Wireless Components ASK Single Conversion Receiver TDA 5201 Version 1.5 Specification July 2004 Revision History Current Version: 1.5 as of 01.07.04 Previous Version: 1.4, March 2000 Page (in previous Version) Page (in current Version) Subjects (major changes since last revision) ABM®, AOP®, ARCOFI®, ARCOFI®-BA, ARCOFI®-SP, DigiTape®, EPIC®-1, EPIC®-S, ELIC®, FALC®54, FALC®56, FALC®-E1, FALC®-LH, IDEC®, IOM®, IOM®-1, IOM®-2, IPAT®-2, ISAC®-P, ISAC®-S, ISAC®-S TE, ISAC®-P TE, ITAC®, IWE®, MUSAC®-A, OCTAT®-P, QUAT®-S, SICAT®, SICOFI®, SICOFI®2, SICOFI®-4, SICOFI®-4µC, SLICOFI® are registered trademarks of Infineon Technologies AG. ACE™, ASM™, ASP™, POTSWIRE™, QuadFALC™, SCOUT™ are trademarks of Infineon Technologies AG. Edition 07.04 Published by Infineon Technologies AG, Balanstraße 73, 81541 München © Infineon Technologies AG July 2004. All Rights Reserved. Attention please! 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Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems2 with the express written approval of the Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that lifesupport device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. TDA 5201 Product Info Product Info General Description Features Application The IC is a very low power consump- Package tion single chip ASK Single Conversion Receiver for receive frequencies between 310 and 350MHz. The Receiver offers a high level of integration and needs only a few external components. The device contains a low noise amplifier (LNA), a double balanced mixer, a fully integrated VCO, a PLL synthesiser, a crystal oscillator, a limiter with RSSI generator, a data filter, a data comparator (slicer) and a peak detector. Additionally there is a power down feature to save battery life. ■ Low supply current (Is = 4.6mA typ.) ■ Selectable frequency ranges around 315 MHz and 345 MHz ■ Supply voltage range 5V ±10% ■ Selectable reference frequency ■ Power down mode with very low supply current (50nA typ) ■ Limiter with RSSI generation, operating at 10.7MHz ■ Fully integrated VCO and PLL Synthesiser ■ 2nd order low pass data filter with external capacitors ■ RF input sensitivity < –110dBm ■ Data slicer with self-adjusting threshold ■ Keyless Entry Systems ■ Fire Alarm Systems ■ Remote Control Systems ■ Low Bitrate Communication Systems Ordering Information Type Ordering Code Package TDA 5201 Q67037-A1118 P-TSSOP-28-1 available on tape and reel Wireless Components Product Info Specification, July 2004 1 Table of Contents 1 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i 2 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3.2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3.3 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.4 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4.1 Low Noise Amplifier (LNA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4.2 Mixer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4.3 PLL Synthesizer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4.4 Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.4.5 Limiter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.4.6 Data Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.4.7 Data Slicer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.4.8 Peak Detector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4.9 Bandgap Reference Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4.1 Choice of LNA Threshold Voltage and Time Constant. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4.2 Data Filter Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4.3 Quartz Load Capacitance Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4.4 Quartz Frequency Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4.5 Data Slicer Threshold Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5 Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5.1 Electrical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.1.2 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.1.3 AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5.3 Test Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.4 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5.5 Appendix - Noise Figure and Gain Circles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2 Product Description Contents of this Chapter 2.1 2.2 2.3 2.4 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 TDA 5201 Product Description 2.1 Overview The IC is a very low power consumption single chip ASK Superheterodyne Receiver (SHR) for the frequency bands 315 and 345MHz. The SHR offers a high level of integration and needs only a few external components. The device contains a low noise amplifier (LNA), a double balanced mixer, a fully integrated VCO, a PLL synthesiser, a crystal oscillator, a limiter with RSSI generator, a data filter, a data comparator (slicer) and a peak detector. Additionally there is a power down feature to save battery life. 2.2 Application ■ Keyless Entry Systems ■ Remote Control Systems ■ Fire Alarm Systems ■ Low Bitrate Communication Systems 2.3 Features Wireless Components ■ Low supply current (Is = 4.6mA typ.) ■ Supply voltage range 5V ±10% ■ Power down mode with very low supply current (50nA typ.) ■ Fully integrated VCO and PLL Synthesiser ■ RF input sensitivity < –110dBm ■ Selectable receive frequency bands 315 and 345MHz ■ Selectable reference frequency ■ Limiter with RSSI generation, operating at 10.7MHz ■ 2nd order low pass data filter with external capacitors ■ Data slicer with self-adjusting threshold 2-2 Specification, July 2004 TDA 5201 Product Description 2.4 Package Outlines P_TSSOP_28.EPS Figure 2-1 Wireless Components P-TSSOP-28-1 package outlines 2-3 Specification, July 2004 3 Functional Description Contents of this Chapter 3.1 3.2 3.3 3.4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 TDA 5201 Functional Description 3.1 Pin Configuration CRST1 1 28 CRST2 VCC 2 27 PDWN LNI 3 26 PDO TAGC 4 25 DATA AGND 5 24 3VOUT LNO 6 23 THRES VCC 7 22 FFB MI 8 21 OPP MIX 9 20 SLN AGND 10 19 SLP FSEL 11 18 LIMX IFO 12 17 LIM DGND 13 16 CSEL VDD 14 15 LF TDA 5201 Pin_Configuration_5201_V1.4.wmf Figure 3-1 Wireless Components IC Pin Configuration 3-2 Specification, July 2004 TDA 5201 Functional Description 3.2 Pin Definition and Function Table 3-1 Pin Definition and Function Pin No. Symbol 1 CRST1 Equivalent I/O-Schematic Function External Crystal Connector 1 4.15V 1 50uA 2 VCC 5V Supply 3 LNI LNA Input 57uA 3 500uA 4k 1k Wireless Components 3-3 Specification, July 2004 TDA 5201 Functional Description 4 TAGC AGC Time Constant Control 4.3V 3uA 4 1k 1.4uA 1.7V 5 AGND Analogue Ground Return 6 LNO LNA Output 5V 1k 6 7 VCC 8 MI 5V Supply Mixer Input 1.7V 2k 9 2k MIX Complementary Mixer Input 8 9 400uA 10 AGND Analogue Ground Return 11 FSEL not applicable - has to be left open Wireless Components 3-4 Specification, July 2004 TDA 5201 Functional Description 12 IFO 10.7 MHz IF Mixer Output 300uA 2.2V 60 12 4.5k 13 DGND Digital Ground Return 14 VDD 5V Supply (PLL Counter Circuitry) 15 LF PLL Filter Access Point 5V 4.6V 30uA 200 15 100 30uA 2.4V 16 CSEL 5.xx or 10.xx MHz Quartz Selector 1.2V 80k 16 Wireless Components 3-5 Specification, July 2004 TDA 5201 Functional Description 17 LIM Limiter Input 2.4V 15k 17 18 LIMX Complementary Limiter Input 75uA 330 18 15k 19 SLP Data Slicer Positive Input 15uA 100 3k 19 40uA 20 SLN Data Slicer Negative Input 5uA 10k 20 Wireless Components 3-6 Specification, July 2004 TDA 5201 Functional Description 21 OPP OpAmp Noninverting Input 5uA 200 21 22 FFB Data Filter Feedback Pin 5uA 100k 22 23 THRES AGC Threshold Input 5uA 10k 23 24 3VOUT 3V Reference Output 24 3V 25 DATA Data Output 200 25 80k Wireless Components 3-7 Specification, July 2004 TDA 5201 Functional Description 26 PDO Peak Detector Output 200 26 27 PDWN Power Down Input 27 220k 220k 28 CRST2 External Crystal Connector 2 4.15V 28 50uA Wireless Components 3-8 Specification, July 2004 TDA 5201 Functional Description 3.3 Functional Block Diagram VCC IF Filter RF 3 LNO MI 6 8 MIX IFO 9 12 LIM LIMX FFB OPP SLP SLN 17 18 22 21 19 20 LNA RSSI 25 DATA 26 PDO 23 THRES SLICER TAGC 4 TDA 5201 AGC Reference VDD 14 24 3VOUT UREF : 1/2 VCO : 128/64 Φ DET Crystal OSC DGND 13 Bandgap Reference Loop Filter 2/7 VCC 5/10 11 AGND FSEL 15 LF 16 1 CSEL 28 27 PDWN Crystal Function_5200.wmf Figure 3-2 Wireless Components Main Block Diagram 3-9 Specification, July 2004 TDA 5201 Functional Description 3.4 Functional Blocks 3.4.1 Low Noise Amplifier (LNA) The LNA is an on-chip cascode amplifier with a voltage gain of 15 to 20dB. The gain figure is determined by the external matching networks situated ahead of LNA and between the LNA output LNO (Pin 6) and the Mixer Inputs MI and MIX (Pins 8 and 9). The noise figure of the LNA is approximately 2dB, the current consumption is 500µA. The gain can be reduced by approximately 18dB. The switching point of this AGC action can be determined externally by applying a threshold voltage at the THRES pin (Pin 23). This voltage is compared internally with the received signal (RSSI) level generated by the limiter circuitry. In case that the RSSI level is higher than the threshold voltage the LNA gain is reduced and vice versa. The threshold voltage can be generated by attaching a voltage divider between the 3VOUT pin (Pin 24) which provides a temperature stable 3V output generated from the internal bandgap voltage and the THRES pin as described in Section 4.1. The time constant of the AGC action can be determined by connecting a capacitor to the TAGC pin (Pin 4) and should be chosen along with the appropriate threshold voltage according to the intended operating case and interference scenario to be expected during operation. The optimum choice of AGC time constant and the threshold voltage is described in Section 4.1. 3.4.2 Mixer The Double Balanced Mixer downconverts the input frequency (RF) in the range of 310-350MHz to the intermediate frequency (IF) at 10.7MHz with a voltage gain of approximately 21dB by utilising either high- or low-side injection of the local oscillator signal. In case the mixer is interfaced only single-ended, the unused mixer input has to be tied to ground via a capacitor. The mixer is followed by a low pass filter with a corner frequency of 20MHz in order to suppress RF signals to appear at the IF output (IFO pin). The IF output is internally consisting of an emitter follower that has a source impedance of approximately 330Ω to facilitate interfacing the pin directly to a standard 10.7MHz ceramic filter without additional matching circuitry. 3.4.3 PLL Synthesizer The Phase Locked Loop synthesizer consists of a VCO, an asynchronous divider chain, a phase detector with charge pump and a loop filter and is fully implemented on-chip. The VCO is including spiral inductors and varactor diodes. The FSEL pin (Pin11) has to be left open. The tuning range of the VCO was designed to guarantee over production spread and the specified temperature range a receive frequency range between 310 and 350MHz depending on whether high- or low-side injection of the local oscillator is used. The oscillator signal is fed both to the synthesiser divider chain and to a divider that is dividing Wireless Components 3 - 10 Specification, July 2004 TDA 5201 Functional Description the signal by 2 before it is applied to the downconverting mixer. Local oscillator high side injection has to be used for receive frequencies between approximately 310 and 330 MHz, low side injection for receive frequencies between 330 and 350MHz - see also Section 4.4.. 3.4.4 Crystal Oscillator The on-chip crystal oscillator circuitry allows for utilisation of quartzes both in the 5 and 10MHz range as the overall division ratio of the PLL can be switched between 64 and 128 via the CSEL (Pin 16 ) pin according to the following table. Table 3-2 CSEL Pin Operating States CSEL Crystal Frequency Open 5.xx MHz Shorted to ground 10.xx MHz The calculation of the value of the necessary quartz load capacitance is shown in Section 4.3, the quartz frequency calculation is expained in Section 4.4. 3.4.5 Limiter The Limiter is an AC coupled multistage amplifier with a cumulative gain of approximately 80dB that has a bandpass-characteristic centred around 10.7MHz. It has an input impedance of 330 Ω to allow for easy interfacing to a 10.7MHz ceramic IF filter. The limiter circuit acts as a Receive Signal Strength Indicator (RSSI) generator which produces a DC voltage that is directly proportional to the input signal level as can be seen in Figure 4-2. This signal is used to demodulate the ASK receive signal in the subsequent baseband circuitry and to turn down the LNA gain by approximately 18dB in case the input signal strength is too strong as described in Section 3.4.1 and Section 4.1. 3.4.6 Data Filter The data filter comprises an OP-Amp with a bandwidth of 100kHz used as a voltage follower and two 100kΩ on-chip resistors. Along with two external capacitors a 2nd order Sallen-Key low pass filter is formed. The selection of the capacitor values is described in Section 4.2. Wireless Components 3 - 11 Specification, July 2004 TDA 5201 Functional Description 3.4.7 Data Slicer The data slicer is a fast comparator with a bandwidth of 100 kHz. This allows for a maximum receive data rate of approximately 120kBaud. The maximum achievable data rate also depends on the IF Filter bandwidth and the local oscillator tolerance values. Both inputs are accessible. The output delivers a digital data signal (CMOS-like levels) for the detector. The self-adjusting threshold on pin 20 its generated by RC-term or peak detector depending on the baseband coding scheme. The data slicer threshold generation alternatives are described in more detail in Section 4.5. 3.4.8 Peak Detector The peak detector generates a DC voltage which is proportional to the peak value of the receive data signal. An external RC network is necessary. The output can be used as an indicator for the signal strength and also as a reference for the data slicer. The maximum output current is 500µA. 3.4.9 Bandgap Reference Circuitry A Bandgap Reference Circuit provides a temperature stable reference voltage for the device. A power down mode is available to switch off all subcircuits which is controlled by the PWDN pin (Pin 27) as shown in the following table. The supply current drawn in this case is typically 50nA. Table 3-3 PDWN Pin Operating States PDWN Operating State Open or tied to ground Powerdown Mode Tied to Vs Wireless Components Receiver On 3 - 12 Specification, July 2004 4 Applications Contents of this Chapter 4.1 4.2 4.3 4.4 4.5 Choice of LNA Threshold Voltage and Time Constant . . . . . . . . . . . . 4-2 Data Filter Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Quartz Load Capacitance Calculation . . . . . . . . . . . . . . . . . . . . . . . . 4-5 Quartz Frequency Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 Data Slicer Threshold Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 TDA 5201 Applications 4.1 Choice of LNA Threshold Voltage and Time Constant In the following figure the internal circuitry of the LNA automatic gain control is shown. R4 R5 Uthreshold Pins: 24 23 RSSI (0.8 - 2.8V) +3V OTA VCC Iload RSSI < Uthreshold: Iload= -1.5µA 4 UC C LNA Gain control voltage RSSI > Uthreshold: Iload=4.2µA Uc:< 2.6V : Gain high Uc:> 2.6V : Gain low Ucmax= VCC - 0.7V Ucmin = 1.67V LNA_autom.wmf Figure 4-1 LNA Automatic Gain Control Circuitry The LNA automatic gain control circuitry consists of an operational transimpedance amplifier that is used to compare the received signal strength signal (RSSI) generated by the Limiter with an externally provided threshold voltage Uthres. As shown in the following figure the threshold voltage can have any value between approximately 0.8 and 2.8V to provide a switching point within the receive signal dynamic range. This voltage Uthres is applied to the THRES pin (Pin 23) The threshold voltage can be generated by attaching a voltage divider between the 3VOUT pin (Pin 24) which provides a temperature stable 3V output generated from the internal bandgap voltage and the THRES pin. If the RSSI level generated by the Limiter is higher than Uthres, the OTA generates a positive current Iload. This yields a voltage rise on the TAGC pin (Pin 4). Otherwise, the OTA generates a negative current. These currents do not have the same values in order to achieve a fast-attack and slow-release action of the AGC and are used to charge an external capacitor which finally generates the LNA gain control voltage. Wireless Components 4-2 Specification, July 2004 TDA 5201 Applications LNA always in high gain mode 3 2 RSSI Level Range UTHRES Voltage Range 2.5 RSSI Level 1.5 1 LNA always in low gain mode 0.5 0 -120 -110 -100 -90 -80 -70 -60 -50 -40 -30 Input Level at LNA Input [dBm] RSSI-AGC.wmf Figure 4-2 RSSI Level and Permissive AGC Threshold Levels The switching point should be chosen according to the intended operating scenario. The determination of the optimum point is described in the accompanying Application Note, a threshold voltage level of 1.8V is apparently a viable choice. It should be noted that the output of the 3VOUT pin is capable of driving up to 50µA, but that the THRES pin input current is only in the region of 40nA. As the current drawn out of the 3VOUT pin is directly related to the receiver power consumption, the power divider resistors should have high impedance values. R4 can be chosen as 120kΩ, R5 as 180kΩ to yield an overall 3VOUT output current of 10µA. Note: If the LNA gain shall be kept in either high or low gain mode this has to be accomplished by tying the THRES pin to a fixed voltage. In order to achieve high gain mode operation, a voltage higher than 2.8V shall be applied to the THRES pin, such as a short to the 3VOLT pin. In order to achieve low gain mode operation a voltage lower than 0.7V shall be applied to the THRES, such as a short to ground. As stated above the capacitor connected to the TAGC pin is generating the gain control voltage of the LNA due to the charging and discharging currents of the OTA and thus is also responsible for the AGC time constant. As the charging and discharging currents are not equal two different time constants will result. The time constant corresponding to the charging process of the capacitor shall be chosen according to the data rate. According to measurements performed at Infineon the capacitor value should be greater than 47nF. Wireless Components 4-3 Specification, July 2004 TDA 5201 Applications 4.2 Data Filter Design Utilising the on-board voltage follower and the two 100kΩ on-chip resistors a 2nd order Sallen-Key low pass data filter can be constructed by adding 2 external capacitors between pins 19 (SLP) and 22 (FFB) and to pin 21 (OPP) as depicted in the following figure and described in the following formulas1. C1 Pins: C2 22 21 R R 100k 100k 19 Filter_Design.wmf Figure 4-3 Data Filter Design C1 = C2 = 2Q b R 2Πf 3dB b 4QRΠf 3dB with Q= b a the quality factor of the poles where in case of a Bessel filter a = 1.3617, b = 0.618 and thus Q = 0.577 and in case of a Butterworth filter a = 1.141, b = 1 and thus Q = 0.71 Example: Butterworth filter with f3dB = 5kHz and R = 100kΩ: C1 = 450pF, C2 = 225pF 1. taken from Tietze/Schenk: Halbleiterschaltungstechnik, Springer Berlin, 1999 Wireless Components 4-4 Specification, July 2004 TDA 5201 Applications 4.3 Quartz Load Capacitance Calculation The value of the capacitor necessary to achieve that the quartz oscillator is operating at the intended frequency is determined by the reactive part of the negative resistance of the oscillator circuit as shown in Section 5.1.3 and by the quartz specifications given by the quartz manufacturer. CS Pin 28 Crystal Input impedance Z1-28 TDA5200 Pin 1 Quartz_load.wmf Figure 4-4 Determination of Series Capacitance Value for the Quartz Oscillator Crystal specified with load capacitance CS = 1 1 + 2π f X L Cl with Cl the load capacitance (refer to the quartz crystal specification). Examples: 5.1 MHz: CL = 12 pF XL=580 Ω CS = 9.8 pF 10.18 MHz: CL = 12 pF XL=870 Ω CS = 7.2 pF These values may be obtained by putting two capacitors in series to the quartz, such as 18pF and 22pF in the 5.1MHz case and 18pF and 12pF in the 10.2MHz case. But please note that the calculated value of CS includes the parasitic capacitors also. Wireless Components 4-5 Specification, July 2004 TDA 5201 Applications 4.4 Quartz Frequency Calculation As described in Section 3.4.3 the operating range of the on-chip VCO is wide enough to guarantee a receive frequency range between 310 and 350MHz. The VCO signal is divided by 2 before applied to the mixer . This local oscillator signal can be used to downconvert the RF signals both with high- or low-side injection at the mixer. High-side injection of the local oscillator has to be used for receive frequencies between 310 and 330 MHz. In this case the local oscillator frequency is calculated by adding the IF frequency (10.7 MHz) to the RF frequency. Low-side injection has to be used for receive frequencies between 330 and 350 MHz. The local oscillator frequency is calculated by subtracting the IF frequency (10.7 MHz) from the RF frequency then. The overall division ratios in the PLL are 64 or 32 depending on whether the CSEL-pin is left open or tied to ground. Therefore the quartz frequency may be calculated by using the following formula: f QU = f RF − 10.7 r with ƒRF .... receive frequency ƒLO .... local oscillator (PLL) frequency (ƒRF ± 10.7) ƒQU .... quartz oscillator frequency r .... ratio of local oscillator (PLL) frequency and quartz frequency as shown in the subsequent table. Table 4-1 PLL Division Ratio Dependence on States of CSEL CSEL Ratio r = (fLO/fQU) open 64 GND 32 Example: Addition of 10.7 is used in case of operation the device at 315 MHz, subtraction in case of operation at 345 MHz for instance. This yields the following frequencies: CSEL tied to GND: f QU = (315 MHz + 10 .7 MHz ) / 32 = 10 .1781 MHz f QU = (345 MHz − 10 .7 MHz ) / 32 = 10 .4469 MHz Wireless Components 4-6 Specification, July 2004 TDA 5201 Applications CSEL open: f QU = (315 MHz + 10 .7 MHz ) / 64 = 5 .0891 MHz f QU = (345 MHz − 10 .7 MHz ) / 64 = 5 .2234 MHz Wireless Components 4-7 Specification, July 2004 TDA 5201 Applications 4.5 Data Slicer Threshold Generation The threshold of the data slicer especially for a coding scheme without DC-content, can be generated in two ways, depending on the signal coding scheme used. In case of a signal coding scheme without DC content such as Manchester coding the threshold can be generated using an external R-C integrator as shown in Figure 4-5. The time constant TA of the R-C integrator has to be significantly larger than the longest period of no signal change TL within the data sequence. In order to keep distortion low, the minimum value for R is 20kΩ. R C Pins: 19 data out 25 20 Uthreshold data filter data slicer Data_slice1.wmf Figure 4-5 Data Slicer Threshold Generation with External R-C Integrator Another possibility for threshold generation is to use the peak detector in connection with two resistors and one capacitor as shown in the following figure. The component values are depending on the coding scheme and the protocol used. R C R Pins: peak detector 26 19 data out 25 20 Uthreshold data slicer data filter Data_slice2.wmf Figure 4-6 Wireless Components Data Slicer Threshold Generation Utilising the Peak Detector 4-8 Specification, July 2004 5 Reference Contents of this Chapter 5.1 5.2 5.3 5.4 5.5 Electrical Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Test Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 Test Board Layouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 Appendix - Noise Figure and Gain Circles . . . . . . . . . . . . . . . . . . . . 5-13 TDA 5201 Reference 5.1 Electrical Data 5.1.1 Absolute Maximum Ratings WARNING The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the IC will result. Table 5-1 Absolute Maximum Ratings, Ambient temperature TAMB=-40°C ... + 85°C # Parameter Symbol Limit Values min max Unit 1 Supply Voltage Vs -0.3 5.5 V 2 Junction Temperature Tj -40 +125 °C 3 Storage Temperature Ts -40 +150 °C 4 Thermal Resistance RthJA 114 K/W 5 ESD integrity, all pins VESD +1 kV Wireless Components 5-2 -1 Remarks HBM according to MIL STD 883D, method 3015.7 Specification, July 2004 TDA 5201 Reference 5.1.2 Operating Range Within the operating range the IC operates as explained in the circuit description. The AC/DC characteristic limits are not guaranteed. Supply voltage: VCC = 4.5V .. 5.5V Table 5-2 Operating Range, Ambient temperature TAMB= -40°C ... + 85°C # Parameter Symbol Limit Values min 1 Supply Current 2 Receiver Input Level -110 Test Conditions/Notes 5.2 mA fRF = 315MHz -13 dBm @ source impedance 50Ω, BER 2E-3, average power level, Manchester encoded datarate 4kBit, 280kHz IF Bandwidth L Item max IS RFin Unit 3 LNI Input Frequency fRF 310 350 MHz 4 MI/X Input Frequency fMI 310 350 MHz 5 3dB IF Frequency Range fIF -3dB 5 23 MHz 6 Powerdown Mode On PWDNON 0 0.8 V 7 Powerdown Mode Off PWDNOFF 2 VS V 8 Gain Control Voltage, LNA high gain state VTHRES 2.8 VS V 9 Gain Control Voltage, LNA low gain state VTHRES 0 0.7V V ■ ■ Not part of the production test - either verified by design or measured in an Infineon Evalboard as described in Section 5.2. Wireless Components 5-3 Specification, July 2004 TDA 5201 Reference 5.1.3 AC/DC Characteristics AC/DC characteristics involve the spread of values guaranteed within the specified voltage and ambient temperature range. Typical characteristics are the median of the production. The device performance parameters marked with ■ are not part of the production test, but verified by design or measured on an Infineon evaluation board as desdribed in Section 5.2. Table 5-3 AC/DC Characteristics with TA 25 °C, VVCC = 4.5 ... 5.5 V # Parameter Symbol Limit Values min typ max Unit Test Conditions / Notes Pin 27 (PDWN) open or tied to 0 V L Item Supply Supply Current 1 Supply current, standby mode IS PDWN 50 70 nA 2 Supply current IS 4.6 5 mA LNA Signal Input LNI (PIN 3), VTHRES > 2.8V, high gain mode 1 Average Power Level at BER = 2E-3 (Sensitivity) RFin -112 dBm Manchester encoded datarate 4kBit, 280kHz IF Bandwidth ■ ■ 2 Input impedance, fRF = 315 MHz S11 LNA 3 Input level @ 1dB C.P. fRF=315 MHz P1dBLNA -14 dBm 4 Input 3rd order intercept point fRF = 315 MHz IIP3LNA -10 dBm 5 LO signal feedthrough at antenna port LOLNI -119 dBm 0.895 / -25.5 deg ■ fin = 315 & 317MHz ■ ■ Signal Output LNO (PIN 6), VTHRES > 2.8V, high gain mode 1 Gain fRF = 315 MHz S21 LNA 1.577 / 150.3 deg ■ 2 Output impedance, fRF = 315 MHz S22 LNA 0.897 / -10.3 deg ■ 3 Voltage Gain Antenna to MI fRF = 315 MHz GAntMI 21 dB 4 Noise Figure NFLNA 2 dB excluding matching network loss - see Appendix ■ Signal Input LNI, VTHRES = GND, low gain mode 1 Input impedance, fRF = 315 MHz S11 LNA 2 Input level @ 1dB C. P. fRF = 315 MHz P1dBLNA Wireless Components ■ 0.918 / -25.2 deg -7 5-4 dBm matched input ■ Specification, July 2004 TDA 5201 Reference Table 5-3 AC/DC Characteristics with TA 25 °C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values min typ Unit max Test Conditions/ L Item Notes Signal Input LNI, VTHRES = GND, low gain mode 3 Input 3rd order intercept point fRF = 315 MHz -13 IIP3LNA dBm fin = 315 & 317MHz ■ Signal Output LNO, VTHRES = GND, low gain mode 1 Gain fRF = 315 MHz S21 LNA 0.007 / 153.7 deg ■ 2 Output impedance, fRF = 315 MHz S22 LNA 0.907 / -10.5 deg ■ 3 Voltage Gain Antenna to MI fRF = 315 MHz GAntMI 2 dB 3 V Signal 3VOUT (PIN 24) 1 Output voltage V3VOUT 2 Current out I3VOUT 50 µA VS-1V V Signal THRES (PIN 23) 1 Input Voltage range VTHRES 0 2 LNA low gain mode VTHRES 0 3 LNA high gain mode VTHRES 2.8 4 Current in ITHRES_in 5 nA see chapter 4.1 V 3 VS-1 V or shorted to Pin 24 ■ Signal TAGC (PIN 4) 1 Current out, LNA low gain state ITAGC_out 4.2 µA RSSI > VTHRES 2 Current in, LNA high gain state ITAGC_in 1.5 µA RSSI < VTHRES MIXER Signal Input MI/MIX (PINS 8/9) ■ 1 Input impedance, fRF = 315 MHz S11 MIX 0.954 / -10.9 deg 2 Input 3rd order intercept point IIP3MIX -25 dBm ■ Signal Output IFO (PIN 12) 1 Output impedance ZIFO 330 Ω 2 Conversion Voltage Gain fRF=869 MHz GMIX +21 dB 3 Noise Figure, SSB (~DSB NF+3dB) NFMIX 13 dB ■ 4 RF to IF isolation ARF-IF 46 dB ■ Wireless Components 5-5 Specification, July 2004 TDA 5201 Reference Table 5-3 AC/DC Characteristics with TA 25 °C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values Unit min typ max ZLIM 264 330 396 Ω 60 80 dB Test Conditions/ L Item Notes LIMITER Signal Input LIM/X (PINS 17/18) 1 Input Impedance 2 RSSI dynamic range DRRSSI 3 RSSI linearity LINRSSI 4 Operating frequency (3dB points) fLIM dB ■ 23 MHz ■ 100 kHz ■ ±1 5 10.7 ■ DATA FILTER 1 Useable bandwidth BWBB FILT 2 RSSI Level at Data Filter Output SLP RSSIlow 1.1 V LNA in high gain RFIN ~-103dBm 3 RSSI Level at Data Filter Output SLP RSSIhigh 2.65 V LNA in high gain. RFIN ~-30dBm SLICER Signal Output DATA (PIN 25) 1 Useable bandwith BWBB 100 kHz 20 pF ■ SLIC 2 Capacitive loading of output Cmax SLIC 3 LOW output voltage VSLIC_L 4 HIGH output voltage VSLIC_H 5 Output current ISLIC_out 0 VS-1.3 VS-1 V VS-0.7 V 200 µA Output current =200µA PEAK DETECTOR Signal Output PDO (PIN 26) 1 LOW output voltage VSLIC_L 2 HIGH output voltage VSLIC_H 3 Load current 4 Leakage current Wireless Components Iload Ileakage 0 V VS-1 -500 V µA 700 5-6 Static load current must not exceed -500µA nA Specification, July 2004 TDA 5201 Reference Table 5-3 AC/DC Characteristics with TA 25 °C, VVCC = 4.5 ... 5.5 V (continued) Parameter Symbol Limit Values min typ Unit max Test Conditions/ L Item Notes CRYSTAL OSCILLATOR Signals CRSTL1, CRISTL 2, (PINS 1/28) 1 Operating frequency fCRSTL 5 11 MHz fundamental mode, series resonance 2 Input Impedance @ ~5MHz Z1-28 -760 +j580 Ω ■ 3 Input Impedance @ ~10MHz Z1-28 -600 +j870 Ω ■ 4 Serial Capacity @ ~5MHz CS 5=C1 9.3 pF 5 Serial Capacity @ ~10MHz CS10=C1 6.4 pF PLL Signal LF (PIN 15) 1 Tuning voltage relative to Vs VTUNE 0.4 PWDNO 1.6 2.4 V 2.8 VS V 0 0.8 V POWER DOWN MODE Signal PDWN (PIN 27) 1 Powerdown Mode On N 2 Powerdown Mode Off PWDNOff 3 Input bias current PDWN IPDWN 19 µA 4 Start-up Time until valid IF signal is detected TSU 1 mS Depends on the used crystal PLL DIVIDER Signal CSEL (PIN 16) 1 fCRSTL range 5.xxMHz VCSEL 1.4 4 V 2 fCRSTL range 10.xxMHz VCSEL 0 0.2 V 3 Input bias current CSEL ICSEL 5 µA or open CSEL tied to GND ■ Not part of the production test - either verified by design or measured in an Infineon Evalboard as described in Section 5.2. Wireless Components 5-7 Specification, July 2004 TDA 5201 Reference 5.2 Test Circuit DATE: Jul.19, 1999 n Board FILE: -10 V 2.0 TITLE: TDA5200 /-01 /-02 Evaluatio Infineon Technologies Design Center Graz The device performance parameters marked with ■ in Section 5.1.3 were either verified by design or measured on an Infineon evaluation board. This evaluation board can be obtained together with evaluation boards of the accompanying transmitter device TDA5101 in an evaluation kit that may be ordered on the INFINEON RKE Webpage www.infineon.com/rke Test_circuit.wmf Figure 5-1 Wireless Components Schematic of the Evaluation Board 5-8 Specification, July 2004 TDA 5201 Reference 5.3 Test Board Layouts Wireless Components Figure 5-2 Top Side of the Evaluation Board Figure 5-3 Bottom Side of the Evaluation Board 5-9 Specification, July 2004 TDA 5201 Reference Figure 5-4 Wireless Components Component Placement on the Evaluation Board 5 - 10 Specification, July 2004 TDA 5201 Reference 5.4 Bill of Materials The following components are necessary for evaluation of the TDA5201 at 315MHz without use of a Microchip HCS515 decoder. Table 5-4 Bill of Materials Ref Value Specification R1 100kΩ 0805, ± 5% R2 100kΩ 0805, ± 5% R3 820kΩ 0805, ± 5% R4 120kΩ 0805, ± 5% R5 180kΩ 0805, ± 5% R6 10kΩ 0805, ± 5% L1 15nH Toko, PTL2012-F15N0G L2 12pF 0805,COG, ± 2% C1 3.3 pF 0805, COG, ± 0.1pF C2 10pF 0805, COG, ± 0.1pF C3 6.8pF 0805, COG, ± 0.1pF C4 100pF 0805, COG, ± 5% C5 47nF 1206, X7R, ± 10% C6 15nH Toko, PTL2012-F15N0G C7 100pF 0805, COG, ± 5% C8 33pF 0805, COG, ± 5% C9 100pF 0805, COG, ± 5% C10 10nF 0805, X7R, ± 10% C11 10nF 0805, X7R, ± 10% C12 220pF 0805, COG, ± 5% C13 47nF 0805, X7R, ± 10% C14 470pF 0805, COG, ± 5% C15 47nF 0805, X7R, ± 10% C16 18pF 0805, COG, ± 0.1pF C17 12pF 0805, COG, ± 2% Q2 (315 + 10.7MHz)/32 HC49/U, fundamental mode, CL = 12pF, e.g. 434.2 MHz: Jauch Q 10.17813-S11-1323-12-10/20 F1 SFE10.7MA5-A Murata X2, X3 142-0701-801 Johnson X1, X4, S1, S5 2-pole pin connector S4 3-pole pin connector, or not equipped IC1 Wireless Components TDA 5201 Infineon 5 - 11 Specification, July 2004 TDA 5201 Reference The following components are necessary in addition to the above mentioned ones for evaluation of the TDA5201 in conjunction with a Microchip HCS515 decoder. Table 5-5 Bill of Materials Addendum Ref Value Specification R21 22kΩ 0805, ± 5% R22 100kΩ 0805, ± 5% R23 22kΩ 0805, ± 5% R24 820kΩ 0805, ± 5% R25 560kΩ 0805, ± 5% C21 100nF 1206, X7R, ± 10% C22 100nF 1206, X7R, ± 10% IC2 HCS515 Microchip T1 BC 847B Infineon D1 LS T670-JL Infineon Wireless Components 5 - 12 Specification, July 2004 TDA 5201 Reference 5.5 Appendix - Noise Figure and Gain Circles The following gain and noise figure circles were measured utilizing Microlab Stub Stretchers and a HP8514 network analyser. Maximum gain is shown at point 1 at 18.5 dB, minimum noise figure ist 1.9dB at point 2, step size of circles is 0.5dB. Figure 5-5 Wireless Components Gain and Noise Circles of the TDA5201 at 315 MHz. 5 - 13 Specification, July 2004 TDA 5201 List of Figures List of Figures Figure 2-1 P-TSSOP-28-1 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Figure 3-1 IC Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Figure 3-2 Main Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 4-1 LNA Automatic Gain Control Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Figure 4-2 RSSI Level and Permissive AGC Threshold Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Figure 4-3 Data Filter Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 4-4 Determination of Series Capacitance Value for the Quartz Oscillator . . . . . . . . . . . . . . 5 Figure 4-5 Data Slicer Threshold Generation with External R-C Integrator . . . . . . . . . . . . . . . . . . 7 Figure 4-6 Data Slicer Threshold Generation Utilising the Peak Detector . . . . . . . . . . . . . . . . . . . 7 Figure 5-1 Schematic of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5-2 Top Side of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 5-3 Bottom Side of the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 5-4 Component Placement on the Evaluation Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 5-5 Gain and Noise Circles of the TDA5201 at 315 MHz. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Wireless Components List of Figures - 1 Specification, July 2004 TDA 5201 List of Tables List of Tables Table 3-1 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Table 3-3 PDWN Pin Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 5-1 Absolute Maximum Ratings, Ambient temperature TAMB=-40°C ... + 85°C . . . . . . . . . 2 Table 5-2 Operating Range, Ambient temperature TAMB= -40°C ... + 85°C . . . . . . . . . . . . . . . . . 3 Table 5-3 AC/DC Characteristics with TA 25 °C, VVCC = 4.5 ... 5.5 V . . . . . . . . . . . . . . . . . . . . . 4 AC/DC Characteristics with TA 25 °C, VVCC = 4.5 ... 5.5 V (continued) 5 AC/DC Characteristics with TA 25 °C, VVCC = 4.5 ... 5.5 V (continued) 6 AC/DC Characteristics with TA 25 °C, VVCC = 4.5 ... 5.5 V (continued) 7 Table 5-4 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 5-5 Bill of Materials Addendum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Wireless Components List of Tables - 1 Specification, July 2004