bq27411-G1 www.ti.com SLUSBN7 – JANUARY 2014 Single Cell Li-Ion Battery Fuel Gauge for Battery Pack Integration Check for Samples: bq27411-G1 FEATURES APPLICATIONS • • • • • 1 2 • • Single Series Cell Li-Ion Battery Fuel Gauge – Resides in Battery Pack – Low-Value external Sense Resistor (10mΩ typical) – One Time Programmable (OTP) configuration Non-Volatile Memory (NVM) – Powered directly from battery with integrated LDO – 400-kHz I2C serial interface – Internal temperature sensor, or Host reported temperature Easy to configure fuel gauging based on patented Impedance Track™ technology – Reports Remaining Capacity and State of Charge (SOC) with Smoothing Filter – Automatically adjusts for battery aging, self-discharge, temperature, and rate changes – Battery State of Health (aging) estimation Small 12-pin 2.5 mm × 4 mm SON Package Smartphones, Feature phones and Tablets Digital Still and Video Cameras Handheld Terminals MP3 or Multimedia Players DESCRIPTION The Texas Instruments bq27411-G1 is an easy to configure fuel gauging solution for single series cell Li-Ion battery packs. The device requires minimal configuration and uses One Time Programmable (OTP) Non-Volatile Memory (NVM) to avoid an initialization download by the system processor. The bq27411-G1 uses the patented Impedance Track™ algorithm for fuel gauging, and provides information such as remaining battery capacity (mAh), state-of-charge (%), and battery voltage (mV). The small 12-pin 2.5 mm × 4 mm SON package is ideal for space constrained applications. TYPICAL APPLICATION Battery Pack PACKP PROG bq27411 1.0 M I2C Bus SDA SDA SCL SCL Couloumb Counter Current ADC SRN Diff. Input OTP Data I-Wake CPU BAT Voltage ADC TEST Die Temp Sensor 1.0 M BAT 10 m, 1% shunt SRP 1.8V LDO VSS VDD Li-Ion Cell 0.47uF Protection IC PACKN FET FET 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Impedance Track is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2014, Texas Instruments Incorporated bq27411-G1 SLUSBN7 – JANUARY 2014 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE INFORMATION AVAILABLE OPTIONS PART NUMBER bq27411DRZR-G1A bq27411DRZT-G1A bq27411DRZR-G1B bq27411DRZT-G1B bq27411DRZR-G1C bq27411DRZT-G1C (1) (2) (3) (4) BATTERY TYPE CHEM_ID (1) LiCoO2 (4.2 V max charge) 0x0128 LiMn2O4 (4.3 V max charge) 0x0312 LiMn2O4 (4.35 V max charge) 0x0354 DM_CODE (2) FIRMWARE VERSION (3) PACKAGE (4) TA 3000 0x80 0x90 TAPE and REEL QUANTITY 250 1.09 (0x0109) 12-pin, 2.5 × 4 mm SON –40°C to 85°C 3000 250 3000 0xA0 250 Refer to the CHEM_ID subcommand to confirm the battery chemistry type. Refer to the DM_CODE subcommand to confirm the Data Memory code. Refer to the FW_VERSION subcommand to confirm the firmware version. For the most current package and ordering information see the Package Option Addendum at the end of this document; or, see the TI website at www.ti.com. THERMAL INFORMATION THERMAL METRIC (1) bq27411-G1 DRZ (12-PINS) θJA Junction-to-ambient thermal resistance 64.1 θJCtop Junction-to-case (top) thermal resistance 59.8 θJB Junction-to-board thermal resistance 52.7 ψJT Junction-to-top characterization parameter 0.3 ψJB Junction-to-board characterization parameter 28.3 θJCbot Junction-to-case (bottom) thermal resistance 2.4 (1) 2 UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 bq27411-G1 www.ti.com SLUSBN7 – JANUARY 2014 PIN DIAGRAM AND PACKAGE DIMENSIONS PIN DIAGRAM (TOP VIEW) SDA 1 12 PROG SCL 2 11 NC VSS 3 10 TEST NC 4 9 NC VDD 5 8 SRP BAT 6 7 SRN bq27411 12-pin VSON, 2.5 x 4mmm 0.4mm pitch PIN FUNCTIONS PIN NAME NO. TYPE (1) DESCRIPTION BAT 6 PI, AI LDO regulator input, battery voltage input, and coulomb counter input typically connected to the PACK+ terminal. VDD 5 PO 1.8V Regulator Output. Decouple with 0.47μF ceramic capacitor to Vss. This pin is not intended to provide power for other devices in the system. VSS 3 PI Ground pin. SRP 8 AI SRN 7 AI Coulomb counter differential inputs expecting an external 10mΩ, 1% sense resistor. Connect SRP to BAT (CELLP) and connect SRN to PACKP. Refer to application diagram. PROG 12 DO SDA 1 DIO SCL 2 DIO TEST 10 DI This digital factory TEST pin must be pulled low for proper operation in customer's application. Recommend terminating with a 1.0MΩ (typical) pull-down resistor to VSS for reduced power consumption. 4, 8, 11 -- No internal connection. May be left floating or tied to VSS. NC (1) Programming voltage input for the One Time Programmable (OTP) memory to be used during customer factory configuration. To avoid a floating input condition, recommend terminating with a 1.0MΩ (typical) pull-down resistor to VSS for reduced power consumption. Slave I2C serial bus for communication with system (Master). Open-drain pins. Use with external 5 - 10kΩ pull-up resistors (typical) for each pin. If the external pull-up resistors will be disconnected from these pins during normal operation, recommend using external 1.0MΩ pull-down resistors to VSS at each pin to avoid floating inputs. I/O = Digital input/output, IA = Analog input, P = Power connection Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 3 bq27411-G1 SLUSBN7 – JANUARY 2014 www.ti.com ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) PARAMETER VBAT VSR MIN MAX UNIT BAT pin input voltage range –0.3 6 V SRP and SRN pins input voltage range -0.3 [VBAT + 0.3] V 2 V Differential voltage across SRP and SRN. ABS(SRP - SRN). VDD VDD pin supply voltage range (LDO ouptut) –0.3 2 V VIOD Open-drain I/O pins (SDA, SCL) –0.3 6 V VPROG PROG pin –0.3 7.8 V VIOPP Push-Pull I/O pins (TEST ) –0.3 [VDD + 0.3] V TA Operating free-air temperature range –40 85 °C TSTG Storage temperature range –65 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS TA = 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted) PARAMETER CBAT CLDO18 VPU External input capacitor for internal LDO between BAT and VSS (1) (1) (1) External output capacitor for internal LDO between VDD and VSS PROG Programming Voltage [RA0] IPV PROG Programming Current [RA0] MIN Nominal capacitor values specified. Recommend a 5% ceramic X5R type capacitor located close to the device. External pull-up voltage for opendrain pins (SDA, SCL, PROG ) VPV (1) TEST CONDITIONS TYP 7.3 UNIT 0.1 μF 0.47 μF 1.62 TA = 15°C to 35°C. OTP Programming mode only. MAX 3.6 7.4 7.5 4 5 TYP MAX V V mA Specified by design. Not production tested. SUPPLY CURRENT TA = 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted) PARAMETER ICC (1) ISLP (1) IHIB (1) ISD (1) (2) 4 (1) TEST CONDITIONS MIN UNIT NORMAL mode current ILOAD > Sleep Current (2) 93 μA SLEEP mode current ILOAD < Sleep Current (2) 21 μA 9 μA 0.6 μA (2) HIBERNATE mode current ILOAD < Hibernate Current SHUTDOWN mode current Fuel gauge in host commanded SHUTDOWN mode. (LDO Regulator Output Disabled.) Specified by design. Not production tested. Wake Comparator Disabled. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 bq27411-G1 www.ti.com SLUSBN7 – JANUARY 2014 DIGITAL INPUT AND OUTPUT DC CHARACTERISTICS TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER TEST CONDITIONS VIH(OD) Input voltage, high (2) VIH(PP) Input voltage, high (3) VIL Input voltage, low VOL Output voltage, low External pullup resistor to VPU (1) (2) (3) V V V (2) 0.6 V 0.5 mA -3 mA 5 pF Output sink current, low Ilkg VPU x 0.7 UNIT 0.6 Output source current, high Input capacitance MAX (2) (3) IOL(OD) (1) TYP 1.4 IOH CIN MIN (2) (2) (2) (3) Input leakage current (2) (3) SCL, SDA, and TEST pins 0.1 PROG pin 1.0 μA Specified by design. Not production tested. Open Drain pins: (SCL, SDA, PROG ) Push Pull pin: (TEST ) LDO REGULATOR, WAKE-UP AND AUTO-SHUTDOWN DC CHARACTERISTICS TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER VBAT BAT pin regulator input VDD Regulator output voltage UVLOIT+ VBAT Under Voltage Lock Out LDO Wake-Up Rising Threshold UVLOIT- VBAT Under Voltage Lock Out LDO Auto-Shutdown Falling Threshold (1) TEST CONDITIONS MIN TYP 2.45 MAX 4.5 UNIT V 1.8 V 2 V 1.95 V Specified by design. Not production tested. ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) PARAMETER VIN(BAT) BAT pin voltage measurement range. tADC_CONV Conversion time TEST CONDITIONS Voltage divider enabled. MIN Effective Resolution (1) TYP 2.45 MAX 4.5 UNIT V 125 ms 15 bits Specified by design. Not tested in production. INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER TEST CONDITIONS MIN TYP MAX Input voltage range from BAT to SRX pins tSR_CONV Conversion time Single conversion 1 s Effective Resolution Single conversion 16 bits (1) BAT ± 25 UNIT VSR mV Specified by design. Not tested in production. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 5 bq27411-G1 SLUSBN7 – JANUARY 2014 www.ti.com I2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Standard Mode (100 kHz) 4 μs 4.7 μs 4 μs 4.7 μs 250 ns td(STA) Start to first falling edge of SCL tw(L) SCL pulse duration (low) tw(H) SCL pulse duration (high) tsu(STA) Setup for repeated start tsu(DAT) Data setup time Host drives SDA th(DAT) Data hold time Host drives SDA 0 ns tsu(STOP) Setup time for stop 4 μs t(BUF) Bus free time between stop and Includes Command Waiting Time start 66 μs tf SCL/SDA fall time tr SCL/SDA rise time fSCL Clock frequency (2) (1) 300 (1) ns 300 ns 100 kHz Fast Mode (400 kHz) td(STA) Start to first falling edge of SCL 600 ns tw(L) SCL pulse duration (low) 1300 ns tw(H) SCL pulse duration (high) 600 ns tsu(STA) Setup for repeated start 600 ns tsu(DAT) Data setup time Host drives SDA 100 ns th(DAT) Data hold time Host drives SDA 0 ns tsu(STOP) Setup time for stop 600 ns t(BUF) Bus free time between stop and Includes Command Waiting Time start 66 μs tf SCL/SDA fall time tr SCL/SDA rise time fSCL Clock frequency (2) (1) (2) (1) 300 (1) ns 300 ns 400 kHz Specified by design. Not production tested. If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at 400 kHz. (Refer to I2C INTERFACE and I2C Command Waiting Time) tSU(STA) tw(H) tf tw(L) tr t(BUF) SCL SDA td(STA) tsu(STOP) tf tr th(DAT) tsu(DAT) REPEATED START STOP START Figure 1. I2C-Compatible Interface Timing Diagrams 6 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 bq27411-G1 www.ti.com SLUSBN7 – JANUARY 2014 GENERAL DESCRIPTION The bq27411-G1 accurately predicts the battery capacity and other operational characteristics of a single Libased rechargeable cell. It can be interrogated by a system processor to provide cell information, such as stateof-charge (SOC). The bq27411-G1 is available in several options optimized for different battery cell chemistries. (See AVAILABLE OPTIONS table.) Configuration parameters unique to the customer's application are programmed in OTP memory at the customer's factory using a 7.4V typical voltage applied to the PROG pin and a set of I2C programming commands. More details are available in the SmartFlash OTP Programming (SLUA703) document. Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command( ), are used to read and write information contained within the bq27411-G1 control and status registers, as well as its data locations. The key to the bq27411-G1’s high-accuracy gas gauging prediction is Texas Instrument’s proprietary Impedance Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-ofcharge predictions that can achieve high accuracy across a wide variety of operating conditions and over the lifetime of the battery. The bq27411-G1 measures charge/discharge activity by monitoring the voltage across a small-value sense resistor. When a cell is attached to the bq27411-G1, cell impedance is computed, based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions. The bq27411-G1 uses an integrated temperature sensor for estimating cell temperature. Alternatively, the host processor can provide temperature data for the bq27411-G1. To minimize power consumption, the bq27411-G1 has several power modes: INITIALIZATION, NORMAL, SLEEP, and HIBERNATE. The bq27411-G1 passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. More details are found in the bq27411-G1 Technical Reference Manual (SLUUAS7). NOTE Formatting Conventions in this Document: Commands: italics with parentheses( ) and no breaking spaces, for example, RemainingCapacity( ). Data Flash: italics, bold, and breaking spaces, for example, Design Capacity. Register bits and flags: italics with brackets [ ], for example, [TDA] Data flash bits: italics, bold, and brackets [ ], for example, [LED1] Modes and states: ALL CAPITALS, for example, UNSEALED mode. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 7 bq27411-G1 SLUSBN7 – JANUARY 2014 www.ti.com DATA COMMANDS STANDARD DATA COMMANDS The bq27411-G1 uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in . Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data. Additional details are found in the bq27411-G1 Technical Reference Manual (SLUUAS7). Table 1. Standard Commands NAME COMMAND CODE SEALED ACCESS Control( ) CNTL 0x00 / 0x01 N/A R/W Temperature( ) TEMP 0x02 / 0x03 0.1°K R/W VOLT 0x04 / 0x05 mV R FLAGS 0x06 / 0x07 N/A R NominalAvailableCapacity( ) 0x08 / 0x09 mAh R FullAvailableCapacity( ) 0x0a / 0x0b mAh R Voltage( ) Flags( ) RemainingCapacity( ) RM 0x0c / 0x0d mAh R FullChargeCapacity( ) FCC 0x0e / 0x0f mAh R AverageCurrent( ) 0x10 / 0x11 mA R StandbyCurrent( ) 0x12 / 0x13 mA R MaxLoadCurrent( ) 0x14 / 0x15 mA R AveragePower( ) 0x18 / 0x19 mW R 0x1c / 0x1d % R 0x1e / 0x1f 0.1°K R 0x20 / 0x21 num / % R StateOfCharge( ) SOC IntTemperature( ) StateOfHealth( ) 8 UNITS SOH Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 bq27411-G1 www.ti.com SLUSBN7 – JANUARY 2014 Control( ): 0x00/0x01 Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control( ) command allows the system to control specific features of the bq27411-G1 during normal operation and additional features when the device is in different access modes, as described in . Additional details are found in the bq27411-G1 Technical Reference Manual (SLUUAS7). Table 2. Control( ) Subcommands CNTL FUNCTION CNTL DATA SEALED ACCESS CONTROL_STATUS 0x0000 Yes DESCRIPTION Reports the status of device. DEVICE_TYPE 0x0001 Yes Reports the device type (0x0421). FW_VERSION 0x0002 Yes Reports the firmware version of the device. DM_CODE 0x0004 Yes Reports the Data Memory Code number stored in NVM. PREV_MACWRITE 0x0007 Yes Returns previous MAC command code. CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track™ configuration SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1. CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0. SET_CFGUPDATE 0x0013 No Force CONTROL_STATUS [CFGUPMODE] to 1 and gauge enters CONFIG UPDATE mode. SEALED 0x0020 No Places the device in SEALED access mode. RESET 0x0041 No Performs a full device reset. SOFT_RESET 0x0042 No Gauge exits CONFIG UPDATE mode. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 9 bq27411-G1 SLUSBN7 – JANUARY 2014 www.ti.com FUNCTIONAL DESCRIPTION I2C INTERFACE The bq27411-G1 supports the standard I2C read, incremental read, quick read, one-byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively. Host generated S ADDR[6:0] 0 A Gauge generated CMD [7:0] A DATA [7:0] A P S ADDR[6:0] (a) 1-byte write S ADDR[6:0] 0 A 1 A DATA [7:0] N P (b) quick read CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] N P (c) 1- byte read S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A ... DATA [7:0] N P (d) incremental read S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A ... A P (e) incremental write (S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop). The quick read returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the bq27411-G1 or the I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data). The following command sequences are not supported: Attempt to write a read-only address (NACK after data sent by master): Attempt to read an address above 0x6B (NACK command): I2C Time Out The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the bq27411-G1 is holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power sleep mode. 10 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 bq27411-G1 www.ti.com SLUSBN7 – JANUARY 2014 I2C Command Waiting Time To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all packets addressed to the bq27411-G1. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-byte write commands for proper data flow control. The following diagram shows the standard waiting time required between issuing the control subcommand the reading the status result. For read-write standard command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host must not issue any standard command more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer. S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms N P 66ms Waiting time inserted between two 1-byte write packets for a subcommand and reading results (required for 100 kHz < fSCL £ 400 kHz) S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] A 1 A DATA [7:0] DATA [7:0] A P A 66ms DATA [7:0] Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results (acceptable for fSCL £ 100 kHz) S ADDR [6:0] DATA [7:0] 0 A A CMD [7:0] DATA [7:0] A Sr N P ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] A 66ms Waiting time inserted after incremental read I2C Clock Stretching A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short ≤ 100 µs clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes ( INITIALIZATION , NORMAL) a ≤ 4 ms clock stretching period may occur within packets addressed for the fuel gauge as the I2C interface performs normal data flow control. Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 11 bq27411-G1 SLUSBN7 – JANUARY 2014 www.ti.com REFERENCE SCHEMATIC SDA SCL Optional ESD Filter C4 R6 1M R10 100 R11 100 R7 300 R8 300 R9 1M 150pF C5 150pF PGND PGND TP1 PROG U1 2 3 4 PGND 5 6 C1 SDA SCL VSS NC bq27411 NC SRP SRN 12 11 R4 1.0M PGND 10 9 PGND 8 7 13 0.47uF TEST NC VDD BAT R5 1.0M PROG PWPD 1 PGND PGND J2 R1 J1 CELLP CELLN 1 2 0.010 1 2 C2 1.0uF SDA Note: 1% Tol. SCL 1 PACKP 2 SDA 3 SCL 4 PACKN Note: SDA & SCL require 5KOhm pull-ups provided by system PGND 12 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: bq27411-G1 PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ27411DRZ-G1A PREVIEW SON DRZ 12 TBD Call TI Call TI -40 to 85 BQ27411DRZ-G1C PREVIEW SON DRZ 12 TBD Call TI Call TI -40 to 85 BQ27411DRZR-G1A ACTIVE SON DRZ 12 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ27 411A BQ27411DRZR-G1C ACTIVE SON DRZ 12 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ27 411C BQ27411DRZT-G1A ACTIVE SON DRZ 12 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ27 411A BQ27411DRZT-G1C ACTIVE SON DRZ 12 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ27 411C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2014 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jan-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ27411DRZR-G1A SON DRZ 12 3000 330.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2 BQ27411DRZR-G1C SON DRZ 12 3000 330.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2 BQ27411DRZT-G1A SON DRZ 12 250 180.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2 BQ27411DRZT-G1C SON DRZ 12 250 180.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jan-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ27411DRZR-G1A SON DRZ 12 3000 367.0 367.0 35.0 BQ27411DRZR-G1C SON DRZ 12 3000 367.0 367.0 35.0 BQ27411DRZT-G1A SON DRZ 12 250 210.0 185.0 35.0 BQ27411DRZT-G1C SON DRZ 12 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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