CD40109B-Q1 SCHS380 A – JUNE 2010 – REVISED AUGUST 2011 www.ti.com CMOS QUAD LOW-TO-HIGH VOLTAGE SHIFTER Check for Samples: CD40109B-Q1 FEATURES 1 • • • • • • • • • • Qualified for Automotive Applications Independent of Power Supply Sequence Considerations – VCC Can Exceed VDD – Input Signals can Exceed Both VCC and VDD Up and Down Level-Shifting Capability Three-State Outputs With Separate Enable Controls Standardized Symmetrical Output Characteristics 100% Tested for Quiescent Current at 20 V Maximum Input Current: – 1 µA at 18 V Over Full Package-Temperature Range – 100 nA at 18 V and 25°C Noise Margin (Full Package-Temperature Range): – 1 V at VCC = 5 V, VDD = 10 V – 2 V at VCC = 10 V, VDD = 15 V 5-V, 10-V, and 15-V Parametric Ratings Meets All Requirements of JEDEC Tentative Standard No. 13B, "Standard specifications for • Description of 'B' Series CMOS Devices" Latch-Up Performance Meets 50 mA per JESD 78, Class I APPLICATIONS • • High-or-Low Level-Shifting With Three-State Outputs for Unidirectional or Bidirectional Bussing Isolation of Logic Subsystem Using Separate Power Supplies from Supply Sequencing, Supply Loss, and Supply Regulation Considerations NS PACKAGE (TOP VIEW) DESCRIPTION CD40109B contains four low-to-high-voltage level-shifting circuits. Each circuit will shift a low-voltage digital-logic input signal (A, B, C, D) with logical 1 = VCC and logical 0 = VSS to a high-voltage output signal (E, F, G, H) with logical 1 = VDD and logical 0 = VSS. The RCA-CD40109, unlike other low-to-high level-shifting circuits, does not require the presence of the high-voltage supply (VDD) before the application of either the low-voltage supply (VCC) or the input signals. There are no restrictions on the sequence of application of VDD, VCC, or the input signals. In addition, with one exception there are no restrictions on the relative magnitudes of the supply voltages or input signals within the device maximum ratings, provided that the input signal swings between VSS and at least 0.7 VCC; VCC may exceed VDD, and input signals may exceed VCC and VDD. When operated in the mode VCC > VDD, the CD40109 will operate as a high-to-low level-shifter. The CD40109 also features individual three-state output capability. A low level on any of the separately enabled three-state output controls produces a high-impedance state in the corresponding output. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) SOIC – NS Reel of 2000 ORDERABLE PART NUMBER CD40109BQNSRQ1 TOP-SIDE MARKING CD40109BQ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2011, Texas Instruments Incorporated CD40109B-Q1 SCHS380 A – JUNE 2010 – REVISED AUGUST 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. TRUTH TABLE (1) INPUTS (1) OUTPUTS A, B, C, D ENABLE A, B, C, D E, F, G, H 0 1 0 1 1 1 X 0 Z 0 = VSS, 1 = VCC at inputs and VDD at outputs, X = Don't care, Z = High impedance Functional Diagram (1 of 4 Units) Logic Diagram (1 of 4 Units) 2 Copyright © 2010–2011, Texas Instruments Incorporated CD40109B-Q1 SCHS380 A – JUNE 2010 – REVISED AUGUST 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VDD PD DC supply voltage range Voltages referenced to VSS terminal Output voltage range All outputs DC input current Power dissipation per package VALUE UNIT –0.5 to +20 V –0.5 to VDD + 0.5 V Any one input ±10 mA TA = –40°C to + 100°C 500 mW TA = 100°C to + 125°C Derate linearly at 12 mW/°C to 200 mW Device dissipation per output transistor (for TA = full package-temperature range, all package types) 100 mW °C TA Operating-temperature range –40 to +125 Tstg Storage temperature range –65 to +150 °C 50 mA Latch-Up Performance per JESD 78, Class I (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS VDD Supply-voltage range (for TA = full package-temperature range) MIN MAX 3 18 UNIT V STATIC ELECTRICAL CHARACTERISTICS CONDITIONS PARAMETER IDD Max IOL Min IOH Min VOL Max VOH Min IIN Max VO (V) Quiescent device current Output low (sink) current VIH Min –40 +85 +125 0, 5 5 1 30 0, 10 10 2 0, 15 15 4 +25 MIN TYP MAX 30 0.02 1 60 60 0.02 2 120 120 0.02 4 0.04 20 0, 20 20 20 600 600 0, 5 5 0.61 0.42 0.36 0.51 1 0.5 0, 10 10 1.5 1.1 0.9 1.3 2.6 1.5 0, 15 15 4 2.8 2.4 3.4 6.8 4.6 0, 5 5 –0.61 –0.42 –0.36 –0.51 –1 0, 5 5 –1.8 –1.3 –1.15 –1.6 –3.2 9.5 0, 10 10 –1.5 –1.1 –0.9 –1.3 –2.6 13.5 0, 15 15 –4 –2.8 –2.4 –3.4 –6.8 Output voltage: low-level Output voltage: high-level Input current Input high voltage VDD (V) 2.5 Output high (source) current Input low voltage VIN (V) 0.4 IOUT Max VIL Max LIMITS AT INDICATED TEMPERATURES (°C) 0, 5 5 0.05 0 0.05 10 0.05 0 0.05 0, 15 15 0.05 0 0.05 0, 5 5 4.95 0, 10 10 0, 15 15 0, 18 18 ±0.1 ±0.4 5 9.95 9.95 10 14.95 14.95 ±1 ±12 0, 18 18 1, 9 5 10 1.5 1.5, 13.5 10 15 3 1, 9 5 10 3.5 1.5, 13.5 10 15 7 Copyright © 2010–2011, Texas Instruments Incorporated ±1 ±12 µA mA 0, 10 4.95 UNIT V 15 ±10–5 ±0.1 µA –4 ±0.4 µA ±10 1.5 3 3.5 V 7 3 CD40109B-Q1 SCHS380 A – JUNE 2010 – REVISED AUGUST 2011 www.ti.com DYNAMIC ELECTRICAL CHARACTERISTICS TA = 25°C, Input tr/tf = 20 ns, CL = 50 pF, RL = 200 kΩ (unless otherwise noted) PARAMETER TEST CONDITIONS SHIFTING MODE L–H tPHL Propagation delay time, high-to-low level, data input to output H–L L–H tPLH Propagation delay time, low-to-high level, data input to output H–L tPHZ tPLZ tPZH tPZL Propagation delay time, 3-state disable, delay, output high to high impedance Propagation delay time, 3-state disable, delay, output low to high impedance Propagation delay time, 3-state disable, delay, output high impedance to high Propagation delay time, 3-state disable, delay, output high impedance to low L–H RL = 1 kΩ H–L L–H RL = 1 kΩ H–L L–H RL = 1 kΩ H–L L–H RL = 1 kΩ H–L L–H tTHL, tTLH Transition time H–L Ci 4 Input capacitance VCC (V) VDD (V) MIN MAX 5 10 300 600 5 15 220 440 10 15 180 360 10 5 250 500 15 5 250 500 15 10 120 240 5 10 130 260 5 15 120 240 10 15 70 140 10 5 230 460 15 5 230 460 15 10 80 160 5 10 60 120 150 5 15 75 10 15 35 70 10 5 200 400 15 5 200 400 15 10 40 80 5 10 370 740 5 15 300 600 10 15 250 500 10 5 250 500 15 5 250 500 15 10 130 260 5 10 320 640 5 15 230 460 10 15 180 360 10 5 300 600 15 5 300 600 15 10 130 260 5 10 100 200 5 15 80 160 10 15 40 80 10 5 200 400 15 5 200 400 15 10 40 80 5 10 50 100 5 15 40 80 10 15 40 80 10 5 100 200 15 5 100 200 15 10 50 100 5 7.5 Any input UNIT ns ns ns ns ns ns ns pF Copyright © 2010–2011, Texas Instruments Incorporated CD40109B-Q1 SCHS380 A – JUNE 2010 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS Figure 1. Typical Output Low (Sink) Current Characteristics Figure 2. Minimum Output Low (Sink) Current Characteristics Figure 3. Typical Output High (Source) Current Characteristics Figure 4. Minimum Output High (Source) Current Characteristics Figure 5. Typical Transition Time as a Function of Load Capacitance Figure 6. Typical High-to-Low Propagation Delay Time as a Function of Load Capacitance Copyright © 2010–2011, Texas Instruments Incorporated 5 CD40109B-Q1 SCHS380 A – JUNE 2010 – REVISED AUGUST 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) 6 Figure 7. Typical Low-to-High Propagation Delay Time as a Function of Load Capacitance Figure 8. Typical Input Switching as a Function of High-Level Supply Voltage Figure 9. High-Level Supply Voltage vs Low-Level Supply Voltage Figure 10. Typical Dynamic Power Dissipation as a Function of Input Frequency Copyright © 2010–2011, Texas Instruments Incorporated CD40109B-Q1 SCHS380 A – JUNE 2010 – REVISED AUGUST 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 11. Output Enable Delay Times Test Circuit and Waveforms Figure 12. Quiescent Device Current Test Circuit Figure 13. Input Voltage Test Circuit Figure 14. Input Current Test Circuit Figure 15. Dynamic Power Dissipation Test Circuit Copyright © 2010–2011, Texas Instruments Incorporated 7 CD40109B-Q1 SCHS380 A – JUNE 2010 – REVISED AUGUST 2011 Note: www.ti.com Dimensions in parentheses are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10–3 inch). Figure 16. Dimensions and Pad Layout 8 Copyright © 2010–2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2012 PACKAGING INFORMATION Orderable Device CD40109BQNSRQ1 Status (1) ACTIVE Package Type Package Drawing SO NS Pins Package Qty 16 2000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD40109B-Q1 : • Catalog: CD40109B • Military: CD40109B-MIL NOTE: Qualified Version Definitions: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2012 • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD40109BQNSRQ1 Package Package Pins Type Drawing SO NS 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 8.2 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.5 2.5 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD40109BQNSRQ1 SO NS 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated