IRF IRLL2705

PD- 91380B
IRLL2705
HEXFET® Power MOSFET
Surface Mount
Dynamic dv/dt Rating
l Logic-Level Gate Drive
l Fast Switching
l Ease of Paralleling
l Advanced Process Technology
l Ultra Low On-Resistance
Description
l
D
l
VDSS = 55V
RDS(on) = 0.04Ω
G
ID = 3.8A
S
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The SOT-223 package is designed for surface-mount
using vapor phase, infra red, or wave soldering techniques.
Its unique package design allows for easy automatic pickand-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application
S O T -22 3
Absolute Maximum Ratings
Parameter
ID @ TA = 25°C
ID @ TA = 25°C
ID @ TA = 70°C
IDM
PD @TA = 25°C
PD @TA = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ, TSTG
Max.
Continuous Drain Current, VGS @ 10V**
Continuous Drain Current, VGS @ 10V*
Continuous Drain Current, VGS @ 10V*
Pulsed Drain Current 
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt ƒ
Junction and Storage Temperature Range
Units
5.2
3.8
3.0
30
2.1
1.0
8.3
± 16
110
3.8
0.10
7.5
-55 to + 150
A
W
W
mW/°C
V
mJ
A
mJ
V/ns
°C
Thermal Resistance
Parameter
RθJA
RθJA
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
Typ.
Max.
Units
93
48
120
60
°C/W
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
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1/22/99
IRLL2705
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
∆V(BR)DSS/∆TJ
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
V(BR)DSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Min.
55
–––
–––
–––
–––
1.0
5.1
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Typ. Max. Units
Conditions
––– –––
V
V GS = 0V, ID = 250µA
0.061 ––– V/°C Reference to 25°C, ID = 1mA
––– 0.040
VGS = 10V, ID = 3.8A „
––– 0.051
Ω
VGS = 5.0V, ID = 3.8A „
––– 0.065
VGS = 4.0V, ID = 1.9A „
––– 2.0
V
VDS = V GS, ID = 250µA
––– –––
S
V DS = 25V, ID = 1.9A
––– 25
VDS = 55V, VGS = 0V
µA
––– 250
VDS = 44V, VGS = 0V, TJ = 150°C
––– 100
VGS = 16V
nA
––– -100
VGS = -16V
32
48
ID = 3.8A
3.5 5.3
nC
VDS = 44V
9.7
14
VGS = 10V, See Fig. 6 and 9 „
6.2 –––
VDD = 28V
12 –––
ID = 3.8A
ns
35 –––
RG = 6.2Ω
22 –––
RD = 7.1Ω, See Fig. 10 „
870 –––
VGS = 0V
220 –––
pF
VDS = 25V
92 –––
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
IS
ISM
VSD
trr
Qrr
ton
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
––– ––– 0.91
showing the
A
integral reverse
––– –––
30
p-n junction diode.
––– ––– 1.3
V
TJ = 25°C, IS = 3.8A, VGS = 0V „
––– 58
88
ns
TJ = 25°C, I F = 3.8A
––– 140 210
nC
di/dt = 100A/µs „
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
‚ VDD = 25V, starting TJ = 25°C, L = 15mH
ƒ ISD ≤ 3.8A, di/dt ≤ 220A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
„ Pulse width ≤ 300µs; duty cycle ≤ 2%.
RG = 25Ω, I AS = 3.8A. (See Figure 12)
2
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IRLL2705
100
100
VGS
15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
BOTTOM 3.0V
VGS
15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
BOTTOM 3.0V
TOP
I D, D rain-to-S ource C u rrent (A)
I D , D rain-to-Source C urrent (A)
TOP
10
3 .0 V
2 0µ s P U L S E W ID T H
TJ = 25 °C
A
1
0.1
1
10
10
3 .0V
2 0µ s P U L S E W ID TH
TJ = 15 0°C
A
1
100
0.1
1
10
100
V D S , D rain-to-S ource V oltage (V )
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
2.0
R D S (on) , D ra in-to -S o urc e O n R e s is ta nc e
(N o rm alize d)
I D , D rain-to-So urce C urren t (A )
V DS , D rain-to-S ource V oltage (V )
TJ = 2 5 °C
TJ = 1 50 °C
10
V DS = 25V
2 0 µ s P UL S E W ID TH
1
3.0
3.5
4.0
4.5
V G S , G ate-to -So urce Voltag e (V)
Fig 3. Typical Transfer Characteristics
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5.0
A
I D = 3.8 A
1.5
1.0
0.5
V G S = 1 0V
0.0
-60
-40
-20
0
20
40
60
80
A
100 120 140 160
T J , J unc tion T em perature (°C )
Fig 4. Normalized On-Resistance
Vs. Temperature
3
IRLL2705
V GS
C is s
C rs s
C iss C o ss
C , Capacitance (pF)
1200
=
=
=
=
20
0V ,
f = 1M H z
C g s + C g d , Cd s S H O R T E D
C gd
C d s + C gd
V G S , G ate-to-Source V oltage (V )
1400
1000
800
C oss
600
400
C rss
200
0
10
V D S = 4 4V
V D S = 2 8V
16
12
8
4
F O R TE S T C IR C U IT
S E E F IG U R E 9
0
A
1
I D = 3.8 A
100
0
10
V D S , D rain-to-S ourc e V oltage (V )
40
A
50
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
100
100
O P E R A T IO N IN T H IS A R E A L IM ITE D
B Y R D S (o n)
10µ s
I D , D rain Current (A )
I S D , Reverse D rain C urrent (A)
30
Q G , T otal G ate C harge (nC )
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
TJ = 1 50 °C
10
TJ = 25 °C
V G S = 0V
1
0.4
0.6
0.8
1.0
1.2
V S D , S ourc e-to-D rain V oltage (V )
Fig 7. Typical Source-Drain Diode
Forward Voltage
4
20
A
1.4
10
100µ s
1m s
1
10m s
0.1
T A = 25 °C
T J = 15 0°C
S ing le P u lse
0.1
A
1
10
100
V D S , D rain-to-S ource V oltage (V )
Fig 8. Maximum Safe Operating Area
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IRLL2705
10V
VGS
QGS
RD
VDS
QG
QGD
D.U.T.
RG
+
- VDD
VG
10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
Charge
Fig 10a. Switching Time Test Circuit
Fig 9a. Basic Gate Charge Waveform
Current Regulator
Same Type as D.U.T.
VDS
90%
50KΩ
.2µF
12V
.3µF
D.U.T.
+
V
- DS
10%
VGS
VGS
td(on)
3mA
IG
tr
t d(off)
tf
ID
Current Sampling Resistors
Fig 9b. Gate Charge Test Circuit
Fig 10b. Switching Time Waveforms
Therm al R esponse (Z thJA )
1000
100
D = 0 .5 0
0 .2 0
0 .1 0
10
0 .0 5
0 .0 2
0 .0 1
1
PD M
t
0.1
0.01
0.00001
1
t2
S IN G L E P U L S E
(T H E R M A L R E S P O N S E )
N o te s:
1 . D u ty fa c to r D = t
1
/ t
2
2. P e a k TJ = P D M x Z th J A + T A
0.0001
0.001
0.01
0.1
1
10
100
1000
A
10000
t 1 , R e c ta n g u la r P u ls e D u ra tio n (s e c )
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
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IRLL2705
1 5V
L
VD S
D .U .T
RG
IA S
20V
tp
D R IV E R
+
- VD D
A
0 .01 Ω
Fig 12a. Unclamped Inductive Test Circuit
E A S , S ingle P ulse A valanche E nergy (m J)
250
TO P
B O TTO M
200
150
100
50
0
V D D = 25 V
25
V (B R )D SS
ID
1.7 A
3.0A
3 .8 A
50
A
75
100
125
150
S tarting T J , J unc tion T em perature (°C )
tp
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
IAS
Fig 12b. Unclamped Inductive Waveforms
6
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IRLL2705
Peak Diode Recovery dv/dt Test Circuit
+
D.U.T
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
ƒ
+
‚
-
-
„
+

•
•
•
•
RG
Driver Gate Drive
P.W.
+
dv/dt controlled by RG
Driver same type as D.U.T.
ISD controlled by Duty Factor "D"
D.U.T. - Device Under Test
D=
Period
-
VDD
P.W.
Period
VGS=10V
*
D.U.T. ISD Waveform
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
Re-Applied
Voltage
Body Diode
VDD
Forward Drop
Inductor Curent
Ripple ≤ 5%
ISD
* VGS = 5V for Logic Level Devices
Fig 13. For N-Channel HEXFETS
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IRLL2705
Package Outline
SOT-223 (TO-261AA) Outline
Part Marking Information
SOT-223
E X A M P L E : T H IS IS A N IR FL 0 14
P A R T NU M B E R
IN TE RN A TIO NA L
RE CT IF IE R
LO G O
F L0 14
31 4
TOP
8
W A FER
LO T CO D E
XXXXXX
D A TE CO D E (Y W W )
Y = LA S T D IG IT O F TH E Y E A R
W W = W E EK
B O TT O M
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IRLL2705
Tape & Reel Information
SOT-223 Outline
2 .0 5 (.0 8 0 )
1 .9 5 (.0 7 7 )
TR
4 .1 0 (.1 6 1)
3 .9 0 (.1 5 4)
0 .3 5 (.0 1 3 )
0 .2 5 (.0 1 0 )
1 .8 5 (.0 7 2 )
1 .6 5 (.0 6 5 )
7 .5 5 (.2 9 7 )
7 .4 5 (.2 9 4 )
1 6 .3 0 (.6 4 1 )
1 5 .7 0 (.6 1 9 )
7 .6 0 (.2 9 9 )
7 .4 0 (.2 9 2 )
1 .6 0 (.0 6 2 )
1 .5 0 (.0 5 9 )
TYP .
F E E D D IR E C T IO N
1 2 .1 0 (.4 7 5 )
1 1 .9 0 (.4 6 9 )
2 .3 0 (.0 9 0 )
2 .1 0 (.0 8 3 )
7 .1 0 (.2 79 )
6 .9 0 (.2 72 )
NOTES :
1 . C O N T R O L L IN G D IM E N S IO N : M IL L IM E T E R .
2 . O U T L IN E C O N F O R M S T O E IA -4 8 1 & E IA -5 41 .
3 . E A C H O 3 3 0 .0 0 (1 3 .0 0 ) R E E L C O N T A IN S 2,50 0 D E V IC E S .
1 3 .2 0 (.5 1 9 )
1 2 .8 0 (.5 0 4 )
1 5.40 (.6 0 7 )
1 1.90 (.4 6 9 )
4
330.0 0
(13.000)
M AX.
N O T ES :
1 . O U T LIN E C O M F O R M S T O E IA -4 1 8 -1 .
2 . C O N T R O L L IN G D IM E N S IO N : M IL L IM E T E R ..
3 . D IM E N S IO N M E A S U R E D @ H U B .
4 . IN C L U D E S F L A N G E D IS T O R T IO N @ O U T E R E D G E .
5 0.0 0 (1 .9 6 9 )
M IN .
1 4 .4 0 (.5 6 6 )
1 2 .4 0 (.4 8 8 )
3
1 8 .4 0 (.7 2 4 )
M AX .
4
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Data and specifications subject to change without notice. 1/99
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