TI CC3000MOD

CC3000MOD
www.ti.com
SWRS126 – NOVEMBER 2012
TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor
FEATURES
1
• Wireless network processor
– IEEE 802.11 b/g
– Embedded IPv4 TCP/IP stack
• Best-in-class radio performance Wi-Fi™
– TX power: +18.0 dBm at 11 Mbps, CCK
– RX sensitivity: –88 dBm, 8% PER, 11 Mbps
• Works with low MIPS and low-cost MCUs with
compact memory footprint
• FCC, IC, and CE certified with a chip antenna
• HW design files and design guide available
from TI
• Integrated crystal and power management
• Small form factor: 16.3 mm × 13.5 mm × 2 mm
234
•
•
•
Operating temperature: –20°C to 70°C
Based on TI's seventh generation of proven
Wi-Fi solutions
Complete platform solution including user and
porting guides, API guide, sample
applications, and support community
APPLICATIONS
•
•
•
•
•
Home automation
Home security
Connected appliances
Smart energy
M2M communication
DESCRIPTION
The TI CC3000 module is a self-contained wireless network processor that simplifies the implementation of
Internet connectivity (see Figure 1). TI's SimpleLink™ Wi-Fi solution minimizes the software requirements of the
host microcontroller (MCU) and is thus the ideal solution for embedded applications using any low-cost and lowpower MCU.
The TI CC3000 module reduces development time, lowers manufacturing costs, saves board space, eases
certification, and minimizes the RF expertise required. This complete platform solution includes software drivers,
sample applications, API guide, user documentation, and a world-class support community.
For more information on TI’s wireless platform solutions for Wi-Fi, go to TI's Wireless Connectivity wiki
(www.ti.com/connectivitywiki).
SWRS126-013
Figure 1. Wi-Fi Solution for TI SimpleLink CC3000 Module
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SimpleLink, Smart Config are trademarks of Texas Instruments.
Wi-Fi is a trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
CC3000MOD
SWRS126 – NOVEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FEATURES
WLAN
•
•
•
•
•
802.11b/g integrated radio, modem, and MAC supporting WLAN communication as a BSS station with CCK
and OFDM rates from 1 to 54 Mbps in the 2.4-GHz ISM band
Auto-calibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna without
requiring expertise in radio circuit design.
Advanced connection manager with seven user-configurable profiles stored in an NVMEM allows automatic
fast connection to an access point without user or host intervention.
Supports all Wi-Fi security modes for personal networks: WEP, WPA, and WPA2 with on-chip security
accelerators
Smart Config™ WLAN provisioning tools allow customers to connect a headless device to a WLAN network
using a smart phone, tablet, or PC.
Network Stack
• Integrated IPv4 TCP/IP stack with BSD socket APIs enables simple internet connectivity with any
microcontroller, microprocessor, or ASIC.
• Supports four simultaneous TCP or UDP sockets
• Built-in network protocols: ARP, ICMP, DHCP client, and DNS client enable easy connection to the local
network and to the Internet.
Host Interface and Driver
• Interfaces over 4-wire serial peripheral interface (SPI) with any microcontroller, or processor at clock speed
up to16 MHz
• Low footprint driver provided for TI MCUs and easily ported to any processor or ASIC
• Simple APIs enable easy integration with any single-threaded or multi-threaded application.
System
• Works from a single, preregulated power supply or connects directly to a battery
• Separated I/O voltage rail allows flexible integration with host processors
• Ultra-low leakage shut-down mode with current <5 µA
• Integrated clock sources
EEPROM
• Integrated EEPROM stores firmware patch, network configuration, and MAC address.
• Programmable through an I2C interface or over APIs from the host, allowing over-the-air firmware upgrades
• Can store 5 KB of user data accessible to the host application, enhancing the MCU NVM
2
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CC3000MOD
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SWRS126 – NOVEMBER 2012
PACKAGE INFORMATION
Module Outline
For the PCB layout of your applications, TI recommends the footprint shown in Figure 2.
13.5000
Unit: mm
0.5000
0.7000
36
43
1.2000
2.1000
29
46
PIN-1
28
1.9000
1.9000
37
40
38
41
39
42
0.3000
1.7000
16.3000
1.9000
2.4000
1.9000
1.9000
19
10
2.1000
1.2000
44
45
18
11
0.7000
1.2000
SWRS126-002
Figure 2. CC3000 Module Footprint and Pinouts
Pin Description
Table 1 describes the CC3000 module pins.
Table 1. CC3000 Module Pins Description
Pin
Signal Name
Type
State at
Reset
State After
Reset
1
GND
GND
—
—
—
2
Reserved_1
—
—
—
1.8 V
3
NC
—
—
—
—
4
Reserved_2
—
—
—
1.8 V
5
WL_EN2 (1)
I
Hi-Z
—
—
O
Hi-Z
Force 1
1.8 V
I
Hi-Z
—
—
I
Hi-Z
PU
1.8 V
6
7
8
(1)
(2)
WL_RS232_TX
(2)
WL_EN1
WL_RS232_RX
(2)
Voltage Level
Description
Ground
Reserved. Connect to test point.
Not connected
Reserved. Connect to test point.
Mode setting
RS232 test-mode signal (1.8-V logic).
Connect to test point. Serial connection
for CC3000 radio tool.
Mode setting
RS232 test-mode signal (1.8-V logic).
Connect to test point. Serial connection
for CC3000 radio tool.
9
GND
GND
—
—
—
Ground
10
GND
GND
—
—
—
Ground
11
GND
GND
—
—
—
Ground
12
SPI_CS
I
Hi-Z
PU
VIO_HOST
Host interface SPI chip-select (CS)
13
SPI_DOUT
O
Hi-Z
PU
VIO_HOST
Host interface SPI data out
14
SPI_IRQ
O
Hi-Z
Force 1
VIO_HOST
Host interface SPI interrupt
Connect WL_EN1 to WL_EL2 for proper operation of the module.
Leave unconnected in function module.
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Table 1. CC3000 Module Pins Description (continued)
(3)
(4)
4
Pin
Signal Name
Type
State at
Reset
State After
Reset
Voltage Level
15
16
SPI_DIN
I
Hi-Z
PU
VIO_HOST
GND
GND
—
—
—
17
SPI_CLK
I
Hi-Z
PD
VIO_HOST
Description
Host interface SPI data in
Ground
Host interface SPI clock
18
GND
GND
—
—
—
19
VBAT_IN
Power
—
—
VBAT
20
GND
GND
—
—
—
Ground
21
EXT_32K
—
—
—
—
Not used. Connect to ground.
22
GND
GND
—
—
—
Ground
23
VIO_HOST
Power
—
—
VIO_HOST
24
Reserved 3
—
—
—
—
Reserved. Connect to test point.
25
GND
GND
—
—
—
Ground
26
VBAT_SW_EN
I
—
—
VIO_HOST
27
SDA_EEPROM (3)
I/O
1.8 V
I2C data line from EEPROM
(3)
Ground
Power supply input, 2.7 to 4.8 V
VIO host supply voltage
Module enable. Connect to host GPIO.
28
SDA_CC3000
I/O
1.8 V
I2C data line from the CC3000 module
29
SCL_EEPROM (4)
I/O
1.8 V
I2C clock line from EEPROM
30
SCL_CC3000 (4)
I/O
1.8 V
I2C clock line from the CC3000
module
31
GND
GND
—
—
—
Ground
32
GND
GND
—
—
—
Ground
33
GND
GND
—
—
—
Ground
34
GND
GND
—
—
—
Ground
35
RF_ANT
RF
—
—
—
WLAN antenna port, 50-Ω single
36
GND
GND
—
—
—
Ground
37
GND
GND
—
—
—
Ground
38
GND
GND
—
—
—
Ground
39
GND
GND
—
—
—
Ground
40
GND
GND
—
—
—
Ground
41
GND
GND
—
—
—
Ground
42
GND
GND
—
—
—
Ground
43
GND
GND
—
—
—
Ground
44
GND
GND
—
—
—
Ground
45
GND
GND
—
—
—
Ground
46
GND
GND
—
—
—
Ground
Connect SDA_EEPROM and SDA_CC3000 through a 0-Ω resistor.
Connect SLC_EEPROM and SLC_CC3000 through a 0-Ω resistor.
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CC3000MOD
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SWRS126 – NOVEMBER 2012
ESD PERFORMANCE
Because electrostatic discharge (ESD) can damage this integrated circuit, TI recommends handling all integrated
circuits (ICs) with appropriate precautions. Failure to observe proper handling and installation procedures can
cause damage. ESD damage can range from subtle performance degradation to complete device failure.
Precision ICs can be more susceptible to damage because very small parametric changes can cause devices
not to meet their published specifications.
Table 2 describes the ESD performance.
Table 2. ESD Performance
HDM
(1)
CDM (2)
1000 V
(1)
(2)
500 V
JEDEC ESD HBM spec JS-001-2012
JEDEC ESD CDM spec 22C101E
space
MODULE SPECIFICATIONS
Absolute Maximum Ratings
Parameters
VBAT_IN
VIO_HOST
Pin
Min
Max
Unit
19
–0.5
+6.0
V
23
–0.5
+4.6
V
I2C and WL_RS232
27, 28, 29, 30, 6, 8
–0.5
+2.1
V
SPI interface
12, 13, 14, 15, 17
–0.5
+4.6
V
VBAT_SW_EN
26
–0.3
+6.0
V
Storage temperature range
–
–40
+85
°C
Recommended Operating Conditions
Min
Max
Unit
Operating ambient
temperature
Rating
Condition
Sym
–20
+70
°C
VBAT_IN
2.7
4.8
V
VIO_HOST supply voltage
1.8
3.6
V
SPI interface
High-level input voltage
VIO_HOST =
1.8 to 1.95 V
VIH
1.95 to 2.7 V
VIO_HOST =
1.8 to 1.95 V
2
VIL
VIO_HOST × 0.35
1.95 to 2.7 V
Output voltage
Active state
Input transition rise or fall
rate
V
0.7
2.7 to 3.6 V
Input voltage
V
1.6
2.7 to 3.6 V
Low-level input voltage
VIO_HOST x 0.65
0.8
VI
0
3.6
VO
0
VIO_HOST
V
5
ns/V
△t/△v
V
VBAT SW EN
High-level input voltage
VIH
1.1
5.5
V
Low-level input voltage
VIL
0
0.4
V
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Power Consumption
Parameters
Typ
Max
Unit
802.11b TX current
VBAT = 3.6 V
Tamb = +25°C
Po = 18 dBm, 11 Mbps
L = 2048 bytes
tdelay (idle) = 40 µs
260
275
mA
802.11g TX current
VBAT = 3.6 V
Tamb = +25°C
Po = 14 dBm, 54 Mbps
L = 2048
tdelay (idle) = 40 µs
190
207
mA
VBAT = 3.6 V
92
103
mA
5
µA
802.11bg RX current
Shut-down mode
Test Conditions
VBAT = 3.6 V
VBAT_SW_EN = 0 V
WLAN Transmitter RF Characteristics
(TA = +25°C, VBAT = 3.6 V)
Characteristics
Condition
(Mbps)
Maximum RMS
output power
Min
Typ
1
18.3
2
18.2
11
18.1
6
17.0
9
17.0
18
17.0
36
15.5
54
14.0
Max
Unit
dBm
In-band power
variation
±1
Transmit center
frequency accuracy
±20
ppm
Max
Unit
Receiver RF Characteristics
(TA = +25°C, VBAT = 3.6 V)
Characteristics
Sensitivity
Maximum input level
6
Condition
(Mbps)
Min
Typ
1 DSSS
–97.5
2 DSSS
–95.0
11 CCK
–89.0
6 OFDM
–91.0
9 OFDM
–91.0
18 OFDM
–87.0
36 OFDM
–81.0
54 OFDM
–75.0
dBm
802.11b
–10
802.11g
–20
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dBm
Copyright © 2012, Texas Instruments Incorporated
CC3000MOD
www.ti.com
SWRS126 – NOVEMBER 2012
SPI HOST CONTROLLER INTERFACE
The SPI is the primary host interface to the CC3000 module.
The SPI interface contains the five-line, master and slave communication model shown in Figure 3.
SPI_CLK
SPI_CS
SPI_IRQ
SPI_DOUT
MCU SPI
master
CC3000
SPI slave
SPI_DIN
SWRS126-016
Figure 3. SPI Host Connectivity
Table 3 highlights the CC3000 SPI pin names and functions.
Table 3. SPI Line Description
Pin Name
Description
SPI_CLK
Clock (0 to 16 MHz) from host to slave
SPI_CS (1)
CS (active low) signal from host to slave
SPI_DIN
(1)
(2)
Data from host to slave
SPI_IRQ (2)
Interrupt from slave to host
SPI_DOUT
Data from slave to host
SPI_CS selects a CC3000 module, indicating that a master wants to communicate to the device.
SPI_IRQ is a dual-purpose slave to the master direction line: in SPI IDLE state while no data transfer is active, driving SPI_IRQ low
indicates to the master that the CC3000 module has data to pass to it; driving SPI_IRQ low following SPI_CS deassertion indicates that
the CC3000 module is ready to receive data.
SPI Timing
Figure 4 shows the SPI timing sequence.
Tclk
Tp
Host launch
CC3000 capture
CC3000 launch
Host capture
SPI_CLK
(at device die)
tis
tin
SPI_DIN
(data from host to device)
toh
tos
SPI_DOUT
(data from device to host)
SWRS126-004
Figure 4. SPI Timing Sequence
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Table 4 lists the SPI timing parameters.
Table 4. SPI Timing Parameters
Symbol
(1)
(2)
(3)
8
Parameter
(1) (2)
Min
Tclk
Clock period
62.5
Tp
High pulse width
(including jitter and duty
cycle)
25 (3)
tis
RX setup time; minimum
time in which data is
stable before capture
edge
5
tih
RX hold time; minimum
time in which data is
stable after capture edge
5
tos
TX setup propagation
time; maximum time from
launch edge until data is
stable
toh
TX hold propagation time;
minimum time of data
stable after launch edge
CL
Capacitive load on
interface
Max
Unit
ns
37.5 (3)
ns
ns
10.2
3
20
pF
The SPI_CS signal is considered to be asynchronous.
In this example, launch is on the rising edge, and capture is on the falling edge. The opposite scheme can be configured.
40% to 60% DC (valid for the minimum clock period)
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CC3000MOD
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SWRS126 – NOVEMBER 2012
POWER-UP SEQUENCE
Figure 5 demonstrates the wake-up sequence of the CC3000 module.
VBAT_IN
VIO_HOST
VBAT_SW_EN
SPI_IRQ
SPI_CS
T0
T1
T2
SWRS126-005
Figure 5. CC3000 Module Power-On Sequences
•
•
•
NOTE
VBAT_IN and VIO_HOST must be available before VBAT_SW_EN is asserted.
At wake-up time (T1): The CC3000 module powers up after SPI_IRQ changes state to
LOW. T1 is approximately 53 ms.
At T2: The normal master SPI write sequence is SPI_CS low, followed by SPI_IRQ low
(CC3000 host), indicating that the CC3000 core module is ready to accept data. T2
duration is approximately 7 ms.
CC3000 Enable Pins Configuration
Table 5 describes the CC3000 mode of operation based on the enable (EN) pins setting.
Table 5. CC3000 EN Pins Configuration
Mode
Test mode (1)
Functional mode (2)
(1)
(2)
State
WL_EN1: Leave disconnected.
WL_EN2: Connect to ground.
WL_EN1 and WL_EN2 are shorted together.
For CC3000 radio tool operation
For normal operation
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Test Mode Serial Interface
The CC3000 module contains a dedicated WLAN serial interface to connect to the CC3000 radio tests tool, an
external PC-based software test utility, during development and evaluation phase (see Figure 6 and Table 6).
The CC3000 radio test tool utility can be obtained from the CC3000 TI wiki (www.ti.com/connectivitywiki).
CC3000
USB cable
USB to serial
bridge
PC
1.8 V
WL_RS232_TX
WL_EN2
WL_RS232_RX
SWRS126-017
Figure 6. CC3000 Test Mode Serial Interface Connection
Table 6. CC3000 Test Mode Debug Interface Description
Signal Name
WL_RS232_TX
WL_RS232_RX
(1)
Function
Connection with CC3000 radio PC-based software (1)
WL_EN2 pins must be grounded while bringing up the CC3000 radio tool.
SURFACE MOUNT INFORMATION
The CC3000 module uses a flat shield cover designed for a fully automated assembly process. For baking and
reflow recommendations, follow MSL level 4 found in the JEDEC/IPC Standard J-STD-20b. The classification
temperature (TC) for the module is 250°C.
MECHANICAL INFORMATION
Module Mechanical Outline
Figure 7 shows the mechanical outline for the CC3000 module.
13.50
2.00
16.30
TOP VIEW
16.30
SIDE VIEW
CC3000MOD
Module Size: 16.3 x 13.5 x 2.0 mm
SWRS126-007
Figure 7. CC3000 Module Mechanical Outline
10
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CC3000MOD
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SWRS126 – NOVEMBER 2012
Package Marking
Figure 8 shows the CC3000 module package marking.
CC3000MOD
YYWWSSF
6.0 mm
SWRS126-008
Figure 8. CC3000 Module Package Marking
Table 7 defines the marking code.
Table 7. Package Marking Definitions
Code
Definition
YYWWSSF
Date
YY
Year (for example, 2012 = 12)
WW
Week (01 through 53)
SS
Serial number from 01 to 99 to match manufacturer lot number
F
Reserved for internal use
Ordering Information
Table 8 lists the CC3000 module part numbers.
Table 8. CC3000 Module Part Numbers
Order Number
CC3000MOD
CC3000MODR
Copyright © 2012, Texas Instruments Incorporated
Description
CC3000 module, 44 modules per tray
CC3000 module reel, 1200 modules per reel
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REFERENCE SCHEMATICS AND BILL OF MATERIALS
Figure 9 shows the schematics for the CC3000 to host reference design.
ANT1
AT8010-E2R9HAA
8.0x1.0x1.0mm
1
C1
2.2pF
CAP1005
2
L1
NL
IND1005
The value of antenna matching components
are match for CC3000MOD EM board
L2
2.2nH
IND1005
TI CC3000MOD Module Reference Design
C2
10pF
CAP1005
46
45
44
43
42
41
30
31
32
33
29
SCL_EEPROM
SCL_CC3000
GND
GND
34
26
GND
25
U1
5
WL_EN2
6
WL_RS232_TX
CC3000MOD
RESERVED_3
24
VIO_HOST
23
GND
22
WL_EN1
21
GND
20
10
GND
VBAT_IN
19
R2
0R
RES1005
Internal Power FET Switch Enable.
Connect to Host GPIO.
VBAT_SW_EN
TP3
VIO_HOST
VIO_HOST =
level of the Host Interface.
Voltage
C4
1uF
CAP1005
VBAT_IN
VBAT_IN: 2.7V~4.8V => 3.6V TYP
GND
GND
GND
GND
37
38
39
40
GND
C5
1uF
CAP1005
18
17
11
SPI_CLK
EXT_32K
GND
GND
WL_RS232_RX
9
GND
8
16
TP5
GND
VBAT_SW_EN
RESERVED_2
7
TP4 and TP5 CC3000 Radio Tool Connection 1.8V.
35
NC
4
SPI_DIN
TP4
3
15
R5
0R
RES1005
SDA_EEPROM
SPI_IRQ
0R NC
RESERVED_1
27
SPI_DOUT
NC 0R
Test Mode
for Radio Tool Operation
TP2
28
GND
14
Function mode
R4
NL
RES1005
GND
36
R5
SDA_CC3000
2
SPI_CS
R4
RF_ANT
GND
1
TP1
Mode
R1
0R
RES1005
NL_10pF
CAP1005
13
C3
12
2
1
3
J1
NL_U.FL-R-SMT(10)
U.FL
GND
GND
GND
GND
GND
GND
Optional for conductive measurment
WL_SPI_CLK_HOST
WL_SPI_DIN_HOST
WL_SPI_IRQ_HOST
WL_SPI_DOUT_HOST
WL_SPI_CS_HOST
Connect to Host SPI Interface.
SWRS126-009
Figure 9. CC3000 Module to Host Reference Design
NOTE
For flexibility, VIO_HOST supports both cases in which the VBAT and VIO voltages of the
MCU can be the same or different.
Table 9 lists the bill of materials.
Table 9. Bill of Materials
Part Reference
ANT1
C1
C0402, 2.2 pF
Manufacturer PN
ACX
AT8010-E2R9HAA
Walsin
0402N2R2C500LT
Hl1005-1C2N2SMT
L2
L0402, 2.2 nH
ACX
C0402, 10 pF
Walsin
0402N100J500LT
C4, C5 (1)
C0402, 1 µF
Murata
GRM155R60J105KE19D
R0402, 0R
Walsin
WR04X000PTL
RF coaxial U.FL, SMD
Hirose
U.FL-R-SMT-1(10)
J1
12
Manufacturer
C2 (1)
R1, R2, R5 (1)
(1)
Description
2.4-GHz chip antenna, 8.0 × 1.0 mm
Any component with similar values can be used.
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CC3000MOD
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SWRS126 – NOVEMBER 2012
DESIGN RECOMMENDATIONS
This section describes the layout recommendations for the CC3000 module, RF trace, and antenna.
Antenna
The ACX ceramic antenna is mounted on the CC3000 EVM board with a specific layout and matching circuit for
the radiation test conducted in FCC, CE and IC certifications. Figure 10 shows the location of the antenna on the
EVM board as well as the RF trace routing from the CC3000 module.
No trace and
Via stitching
beside RF
trace
ground under
Antenna on
antenna section
the edge
of PCB
Top layer
Bottom layer
Constant
No sharp
impedance for
corner
RF trace
SWRS126-015
Figure 10. RF Trace and Antenna Design for PCB Layout
Module Layout Recommendations
Observe the following module layout recommendations (see also Figure 11):
• Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.
• Do not run signal traces underneath the module on a layer where the module is mounted.
• Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting
layer.
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Signal trace
Solid ground
plane and vias
run on third layer
No trace
under
module
Top layer
Bottom layer
SWRS126-014
Figure 11. Module Layout
RF Trace and Antenna Layout Recommendations
Observe the following recommendations for RF trace and antenna layout (see also Figure 10):
• RF traces must have 50-Ω impedance (microstrip transmission line).
• RF trace bends must be gradual with a maximum bend of approximately 45 degrees and with trace mitered.
RF traces must not have sharp corners.
• There must be no traces or ground under the antenna section.
• RF traces must have via stitching on the ground plane beside the RF trace on both sides.
• RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the
PCB product in consideration of the product enclosure material and proximity.
14
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Copyright © 2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
13-Feb-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CC3000MOD
ACTIVE
46
84
TBD
Call TI
Call TI
-20 to 70
CC3000MODR
ACTIVE
46
1
TBD
Call TI
Call TI
-20 to 70
XCC3000MOD
PREVIEW
46
TBD
Call TI
Call TI
-20 to 70
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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