PHOTO SCR OPTOCOUPLERS DESCRIPTION 4N39 4N40 The 4N39 and 4N40 have a gallium-arsenide infrared emitting diode optically coupled with a light activated silicon controlled rectifier in a dual in-line package. FEATURES • • • • 10 A, T2L compatible, solid state relay 25 W logic indicator lamp driver 400 V symmetrical transistor coupler Underwriters Laboratory (UL) recognized File #E90700 6 6 SCHEMATIC 1 1 ANODE 1 6 GATE APPLICATIONS • • • • • Low power logic circuits 6 Telecommunications equipment Portable electronics Solid state relays Interfacing coupling systems of different potentials and impedances. Parameter CATHODE 2 5 ANODE N/C 3 1 4 CATHODE Symbol Device Value Units TSTG All -55 to +150 °C *Operating Temperature TOPR All -55 to +100 °C *Lead Solder Temperature TSOL All 260 for 10 sec °C 450 mW 9.0 mW/°C TOTAL DEVICE *Storage Temperature *Total Device Power Dissipation (-55°C to 50 °C) Derate above 50°C EMITTER *Continuous Forward Current *Reverse Voltage *Forward Current - Peak (300 µs, 2% Duty Cycle) *LED Power Dissipation (-55°C to 50 °C) Derate above 50°C PD All IF All 60 mA VR All 6 V IF(pk) All PD 1.0 A 100 mW 2.0 mW/°C 4N39 200 V 4N40 400 V All DETECTOR *Off-State And Reverse Voltage *Peak Reverse Gate Voltage 6 V *Direct On-State Current 300 mA *Surge On-State Current (100 µs) 10 A *Peak Gate Current 10 mA *Detector Power Dissipation (-55°C to 50°C) Derate above 50°C PD All 400 mW 8.0 mW/°C Note * Indicates JEDEC Registered Data ** Typical values at TA = 25°C 2001 Fairchild Semiconductor Corporation DS300381 2/27/01 1 OF 8 www.fairchildsemi.com PHOTO SCR OPTOCOUPLERS 4N39 ELECTRICAL CHARACTERISTICS 4N40 (TA = 25°C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Device Min Typ** Max Unit IF = 10 mA VR = 3 V VF All 1.1 1.5 10 V µA IR All VF = 0 V, f = 1.0 MHz CJ All Peak Off-State Voltage RGK = 10 kΩ, TA=100 °C VDM Peak Reverse Voltage TA=100 °C VRM On-State Voltage IT = 300 mA VT All 1.3 V Off-State Current VDM = 200 V, TA = 100 °C, IDM 4N39 4N40 50 150 µA Reverse Current VR = 200 V, TA=100 °C, IF = 0 mA IR Holding Current VFx = 50V, RGK = 27 kΩ IH EMITTER Input Forward Voltage Reverse Leakage Current Capacitance 50 pF DETECTOR IF = 0 mA, RGK = 10 kΩ TRANSFER CHARACTERISTICS Characteristics *Input Current to Trigger *Turn-On Time (input to output) Test Conditions Symbol VAK = 100 V, RGK = 27 kΩ VAK = 50 V, IF = 30 mA RGK = 10 kΩ, RL = 200 Ω f = 1 MHz Input to Output Voltage = 0 Coupled dv/dt, input to output (figure 13) 200 4N40 400 4N39 200 4N40 400 V V 4N39 50 4N40 All 150 1.0 mA Max Units µA (TA = 25°C Unless otherwise specified.) VAK = 50 V, RGK = 10 kΩ Package Capacitance 4N39 Device Min Typ** 4N39 30 4N40 14 ton ALL 50 µA CI-O ALL 2 pF dV/dt ALL IFT 500 mA V/µS ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Typ** Max Units ( II-0 ≤ 1 µA, Vrms, t = 1 min.) (VI-O = 500 VDC) VISO 5300 Vac(rms) *Isolation Resistance RISO 1011 ! Isolation Capacitance (VI-O = ∅, f = 1 MHz) CISO *Input-Output Isolation Voltage 0.8 pf Note * Indicates JEDEC Registered Data ** Typical values at TA = 25°C www.fairchildsemi.com 2 OF 8 2/27/01 DS300381 PHOTO SCR OPTOCOUPLERS 4N39 4N40 Figure 2. Input Current To Trigger vs. Temperature Figure 1. Input Current To Trigger vs. Anode-Cathode Voltage NORMALIZED TO VAK = 50V RGK = 10K TA = 25˚C 50 10 IFT - NORMALIZED INPUT CURRENT TO TRIGGER IFT - NORMALIZED INPUT CURRENT TO TRIGGER 12 RGK = 300Ω 5 1K 1 10K .5 27K 56K .1 1 5 10 50 100 200 400 10 8 6 RGK = 300Ω 4 1K 2 10K 1 .8 .6 27K .4 56K .1 -60 VAK - ANODE TO CATHODE VOLTAGE (VOLTS) NORMALIZED TO VAK = 50V RGK = 10K TA = 25˚C .2 -40 -20 0 20 40 60 80 100 120 TA - AMBIENT TEMPERATURE (˚C) Figure 4. Input Current To Trigger vs. Pluse Width Figure 3. Input Current To Trigger Distribution vs. Temperature 100 10 IFT - NORMALIZED INPUT CURRENT TO TRIGGER 8 IFT - NORMALIZED INPUT CURRENT TO TRIGGER 6 4 2 NORMALIZED TO VAK = 50V RGK = 10K TA = 25˚C 90 TH PERCENTILE 1 .8 .6 10 TH PERCENTILE .4 NORMALIZED TO VAK = 50V RGK = 10K TA = 25˚C 40 20 RGK = 300Ω 10 8 6 1K 4 2 10K 1 .8 .6 27K .4 56K .2 .1 1 .2 2 4 6 8 10 20 40 60 100 200 400 1000 PULSE WIDTH (MICRO SECONDS) .1 -40 -20 0 20 40 60 80 Figure 6. Input Characteristics IF vs. VF 100 IF - FORWARD CURRENT (MILLIAMPERES) TA - AMBIENT TEMPERATURE (˚C) Figure 5. Turn-On Time vs. Input Current ton - TURN ON TIME (MICROSECONDS) 24 22 20 18 16 14 VAK = 50V ton = td + Ir tr ≈ 1µS RGK = 1K 12 10 10K 8 6 56K 4 1000 100 10 1 0 .01 2 10 20 30 40 50 60 70 80 90 100 .001 0.5 1.0 2.0 3.0 IF - INPUT CURRENT (MILLIAMPERES) VAK - FORWARD VOLTAGE (VOLTS) DS300381 2/27/01 3 OF 8 www.fairchildsemi.com PHOTO SCR OPTOCOUPLERS Figure 7. Holding Current vs. Temperature IM - HOLDING CURRENT (MICROAMPERES) IFT - NORMALIZED INPUT CURRENT TO TRIGGER 10,000 5,000 RGK = 300Ω 1000 1K 500 10K 100 27K 50 56K VAK = 50V 10 -40 -20 0 20 40 60 80 TRANSIENT THERMAL IMPEDANCE (˚C PER WATT) 4N39 4N40 Figure 8. Maximum Transient Thermal Impedance 1000 NOTE: (1) LEAD TEMPERATURE MEASURED AT THE WIDEST PORTION OF THE SCR ANODE LEAD (2) AMBIENT TEMPERATURE MEASURED AT A POINT 1/2" FROM THE DEVICE 600 400 200 JUNCTION TO AMBIENT 100 60 40 20 JUNCTION TO LEAD 10 6 4 2 1 .0001 .0004 .001 .002 .004 .01 .0002 100 .02 .04 1 2 4 10 20 40 100 TIME (SECONDS) TA - AMBIENT TEMPERATURE (˚C) Figure 9. Off-State Forward Current vs. Temperature Figure 10. On-State Current vs. Maximum Allowable Temperature 100 10,000 MAXIMUM ALLOWABLE TEMPERATURE (˚C) ID - NORMALIZED FORWARD CURRENT (OFF STATE) 5000 NORMALIZED TO VAK +50V TA +25˚C 1000 500 100 50 400V 10 50V 90 80 70 60 50 ANODE LEAD TEMP DC CURRENT 40 30 AMBIENT TEMP HALF-SINE WAVE AVGERAGE 20 10 AMBIENT TEMP DC CURRENT 5 0.2 ANODE LEAD TEMP 1/2 SINE WAVE AVERAGE 0.4 0.6 08 10 ON-STATE CURRENT (AMPERES) 1 0 25 50 75 100 TA - AMBIENT TEMPERATURE (˚C) Figure 12. On-State Characteristics 2 1000 1 .8 .6 500 IT - ON-STATE CURRENT (AMPERES) dV/dI - CRITICAL RATE OF RISE APPLIED FORWARD VOLTAGE ( Volt/µ sec) Figure 11. dv/dt vs. Temperature 100 RGK = 300Ω 50 1K 10 5 .4 .2 .01 .08 .06 JUNCTION TEMPERATURE = 25˚C .04 JUNCTION TEMPERATURE = 100˚C .-2 .01 1.0 10K .5 INCREASES TO FORWARD BREAKOVER VOLTAGE 27K 0 10 20 30 40 56K VT - ON-STATE VOLTAGE (VOLTS) 25 50 75 100 TA - AMBIENT TEMPERATURE (˚C) www.fairchildsemi.com 4 OF 8 2/27/01 DS300381 PHOTO SCR OPTOCOUPLERS 4N39 4N40 +100 V AC Vp = 800 Volts tp = .010 Seconds f = 25 Hertz TA = 25 °C 100 Ω DUT + H Vp Vp .63 Vp 10 KΩ dV / dt tp EXPONENTIAL RAMP GEN. OSCILLOSCOPE Fig. 13 Coupled dv/dt - Test Circuit TYPICAL APPLICATIONS 10A, T2L COMPATIBLE, SOLID STATE RELAY Use of the 4N40 for high sensitivity, 5300 V isolation capability, provides this highly reliable solid state relay design. This design is compatible with 74, 74S and 74H series T2L logic systems inputs and 220V AC loads up to 10A. LOAD 47 Ω 470 Ω 100 Ω +5V "CONTACT" 220 V AC 4N40 "COIL" SC1460 0.1 µF 56K 47 Ω IN5060 (4) INDICATER LAMP 25W, LOGIC INDICATOR LAMP DRIVER The high surge capability and non-reactive input characteristics of the 4N40 allow it to directly couple, without buffers, T2L and DTL logic to indicator alarm devices, without danger of introducing noise and logic glitches. 470 Ω +5V 4N40 100 Ω LOGIC INPUT 220 V AC 56K 0.1 µF 400V SYMMETRICAL TRANSISTOR COUPLER Use of the high voltage PNP portion of the 4N40 provides a 400V transistor capable of conducting positive and negative signals with current transfer ratios of over 1%. This function is useful in remote instrumentation, high voltage power supplies and test equipment. Care should be taken not to exceed the 40mW power dissipation rating when used at high voltages. DS300381 2/27/01 5 OF 8 4N40 INPUT OUTPUT www.fairchildsemi.com PHOTO SCR OPTOCOUPLERS 4N39 Package Dimensions (Through Hole) 4N40 Package Dimensions (Surface Mount) PIN 1 ID. 0.350 (8.89) 0.330 (8.38) 0.270 (6.86) 0.240 (6.10) 3 2 PIN 1 ID. 1 SEATING PLANE 0.270 (6.86) 0.240 (6.10) 0.350 (8.89) 0.330 (8.38) 5 4 0.070 (1.78) 0.045 (1.14) 6 0.300 (7.62) TYP 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.135 (3.43) 0.200 (5.08) 0.165 (4.18) 0.016 (0.41) 0.008 (0.20) 0.020 (0.51) MIN 0.154 (3.90) 0.100 (2.54) 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0° to 15° 0.020 (0.51) MIN 0.022 (0.56) 0.016 (0.41) 0.300 (7.62) TYP 0.100 (2.54) TYP 0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX 0.100 (2.54) TYP Lead Coplanarity : 0.004 (0.10) MAX Package Dimensions (0.4”Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.270 (6.86) 0.240 (6.10) 0.060 (1.52) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.415 (10.54) 0.070 (1.78) 0.045 (1.14) 0.100 (2.54) 0.295 (7.49) 0.200 (5.08) 0.135 (3.43) 0.154 (3.90) 0.100 (2.54) 0.004 (0.10) MIN 0.030 (0.76) 0.016 (0.40) 0.008 (0.20) 0° to 15° 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.400 (10.16) TYP NOTE All dimensions are in inches (millimeters) www.fairchildsemi.com 6 OF 8 2/27/01 DS30381 PHOTO SCR OPTOCOUPLERS 4N39 4N40 ORDERING INFORMATION Order Entry Identifier Option Description S .S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W .W 0.4” Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4” Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape & Reel Carrier Tape Specifications (“D” Taping Orientation) 12.0 ± 0.1 4.85 ± 0.20 4.0 ± 0.1 0.30 ± 0.05 4.0 ± 0.1 Ø1.55 ± 0.05 1.75 ± 0.10 7.5 ± 0.1 16.0 ± 0.3 13.2 ± 0.2 9.55 ± 0.20 0.1 MAX 10.30 ± 0.20 Ø1.6 ± 0.1 User Direction of Feed NOTE All dimensions are millimeters DS300381 2/27/01 7 OF 8 www.fairchildsemi.com PHOTO SCR OPTOCOUPLERS 4N39 4N40 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in a significant injury of the user. www.fairchildsemi.com 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 8 OF 8 2/27/01 DS30381