INFINEON PMB2208

Wireless Components
Mixer and IF Vector Modulator
PMB 2208 Version V1.2
Specification August 1999
preliminary
CONFIDENTIAL
Revision History: Current Version: 08.99
Previous Version:Data Sheet
Page
(in previous
Version)
Page
(in current
Version)
Subjects (major changes since last revision)
ABM®, AOP®, ARCOFI®, ARCOFI®-BA, ARCOFI®-SP, DigiTape®, EPIC®-1, EPIC®-S, ELIC®, FALC®54, FALC®56, FALC®-E1, FALC®-LH, IDEC®, IOM®,
IOM®-1, IOM®-2, IPAT®-2, ISAC®-P, ISAC®-S, ISAC®-S TE, ISAC®-P TE, ITAC®, IWE®, MUSAC®-A, OCTAT®-P, QUAT®-S, SICAT®, SICOFI®, SICOFI®2, SICOFI®-4, SICOFI®-4µC, SLICOFI® are registered trademarks of Infineon Technologies AG.
ACE™, ASM™, ASP™, POTSWIRE™, QuadFALC™, SCOUT™ are trademarks of Infineon Technologies AG.
Edition 03.99
Published by Infineon Technologies AG i. Gr.,
SC,
Balanstraße 73,
81541 München
© Infineon Technologies AG i. Gr. 30.08.99.
All Rights Reserved.
Attention please!
As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved.
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies AG is an approved CECC manufacturer.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing
material back, if it is sorted. You must bear the costs of transport.
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems2 with the express written approval of the
Infineon Technologies AG.
1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that lifesupport device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they
fail, it is reasonable to assume that the health of the user may be endangered.
PMB 2208
preliminary
Product Info
Confidential
Product Info
General Description
Features
Package
The PMB 2208 contains a direct
quadrature modulator and an up/downconversion mixer with corresponding
bias circuitry.
■
Direct quadrature modulator and
up/down-conversion mixer on one
chip
■
Modulator:
-
LO input frequency range from
200MHz to 550MHz corresponds to
an output frequency range from
100MHz to 275MHz
-
Generation of orthogonal carriers
without external elements and without trimming
-
typ. 48dB carrier suppression with
1Vpp baseband level
-
typ. 49dB SSB suppression with
1Vpp baseband level
-
typ. 51dB rejection of third-order
intermodulation products with 1Vpp
baseband level
-
Application
Low output noise floor
■
■
Ordering Information
Vector-modulated digital mobile
cellular systems, such as GSM,
PDC-800, PDC-1.5, PHS, DAMPS,
DCS1800, WLAN, etc.
Mixer:
-
Double-balanced Gilbert cell
-
RF and IF frequency range from
DC to 2.5GHz
-
typ 39dB carrier suppression
-
Low noise
■
Supply voltage range from 2.7 to
4.5V
■
Power-down mode
■
Temperature range -30 to 85°C
■
Analog systems with FM and AM
modulation
■
Space- and power-saving optimizations of existing discrete transmitter circuits
Various modulation schemes, such
as PM, PSK, FSK, QAM, QPSK,
GMSK, etc.
Type
Ordering Code
Package
P-TSSOP-24
PMB 2208
Wireless Components
■
Product Info
Specification, August 1999
1
Table of Contents
1
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
2
2.1
2.2
2.3
2.4
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
3
3.1
3.2
3.3
3.4
3.5
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Internal Input/Output Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
4
4.1
4.2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
5
5.1
5.1.1
5.1.2
5.1.3
5.2
5.2.1
5.2.2
5.2.3
5.3
Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
S-Parameters and Input/Output Impedances . . . . . . . . . . . . . . . . . . . 5-7
Mixer Input RX/RFX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
Mixer Input IF/IFX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
Mixer Output MO/MOX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
2
Product Description
Contents of this Chapter
2.1
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2.4
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
PMB 2208
preliminary
Product Description
Confidential
2.1 Overview
The PMB 2208 contains a direct quadrature modulator and an up/down-conversion mixer with corresponding bias circuitry.
The modulator splits the signal at the LO/LOX input into two orthogonal carriers. The frequency of these carriers is half of the LO/LOX input frequency. The
carriers are multiplied with the baseband modulation signals at the A/AX and
B/BX inputs. The outputs of the multipliers are added and amplified by a linear
output stage. The modulated signal is available at the E/EX output. A reference
voltage is available at the TREF output, which can be used to bias the baseband inputs.
The mixer combines the signals at the RF/RFX and IF/IFX inputs; the resulting
signal is available at the MO/MOX output. The IF/IFX input is suitable for the
lower-frequency signal because of its linear transfer function to the output. The
higher-frequency signal is applied to the RF/RFX input, which operates in
switched mode. In a typical application, the output signal of the modulator is
band-pass filtered and then fed to the IF/IFX input of the mixer.
The modulator and mixer have separate power supplies, and can be powered
down independently. The power-down concept enables the modulator to be
used with or without the mixer.
2.2 Features
Wireless Components
■
Direct quadrature modulator and up/down-conversion mixer on one chip
■
Modulator:
-
LO input frequency range from 200MHz to 550MHz corresponds to an output frequency range from 100MHz to 275MHz
-
Generation of orthogonal carriers without external elements and without
trimming
-
typ. 48dB carrier suppression with 1Vpp baseband level
-
typ. 49dB SSB suppression with 1Vpp baseband level
-
typ. 51dB rejection of third-order intermodulation products with 1V pp baseband level
-
Low output noise floor
■
Mixer:
-
Double-balanced Gilbert cell
-
RF and IF frequency range from DC to 2.5GHz
-
typ 39dB carrier suppression
-
Low noise
2-2
Specification, August 1999
PMB 2208
preliminary
Product Description
Confidential
■
Supply voltage range from 2.7 to 4.5V
■
Power-down mode
■
P-TSSOP-24 package
■
Temperature range -30 to 85°C
2.3 Applications
■
Vector-modulated digital mobile cellular systems, such as GSM, PDC-800,
PDC-1.5, PHS, DAMPS, DCS1800, WLAN, etc.
■
Various modulation schemes, such as PM, PSK, FSK, QAM, QPSK, GMSK,
etc.
■
Analog systems with FM and AM modulation
■
Space- and power-saving optimizations of existing discrete transmitter circuits
2.4 Package Outlines
P-TSSOP-24
Wireless Components
2-3
Specification, August 1999
3
Functional Description
Contents of this Chapter
3.1
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.2
Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.3
Internal Input/Output Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.4
Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
3.5
Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
PMB 2208
preliminary
Functional Description
Confidential
3.1 Pin Configuration
RF
1
24
RFX
VCC2
2
23
GND
MOX
3
22
IF
MO
4
21
IFX
GND
5
20
PD2
GND
6
19
GND
LOX
7
18
E
LO
8
17
EX
PD1
9
16
VCC1
TREF
10
15
GND
A
11
14
B
AX
12
13
BX
PMB 2208
Pin_config.wmf
Figure 3-1
Wireless Components
Pin Configuration
3-2
Specification, August 1999
PMB 2208
preliminary
Functional Description
Confidential
3.2 Pin Definition and Function
Table 3-1 Pin Definition and Function
Wireless Components
Pin No.
Symbol
Function
1
RF
RF input (base)
2
VCC2
Mixer supply voltage
3
MOX
Inverted mixer output (open collector)
4
MO
Mixer output (open collector)
5
GND
Ground
6
GND
Ground
7
LOX
Inverting modulator LO input
8
LO
Modulator LO input
9
PD1
Modulator power-down
10
TREF
Reference voltage output (DC bias for A, AX, B, BX)
11
A
Modulation input A
12
AX
Inverting modulation input A
13
BX
Inverting modulation input B
14
B
Modulation input B
15
GND
Ground
16
VCC1
Modulator supply voltage
17
EX
Inverted modulator output (open collector)
18
E
Modulator output (open collector)
19
GND
Ground
20
PD2
Mixer power-down
21
IFX
Inverting IF input (emitter)
22
IF
IF input (emitter)
23
GND
Ground
24
RFX
Inverting RF input (base)
3-3
Specification, August 1999
PMB 2208
preliminary
Functional Description
Confidential
3.3 Internal Input/Output Circuits
RF
1
RFX
2kΩ
VCC2
2kΩ
bias2
GND
800Ω
MOX
IF
MO
IFX
800Ω
200kΩ 200kΩ
GND
GND
GND
LOX
E
LO
EX
PD1
Wireless Components
PD2
200kΩ 200kΩ
7kΩ
bias1
VCC1
TREF
GND
A
B
AX
BX
3-4
Specification, August 1999
PMB 2208
preliminary
Functional Description
Confidential
3.4 Functional Block Diagram
1
RF
RFX
VCC2
GND
MOX
IF
mixer
MO
IFX
mixer
bias
GND
GND
LOX
PD2
GND
input
buffer
E
LO
EX
output
stage
PD1
VCC1
modulator
bias
TREF
GND
A
B
ƒ÷ 2
AX
mixer
frequency
divider
mixer
BX
Funct_block.wmf
Figure 3-2
Wireless Components
Functional Block Diagram
3-5
Specification, August 1999
PMB 2208
preliminary
Functional Description
Confidential
3.5 Circuit Description
The modulator performs a direct quadrature modulation. The LO signal is connected to an emitter-coupled transistor pair. The LO signal is split internally into
two orthogonal carriers at half of the LO/LOX input frequency. The accuracy of
the internal 90° phase shift requires a balanced input signal and depends on the
accuracy of the 50% duty cycle of the LO/LOX signal. The modulator has two
Gilbert cell mixers, in which the baseband modulation signals at the A/AX and
B/BX inputs are multiplied with the orthogonal carriers. The outputs of the two
Gilbert cells are added and amplified by a linear output stage. The modulated
transmit signal is available at the high-impedance, open-collector output E/EX.
It can be band-pass filtered and fed to the IF/IFX input of the mixer.
At the TREF output, a reference voltage is available, which should be capacitively decoupled to ground. TREF can be used to set the DC bias of the baseband inputs using external resistors. Alternatively, the DC level can be set
independently of TREF, provided it is within the specified operational range.
The up/down-conversion mixer is a fully-balanced Gilbert cell. The transfer
function from the low-impedance emitter input IF/IFX to the output is linear for
input levels below the 1dB compression point. For improved intermodulation,
the mixer current can be increased with external resistors to ground at IF/IFX.
The high-impedance input RF/RFX is directly connected to the bases of the
switching transistors. The input level should be high enough to ensure proper
switching. The output signal of the mixer is available at the high-impedance,
open-collector outputs MO/MOX.
The modulator and the mixer have separate supply and power-down pins:
VCC1, PD1 for the modulator and VCC2, PD2 for the mixer. Applying a logic
LOW to PD1 or PD2 powers down the corresponding part of the chip, including
its bias circuitry. Depending on the application, the power-down pins can be
combined or separately fixed to supply rails.
Wireless Components
3-6
Specification, August 1999
4
Applications
Contents of this Chapter
4.1
Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2
Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
PMB 2208
preliminary
Applications
Confidential
4.1 Circuits
Appl_circuit.eps
Figure 4-1
Wireless Components
Application Circuit
4-2
Specification, August 1999
PMB 2208
preliminary
Applications
Confidential
4.2 Hints
Wireless Components
4-3
Specification, August 1999
5
Reference
Contents of this Chapter
5.1
5.1.1
5.1.2
5.1.3
Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.2
5.2.1
5.2.2
5.2.3
S-Parameters and Input/Output Impedances . . . . . . . . . . . . . . . . . . . 5-7
Mixer Input RX/RFX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
Mixer Input IF/IFX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
Mixer Output MO/MOX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
5.3
Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
PMB 2208
preliminary
Reference
Confidential
5.1 Electrical Data
5.1.1
Absolute Maximum Ratings
WARNING
The maximum ratings may not be exceeded under any circumstances, not even
momentarily and individually, as permanent damage to the IC will result.
Table 5-1 Absolute Maximum Ratings
Parameter
Symbol
Limit Values
Unit
min
max
Remarks
Supply voltage
9CC
-0.5
5.0
V
Input voltage (except IF, IFX)
9I
-0.5
9CC+0.5
5.0
V
Input voltage IF, IFX
9IF
2
V
Input current IF, IFX
,IF
10
mA
Differential input voltage
9I − 9IX
-2
2
V
Output voltage TREF
9TREF
-0.5
9CC+0.5
5.0
V
9CC ≤ 4.5V
9CC > 4.5V
Output voltage MO, MOX
9MO
-0.5
9CC+1.0
5.5
V
9CC ≤ 4.5V
9CC > 4.5V
Output voltage E, EX
9E
9CC−1.0
9CC+1.0
5.5
V
9CC ≤ 4.5V
9CC > 4.5V
Junction temperature
7j
125
°C
Storage temperature
7S
125
°C
Thermal resistance
(junction to lead)
5thJL
140
K/W
ESD integrity *
9ESD
1000
V
-55
-1000
9CC ≤ 4.5V
9CC > 4.5V
according MIL-STD
883D, method 3015.7
and EOS/ESD assn.
standard S5.1 - 1993
* The RF pins 3, 4, 17 and 18 are not protected against voltage stress > 300V (versus VS or GND).
The high frequency performance prohibits the use of adequate protective structures.
Wireless Components
5-2
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
5.1.2
Operating Range
Table 5-2 Operating Range, Supply voltage VCC=2.7V to 4.5 V, ambient temperature TA= -30 to 85°C
Parameter
Symbol
Limit Values
min
max
Unit
Remarks
Item
Control inputs PD1, PD2
LOW input voltage
9IL
0
0.8
V
1
HIGH input voltage
9IH
2.1
9CC
V
2
RF, RFX input frequency
IRF
DC
2.5
GHz
3
RF, RFX input level
3RF
0
dBm
4
IF, IFX input frequency
IIF
2.5
GHz
5
IF, IFX input level
3IF
0
dBm
6
MO, MOX output frequency
IMO
DC
2.5
GHz
7
Minimum resistive load at IF, IFX
to GND
R2, R3 in
Test
Circuit 1
33
Ω
8
LO, LOX input frequency
ILO
200
550
MHz
9
LO, LOX input level
3LO
-15
-10
0
0
dBm
dBm
Suppression of the even harmonics at the LO, LOX input
DHn2
40
A, AX, B, BX input frequency
IA-AXIB-BX
0
10
A, AX, B, BX input level
9A9AX
9B9BX
1.4
9CC−
0.6
A-AX, B-BX differential input
signal level
9A-AX
9B-BX
Decoupling capacitance at
TREF
CTREF
Load current at TREF
ITREF
Mixer
DC
Modulator
1RWH
Wireless Components
1
1
1.0
fLO=200MHz
fLO=550MHz
10
dB
11
MHz
12
V
DC
13
Vpp
AC
14
nF
15
mA
16
3RZHUOHYHOVDUHUHIHUUHGWRDQLPSHGDQFHRIΩ
5-3
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
5.1.3
AC/DC Characteristics
AC/DC characteristics involve the spread of values guaranteed within the specified supply voltage and ambient temperature range. Typical characteristics are
the median of the production.
Table 5-3 AC/DC Characteristics with TA =+25 °C, VCC =2.7 to 4.5V
Symbol
Limit Values
Unit
Test Conditions
L
Item
min
typ
max
9
10
0.3
5
11
12
0.6
7
14
16
1.0
9
mA
mA
mA
mA
PD1,PD2=H
1
2
2
2
2
µA
µA
µA
µA
PD1,PD2=L
2
Supply Currents
Supply current when all
powered up
,VCC1
,E+,EX
,VCC2
,MO+,MOX1)
Supply current when all
powered down
,VCC1
,E+,EX
,VCC2
,MO+,MOX
Control inputs PD1, PD2
LOW input current
,IL
2
4
µA
9IL=0.8V
3
HIGH input current
,IH
9
18
µA
9IH=2.1V
4
Power-up settling time
for modulator
WPU2)
2
µs
1nF at TREF
9IF3)
0.3
V
6
9RF
2.0
V
7
*
5
Mixer input IF/IFX
Internal DC voltage
Mixer input RF/RFX
Internal DC voltage
Mixer output MO/MOX:
Output power
3MO
Gain with power matching
*MO4)
1dB compression point
3IF1dB
Noise figure
1IF4)
Carrier suppression
DC
Wireless Components
-12
4)
25
-9
-6
dBm
PRFIN = -5dBm
fRFIN = 1.4GHz
PIFIN = -5dBm
fIFIN = 400MHz
8
+3
dB
Application Circuit
■
9
-7
dBm
PRFIN > -4dBm
Application Circuit
■
10
8
dB
DSB noise,I =1GHz
Application Circuit
■
11
39
dB
PRFIN = -5dBm
fRFIN = 1.4GHz
PIFIN = -5dBm
fIFIN = 400MHz
5-4
12
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
Table 5-3 AC/DC Characteristics with TA =+25 °C, VCC =2.7 to 4.5V (continued)
Symbol
Limit Values
min
typ
Unit
Test Conditions
L
Item
max
Modulator inputs A/AX and B/BX: 9A =9AX =9B =9BX = 1.75V
Differential input Resistance
5A-AX
5B-BX
250
kΩ
I=100kHz
■
13
Differential input Capacitance
&A-AX
&B-BX
1
pF
I=100kHz
■
14
Input DC current
,A,AX
,B,BX
2.5
10
µA
Differential input
voltage = 0V
Differential input
offset current
,OSA,OSB
-1
1
µA
5.0
15
16
Modulator inputs LO/LOX:
Differential input Resistance
5LO-LOX
4
kΩ
I/2=350MHz
■
17
Differential input Capacitance
&LO-LOX
0.4
pF
I/2=350MHz
■
18
Reference voltage output TREF for A/AX and B/BX inputs:
Output voltage
9TREF
1.65
1.75
1.85
V
19
Modulator output E/EX: 3LO = -10dBm, IA-AX =IB-BX = 455kHz, 9A-AX = 9B-BX = 1Vpp, 90° phase shift
Output power
3E
Output power with
power matching
3E
Carrier suppression
DC6)
Single sideband
supression
-7
-4
-1
dBm
20
dBm
33
48
dB
22
DSSB
35
49
dB
23
Suppression of third order
intermodulation products
DIM37)
45
51
dB
24
Output noise floor
3N5)
-144
dBc/
Hz
Differential output resistance
5E-EX
20
Differential output capacitance
&E-EX
0.4
RMS phase error of output
signal
φe
0.4
1.0
Application circuit
■
0
4)
21
20MHz from carrier
Application circuit
■
25
kΩ
I(=175MHz
■
26
pF
I(=175MHz
■
27
Degree
28
■ This value is only measured in lab.
*
guaranteed by design
Wireless Components
5-5
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
1)
The mixer current decreases when no external resistors to ground are
connected at IF and IFX. In this case the typical value of ,MO+,MOX is 1mA.
2)
Design hint. The settling time is determined by the time required to charge
the external capacitors.
3)
Note: There are external resistors (82 Ohms) at IF and IFX to ground.
4)
Application hint
5)
Design hint
6)
The carrier suppression can be optimized for a particular application using
offset voltages at the baseband inputs A/AX and B/BX. The optimum
values can be found iteratively by adjusting the A/AX and B/BX offsets
alternately until the carrier disappears into the noise floor. If the actual
offset voltages differ from their optimum values by ∆926$ and ∆926%, the
carrier suppression in dB is given by
Vm
a c = 20 ⋅ log 10 ------------------------------------------------------------2
2
( ∆V OSA ) + ( ∆V OSB )
where 9P is the peak value of the signal voltage at A/AX and B/BX.
7)
Wireless Components
DIM3 can be increased by reducing the amplitude of the modulator inputs
VA-AX and VB-BX.
5-6
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
5.2 S-Parameters and Input/Output Impedances
The S-parameters provided in this section are based on measurements at the supply
voltage of VCC = 3.6V. Via the internal bias tees of the NWA the capacitive coupling is
done and the open collector pins are connected to VCC.
The S-parameters have to be considered as application hints.
Table 5-4
Test
Frequency
[MHz]
Port 1
Port 2
Output levels
RF-Input impedance
50 - 2500
RF
RFX
-5 dBm
IF-Input impedance
50 - 2500
IF
IFX
-30 dBm
MO-Output impedance
50 - 2500
MO
MOX
-30 dBm
The input/output impedances are calculated from these parameters. The
impedances are given as equivalent circuit with lumped elements for differential
and single ended in-/outputs.
As equivalent circuit for these in-/outputs a resistor Rp parallel to a capacitance
Cp is derived:
Rpd
Cpd
Rps
Cps
single
ended
differential
S_Parameter.wmf
The IF-Input impedance is given as a equivalent circuit of a resistor Rs serial to
a inductivity Ls:
Rsd
Rss
Lsd
Lss
single
ended
differential
S_Parameter_2.wmf
Wireless Components
5-7
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
5.2.1
Mixer Input RX/RFX
Circuit for measurement:
'&
6XSSO\
Ω
S
9&&
,)
Ω
,);
S
Ω
3'
'87
Q)
02
Q)
02;
5)
Ω
5);
3
1:$
3
Mixer Input RF/RFX S-Parameters:
f
MHz
50
250
500
750
1000
1250
1500
1750
2000
2250
2500
S11
mag
0.943
0.941
0.920
0.896
0.866
0.832
0.795
0.747
0.701
0.647
0.586
ang
-1.8
-8.9
-18.2
-28.4
-39.4
-51.5
-61.5
-71.2
-80.4
-92.4
-109.3
S21
mag
0.027
0.029
0.063
0.099
0.137
0.161
0.192
0.220
0.250
0.284
0.297
S12
mag
0.006
0.032
0.057
0.094
0.132
0.158
0.195
0.230
0.265
0.301
0.317
ang
0.4
57.9
69.5
66.1
59.4
54.0
47.9
41.9
34.8
24.8
12.3
S22
mag
0.965
0.939
0.921
0.902
0.878
0.852
0.839
0.817
0.786
0.746
0.682
ang
48.4
49.0
73.0
70.9
66.3
62.7
56.2
50.7
42.5
31.4
21.4
ang
-1.5
-8.4
-17.5
-27.7
-38.9
-50.9
-62.2
-73.7
-85.6
-100.6
-120.6
Mixer Input RX/RFX Impedances:
5SG
5SV
P
K
2
N
Q
L
5
) S
Q
L
&
ILQ0+]
Wireless Components
&SG
&SV
ILQ0+]
5-8
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
5.2.2
Mixer Input IF/IFX
Circuit for measurement:
'&
6XSSO\
Ω
%LDV7HH
,QWHUQDO
%LDV7HHV
9&& 3'
3
,)
1:$
,);
3
'87
Ω
02
02;
Ω
5);
5)
%LDV7HH
Q) Q)
Ω
Ω
Mixer Input IF/IFX S-Parameters:
f
MHz
50
250
500
750
1000
1250
1500
1750
2000
2250
2500
S11
mag
0.443
0.317
0.289
0.294
0.312
0.330
0.344
0.370
0.413
0.472
0.515
ang
172.5
149.8
143.0
138.2
134.0
129.4
123.6
116.4
107.3
96.4
86.7
S21
mag
0.310
0.403
0.421
0.418
0.399
0.383
0.365
0.337
0.300
0.263
0.255
S12
mag
0.253
0.398
0.421
0.418
0.401
0.388
0.372
0.347
0.318
0.290
0.271
ang
10.8
11.4
4.1
0.6
-1.4
-3.2
-5.4
-7.2
-7.7
-3.7
-1.0
S22
mag
0.406
0.310
0.286
0.288
0.298
0.310
0.322
0.338
0.367
0.407
0.441
ang
11.8
11.5
4.6
1.2
-0.6
-2.3
-4.0
-5.5
-6.1
-4.4
-5.0
ang
168.2
150.9
144.7
141.0
137.5
133.8
128.0
122.3
113.0
102.3
93.2
Mixer Input IF/IFX Impedances:
P
K
2
Q
L
5
+
Q
Q L
/
5VG
5VV
ILQ0+]
Wireless Components
/VG
/VV
5-9
ILQ0+]
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
5.2.3
Mixer Output MO/MOX
Circuit for measurement:
Ω
%LDV7HH
Ω
,QWHUQDO
9&& 3'
,)
'87 02
3
5);
5)
%LDV7HH
1:$
02;
,);
Ω
%LDV7HHV
3
Q) Q)
Ω
3RZHU
6XSSO\
9
Ω
Mixer Output MO/MOX S-Parameters:
f
MHz
50
250
500
750
1000
1250
1500
1750
2000
2250
2500
S11
mag
1.041
0.987
0.971
0.958
0.935
0.919
0.900
0.892
0.881
0.864
0.797
angle
-1.5
-6.9
-13.7
-22.1
-31.3
-41.2
-50.0
-57.4
-64.2
-72.0
-81.1
S21
mag
0.005
0.010
0.037
0.056
0.076
0.088
0.092
0.093
0.074
0.050
0.103
S12
mag
0.014
0.015
0.034
0.054
0.080
0.091
0.097
0.103
0.089
0.074
0.092
angle
52.7
97.3
101.9
96.4
90.4
87.0
86.5
84.1
85.4
119.9
159.3
angle
-38.3
117.8
107.5
108.0
94.1
90.8
92.3
89.1
89.7
108.5
145.8
S22
mag
1.032
0.992
0.967
0.939
0.926
0.903
0.869
0.855
0.843
0.816
0.761
angle
0.4
-6.9
-13.4
-22.0
-30.7
-40.9
-50.1
-58.2
-66.3
-76.2
-89.1
Mixer Output MO/MOX Impedances:
P
K
2
N
Q
L
5
5SG
5SV
&SG
&SV
)
S
Q L
&
ILQ0+]
Wireless Components
5 - 10
ILQ0+]
Specification, August 1999
PMB 2208
preliminary
Reference
Confidential
5.3 Test Circuit
27Ω
R1
RFIN
TR4
C7
1nF
5)
5);
C20
1nF
27Ω
C8
1nF
R4
VCC2
9&&
*1'
82Ω
R3
C9
1nF
02;
,)
C21
1nF
TR5
IFIN
TR1
C10
1nF
MOUT
02
,);
82Ω
C22
1nF
R2
*1'
*1'
3'
PD2
C23
1nF
*1'
100Ω
R8
C13
1nF
LOIN
/2;
C24
1nF
(
EOUT
TR6
TR2
C14
1nF
100Ω
/2
C25
1nF
(;
R7
PD1
C15
1nF
TREF
2.2kΩ
A
AIN
C18
22nF
TR3
R11
2.2kΩ
AX
R12
Figure 5-1
Wireless Components
C16
1nF
C19
22nF
3'
C26
1nF
75()
C17
22nF
*1'
C28
22nF
$
R6
220Ω
VCC1
9&&
$;
%
%;
R5
220Ω
C27
22nF
2.2kΩ
TR7
B
R9
2.2kΩ
BIN
BX
C29
22nF
R10
Test Circuit
5 - 11
Specification, August 1999