5.5 V.
LED Sink 1.
LED Sink 2.
LED Sink 3.
LED Sink 4.
LED Sink 5.
LED Sink 6. This pin can also be selected as a comparator input for the second phototransistor.
LED Sink 7.
Comparator Input for Phototransistor. When using this function, a capacitor (0.1 μF recommended) must be
connected from this pin to ground.
Charge Pump Output.
Charge Pump C1+.
Charge Pump C1−.
Charge Pump C2+.
Charge Pump C2−.
Ground. Connect the exposed pad to GND1 and/or GND2.
Ground. Connect the exposed pad to GND1 and/or GND2.
Processor Interrupt (Active Low). Requires an external pull-up resistor. If this pin is not used, it can be left floating.
Hardware Reset (Active Low). This pin resets the device to the default conditions. If not used, this pin must be tied
above VIH(MIN).
I2C Serial Data. Requires an external pull-up resistor.
I2C Clock. Requires an external pull-up resistor.
Exposed Paddle. Connect the exposed paddle to GND1 and/or GND2.
Rev. 0 | Page 6 of 48
ADP8863
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.6 V, SCL = 2.7 V, SDA = 2.7 V, nRST = 2.7 V, VD1:D7 = 0.4 V, CIN = 1 μF, Capacitor C1 = 1 μF, Capacitor C2 = 1 μF, COUT = 1 μF,
TA= 25°C, unless otherwise noted.
35
2.0
1.8
VIN = 3.6V
ID1:D7 = 30mA
IOUT = NO LOAD
30
1.6
25
1.4
IOUT (mA)
1.0
0.8
D1
15
D2
D3
10
–40°C
+25°C
+85°C
+105°C
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
D5
5.5
VIN (V)
0
Figure 4. Typical Quiescent Current, G = 1×
D6
D7
0
35
IOUT = NO LOAD
0.8
1.0
1.2
1.4
1.6
1.8
3.5
32
3.0
31
IOUT (mA)
33
2.5
VD1:D7 = 0.4V
30
D1
29
D2
D3
28
1.5
–40°C
+25°C
+85°C
+105°C
0.5
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
25
2.0
6
5
MISMATCH (%)
1
0.1
–40°C
+25°C
+85°C
+105°C
2
3
4
VIN (V)
Figure 6. Typical Standby IQ vs. VIN
5
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.0
VIN = 3.6V
ID1:D7 = 30mA
–40°C
+25°C
+85°C
+105°C
4
3
2
1
6
0
0.2
08392-006
1
D7
Figure 8. Typical Diode Matching vs. VIN
SCL = SDA = 0V
nRST = 2.7V
0
D6
VIN (V)
Figure 5. Typical Quiescent Current, G = 2×, IQ(ACTIVE)
0.01
D5
26
VIN (V)
10
D4
27
08392-005
1.0
2.0
34
2.0
IQ (µA)
0.6
Figure 7. Typical Diode Current vs. Current Sink Headroom Voltage (VHR)
4.0
0.001
0.4
VHR (V)
5.0
4.5
0.2
08392-008
0.2
D4
5
08392-004
0.4
08392-007
0.6
IQ (mA)
20
08392-009
IQ (mA)
1.2
0.4
0.6
0.8
1.0
1.2
VHR (V)
1.4
1.6
1.8
Figure 9. Typical Diode Matching vs. Current Sink Headroom Voltage (VHR)
Rev. 0 | Page 7 of 48
ADP8863
35
1.0
VIN = 3.6V
ID1:D7 = 30mA
IOUT = 100mA
0.9
30
0.8
0.7
20
ROUT (Ω)
15
0.5
0.4
0.3
10
–40°C
+25°C
+85°C
+105°C
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
–40°C
+25°C
+85°C
+105°C
0.2
0.1
2.0
VHR (V)
0
2.0
08392-010
5
0
0.6
3.0
3.5
4.0
4.5
5.0
5.5
VIN (V)
Figure 10. Typical Diode Current vs. Current Sink Headroom Voltage (VHR)
1
2.5
08392-013
IOUT (mA)
25
Figure 13. Typical ROUT (G = 1×) vs. VIN
10
VIN = 3.6V
VD1:D7 = 0.40V
VOUT = 80% OF VIN
9
0
7
IOUT (mA)
–2
–3
6
5
4
3
–40°C
+25°C
+85°C
+105°C
2
–5
1
–10
20
50
80
110
JUNCTION TEMPERATURE (°C)
0
2.0
08392-011
–6
–40
4.0
4.5
5.0
5.5
1.4
VIH @ +25°C
1.2
5
1.0
THRESHOLD (V)
6
G = 2× @ VIN = 2.5V
4
3
G = 1.5× @ VIN = 3V
VIH @ +85°C
VIH @ –40°C
0.8
VIL @ +25°C
VIL @ +85°C
0.6
VIL @ –40°C
0.4
2
1
0.2
G = 1× @ VIN = 3.6V
–20
0
20
40
60
TEMPERATURE (°C)
80
100
0
2.5
08392-012
ROUT (Ω)
3.5
Figure 14. Typical Output Soft Start Current, ISS
IOUT = 100mA
0
–40
3.0
VIN (V)
Figure 11. Typical Change In Diode Current vs. Temperature
7
2.5
08392-014
–4
3.0
3.5
4.0
4.5
5.0
VIN (V)
Figure 15. Typical I2C Thresholds, VIH and VIL
Figure 12. ROUT vs. Temperature
Rev. 0 | Page 8 of 48
5.5
08392-015
IOUT DEVIATION (%)
8
–1
ADP8863
1.4
1.3
90
450
80
400
70
350
60
300
50
250
40
200
30
150
20
100
1.0
0.9
–40°C
+25°C
+85°C
+105°C
3.0
3.5
4.0
4.5
5.0
IOUT = 140mA, Vf = 3.1V
10
5.5
VIN (V)
0
2.5
50
IOUT = 210mA, Vf = 3.2V
3.0
3.5
4.0
4.5
5.0
0
5.5
VIN (V)
Figure 16. Typical ALS Current, IALS
100
450
90
400
5.3
80
5.2
70
EFFICIENCY (%)
VOUT (V)
5.4
VIN = 3V
GAIN = 2×
IOUT = 10mA
5.1
5.0
4.9
4.8
350
300
60
250
50
200
40
150
30
4.7
100
20
4.6
IOUT = 140mA, Vf = 3.85V
10
–10
20
50
80
110
JUNCTION TEMPERATURE (°C)
08392-016
4.5
–40
0
2.5
50
IOUT = 210mA, Vf = 4.25V
3.0
3.5
4.0
4.5
5.0
0
5.5
VIN (V)
Figure 17. Typical Regulated Output Voltage (VOUT(REG))
Figure 20. Typical Efficiency (High Vf Diode)
6.0
T
VIN (AC-COUPLED) 50mV/DIV
1
5.8
VOUT (AC-COUPLED) 50mV/DIV
2
IIN (AC-COUPLED) 10mA/DIV
5.4
CIN = 1µF, COUT = 1µF, C1 = 1µF, C2 = 1µF
VIN = 3.6V
IOUT = 120mA
OVP RECOVERY
5.2
–40
–10
20
50
80
110
JUNCTION TEMPERATURE (°C)
500ns/DIV
Figure 18. Typical Overvoltage Protection (OVP) Threshold
Figure 21. Typical Operating Waveforms, G = 1×
Rev. 0 | Page 9 of 48
08392-020
3
08392-017
VOUT (V)
OVP THRESHOLD
5.6
IIN (mA)
5.5
Figure 19. Typical Efficiency (Low Vf Diode)
08392-019
0.7
2.5
08392-035
0.8
IIN (mA)
1.1
08392-018
EFFICIENCY (%)
IALS (mA)
1.2
ADP8863
CIN = 10pF, COUT = 1µF
C1 = 1µF, C2 = 1µF
VIN = 3.7V
IOUT = 30mA
(ONE DIODE AT
MAX CURRENT)
T
VIN (AC-COUPLED) 50mV/DIV
1
VOUT (1V/DIV)
VOUT (AC-COUPLED) 50mV/DIV
2
2
IIN (10mA/DIV)
IIN (AC-COUPLED) 10mA/DIV
500ns/DIV
4
Figure 22. Typical Operating Waveforms, G = 1.5×
VIN (AC-COUPLED) 50mV/DIV
1
VOUT (AC-COUPLED) 50mV/DIV
2
IIN (AC-COUPLED) 10mA/DIV
08392-022
3
500ns/DIV
100µs/DIV
Figure 24. Typical Start-Up Waveform
T
CIN = 1µF, COUT = 1µF, C1 = 1µF, C2 = 1µF
VIN = 2.5V
IOUT = 120mA
IOUT (10mA/DIV)
Figure 23. Typical Operating Waveforms, G = 2×
Rev. 0 | Page 10 of 48
08392-023
CIN = 1µF, COUT = 1µF, C1 = 1µF, C2 = 1µF
VIN = 3.0V
IOUT = 120mA
08392-021
3
ADP8863
THEORY OF OPERATION
operate backlight LEDs. A full set of safety features, including
short-circuit, overvoltage, and overtemperature protection with
input-to-output isolation, allows for a robust and safe design.
The integrated soft start limits inrush currents at startup, restart
attempts, and gain transitions.
The ADP8863 combines a powerful LED charge pump driver
with independent control of up to seven LEDs. These LED
drivers can sink up to 30 mA (typical) on six channels. The
seventh LED can also be driven to 60 mA (typical). All LEDs
can be individually programmed or combined into a group to
VALS
OPTIONAL
PHOTOSENSOR
D1
ID1
D2
ID2
D3
ID3
ID4
D4
D5
ID5
D6
D7
CMP_IN
GAIN
SELECT
LOGIC
ID7
ID6
VIN
CIN
VIN
VIN
CHARGE
PUMP
LOGIC
VREFS
VOUT
IREFS
COUT
EN
STNDBY
CLK
NOISE FILTER
nRST
ISS
SOFT START
UVLO
VDDIO
PHOTOSENSOR
CONVERSION
C1+
50µs
RESET
LIGHT
SENSOR
LOGIC
CHARGE
PUMP
(1×, 1.5×, 2×)
STANDBY
C1
1µF
C1–
C2+
C2
1µF
SCL
I2C
SDA
C2–
LOGIC
SWITCH CONTROL
CURRENT SINK CONTROL
nINT
GND1
GND2
Figure 25. Detailed Block Diagram
Rev. 0 | Page 11 of 48
08392-024
VBAT
VIN
ADP8863
in parallel and are discharged to VOUT in parallel. In certain fault
modes, the switches are opened and the output is physically
isolated from the input.
POWER STAGE
Because typical white LEDs require up to 4 V to drive them,
some form of boosting is required over the typical variation in
battery voltage. The ADP8863 accomplishes this with a high
efficiency charge pump capable of producing a maximum IOUT
of 240 mA over the entire input voltage range (2.5 V to 5.5 V).
Charge pumps use the basic principle that a capacitor stores
charge based on the voltage applied to it, as shown in the
following equation:
Q=C×V
Automatic Gain Selection
Each LED that is driven requires a current source. The voltage
on this current source must be greater than a minimum headroom voltage (200 mV typical) to maintain accurate current
regulation. The gain is automatically selected based on the
minimum voltage (VDX) at all of the current sources. At startup,
the device is placed into G = 1× mode and the output charges
to VIN. If any VDX level is less than the required headroom
(200 mV), the gain is increased to the next step (G = 1.5×).
A 100 μs delay is allowed for the output to stabilize prior to
the next gain switching decision. If there remains insufficient
current sink headroom, then the gain is increased again to 2×.
Conversely, to optimize efficiency, it is not desirable for the
output voltage to be too high. Therefore, the gain reduces when
the headroom voltage is great enough. This point (labeled
VDMAX in Figure 26) is internally calculated to ensure that the
lower gain still results in ample headroom for all the current
sinks. The entire cycle is illustrated in Figure 26.
(1)
By charging the capacitors in different configurations, the
charge, and therefore the gain, can be optimized to deliver the
voltage required to power the LEDs. Because a fixed charging
and discharging combination must be used, only certain
multiples of gain are available. The ADP8863 is capable of
automatically optimizing the gain (G) from 1×, 1.5×, and 2×.
These gains are accomplished with two capacitors (labeled C1
and C2 in Figure 25) and an internal switching network.
In G = 1× mode, the switches are configured to pass VIN
directly to VOUT. In this mode, several switches are connected
in parallel to minimize the resistive drop from input to output.
In G = 1.5× and 2× modes, the switches alternatively charge
from the battery and discharge into the output. For G = 1.5×,
the capacitors are charged from VIN in series and are discharged to
VOUT in parallel. For G = 2×, the capacitors are charged from VIN
STANDBY
EXIT STANDBY
Note that the gain selection criteria apply only to active current
sources. If current sources have been deactivated through an
I2C command (for example, only five LEDs are used), then the
voltages on the deactivated current sources are ignored.
STARTUP:
CHARGE
VIN TO VOUT
0
EXIT
STARTUP
1
VOU T > VOUT(START)
0
WAIT
100µs (TYP)
G=1
MIN (VD1:D7) < VHR(UP)
1
G = 1.5
1
WAIT
100µs (TYP)
MIN (VD1:D7) < VHR(UP)
1
0
0
MIN (VD1:D7) > VDMAX
0
1
WAIT
100µs (TYP)
MIN (VD1:D7) < VDMAX
NOTES
1. VDMAX IS THE CALCULATED GAIN DOWN TRANSITION POINT.
Figure 26. State Diagram for Automatic Gain Selection
Rev. 0 | Page 12 of 48
08392-025
G=2
ADP8863
Soft Start Feature
Shutdown Mode
At startup (either from UVLO activation or fault/standby
recovery), the output is first charged by ISS (3.75 mA typical)
until it reaches about 92% of VIN. This soft start feature reduces
the inrush current that is otherwise present when the output
capacitance is initially charged to VIN. When this point is
reached, the controller enters G = 1× mode. If the output
voltage is not sufficient, then the automatic gain selection
determines the optimal point as defined in the Automatic Gain
Selection section.
Shutdown mode disables all circuitry, including the I2C receivers.
Shutdown occurs when VIN is below the undervoltage thresholds.
When VIN rises above VIN(START) (2.05 V typical), all registers are
reset and the part is placed into standby mode.
Reset Mode
In reset mode, all registers are set to their default values and
the part is placed into standby. There are two ways to reset the
part: by power-on reset (POR) or using the nRST pin. POR is
activated any time that the part exits shutdown mode. After a
POR sequence is complete, the part automatically enters
standby mode.
OPERATING MODES
There are four different operating modes: active, standby,
shutdown, and reset.
After startup, the part can be reset by pulling the nRST pin low.
As long as the nRST pin is low, the part is held in a standby
state, but no I2C commands are acknowledged (all registers are
kept at their default values). After releasing the nRST pin, all
registers remain at their default values, and the part remains in
standby; however, the part does accept I2C commands.
Active Mode
In active mode, all circuits are powered up and in a fully
operational state. This mode is entered when Bit nSTBY (in
Register MDCR) is set to 1.
Standby Mode
The nRST pin has a 50 μs (typical) noise filter to prevent inadvertent activation of the reset function. The nRST pin must be
held low for this entire time to activate reset.
Standby mode disables all circuitry except for the I2C receivers.
Current consumption is reduced to less than 1 μA. This mode is
entered when the nSTBY bit is set to 0 or when the nRST pin is
held low for more than 100 μs (maximum). When standby is
exited, a soft start sequence is performed.
The operating modes function according to the timing diagram
in Figure 27.
SHUTDOWN
VIN
VIN CROSSES ~2.05V AND TRIGGERS POWER-ON RESET
nRST MUST BE HIGH FOR 20µs (MAX)
BEFORE SENDING I2C COMMANDS
BIT nSTBY IN REGISTER
MDCR GOES LOW
~100µs DELAY BETWEEN POWER-UP AND
WHEN I2C COMMANDS CAN BE RECEIVED
STANDBY
nRST IS LOW, WHICH FORCES STANDBY
LOW AND RESETS ALL I2C REGISTERS
25µs TO 100µs NOISE FILTER
nRST
VIN
~3.75mA CHARGES
VOUT TO VIN LEVEL
SOFT START
1.5×
2×
1×
GAIN CHANGES OCCUR ONLY WHEN NECESSARY,
BUT HAVE A MIN TIME BEFORE CHANGING
10µs 100µs
Figure 27. Typical Timing Diagram
Rev. 0 | Page 13 of 48
SOFT START
08392-026
VOUT
ADP8863
30
LED GROUPINGS
Each LED can respond individually or be grouped together
into the backlight controls. By default, all LEDs are set to be
part of the backlight. This is changed by setting Bits[6:0] in
Register 0x05. LEDs that are set up as independent sinks can
be enabled individually in Register 0x10. They can also all be
enabled simultaneously via the SIS_EN bit in Register 0x01.
Any LEDs configured for the backlight can only be enabled
via the BL_EN bit in Register 0x01.
LED CURRENT (mA)
25
15
LINEAR
10
SQUARE
Any of the LED outputs (Pin D1 to Pin D7) can be used to
drive any color of LED at 0 mA to 30 mA, provided that the
LED’s Vf is less than 4.1 V. Additionally, the D7 sink can regulate up to 60 mA. The current settings are determined by a
7-bit code programmed by the user into Register 0x14 through
Register 0x1A (for the independent sinks) and Register 0x09 to
Register 0x0E (for the backlight sinks). The 7-bit resolution
allows the user to set the LED to one of 128 different levels.
The ADP8863 can implement two distinct algorithms to
achieve a linear or a nonlinear relationship between input
code and diode output current. The law and SC_LAW bits
in Register 0x04 and Register 0x0F, respectively, are used to
change between these algorithms.
0
32
64
CODE
96
128
Figure 28. LED Current vs. Input Code
AUTOMATED FADE IN AND FADE OUT
The LED drivers are easily configured for automated fade in
and fade out. Sixteen fade in and fade out rates can be selected
via the I2C interface. Fade in and fade out rates range from
0.0 sec to 5.5 sec (per full-scale current, either 30 mA or 60 mA).
The backlight LEDs have separate fade in and fade out time
controls from the independent sink LEDs.
Table 5. Available Fade In and Fade Out Rates
By default, the ADP8863 uses a linear algorithm (law and
SC_LAW = 00), where the LED current increases linearly for
a corresponding increase in input code. LED current (in
milliamperes) is determined by the following equation:
LED Current (mA) = Code × (Full-Scale Current/127)
(2)
where:
Code is the input code programmed by the user.
Full-Scale Current is the maximum sink current allowed per
LED (typically 30 mA).
The ADP8863 can also implement a nonlinear (square
approximation) relationship between input code and LED
current. In this case (law and SC_LAW = 01, 10, or 11), the LED
current (in milliamperes) is determined by the following
equation:
⎞
⎟
⎟
⎠
0
08392-027
5
LED CURRENT SETTINGS
⎛
Full − Scale Current
LED Current (mA) = ⎜ Code ×
⎜
127
⎝
20
2
(3)
Figure 28 shows the LED current level vs. input code for both
the linear and square law algorithms.
Code
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
Fade Rate (in sec per Full-Scale Current)
0.0 (disabled)
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
3.5
4.0
4.5
5.0
5.5
The fade profile is based on the transfer law selected (linear,
square, Cubic 10, or Cubic 11) and the delta between the actual
current and the target current. Smaller changes in current
reduce the fade time. For linear and square law fades, the fade
time is given by
Fade Time = Fade Rate × (Code/127)
where the Fade Rate is shown in Table 5.
Rev. 0 | Page 14 of 48
(4)
ADP8863
The Cubic 10 and Cubic 11 laws also use the square law LED
currents derived from Equation 3; however, the time between
each step is varied to produce a steeper slope at higher currents
and a shallower slope at lower currents (see Figure 29).
ISCx
ON TIME
FADE-IN
ON TIME
FADE-OUT FADE-IN
FADE-OUT
MAX
30
25
OFF
TIME
20
15
OFF
TIME
SCx_EN
SQUARE
08392-029
CURRENT (mA)
LINEAR
SET BY USER
10
Figure 30. Independent Sink Blink Mode with Fading
CUBIC 11
RGB COLOR GENERATION
5
0
0
0.25
0.50
0.75
1.00
UNIT FADE TIME
08392-028
CUBIC 10
Figure 29. Comparison of the Dimming Transfers Laws
Each LED can be enabled independently and has its own
current level, but all LEDs share the same fade in rates, fade out
rates, and fade law.
The ADP8863 is easily programmed to generate any color with
an RGB LED. To configure this feature, connect each LED in a
standard RGB diode to a separate driver on the ADP8863.
Because each channel can be programmed for a different
current level, setting the currents for all three LEDs generates
the desired color. To set the current levels, use a simple RGB
color selector (see Figure 31).
INDEPENDENT SINK CONTROL
The ISCs have additional timers to facilitate blinking functions.
A shared on timer (SCON) in conjunction with the off timer of
each ISC (SC1OFF, SC2OFF, SC3OFF, SC4OFF, SC5OFF, SC6OFF,
and SC7OFF) allows the LED current sinks to be configured in
various blinking modes. The on timer can be set to one of four
different settings: 0.2 sec, 0.6 sec, 0.8 sec, or 1.2 sec. The off
timers have four different settings: disabled, 0.6 sec, 1.2 sec, and
1.8 sec. Blink mode is activated by setting the off timers to any
setting other than disabled.
Program all fade, on, and off timers before enabling any of the
LED current sinks. If ISCx is on during a blink cycle and
SCx_EN is cleared, the LED turns off (or fades to off if fade out
is enabled). If ISCx is off during a blink cycle and SCx_EN is
cleared, it stays off.
08392-036
Each of the seven LEDs can be configured (in Register 0x05) to
operate as either part of the backlight or to operate as an independent sink current (ISC). Each ISC can be enabled independently
and has its own current level. All ISCs share the same fade in
rates, fade out rates, and fade law.
Figure 31. Standard RGB Color Generator
The example in Figure 31 shows a color of green, which is generated with a red content of 18 (out of 255), a green content of
190, and a blue content of 96. All numbers are out of a maximum
of 255. Thus, the percentage of red is 7.1%, the percentage of
green is 74.5%, and the percentage of blue is 37.6%. To generate
the color with the ADP8863, scale this value to each of the current
drivers.
AUTOMATED RGB COLOR FADES
The ADP8863 is easily programmed to cycle through RGB
generated colors. This can be either a repeating or a random
pattern of one color fading into the other. To execute this cycle
autonomously, set up the RGB LEDs as described in the RGB
Color Generation section and program the on, off, fading times,
and current intensities. Adjusting the fading time in particular
can create any pattern from a fast, striking effect to a soothing
slow color change.
Rev. 0 | Page 15 of 48
ADP8863
BACKLIGHT
CURRENT
BACKLIGHT OPERATING LEVELS
Backlight brightness control operates at three distinct levels:
daylight (L1), office (L2), and dark (L3). The BLV bits in
Register 0x04 control the specific level at which the backlight
operates. These bits can be changed manually or, if in automatic
mode (CMP_AUTOEN is set high in Register 0x01), by the
ambient light sensor (see the Ambient Light Sensing section).
30mA
DAYLIGHT (L1)
OFFICE (L2)
DARK (L3)
BL_EN = 1
DIM_EN = 1
DIM_EN = 0
BL_EN = 0
Figure 34. Backlight Turn On/Dim/Turn Off
The maximum and dim settings can be set from 0 mA to 30 mA;
therefore, it is possible to program a dim setting that is greater
than a maximum setting. For normal expected operation,
ensure that the dim setting is programmed to be less than the
maximum setting.
AUTOMATIC DIM AND TURN OFF TIMERS
DAYLIGHT_MAX
BACKLIGHT CURRENT
DIM
08392-039
By default, the backlight operates at daylight level (BLV = 00),
where the maximum brightness is set using Register 0x09
(BLMX1). A daylight dim setting can also be set using Register
0x0A (BLDM1). When operating at office level (BLV = 01), the
backlight maximum and dim brightness settings are set using
Register 0x0B (BLMX2) and Register 0x0C (BLDM2). When
operating at the dark level (BLV = 10), the backlight maximum
and dim brightness settings are set using Register 0x0D (BLMX3)
and Register 0x0E (BLDM3).
MAX
OFFICE_MAX
DARK_MAX
DAYLIGHT_DIM
OFFICE_DIM
08392-037
DARK_DIM
0
BACKLIGHT OPERATING LEVELS
The user can program the backlight to dim automatically by
using the DIMT bits in Register 0x07. The dim timer has 127
settings ranging from 1 sec to 127 sec. Program the dim timer
(DIMT) before turning on the backlight. If BL_EN = 1, the
backlight turns on to its maximum setting and the dim timer
starts counting. When the dim timer expires, the internal state
machine sets DIM_EN = 1, and the backlight enters its dim
setting.
BACKLIGHT
CURRENT
Figure 32. Backlight Operating Levels
BACKLIGHT TURN ON/TURN OFF/DIM
With the device in active mode (nSTBY = 1), the backlight can
be turned on using the BL_EN bit in Register 0x01. Before
turning on the backlight, select the level (daylight (L1), office
(L2), or dark (L3)) to operate in and ensure that maximum and
dim settings are programmed for that level. The backlight turns
on when BL_EN = 1. The backlight turns off when BL_EN = 0.
DIM TIMER
RUNNING
DIM TIMER
RUNNING
MAX
DIM
BACKLIGHT
CURRENT
DIM_EN = 0 DIM_EN = 1
SET BY USER
SET BY INTERNAL STATEMACHINE
BL_EN = 0
08392-040
BL_EN = 1 DIM_EN = 1
MAX
Figure 35. Dim Timer
BL_EN = 0
08392-038
BL_EN = 1
If the user clears the DIM_EN bit, the backlight reverts to its
maximum setting and the dim timer begins counting again.
When the dim timer expires, the internal state machine again
sets DIM_EN = 1, and the backlight enters its dim setting. The
backlight can be turned off at any point during the dim timer
countdown by clearing BL_EN.
Figure 33. Backlight Turn On/Turn Off
While the backlight is on (BL_EN = 1), the user can change to
the dim setting by programming DIM_EN = 1 in Register 0x01.
If DIM_EN = 0, the backlight reverts to its maximum setting.
The user can also program the backlight to turn off automatically by using the OFFT bits in Register 0x06. The off timer has
127 settings ranging from 1 sec to 127 sec. Program the off
timer (OFFT) before turning on the backlight. If BL_EN = 1,
the backlight turns on to its maximum setting and the off timer
Rev. 0 | Page 16 of 48
ADP8863
BACKLIGHT
CURRENT
starts counting. When the off timer expires, the internal state
machine clears the BL_EN bit, and the backlight turns off.
BACKLIGHT
CURRENT
OFF TIMER
RUNNING
FADE-IN
OVERRIDDEN
FADE-OUT
OVERRIDDEN
BL_EN = 1
(REASSERTED)
BL_EN = 0
BL_EN = 0
BL_EN = 1
MAX
BL_EN = 1
Figure 38. Fade Override Function (FOVR Is High)
08392-041
BL_EN = 1 BL_EN = 0
SET BY USER
SET BY INTERNAL STATE MACHINE
AMBIENT LIGHT SENSING
Figure 36. Off Timer
The backlight can be turned off at any point during the off
timer countdown by clearing BL_EN.
The dim timer and off timer can be used together for sequential
maximum-to-dim-to-off functionality. With both the dim and
off timers programmed, and BL_EN asserted, the backlight turns
on to its maximum setting, and when the dim timer expires, the
backlight changes to its dim setting. When the off timer expires,
the backlight turns off.
BACKLIGHT
CURRENT
DIM TIMER
RUNNING
The ADP8863 integrates two ambient light sensing comparators. One of the ambient light sensing comparator pins
(CMP_IN) is always available. The second pin (D6) has an
ambient light sensor comparator (CMP_IN2) that can be
activated rather than connecting an LED to D6. Activating
the CMP_IN2 function of the pin is accomplished through the
CMP2_SEL bit in Register CFGR. Therefore, when the CMP2_
SEL bit is set to 0, Pin D6 is programmed as a current sink.
When the CMP2_SEL bit is set to 1, Pin D6 becomes the input
for a second phototransistor.
These comparators have two programmable trip points (L2 and
L3) that select one of the three backlight operation modes
(daylight, office, and dark) based on the ambient lighting
conditions.
MAX
The L3 comparator controls the dark-to-office mode transition.
The L2 comparator controls the office-to-daylight transition
(see Figure 39). The currents for the different lighting modes
are defined in the BLMXx and BLDMx registers (see the
Backlight Operating Levels Section).
OFF TIMER
RUNNING
DIM_EN = 1
BL_EN = 0
SET BY USER
SET BY INTERNAL STATE MACHINE
L2_OUT = 1
L3_OUT = 1
08392-042
DIM
BL_EN = 1
08392-043
MAX
L2_OUT = 1
L3_OUT = 0
L2_OUT = 0
L3_OUT = 0
Figure 37. Dim and Off Timers Used Together
0 LUX
0A
A fade override feature (FOVR in Register CFGR (0x04)) enables
the host to override the preprogrammed fade in or fade out
settings. If FOVR is set and the backlight is enabled in the
middle of a fade out process, the backlight instantly (within
approximately 100 ms) returns to its maximum setting. Alternatively, if the backlight is fading in, reasserting BL_EN overrides
the programmed fade in time, and the backlight instantly goes
to its final fade value. This is useful for situations in which a key
is pressed during a fade sequence. However, if FOVR is cleared
and the backlight is enabled in the middle of a fade process, the
backlight gradually brightens from where it was interrupted (it
does not go down to 0 and then comes back on).
DARK
OFFICE
L3
DAYLIGHT
L2
BRIGHTNESS
08392-044
FADE OVERRIDE
Figure 39. Light Sensor Modes Based on the Detected Ambient Light Level
Each light sensor comparator uses an external capacitor together
with an internal reference current source to form an analog-todigital converter (ADC) that samples the output of the external
photosensor. The ADC result is fed into two programmable trip
comparators. The ADC has an input range of 0 μA to 1080 μA
(typical).
Rev. 0 | Page 17 of 48
ADP8863
L2_EN
ware may select the comparator of the phototransistor that is
exposed to higher light intensity to control the transition
between the programmed backlight intensity levels.
L2_TRIP
L2_HYS
PHOTO
SENSOR
OUTPUT
L2_OUT
FILTER
SETTINGS
ADC
L3_TRIP
L3_HYS
08392-045
L3_OUT
L3_EN
Figure 40. Ambient Light Sensing and Trip Comparators
The L2 comparator, L2_CMPR, detects when the photosensor
output has dropped below the programmable L2_TRP point
(Register 0x1D). If this event occurs, then the L2_OUT status
signal is set. L2_CMPR contains programmable hysteresis,
meaning that the photosensor output must rise above L2_TRP +
L2_HYS before L2_OUT clears. L2_CMPR is enabled via the
L2_EN bit. The L2_TRP and L2_HYS values of L2_CMPR can
be set between 0 μA and 1080 μA (typical) in steps of 4.3 μA
(typical).
The L3 comparator, L3_CMPR, detects when the photosensor
output drops below the programmable L3_TRP point (Register
0x1F). If this event occurs, the L3_OUT status signal is set.
L3_CMPR contains programmable hysteresis, meaning that the
photosensor output must rise above L3_TRP + L3_HYS before
L3_OUT clears. L3_CMPR is enabled via the L3_EN bit. The
L3_TRP and L3_HYS values of L3_CMPR can be set between
0 μA and 137.7 μA (typical) in steps of 0.54 μA (typical).
L2_TRP
L2_HYS
L3_TRP
AUTOMATIC BACKLIGHT ADJUSTMENT
The ambient light sensor comparators can automatically transition the backlight between one of its three operating levels. To
enable this mode, set the CMP_AUTOEN bit in Register 0x01.
When I2C selection is enabled, the internal state machine takes
control of the BLV bits and changes them based on the L2_OUT
and L3_OUT status bits. When L2_OUT is set high, it indicates
that the ambient light conditions have dropped below the
L2_TRP point and that the backlight should move to its office
(L2) level. When L3_OUT is set high, it indicates that ambient light
conditions have dropped below the L3_TRP point and that the
backlight should move to its dark (L3) level. Table 6 shows the
relationship between backlight operation and the ambient light
sensor comparator outputs.
Filter times from 80 ms to 10 sec can be programmed for the
comparators (Register 0x1B and Register 0x1C) before they
change state.
100
1000
08392-046
10
ADC RANGE (µA)
The interrupt flags (CMP_INT and CMP_INT2) can be used to
notify the system when either L2 or L3 changes state. See the
Interrupts section for more information.
The L3_OUT status bit has greater priority; therefore, if
L3_OUT is set, the backlight operates at L3 (dark) even if
L2_OUT is also set.
L3_HYS
1
The L2_CMPR and L3_CMPR comparators can be enabled
independently of each other, or they can operate simultaneously. A
single conversion from each ADC takes 80 ms (typical). When
CMP_AUTOEN is set for automatic backlight adjustment (see
the Automatic Backlight Adjustment section), the ADC and
comparators run continuously. If the backlight is disabled and
at least one independent sink is enabled, it is possible to use the
light sensor comparators in a single-shot mode. A single-shot read
of the photocomparators is performed by setting the FORCE_RD
bit in Register 0x1B. After the single-shot measurement is completed, the internal state machine clears the FORCE_RD bit.
Table 6. Comparator Output Truth Table
Figure 41. Comparator Ranges
Note that the full-scale value of the L2_TRP and L2_HYS
registers is 250 (decimal). Therefore, if the value of L2_TRP +
L2_HYS exceeds 250, the comparator output is unable to
deassert. For example, if L2_TRP is set to 204 (80% of the fullscale value, or approximately 0.80 × 1080 μA = 864 μA), then
L2_HYS must be set to less than 46 (250 − 204 = 46). If it is not,
then L2_HYS + L2_TRP exceeds 250 and the L2_CMPR
comparator is never allowed to go low.
CMP_AUTOEN
0
L3_OUT
X1
L2_OUT
X1
1
0
0
1
0
1
1
1
X1
1
X is the don’t care bit.
When both phototransistors are enabled and programmed in
automatic mode (through Bit CMP_AUTOEN in Register
0x01), the user application must determine which comparator
outputs to use, by selecting Bit SEL_AB in Register 0x04 for
automatic light sensing transitions. For example, the user softRev. 0 | Page 18 of 48
Backlight Operation
BLV can be manually set
by the user
BLV = 00, backlight
operates at L1 (daylight)
BLV = 01, backlight
operates at L2 (office)
BLV = 10, backlight
operates at L3 (dark)
ADP8863
USING THE ADP8863 TO DRIVE ADDITIONAL LEDS
In some situations, it may be desirable to drive more than seven
LEDs. This can be done in one of two ways: paralleling LEDs
using ballast resistors, or using the ADP8863 to power
additional LED drivers.
Ballast Resistors
D1
In the first method, multiple LEDs can be attached to any one
LED driver with the use of ballast resistors.
VOUT
I1
+
Vf1
–
+
Vf2
–
RBALLAST
I2
D3
D4
D5
D6
1µF
VOUT
VDDIO
1µF
nRST
+
Vf3
–
C1+
VDDIO
ADP8863
RBALLAST
C1–
SDA
VDDIO
08392-033
VDX
IDX = I1 + I2 + I3
D7
VIN
I3
RBALLAST
D2
C1
1µF
C2+
SCL
C2–
VDDIO
C2
1µF
Figure 42. Ballast Resistor Arrangement
R BALLAST ≈
ΔVf
ΔI
(5)
where:
ΔVf is the difference between the maximum Vf and the
minimum Vf of the LEDs in parallel.
ΔI is the difference between the parallel LED currents.
The addition of the ballast resistor brings the effective Vf of the
LED to
Vf (eff ) = Vf (LED ) + I LED × R BALLAST
(6)
nINT
GND1
GND2
08392-034
Ballast resistors attempt to compensate for the forward voltage
(Vf) mismatch inherent in any parallel combination of LEDs.
The choice of a ballasting resistor is a trade-off between the
efficiency and the current matching of the LEDs in parallel.
Smaller ballast resistors give better efficiency. Larger ballast
resistors gives better current matching, because the resistor
balances out the current differences for a voltage drop. The
relationship is summarized with the following:
Figure 43. Powering Additional LEDs with Ballast Resistors
Adding Additional Parallel Sinks
The ballast resistor’s compromises of efficiency and matching
are not suitable for many applications. Therefore, another
option is to use the ADP8863 charge pump to power additional
current sinks. First, the charge pump must be optimized for this
option by setting the GDWN_DIS bit in Register 0x01, which
prevents the charge pump from switching back down in gain,
and thus stabilizes it against the unknown loads that the
additional current sinks present.
To use the sinks, turn the ADP8863 charge pump on before
activating the additional sinks. If the additional sinks are
activated first, the ADP8863 soft start may not complete.
The ADP8863 can be set up with an ADP8860 or ADP8861. An
example using the ADP8861 is shown in Figure 44.
The ILED × RBALLAST term forces the charge pump to work a little
harder for this additional voltage drop. Furthermore, for
guaranteed operation with the ADP8863, the total Vf(eff)
should never exceed VOUT(REG) − VHR(UP) (see Table 1).
Rev. 0 | Page 19 of 48
ADP8863
KEYPAD OR
FUN LIGHTING
BACKLIGHT
D2
VIN
D3
D4
D5
D6
D7
D1
VOUT
1µF
VALS
PHOTO
SENSOR
CMP_IN
D2
VIN
D3
D4
C1+
ADP8863
nRST
C1–
SDA
C1
1µF
C2–
D1
C1+
NC
SDA
C1–
NC
SCL
C2+
NC
C2–
NC
nINT
GNDx
C2
1µF
08392-047
nINT
D7
ADP8861
C2+
SCL
D6
VOUT
nRST
0.1µF
D5
1µF
1µF
GNDx
Figure 44. Connecting the ADP8863 to an ADP8861 to Power More LEDs
OPERATING LEDS FROM ALTERNATIVE SUPPLIES
For some applications, it is advantageous to operate the LEDs
from a voltage source other than the ADP8863 charge pump
output. For example, it may be possible to operate a red LED
over the entire battery voltage range without any charge pump
boosting. For a charge pump,
D2
D3
D4
D5
D6
D7
VIN
1µF
VOUT
VDDIO
1µF
(7)
nRST
Therefore, operating the red LEDs directly from the battery
removes output current of the red LEDs from the charge pump
draw. This in turn reduces the total input current by (Gain − 1) ×
IOUT(red).
However, care must be taken when selecting LEDs to operate
from a different voltage input. Specifically, the voltage source
must at least be able to support the maximum forward voltage
(Vf) of the LED plus the maximum VHR(UP) (276 mV, given in
Table 1). Additionally, operating an LED from an independent
voltage source may interfere with the ADP8863’s gain selection
algorithm. This algorithm selects the optimal gain for the
charge pump based on all seven diodes. By operating one or
more of the diodes from another supply, the algorithm may not
switch the gain back down to a lower state until the LEDs are
disabled or the part enters standby.
C1+
VDDIO
ADP8863
C1–
SDA
VDDIO
C1
1µF
C2+
SCL
C2–
VDDIO
C2
1µF
nINT
Rev. 0 | Page 20 of 48
GND1
GND2
Figure 45. Alternate Schematic for Low Vf LEDs
08392-030
I IN = Gain × I OUT
D1
ADP8863
SHORT-CIRCUIT PROTECTION MODE
The ADP8863 can protect against short circuits on the output
(VOUT). Short-circuit protection (SCP) is activated at the point
when VOUT < 55% of VIN. Note that SCP sensing is disabled
during both startup and restart attempts (fault recovery). SCP
sensing is reenabled 4 ms (typical) after activation. During a
short-circuit fault, the device enters a low current consumption
state and an interrupt flag is set. The device can be restarted at any
time after receiving a short-circuit fault by rewriting nSTBY = 1.
It then repeats another complete soft start sequence. Note that
the value of the output capacitance (COUT) should be small
enough to allow VOUT to reach approximately 55% (typical) of
VIN within the 4 ms (typical) time. If COUT is too large, the device
inadvertently enters short-circuit protection.
OVERVOLTAGE PROTECTION
Overvoltage protection (OVP) is implemented on the output.
There are two types of overvoltage events: normal (no fault) and
abnormal (from a fault or sudden load change).
Normal Overvoltage
In a normal (no fault) overvoltage, the output voltage approaches
VOUT(REG) (4.9 V typical) during normal operation. This is not
caused by a fault or load change, but is simply a consequence of
the input voltage times the gain reaching the same level as the
clamped output voltage (VOUT(REG)). To prevent this type of
overvoltage, the ADP8863 detects when the output voltage rises
to VOUT(REG). It then increases the effective ROUT of the gain stage
to reduce the voltage that is delivered. This effectively regulates
VOUT to VOUT(REG); however, there is a limit to the effect that this
system can have on regulating VOUT. It is designed only for
normal operation and it is not intended to protect against faults
or sudden load changes. When the output voltage is regulated to
VOUT(REG), no interrupt is set and the operation is transparent to
the LEDs and the overall application.
Abnormal Overvoltage
Because of the open-loop behavior of the charge pump as well
as how the gain transitions are computed, a sudden load change
or fault can abnormally force VOUT beyond 6 V. This causes an
abnormal overvoltage situation. If the event happens slowly
enough, the system first tries to regulate the output to 4.9 V as
in a normal overvoltage scenario. However, if this is not sufficient, or if the event happens too quickly, the ADP8863 enters
overvoltage protection (OVP) mode when VOUT exceeds the
OVP threshold (typically 5.8 V). In OVP mode, only the charge
pump is disabled to prevent VOUT from rising too high. The
current sources and all other device functionality remain intact.
When the output voltage falls by about 500 mV (to 5.3 V
typical), the charge pump resumes operation. If the fault or load
event recurs, the process may repeat. An interrupt flag is set at
each OVP instance.
THERMAL SHUTDOWN/OVERTEMPERATURE
PROTECTION
If the die temperature of the ADP8863 rises above a safe limit
(150°C typical), the controllers enter thermal shutdown (TSD)
protection mode. In this mode, most of the internal functions
shut down, the part enters standby, and the TSD_INT interrupt
(Register 0x02) is set. When the die temperature decreases
below ~130°C, the part can be restarted. To restart the part,
remove it from standby. No interrupt is generated when the die
temperature falls below 130°C. However, if the software clears
the pending TSD_INT interrupt and the temperature remains
above 130°C, another interrupt is generated.
The complete state machine for these faults (SCP, OVP, and
TSD) is shown in Figure 46.
INTERRUPTS
There are five interrupt sources available on the ADP8863 in
Register 0x02.
•
•
•
•
•
Main light sensor comparator: The CMP_INT interrupt
sets every time the main light sensor comparator detects a
threshold (L2 or L3) transition (rising or falling condition).
Sensor Comparator 2: The CMP2_INT interrupt works
the same way as CMP_INT, except that the sensing input
derives from the second light sensor. The programmable
thresh-olds are the same as for the main light sensor
comparator.
Overvoltage protection: OVP_INT is generated when the
output voltage exceeds 5.8 V (typical).
Thermal shutdown circuit: an interrupt (TSD_INT) is
generated when entering overtemperature protection.
Short-circuit detection: SHORT_INT is generated when
the device enters short-circuit protection mode.
The interrupt (if any) that appears on the nINT pin is determined by the bits mapped in Register INTR_EN (0x03). To
clear an interrupt, write a 1 to the interrupt in the MDCR2
register (0x02) or reset the part. Reading the interrupt, or writing a
0, has no effect.
Rev. 0 | Page 21 of 48
ADP8863
STANDBY
0
EXIT STANDBY
1
TSD FAULT
DIE TEMP > TSD
EXIT STBY
0
1
STARTUP:
CHARGE
VIN TO VOUT
DIE TEMP <
TSD – TSD(HYS)
SCP FAULT
0
VOUT > VOUT(START)
1
0
EXIT
STARTUP
VOUT < VOUT(SC)
0
1
VOUT < VOVP –
VOVP(HYS)
0
0
G=1
WAIT
100µs (TYP)
MIN (VD1:D7)
< VHR(UP)
1
VOUT > VOVP
1
OVP FAULT
1
1
0
0
VOUT > VOUT(REG)
0
VOUT < VOVP –
VOVP(HYS)
TRY TO
REGULATE
VOUT TO
VOUT(REG)
WAIT
100µs (TYP)
MIN (VD1:D7)
< VHR(UP)
0
0
MIN (VD1:D7)
> VDMAX
1
1
1
OVP FAULT
G = 1.5
1
VOUT > VOVP
0
1
VOUT < VOVP –
VOVP(HYS)
0
0
1
WAIT
100µs (TYP)
MIN (VD1:D7 )
> VDMAX
VOUT > VOUT(REG)
1
0
OVP FAULT
G=2
TRY TO
REGULATE
VOUT TO
VOUT(REG)
NOTES
1. VDMAX IS THE CALCULATED GAIN DOWN TRANSITION POINT.
08392-031
VOUT > VOVP
Figure 46. Fault State Machine
Rev. 0 | Page 22 of 48
ADP8863
APPLICATIONS INFORMATION
The ADP8863 allows the charge pump to operate efficiently with a
minimum of external components. Specifically, the user must
select an input capacitor (CIN), output capacitor (COUT), and two
charge pump fly capacitors (C1 and C2). CIN should be 1 μF or
greater. The value must be high enough to produce a stable input
voltage signal at the minimum input voltage and maximum
output load. A 1 μF capacitor for COUT is recommended. Larger
values are permissible, but care must be exercised to ensure that
VOUT charges above 55% (typical) of VIN within 4 ms (typical).
See the Short-Circuit Protection Mode section for more details.
For best practice, it is recommended that the two charge pump fly
capacitors be 1 μF; larger values are not recommended, and smaller
values may reduce the ability of the charge pump to deliver
maximum current. For optimal efficiency, the charge pump fly
capacitors should have low equivalent series resistance (ESR). Low
ESR X5R or X7R capacitors are recommended for all four components. The use of fly capacitors sized 0402 and smaller is allowed,
but the GDWN_DIS bit in Register 0x01 must be set. Minimum
voltage ratings should adhere to the guidelines in Table 7.
Table 7. Capacitor Stress in Each Charge Pump Gain State
Capacitor
CIN
COUT
C1
C2
Gain = 1×
VIN
VIN
None
None
Gain = 1.5×
VIN
VIN × 1.5 (max of 5.5 V)
VIN/2
VIN/2
Gain = 2×
VIN
VIN × 2.0 (max of 5.5 V)
VIN
VIN
If one or both ambient light sensor comparator inputs (CMP_IN
and D6) are used, a small capacitor (0.1 μF is recommended)
must be connected from the input to ground.
Any color LED can be used if the Vf (forward voltage) is less
than 4.1 V. However, using lower Vf LEDs reduces the input
power consumption by allowing the charge pump to operate at
lower gain states.
The equivalent circuit model for a charge pump is shown in
Figure 47.
VOUT
ROUT
COUT
VDX
08392-032
G × VIN
IOUT
Figure 47. Charge Pump Equivalent Circuit Model
The input voltage is multiplied by the gain (G) and delivered to
the output through an effective resistance (ROUT). The output
current flows through ROUT and produces an IR drop to yield
VOUT = G ×VIN − IOUT × ROUT(G)
(8)
The ROUT term is a combination of the RDSON resistance for the
switches used in the charge pump and a small resistance that accounts
for the effective dynamic charge pump resistance. The ROUT level
changes based upon the gain (the configuration of the switches).
Typical ROUT values are given in Table 1, Figure 12, and Figure 13.
VOUT is also equal to the largest Vf of the LEDs used plus the
voltage drop across the regulating current source. This gives
VOUT = Vf(MAX) + VDX
(9)
Combining Equation 8 and Equation 9 gives
VIN = (Vf(MAX) + VDX + IOUT × ROUT(G))/G
(10)
Equation 10 is useful for calculating approximate bounds for the
charge pump design.
Determining the Transition Point of the Charge Pump
Consider the following design example, where:
Vf(MAX) = 3.7 V
IOUT = 140 mA (7 LEDs at 20 mA each)
ROUT(G = 1.5×) = 3 Ω (obtained from Figure 12)
At the point of a gain transition, VDX = VHR(UP). Table 1 gives the
typical value of VHR(UP) as 0.2 V. Therefore, the input voltage
level when the gain transitions from 1.5× to 2× is
VIN = (3.7 V + 0.2 V + 140 mA × 3 Ω)/1.5 = 2.88 V
LAYOUT GUIDELINES
Note the following layout guidelines:
• For optimal noise immunity, place the CIN and COUT capacitors as close as possible to their respective pins. These
capacitors should share a short ground trace. If the LEDs
are a significant distance from the VOUT pin, another capacitor on VOUT, placed closer to the LEDs, is advisable.
• For optimal efficiency, place the charge pump fly capacitors
(C1 and C2) as close to the part as possible.
• The ADP8863 does not distinguish between power ground
and analog ground. Therefore, both ground pins can be
connected directly together. It is recommended that these
ground pins be connected at the ground for the input and
output capacitors.
• The LFCSP package requires the exposed pad to be
soldered at the board to the GND1 and/or GND2 pin(s).
• Unused diode pins (Pin D1 to Pin D7) can be connected to
ground or to VOUT, or remain floating. However, the
unused diode current sinks must be disabled by setting
them as independent sinks in Register 0x05 and then
disabling them in Register 0x10. If they are not disabled,
the charge pump efficiency may suffer.
• If the CMP_IN phototransistor input is not used, it can be
connected to ground or remain floating.
• If the interrupt pin (nINT) is not used, connect it to ground
or leave it floating. Never connect it to a voltage supply,
except through a ≥1 kΩ series resistor.
• The ADP8863 has an integrated noise filter on the nRST
pin. Under normal conditions, it is not necessary to filter
the reset line. However, if the part is exposed to an unusually
noisy signal, it is beneficial to add a small RC filter or bypass
capacitor on this pin. If the nRST pin is not used, it must
be pulled well above the VIH(MIN) level (see Table 1). Do not
allow the nRST pin to float.
Rev. 0 | Page 23 of 48
ADP8863
I2C PROGRAMMING AND DIGITAL CONTROL
The ADP8863 provides full software programmability to facilitate its adoption in various product architectures. The I2C address
is 0101011x (x = 0 during write, x = 1 during read). Therefore,
the write address is 0x56 and the read address is 0x57.
Table 8 to Table 84 provide register and bit descriptions. The
reset value for all bits in the bit map tables is all 0s, except in
Table 10 (see Table 10 for its unique reset value). Wherever the
acronym N/A appears in the tables, it means not applicable.
Note the following general behavior of registers:
0
1
1
B0
B7
B0
ACK
REGISTER ADDRESS
REGISTER VALUE
SELECT REGISTER TO WRITE
ACK
8-BIT VALUE TO WRITE IN THE
ADDRESSED REGISTER
ST
08392-048
DEVICE ID
FOR WRITE
OPERATION
B7
R/W ACK
STOP
1
FROM ADP8863
0
WRITE = 0
1
FROM ADP8863
B0
0
FROM ADP8863
B7
ST
START
SLAVE TO MASTER
MASTER TO SLAVE
Figure 48. I2C Write Sequence
B7
ACK RS 0
SELECT REGISTER TO WRITE
B0
1
0
1
0
DEVICE ID
FOR READ
OPERATION
SLAVE TO MASTER
MASTER TO SLAVE
Figure 49. I2C Read Sequence
Rev. 0 | Page 24 of 48
1
B7
1 R/W ACK
B0
REGISTER VALUE
8-BIT VALUE TO WRITE IN THE
ADDRESSED REGISTER
ACK ST
STOP
B0
REGISTER ADDRESS
08392-049
B7
1 R/W ACK
FROM MASTER
DEVICE ID
FOR WRITE
OPERATION
1
READ = 1
0
FROM ADP8863
1
FROM ADP8863
0
REPEATED START
B0
1
WRITE = 0
B7
ST 0
FROM ADP8863
•
•
All registers are set to their default values during reset or
after a UVLO event.
All registers are read/write unless otherwise specified.
Unused bits are read as zero.
START
•
ADP8863
Table 8. Register Set Definitions
Address (Hex)
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x23
0x24
Register Name
MFDVID
MDCR
MDCR2
INTR_EN
CFGR
BLSEN
BLOFF
BLDIM
BLFR
BLMX1
BLDM1
BLMX2
BLDM2
BLMX3
BLDM3
ISCFR
ISCC
ISCT1
ISCT2
ISCF
ISC7
ISC6
ISC5
ISC4
ISC3
ISC2
ISC1
CCFG
CCFG2
L2_TRP
L2_HYS
L3_TRP
L3_HYS
PH1LEVL
PH1LEVH
PH2LEVL
PH2LEVH
Description
Manufacturer and device ID
Device mode and status
Device mode and Status Register 2
Interrupts enable
Configuration register
Sink enable, backlight or independent
Backlight off timeout
Backlight dim timeout
Backlight fade in and fade out rates
Backlight (brightness Level 1—daylight) maximum current
Backlight (brightness Level 1—daylight) dim current
Backlight (brightness Level 2—office) maximum current
Backlight (brightness Level 2—office) dim current
Backlight (brightness Level 3—dark) maximum current
Backlight (brightness Level 3—dark) dim current
Independent sink current fade control register
Independent sink current control register
Independent sink current timer register, LED[7:5]
Independent sink current timer register, LED[4:1]
Independent sink current fade register
Independent sink current, LED7
Independent sink current, LED6
Independent sink current, LED5
Independent sink current, LED4
Independent sink current, LED3
Independent sink current, LED2
Independent sink current, LED1
Comparator configuration
Second comparator configuration
L2 comparator reference
L2 hysteresis
L3 comparator reference
L3 hysteresis
First phototransistor ambient light level—low byte register
First phototransistor ambient light level—high byte register
Second phototransistor ambient light level—low byte register
Second phototransistor ambient light level—high byte register
Rev. 0 | Page 25 of 48
ADP8863
Table 9. Register Map
Addr
(Hex)
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x23
0x24
Reg. Name
MFDVID
MDCR
MDCR2
INTR_EN
CFGR
BLSEN
BLOFF
BLDIM
BLFR
BLMX1
BLDM1
BLMX2
BLDM2
BLMX3
BLDM3
ISCFR
ISCC
ISCT1
ISCT2
ISCF
ISC7
ISC6
ISC5
ISC4
ISC3
ISC2
ISC1
CCFG
CCFG2
L2_TRP
L2_HYS
L3_TRP
L3_HYS
PH1LEVL
PH1LEVH
PH2LEVL
PH2LEVH
Bit 7
Reserved
Reserved
Reserved
Reserved
Reserved
Bit 6
Bit 5
Manufacturer ID
INT_CFG
nSTBY
Reserved
Reserved
SEL_AB
CMP2_SEL
D7EN
D6EN
Bit 4
Bit 3
Bit 2
DIM_EN
SHORT_INT
SHORT_IEN
GDWN_DIS
TSD_INT
TSD_IEN
BLV
D5EN
D4EN
OFFT
DIMT
Bit 1
Device ID
SIS_EN
CMP_AUTOEN
OVP_INT
CMP2_INT
OVP_IEN
CMP2_IEN
Law
D3EN
D2EN
BL_FO
Bit 0
BL_EN
CMP_INT
CMP_IEN
FOVR
D1EN
BL_FI
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
BL1_MC
BL1_DC
BL2_MC
BL2_DC
BL3_MC
BL3_DC
Reserved SC7_EN
SCON
SC4OFF
SC6_EN
Reserved
SC5_EN
SC7OFF
SC3OFF
SC4_EN
SC3_EN
SC6OFF
SC2OFF
SCFO
SCR
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
FILT
FILT2
SC2_EN
SC_LAW
SC1_EN
SC5OFF
SC1OFF
SCFI
SCD7
SCD6
SCD5
SCD4
SCD3
SCD2
SCD1
FORCE_RD
L3_OUT
FORCE_RD2
L3_OUT2
L2_TRP
L2_HYS
L3_TRP
L3_HYS
PH1LEV_LOW
Reserved
L2_OUT
L2_OUT2
PH1LEV_HIGH
PH2LEV_LOW
Reserved
PH2LEV_HIGH
Rev. 0 | Page 26 of 48
L3_EN
L3_EN2
L2_EN
L2_EN2
ADP8863
Manufacturer and Device ID (MFDVID)—Register 0x00
This is a read-only register.
Table 10. MFDVID Bit Map
Bit 7
Bit 6
0
Bit 5
Manufacturer ID
0
Bit 4
1
Bit 3
0
Bit 2
1
Bit 1
Device ID
0
Bit 0
1
0
Mode Control Register (MDCR)—Register 0x01
Table 11. MDCR Bit Map
Bit 7
Reserved
Bit 6
INT_CFG
Bit 5
nSTBY
Bit 4
DIM_EN
Bit 3
GDWN_DIS
Bit 2
SIS_EN
Bit 1
CMP_AUTOEN
Bit 0
BL_EN
Table 12. Bit Descriptions for the MDCR Register
Bit Name
N/A
INT_CFG
Bit No.
7
6
nSTBY
5
DIM_EN
4
GDWN_DIS
3
SIS_EN
2
CMP_AUTOEN
1
BL_EN
0
Description
Reserved.
Interrupt configuration.
1 = processor interrupt deasserts for 50 μs and reasserts with pending events.
0 = processor interrupt remains asserted if the host tries to clear the interrupt while there is a pending event.
1 = device is in active mode.
0 = device is in standby mode; only the I2C interface is enabled.
DIM_EN is set by the hardware after a dim timeout. The user may also force the backlight into dim mode by
asserting this bit. Dim mode can only be entered if BL_EN is also enabled.
1 = backlight is operating at the dim current level (BL_EN must also be asserted).
0 = backlight is not in dim mode.
Gain down disable bit. Setting this bit does not allow the charge pump to switch to lower gains.
1 = the charge pump does not switch down in gain until all LEDs are off. The charge pump switches up in gain as
needed. This feature is useful if the ADP8863 charge pump is used to drive an external load. This feature must be
used when utilizing small fly capacitors (0402 or smaller).
0 = the charge pump automatically switches up and down in gain. This provides optimal efficiency, but is not
suitable for driving loads that are not connected through the ADP8863 diode drivers. Additionally, the charge
pump fly capacitors should be low ESR and sized 0603 or greater.
Synchronous independent sinks enable.
1 = enables all LED current sinks designated as independent sinks. All of the ISC enable bits must be cleared;
if any of the SCx_EN bits in Register 0x10 are set, this bit has no effect.
0 = disables all sinks designated as independent sinks. All of the ISC enable bits must be cleared; if any of the
SCx_EN bits in Register 0x10 are set, this bit has no effect.
1 = backlight automatically responds to the comparator outputs (L2_OUT and L3_OUT). L2_EN and/or L3_EN
must be set for this to function. BLV values in Register 0x04 are overridden.
0 = backlight does not respond automatically to comparator level changes. The user can manually select
backlight operating levels using Bit BLV in Register 0x04.
1 = backlight is enabled (nSTBY must also be asserted).
0 = backlight is disabled.
Rev. 0 | Page 27 of 48
ADP8863
Mode Control Register 2 (MDCR2)—Register 0x02
Table 13. MDCR2 Bit Map
Bit 7
Bit 6
Reserved
Bit 5
Bit 4
SHORT_INT
Bit 3
TSD_INT
Bit 2
OVP_INT
Bit 1
CMP2_INT
Bit 0
CMP_INT
Table 14. Bit Descriptions for the MDCR2 Register
Bit Name
N/A
SHORT_INT
Bit No.
[7:5]
4
TSD_INT
3
OVP_INT
2
CMP2_INT
1
CMP_INT
0
1
Description 1
Reserved.
Short-circuit error interrupt.
1 = a short-circuit or overload condition on VOUT has been detected.
0 = no short-circuit or overload condition has been detected.
Thermal shutdown interrupt.
1 = the device temperature has exceeded 150°C (typical).
0 = no overtemperature condition has been detected.
Overvoltage interrupt.
1 = VOUT has exceeded VOVP.
0 = VOUT has not exceeded VOVP.
1 = the second ALS comparator (CMP_IN2) has changed state.
0 = the second sensor comparator has not been triggered.
1 = main ALS comparator (CMP_IN) has changed state.
0 = the main sensor comparator has not been triggered.
Interrupt bits are cleared by writing a 1 to the flag; writing a 0 or reading the flag has no effect.
Interrupt Enable (INTR_EN)—Register 0x03
Table 15. INTR_EN Bit Map
Bit 7
Bit 6
Reserved
Bit 5
Bit 4
SHORT_IEN
Bit 3
TSD_IEN
Bit 2
OVP_IEN
Bit 1
CMP2_IEN
Bit 0
CMP_IEN
Table 16. Bit Descriptions for the INTR_EN Register
Bit Name
N/A
SHORT_IEN
Bit No.
[7:5]
4
TSD_IEN
3
OVP_IEN
2
CMP2_IEN
1
CMP_IEN
0
Description
Reserved.
Short-circuit interrupt is enabled. When the SHORT_INT status bit is set after an error condition, an interrupt is
raised to the host if the SHORT_IEN flag is enabled.
1 = the short-circuit interrupt is enabled.
0 = the short-circuit interrupt is disabled (the SHORT_INT flag continues to assert).
Thermal shutdown interrupt is enabled. When the TSD_INT status bit is set after an error condition, an interrupt is
raised to the host if the TSD_IEN flag is enabled.
1 = the thermal shutdown interrupt is enabled.
0 = the thermal shutdown interrupt is disabled (the TSD_INT flag continues to assert).
Overvoltage interrupt enabled. When the OVP_INT status bit is set after an error condition, an interrupt is raised to
the host if the OVP_IEN flag is enabled.
1 = the overvoltage interrupt is enabled.
0 = the overvoltage interrupt is disabled (the OVP_INT flag continues to assert).
When the CMP2_INT status bit is set after an enabled comparator trips, an interrupt is raised if the CMP2_IEN flag is
enabled.
1 = the second phototransistor comparator interrupt is enabled.
0 = the second phototransistor comparator interrupt is disabled (the CMP2_INT flag continues to assert).
When the CMP_INT status bit is set after an enabled comparator trips, an interrupt is raised if the CMP_IEN flag is
enabled.
1 = the main comparator interrupt is enabled.
0 = the main comparator interrupt is disabled (the CMP_INT flag continues to assert).
Rev. 0 | Page 28 of 48
ADP8863
BACKLIGHT REGISTER DESCRIPTIONS
Configuration Register (CFGR)—Register 0x04
Table 17. CFGR Bit Map
Bit 7
Reserved
Bit 6
SEL_AB
Bit 5
CMP2_SEL
Bit 4
Bit 3
BLV
Bit 2
Bit 1
Law
Bit 0
FOVR
Table 18. Bit Descriptions for the CFGR Register
Bit Name
N/A
SEL_AB
Bit No.
7
6
CMP2_SEL
5
BLV
[4:3]
Law
[2:1]
FOVR
0
Description
Reserved.
1 = selects the second phototransistor (CMP_IN2) to control the backlight.
0 = selects the main phototransistor (CMP_IN) to control the backlight.
1 = the second phototransistor is enabled; the current sink on D6 is disabled.
0 = the second phototransistor is disabled.
Brightness level. This field indicates the brightness level at which the device is operating. The software may force the
backlight to operate at one of the three brightness levels. Setting CMP_AUTOEN high (Register 0x01) sets these
values automatically and overwrites any previously written values.
00 = Level 1 (daylight).
01 = Level 2 (office).
10 = Level 3 (dark).
11 = off (backlight set to 0 mA).
Backlight transfer law.
00 = linear law DAC, linear time steps.
01 = square law DAC, linear time steps.
10 = square law DAC, nonlinear time steps (Cubic 10).
11 = square law DAC, nonlinear time steps (Cubic 11).
Backlight fade override.
1 = the backlight fade override is enabled.
0 = the backlight fade override is disabled.
Backlight Sink Enable (BLSEN)—Register 0x05
Table 19. BLSEN Bit Map
Bit 7
Reserved
Bit 6
D7EN
Bit 5
D6EN
Bit 4
D5EN
Bit 3
D4EN
Bit 2
D3EN
Table 20. Bit Descriptions for the BLSEN Register
Bit Name
N/A
D7EN
Bit No.
7
6
D6EN
5
D5EN
4
D4EN
3
D3EN
2
Description
Reserved
Diode 7 backlight sink enable
1 = selects LED7 as an independent sink
0 = connects LED7 sink to backlight enable (BL_EN)
Diode 6 backlight sink enable
1 = selects LED6 as an independent sink
0 = connects LED6 sink to backlight enable (BL_EN)
Diode 5 backlight sink enable
1 = selects LED5 as an independent sink
0 = connects LED5 sink to backlight enable (BL_EN)
Diode 4 backlight sink enable
1 = selects LED4 as an independent sink
0 = connects LED4 sink to backlight enable (BL_EN)
Diode 3 backlight sink enable
1 = selects LED3 as an independent sink
0 = connects LED3 sink to backlight enable (BL_EN)
Rev. 0 | Page 29 of 48
Bit 1
D2EN
Bit 0
D1EN
ADP8863
Bit Name
D2EN
Bit No.
1
D1EN
0
Description
Diode 2 backlight sink enable
1 = selects LED2 as an independent sink
0 = connects LED2 sink to backlight enable (BL_EN)
Diode 1 backlight sink enable
1 = selects LED1 as an independent sink
0 = connects LED1 sink to backlight enable (BL_EN)
Backlight Off Timeout (BLOFF)—Register 0x06
Table 21. BLOFF Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
OFFT
Bit 2
Bit 1
Bit 0
Table 22. Bit Descriptions for the BLOFF Register
Bit Name
N/A
OFFT
Bit No.
7
[6:0]
Description
Reserved.
Backlight off timeout. After the off timeout (OFFT) period, the backlight turns off. If the dim timeout (DIMT) is
enabled, the off timeout starts after the dim timeout.
0000000 = timeout disabled
0000001 = 1 sec
0000010 = 2 sec
0000011 = 3 sec
…
1111111 = 127 sec
Backlight Dim Timeout (BLDIM)—Register 0x07
Table 23. BLDIM Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
DIMT
Bit 2
Bit 1
Bit 0
Table 24. Bit Descriptions for the BLDIM Register
Bit Name
N/A
DIMT
Bit No.
7
[6:0]
Description
Reserved.
Backlight dim timeout. After the dim timeout (DIMT) period, the backlight is set to the dim current value. The dim
timeout starts after the backlight reaches the maximum current.
0000000 = timeout disabled
0000001 = 1 sec
0000010 = 2 sec
0000011 = 3 sec
…
1111111 = 127 sec
Rev. 0 | Page 30 of 48
ADP8863
Backlight Fade (BLFR)—Register 0x08
Table 25. BLFR Bit Map
Bit 7
Bit 6
Bit 5
BL_FO
Bit 4
Bit 3
Bit 2
Bit 1
BL_FI
Bit 0
Table 26. Bit Descriptions for the BLFR Register
Bit
Name
BL_FO
Bit No.
[7:4]
BL_FI
[3:0]
1
Description
Backlight fade out rate. If fade out is disabled (BL_FO = 0000), the backlight changes instantly (within 100 ms). If the
fade out rate is set, the backlight fades from its current value to the dim or the off value. The times listed for BL_FO are
for a full-scale fade out (30 mA to 0 mA). Fades between closer current values reduce the fade time. See the Automated
Fade In and Fade Out Section for more information.
0000 = 0.1 sec (fade out disabled) 1
0001 = 0.3 sec
0010 = 0.6 sec
0011 = 0.9 sec
0100 = 1.2 sec
0101 = 1.5 sec
0110 = 1.8 sec
0111 = 2.1 sec
1000 = 2.4 sec
1001 = 2.7 sec
1010 = 3.0 sec
1011 = 3.5 sec
1100 = 4.0 sec
1101 = 4.5 sec
1110 = 5.0 sec
1111 = 5.5 sec
Backlight fade in rate. If fade in is disabled (BL_FI = 0000), the backlight changes instantly (within 100 ms). If the fade in
rate is set, the backlight fades from its current value to its maximum value when the backlight is turned on. The times
listed for BL_FI are for a full-scale fade in (0 mA to 30 mA). Fades between closer current values reduce the fade time.
See the Automated Fade In and Fade Out Section for more information.
0000 = 0.1 sec (fade in disabled)1
0001 = 0.3 sec
0010 = 0.6 sec
0011 = 0.9 sec
…
1111 = 5.5 sec
When fade in and fade out are disabled, the backlight does not instantly fade, but instead, fades rapidly within about 100 ms.
Rev. 0 | Page 31 of 48
ADP8863
Backlight Level 1 (Daylight) Maximum Current Register (BLMX1)—Register 0x09
Table 27. BLMX1 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
BL1_MC
Bit 2
Bit 1
Bit 0
Table 28. Bit Descriptions for the BLMX1 Register
Bit Name
N/A
BL1_MC
Bit No.
7
[6:0]
Description
Reserved.
Backlight Level 1 (daylight) maximum current. The backlight maximum current can be set according to
the linear or square law function (see Table 29 for a complete list of values).
DAC
Linear Law (mA) Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Table 29. Linear and Square Law Currents Per DAC Code (SCR = 0)
DAC Code
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
Linear Law (mA)
0
0.236
0.472
0.709
0.945
1.181
1.417
1.654
1.890
2.126
2.362
2.598
2.835
3.071
3.307
3.543
3.780
4.016
4.252
4.488
4.724
4.961
5.197
5.433
5.669
5.906
6.142
6.378
6.614
6.850
7.087
7.323
7.559
7.795
Square Law (mA) 1
0.000
0.002
0.007
0.017
0.030
0.047
0.067
0.091
0.119
0.151
0.186
0.225
0.268
0.314
0.365
0.419
0.476
0.538
0.603
0.671
0.744
0.820
0.900
0.984
1.071
1.163
1.257
1.356
1.458
1.564
1.674
1.787
1.905
2.026
DAC Code
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2A
0x2B
0x2C
0x2D
0x2E
0x2F
0x30
0x31
0x32
0x33
0x34
0x35
0x36
0x37
0x38
0x39
0x3A
0x3B
0x3C
0x3D
0x3E
0x3F
0x40
0x41
0x42
0x43
Rev. 0 | Page 32 of 48
Linear Law (mA)
8.031
8.268
8.504
8.740
8.976
9.213
9.449
9.685
9.921
10.157
10.394
10.630
10.866
11.102
11.339
11.575
11.811
12.047
12.283
12.520
12.756
12.992
13.228
13.465
13.701
13.937
14.173
14.409
14.646
14.882
15.118
15.354
15.591
15.827
Square Law (mA) 1
2.150
2.279
2.411
2.546
2.686
2.829
2.976
3.127
3.281
3.439
3.601
3.767
3.936
4.109
4.285
4.466
4.650
4.838
5.029
5.225
5.424
5.627
5.833
6.043
6.257
6.475
6.696
6.921
7.150
7.382
7.619
7.859
8.102
8.350
ADP8863
DAC Code
0x44
0x45
0x46
0x47
0x48
0x49
0x4A
0x4B
0x4C
0x4D
0x4E
0x4F
0x50
0x51
0x52
0x53
0x54
0x55
0x56
0x57
0x58
0x59
0x5A
0x5B
0x5C
0x5D
0x5E
0x5F
0x60
0x61
0x62
0x63
Linear Law (mA)
16.063
16.299
16.535
16.772
17.008
17.244
17.480
17.717
17.953
18.189
18.425
18.661
18.898
19.134
19.370
19.606
19.842
20.079
20.315
20.551
20.787
21.024
21.260
21.496
21.732
21.968
22.205
22.441
22.677
22.913
23.150
23.386
Square Law (mA) 1
8.601
8.855
9.114
9.376
9.642
9.912
10.185
10.463
10.743
11.028
11.316
11.608
11.904
12.203
12.507
12.814
13.124
13.439
13.757
14.078
14.404
14.733
15.066
15.403
15.743
16.087
16.435
16.787
17.142
17.501
17.863
18.230
DAC Code
0x64
0x65
0x66
0x67
0x68
0x69
0x6A
0x6B
0x6C
0x6D
0x6E
0x6F
0x70
0x71
0x72
0x73
0x74
0x75
0x76
0x77
0x78
0x79
0x7A
0x7B
0x7C
0x7D
0x7E
0x7F
1
Linear Law (mA)
23.622
23.858
24.094
24.331
24.567
24.803
25.039
25.276
25.512
25.748
25.984
26.220
26.457
26.693
26.929
27.165
27.402
27.638
27.874
28.110
28.346
28.583
28.819
29.055
29.291
29.528
29.764
30.000
Square Law (mA) 1
18.600
18.974
19.351
19.733
20.118
20.507
20.899
21.295
21.695
22.099
22.506
22.917
23.332
23.750
24.173
24.599
25.028
25.462
25.899
26.340
26.784
27.232
27.684
28.140
28.599
29.063
29.529
30.000
Cubic 10 and Cubic 11 laws use the square law DAC setting but vary the time
step per DAC code (see the Automated Fade In and Fade Out section).
Rev. 0 | Page 33 of 48
ADP8863
Backlight Level 1 (Daylight) Dim Current Register (BLDM1)—Register 0x0A
Table 30. BLDM1 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
BL1_DC
Bit 2
Bit 1
Bit 0
Table 31. Bit Descriptions for the BLDM1 Register
Bit Name
N/A
BL1_DC
Bit No.
7
[6:0]
Description
Reserved.
Backlight Level 1 (daylight) dim current. The backlight is set to the dim current value after a dim timeout or
if the DIM_EN flag is set by the user (see Table 29 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Backlight Level 2 (Office) Maximum Current Register (BLMX2)—Register 0x0B
Table 32. BLMX2 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
BL2_MC
Bit 2
Bit 1
Table 33. Bit Descriptions for the BLMX2 Register
Bit Name
N/A
BL2_MC
Bit No.
7
[6:0]
Description
Reserved.
Backlight Level 2 (office) maximum current (see Table 29 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Rev. 0 | Page 34 of 48
Bit 0
ADP8863
Backlight Level 2 (Office) Dim Current Register (BLDM2)—Register 0x0C
Table 34. BLDM2 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
BL2_DC
Bit 2
Bit 1
Bit 0
Table 35. Bit Descriptions for the BLDM2 Register
Bit Name
N/A
BL2_DC
Bit No.
7
[6:0]
Description
Reserved.
Backlight Level 2 (office) dim current. See Table 29 for a complete list of values. The backlight is set to the
dim current value after a dim timeout or if the DIM_EN flag is set by the user.
DAC
Linear Law (mA) Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Backlight Level 3 (Dark) Maximum Current Register (BLMX3)—Register 0x0D
Table 36. BLMX3 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
BL3_MC
Bit 2
Bit 1
Table 37. Bit Descriptions for the BLMX3 Register
Bit Name
N/A
BL3_MC
Bit No.
7
[6:0]
Description
Reserved.
Backlight Level 3 (dark) maximum current. See Table 29 for a complete list of values.
DAC
Linear Law (mA) Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Rev. 0 | Page 35 of 48
Bit 0
ADP8863
Backlight Level 3 (Dark) Dim Current Register (BLDM3)—Register 0x0E
Table 38. BLDM3 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
BL3_DC
Bit 2
Bit 1
Bit 0
Table 39. Bit Descriptions for the BLDM3 Register
Bit Name
N/A
BL3_DC
Bit No.
7
[6:0]
Description
Reserved.
Backlight Level 3 (dark) dim current. See Table 29 for a complete list of values. The backlight is set to the
dim current value after a dim timeout or if the DIM_EN flag is set by the user.
DAC
Linear Law (mA) Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
INDEPENDENT SINK REGISTER DESCRIPTIONS
Independent Sink Current Fade Control Register (ISCFR)—Register 0x0F
Table 40. ISCFR Bit Map
Bit 7
Bit 6
Bit 5
Bit 4
Reserved
Bit 3
Bit 2
Bit 1
Bit 0
SC_LAW
Table 41. Bit Descriptions for the ISCFR Register
Bit Name
N/A
SC_LAW
Bit No.
[7:2]
[1:0]
Description
Reserved
Independent sink current fade transfer law
00 = linear law DAC, linear time steps
01 = square law DAC, linear time steps
10 = square law DAC, nonlinear time steps (Cubic 10)
11 = square law DAC, nonlinear time steps (Cubic 11)
Independent Sink Current Control (ISCC)—Register 0x10
Table 42. ISCC Bit Map
Bit 7
Reserved
Bit 6
SC7_EN
Bit 5
SC6_EN
Bit 4
SC5_EN
Bit 3
SC4_EN
Table 43. Bit Descriptions for the ISCC Register
Bit Name
N/A
SC7_EN
Bit No.
7
6
SC6_EN
5
SC5_EN
4
Description
Reserved
This enable acts upon LED7
1 = SC7 is turned on
0 = SC7 is turned off
This enable acts upon LED6
1 = SC6 is turned on
0 = SC6 is turned off
This enable acts upon LED5
1 = SC5 is turned on
0 = SC5 is turned off
Rev. 0 | Page 36 of 48
Bit 2
SC3_EN
Bit 1
SC2_EN
Bit 0
SC1_EN
ADP8863
Bit Name
SC4_EN
Bit No.
3
SC3_EN
2
SC2_EN
1
SC1_EN
0
Description
This enable acts upon LED4.
1 = SC4 is turned on.
0 = SC4 is turned off.
This enable acts upon LED3.
1 = SC3 is turned on.
0 = SC3 is turned off.
This enable acts upon LED2.
1 = SC2 is turned on.
0 = SC2 is turned off.
This enable acts upon LED1.
1 = SC1 is turned on.
0 = SC1 is turned off.
Independent Sink Current Time (ISCT1)—Register 0x11
Table 44. ISCT1 Bit Map
Bit 7
Bit 6
SCON
Bit 5
Bit 4
SC7OFF
Bit 3
Bit 2
SC6OFF
Bit 1
Bit 0
SC5OFF
Table 45. Bit Descriptions for the ISCT1 Register
Bit Name
SCON
Bit No.
[7:6]
Description 1, 2
SC on time. If the SCxOFF time is not disabled and the independent current sink is enabled (Register 0x10), the LED(s)
remains on for the time selected (per the following list) and then turns off.
00 = 0.2 sec
01 = 0.6 sec
10 = 0.8 sec
11 = 1.2 sec
SC7OFF
[5:4]
SC6OFF
[3:2]
SC5OFF
[1:0]
1
2
SC7 off time. When the SC off time is disabled, the ISC remains on while enabled. When the SC off time is set to any
other value, the ISC turns off for the off time (per the following listed times) and then turns on according to the SCON
setting.
00 = off time disabled
01 = 0.6 sec
10 = 1.2 sec
11 = 1.8 sec
SC6 off time. When the SC off time is disabled, the ISC remains on while enabled. When the SC off time is set to any
other value, the ISC turns off for the off time (per the following listed times) and then turns on according to the SCON
setting.
00 = off time disabled
01 = 0.6 sec
10 = 1.2 sec
11 = 1.8 sec
SC5 off time. When the SC off time is disabled, the ISC remains on while enabled. When the SC off time is set to any
other value, the ISC turns off for the off time (per the following listed times) and then turns on according to the SCON
setting.
00 = off time disabled
01 = 0.6 sec
10 = 1.2 sec
11 = 1.8 sec
An independent sink remains on continuously when SCx_EN = 1 and SCxOFF = 00 (disabled).
To enable multiple independent sinks, set the appropriate SCx_EN bits. To create equivalent blinking and fading sequences, enable all independent sinks in one write
cycle to cause a preprogrammed sequence to start simultaneously.
Rev. 0 | Page 37 of 48
ADP8863
Independent Sink Current Time (ISCT2)—Register 0x12
Table 46. ISCT2 Bit Map
Bit 7
Bit 6
SC4OFF
Bit 5
Bit 4
SC3OFF
Bit 3
Bit 2
SC2OFF
Bit 1
Bit 0
SC1OFF
Table 47. Bit Descriptions for the ISCT2 Register
Bit Name
SC4OFF
Bit No.
[7:6]
SC3OFF
[5:4]
SC2OFF
[3:2]
SC1OFF
[1:0]
1
2
Description 1, 2
SC4 off time. When the SC off time is disabled, the ISC remains on while enabled. When the SC off time is set to any
other value, the ISC turns off for the off time (per the following listed times) and then turns on according to the
SCON setting.
00 = off time disabled
01 = 0.6 sec
10 = 1.2 sec
11 = 1.8 sec
SC3 off time. When the SC off time is disabled, the ISC remains on while enabled. When the SC off time is set to any
other value, the ISC turns off for the off time (per the following listed times) and then turns on according to the
SCON setting.
00 = off time disabled
01 = 0.6 sec
10 = 1.2 sec
11 = 1.8 sec
SC2 off time. When the SC off time is disabled, the ISC remains on while enabled. When the SC off time is set to any
other value, the ISC turns off for the off time (per the following listed times) and then turns on according to the
SCON setting.
00 = off time disabled
01 = 0.6 sec
10 = 1.2 sec
11 = 1.8 sec
SC1 off time. When the SC off time is disabled, the ISC remains on while enabled. When the SC off time is set to any
other value, the ISC turns off for the off time (per the following listed times) and then turns on according to the
SCON setting.
00 = off time disabled
01 = 0.6 sec
10 = 1.2 sec
11 = 1.8 sec
An independent sink remains on continuously when SCx_EN = 1 and SCxOFF = 00 (disabled).
To enable multiple independent sinks, set the appropriate SCx_EN bits. To create equivalent blinking and fading sequences, enable all independent sinks in one write
cycle. This causes a preprogrammed sequence to start simultaneously.
Rev. 0 | Page 38 of 48
ADP8863
Independent Sink Current Fade (ISCF)—Register 0x13
Table 48. ISCF Bit Map
Bit 7
Bit 6
Bit 5
SCFO
Bit 4
Bit 3
Bit 2
Bit 1
SCFI
Bit 0
Table 49. Bit Descriptions for the ISCF Register
Bit Name
SCFO
Bit No.
[7:4]
SCFI
[3:0]
Description
Sink current fade out rate. The times listed here are for a full-scale fade out (30 mA to 0 mA). Fades between closer
current values reduce the fade time. See the Automated Fade In and Fade Out section for more information.
0000 = disabled
0001 = 0.30 sec
0010 = 0.60 sec
0011 = 0.90 sec
0100 = 1.2 sec
0101 = 1.5 sec
0110 = 1.8 sec
0111 = 2.1 sec
1000 = 2.4 sec
1001 = 2.7 sec
1010 = 3.0 sec
1011 = 3.5 sec
1100 = 4.0 sec
1101 = 4.5 sec
1110 = 5.0 sec
1111 = 5.5 sec
Sink current fade in rate. The times listed here are for a full-scale fade in (0 mA to 30 mA). Fades between closer
current values reduce the fade time. See the Automated Fade In and Fade Out section for more information.
0000 = disabled
0001 = 0.30 sec
0010 = 0.60 sec
0011 = 0.90 sec
0100 = 1.2 sec
0101 = 1.5 sec
0110 = 1.8 sec
0111 = 2.1 sec
1000 = 2.4 sec
1001 = 2.7 sec
1010 = 3.0 sec
1011 = 3.5 sec
1100 = 4.0 sec
1101 = 4.5 sec
1110 = 5.0 sec
1111 = 5.5 sec
Rev. 0 | Page 39 of 48
ADP8863
Sink Current Register LED7 (ISC7)—Register 0x14
Table 50. ISC7 Bit Map
Bit 7
SCR
Bit 6
Bit 5
Bit 4
Bit 3
SCD7
Bit 2
Bit 1
Bit 0
Table 51. Bit Descriptions for the ISC7 Register
Bit Name
SCR
Bit No.
7
SCD7
[6:0]
Description
1 = Sink Current 1.
0 = Sink Current 0.
For Sink Current 0, use the following DAC code schedule (see Table 29 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0.000
0
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
For Sink Current 1, use the following DAC code schedule (see Table 52 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0.000
0
0000001
0.472
0.004
0000010
0.945
0.014
0000011
1.42
0.034
…
…
…
1111111
60
60
Table 52. Linear and Square Law Currents for LED7 (SCR = 1)
DAC Code
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
Linear Law (mA)
0.000
0.472
0.945
1.42
1.89
2.36
2.83
3.31
3.78
4.25
4.72
5.20
5.67
6.14
6.61
7.09
7.56
8.03
8.50
8.98
9.45
9.92
10.39
10.87
Square Law (mA) 1
0
0.004
0.014
0.034
0.06
0.094
0.134
0.182
0.238
0.302
0.372
0.45
0.536
0.628
0.73
0.838
0.952
1.076
1.206
1.342
1.488
1.64
1.8
1.968
DAC Code
0x18
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x23
0x24
0x25
0x26
0x27
0x28
0x29
0x2A
0x2B
0x2C
0x2D
0x2E
0x2F
Rev. 0 | Page 40 of 48
Linear Law (mA)
11.34
11.81
12.28
12.76
13.23
13.70
14.17
14.65
15.12
15.59
16.06
16.54
17.01
17.48
17.95
18.43
18.90
19.37
19.84
20.31
20.79
21.26
21.73
22.20
Square Law (mA) 1
2.142
2.326
2.514
2.712
2.916
3.128
3.348
3.574
3.81
4.052
4.3
4.558
4.822
5.092
5.372
5.658
5.952
6.254
6.562
6.878
7.202
7.534
7.872
8.218
ADP8863
DAC Code
0x30
0x31
0x32
0x33
0x34
0x35
0x36
0x37
0x38
0x39
0x3A
0x3B
0x3C
0x3D
0x3E
0x3F
0x40
0x41
0x42
0x43
0x44
0x45
0x46
0x47
0x48
0x49
0x4A
0x4B
0x4C
0x4D
0x4E
0x4F
0x50
0x51
0x52
0x53
0x54
0x55
0x56
0x57
Linear Law (mA)
22.68
23.15
23.62
24.09
24.57
25.04
25.51
25.98
26.46
26.93
27.40
27.87
28.35
28.82
29.29
29.76
30.24
30.71
31.18
31.65
32.13
32.60
33.07
33.54
34.02
34.49
34.96
35.43
35.91
36.38
36.85
37.32
37.80
38.27
38.74
39.21
39.69
40.16
40.63
41.10
Square Law (mA) 1
8.57
8.932
9.3
9.676
10.058
10.45
10.848
11.254
11.666
12.086
12.514
12.95
13.392
13.842
14.3
14.764
15.238
15.718
16.204
16.7
17.202
17.71
18.228
18.752
19.284
19.824
20.37
20.926
21.486
22.056
22.632
23.216
23.808
24.406
25.014
25.628
26.248
26.878
27.514
28.156
DAC Code
0x58
0x59
0x5A
0x5B
0x5C
0x5D
0x5E
0x5F
0x60
0x61
0x62
0x63
0x64
0x65
0x66
0x67
0x68
0x69
0x6A
0x6B
0x6C
0x6D
0x6E
0x6F
0x70
0x71
0x72
0x73
0x74
0x75
0x76
0x77
0x78
0x79
0x7A
0x7B
0x7C
0x7D
0x7E
0x7F
1
Linear Law (mA)
41.57
42.05
42.52
42.99
43.46
43.94
44.41
44.88
45.35
45.83
46.30
46.77
47.24
47.72
48.19
48.66
49.13
49.61
50.08
50.55
51.02
51.50
51.97
52.44
52.91
53.39
53.86
54.33
54.80
55.28
55.75
56.22
56.69
57.17
57.64
58.11
58.58
59.06
59.53
60
Square Law (mA) 1
28.808
29.466
30.132
30.806
31.486
32.174
32.87
33.574
34.284
35.002
35.726
36.46
37.2
37.948
38.702
39.466
40.236
41.014
41.798
42.59
43.39
44.198
45.012
45.834
46.664
47.5
48.346
49.198
50.056
50.924
51.798
52.68
53.568
54.464
55.368
56.28
57.198
58.126
59.058
60
Cubic 10 and Cubic 11 laws use the square law DAC setting but vary the time
step per DAC code (see the Automated Fade In and Fade Out section).
Rev. 0 | Page 41 of 48
ADP8863
Sink Current Register LED6 (ISC6)—Register 0x15
Table 53. ISC6 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
SCD6
Bit 2
Bit 1
Bit 0
Table 54. Bit Descriptions for the ISC6 Register
Bit Name
N/A
SCD6
Bit No.
7
[6:0]
Description
Reserved.
Sink current. Use the following DAC code schedule (see Table 29 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Sink Current Register LED5 (ISC5)—Register 0x16
Table 55. ISC5 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
SCD5
Bit 2
Bit 1
Bit 0
Table 56. Bit Descriptions for the ISC5 Register
Bit Name
N/A
SCD5
Bit No.
7
[6:0]
Description
Reserved.
Sink current. Use the following DAC code schedule (see Table 29 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Sink Current Register LED4 (ISC4)—Register 0x17
Table 57. ISC4 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
SCD4
Bit 2
Bit 1
Table 58. Bit Descriptions for the ISC4 Register
Bit Name
N/A
SCD4
Bit No.
7
[6:0]
Description
Reserved.
Sink current. Use the following DAC code schedule (see Table 29 for a complete list of values):
DAC
Linear Law (mA)
Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Rev. 0 | Page 42 of 48
Bit 0
ADP8863
Sink Current Register LED3 (ISC3)—Register 0x18
Table 59. ISC3 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
SCD3
Bit 2
Bit 1
Bit 0
Table 60. Bit Descriptions for the ISC3 Register
Bit Name
N/A
SCD3
Bit No.
7
[6:0]
Description
Reserved.
Sink current. Use the following DAC code schedule (see Table 29 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Sink Current Register LED2 (ISC2)—Register 0x19
Table 61. ISC2 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
SCD2
Bit 2
Bit 1
Bit 0
Table 62. Bit Descriptions for the ISC2 Register
Bit Name
N/A
SCD2
Bit No.
7
[6:0]
Description
Reserved.
Sink current. Use the following DAC code schedule (see Table 29 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Sink Current Register LED1 (ISC1)—Register 0x1A
Table 63. ISC1 Bit Map
Bit 7
Reserved
Bit 6
Bit 5
Bit 4
Bit 3
SCD1
Bit 2
Bit 1
Table 64. Bit Descriptions for the ISC1 Register
Bit Name
N/A
SCD1
Bit No.
7
[6:0]
Description
Reserved.
Sink current. Use the following DAC code schedule (see Table 29 for a complete list of values).
DAC
Linear Law (mA)
Square Law (mA)
0000000
0
0.000
0000001
0.236
0.002
0000010
0.472
0.007
0000011
0.709
0.017
…
…
…
1111111
30
30
Rev. 0 | Page 43 of 48
Bit 0
ADP8863
COMPARATOR REGISTER DESCRIPTIONS
Comparator Configuration (CCFG)—Register 0x1B
Table 65. CCFG Bit Map
Bit 7
Bit 6
FILT
Bit 5
Bit 4
FORCE_RD
Bit 3
L3_OUT
Bit 2
L2_OUT
Bit 1
L3_EN
Bit 0
L2_EN
Table 66. Bit Descriptions for the CCFG Register
Bit Name
FILT
Bit No.
[7:5]
FORCE_RD
4
L3_OUT
L2_OUT
L3_EN
3
2
1
L2_EN
0
Description
Filter setting for the CMP_IN light sensor.
000 = 80 ms
001 = 160 ms
010 = 320 ms
011 = 640 ms
100 = 1280 ms
101 = 2560 ms
110 = 5120 ms
111 = 10,240 ms
Force a read of the CMP_IN light sensor while independent sinks are running, but the backlight is not. Reset by
chip after the conversion is complete and L2_OUT and L3_OUT are valid. Ignored if the backlight is enabled.
This bit is the output of the L3 comparator.
This bit is the output of the L2 comparator.
1 = the L3 comparator is enabled for the CMP_IN comparator.
0 = the L3 comparator is disabled for the CMP_IN comparator.
Note that the L3 comparator has priority over the L2 comparator.
1 = the L2 comparator is enabled for the CMP_IN comparator.
0 = the L2 comparator is disabled for the CMP_IN comparator.
Second Comparator Configuration (CCFG2)—Register 0x1C
Table 67. CCFG2 Bit Map
Bit 7
Bit 6
FILT2
Bit 5
Bit 4
FORCE_RD2
Bit 3
L3_OUT2
Bit 2
L2_OUT2
Bit 1
L3_EN2
Bit 0
L2_EN2
Table 68. Bit Descriptions for the CCFG2 Register
Bit Name
FILT2
Bit No.
[7:5]
FORCE_RD2
4
L3_OUT2
L2_OUT2
L3_EN2
3
2
1
L2_EN2
0
Description
Filter setting for the CMP_IN2 light sensor.
000 = 80 ms
001 = 160 ms
010 = 320 ms
011 = 640 ms
100 = 1280 ms
101 = 2560 ms
110 = 5120 ms
111= 10,240 ms
Force a read of the CMP_IN2 light sensor while independent sinks are running, but the backlight is not. Reset by
chip after the conversion is complete and L2_OUT and L3_OUT are valid. Ignored if backlight is enabled.
This bit is the output of the L3 comparator for the second light sensor.
This bit is the output of the L2 comparator for the second light sensor.
1 = the L3 comparator is enabled for the CMP_IN2 comparator.
0 = the L3 comparator is disabled for the CMP_IN2 comparator.
Note that the L3 comparator has priority over the L2 comparator.
1 = the L2 comparator is enabled for the CMP_IN2 comparator.
0 = the L2 comparator is disabled for the CMP_IN2 comparator.
Rev. 0 | Page 44 of 48
ADP8863
Comparator Level 2 Threshold (L2_TRP)—Register 0x1D
Table 69. L2_TRP Bit Map
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
L2_TRP
Bit 2
Bit 1
Bit 0
Table 70. Bit Descriptions for the L2_TRP Register
Bit Name
L2_TRP
Bit No.
[7:0]
Description
Comparator Level 2 threshold. If the comparator input is below L2_TRP, the comparator trips and the
backlight enters Level 2 (office) mode. The following lists the code settings for the photosensor current:
00000000 = 0 μA
00000001 = 4.3 μA
00000010 = 8.6 μA
00000011 = 12.9 μA
…
11111010 = 1080 μA
…
11111111 = 1106 μA
Although codes above 1111010 (250 decimal) are possible, they should not be used. Furthermore, the
maximum value of L2_TRP + L2_HYS must not exceed 11111010 (250).
Comparator Level 2 Hysteresis (L2_HYS)—Register 0x1E
Table 71. L2_HYS Bit Map
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
L2_HYS
Bit 2
Bit 1
Bit 0
Table 72. Bit Descriptions for the L2_HYS Register
Bit Name
L2_HYS
Bit No.
[7:0]
Description
Comparator Level 2 hysteresis. If the comparator input is above L2_TRP + L2_HYS, the comparator trips and
the backlight enters Level 1 (daylight) mode. The following lists the code settings for the photosensor
current hysteresis:
00000000 = 0 μA
00000001 = 4.3 μA
00000010 = 8.6 μA
00000011 = 12.9 μA
…
11111010 = 1080 μA
…
11111111 = 1106 μA
Although codes above 11111010 (250 decimal) are possible, they should not be used. Furthermore, the
maximum value of L2_TRP + L2_HYS must not exceed 11111010 (250).
Rev. 0 | Page 45 of 48
ADP8863
Comparator Level 3 Threshold (L3_TRP)—Register 0x1F
Table 73. L3_TRP Bit Map
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
L3_TRP
Bit 2
Bit 1
Bit 0
Table 74. Bit Descriptions for the L3_TRP Register
Bit Name
L3_TRP
Bit No.
7:0
Description
Comparator Level 3 threshold. If the comparator input is below L3_TRP, the comparator trips and the
backlight enters Level 3 (dark) mode. The following lists the code settings for photosensor current:
00000000 = 0 μA
00000001 = 0.54 μA
00000010 = 1.08 μA
00000011 = 1.62 μA
…
11111111 = 137.7 μA
Comparator Level 3 Hysteresis (L3_HYS)—Register 0x20
Table 75. L3_HYS Bit Map
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
L3_HYS
Bit 2
Bit 1
Bit 0
Table 76. Bit Descriptions for the L3_HYS Register
Bit Name
L3_HYS
Bit No.
[7:0]
Description
Comparator Level 3 hysteresis. If the comparator input is above L3_TRP + L3_HYS, the comparator trips
and the backlight enters Level 2 (office) mode. The following lists the code settings for photosensor
current hysteresis:
00000000 = 0 μA
00000001 = 0.54 μA
00000010 = 1.08 μA
00000011 = 1.62 μA
…
11111111 = 137.7 μA
First Phototransistor Register: Low Byte (PH1LEVL)—Register 0x21
Table 77. PH1LEVL Bit Map
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
PH1LEV_LOW
Bit 2
Bit 1
Bit 0
Table 78. Bit Descriptions for the PH1LEVL Register
Bit Name
PH1LEV_LOW
Bit No.
[7:0]
Description
Lower eight bits of the 13-bit conversion value for the first light sensor (Bit 7 to Bit 0). The value is
updated every 80 ms (when the light sensor is enabled). This is a read-only register.
Rev. 0 | Page 46 of 48
ADP8863
First Phototransistor Register: High Byte (PH1LEVH)—Register 0x22
Table 79. PH1LEVH Bit Map
Bit 7
Bit 6
Reserved
Bit 5
Bit 4
Bit 3
Bit 2
PH1LEV_HIGH
Bit 1
Bit 0
Table 80. Bit Descriptions for the PH1LEVH Register
Bit Name
N/A
PH1LEV_HIGH
Bit No.
[7:5]
[4:0]
Description
Reserved.
Upper five bits of the 13-bit conversion value for the first light sensor (Bit 12 to Bit 8). The value is
updated every 80 ms (when the light sensor is enabled). This is a read-only register.
Second Phototransistor Register: Low Byte (PH2LEVL)—Register 0x23
Table 81. PH2LEVL Bit Map
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
PH2LEV_LOW
Bit 2
Bit 1
Bit 0
Table 82. Bit Descriptions for the PH2LEVL Register
Bit Name
PH2LEV_LOW
Bit No.
[7:0]
Description
Lower eight bits of the 13-bit conversion value for the second light sensor (Bit 7 to Bit 0). The value is
updated every 80 ms (when the light sensor is enabled). This is a read-only register.
Second Phototransistor Register: High Byte (PH2LEVH)—Register 0x24
Table 83. PH2LEVH Bit Map
Bit 7
Bit 6
Reserved
Bit 5
Bit 4
Bit 3
Bit 2
PH2LEV_HIGH
Bit 1
Bit 0
Table 84. Bit Descriptions for the PH2LEVH Register
Bit Name
N/A
Bit No.
[7:5]
Description
Reserved
PH2LEV_HIGH
[4:0]
Upper five bits of the 13-bit conversion value for the second light sensor (Bit 12 to Bit 8). The value is
updated every 80 ms (when the light sensor is enabled). This is a read-only register.
Rev. 0 | Page 47 of 48
ADP8863
OUTLINE DIMENSIONS
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
0.30
0.25
0.20
0.50
BSC
20
16
15
1
EXPOSED
PAD
5
PIN 1
INDICATOR
2.65
2.50 SQ
2.35
11
0.80
0.75
0.70
0.50
0.40
0.30
10
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
6
BOTTOM VIEW
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
061609-B
TOP VIEW
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
08392-050
Figure 50. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-10)
Dimensions shown in millimeters
Figure 51. Tape and Reel Orientation for LFCSP Units
ORDERING GUIDE
Model 1
ADP8863ACPZ-R7
ADP8863DBCP-EVALZ
ADP886XMB1-EVALZ
1
Temperature Range
−40°C to +85°C
Package Description
20-Lead LFCSP_WQ, 7” Tape and Reel
Daughter Card
USB-to-I2C Adapter Board
Z = RoHS Compliant Part.
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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Package Option
CP-20-10