Philips Semiconductors Preliminary specification Silicon Diffused Power Transistor PHE13009 GENERAL DESCRIPTION The PHE13009 is a silicon npn power switching transistor in the TO220AB envelope intended for use in high frequency electronic lighting ballast applications, converters, inverters, switching regulators, motor control systems, etc. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT VCESM VCBO VCEO IC ICM Ptot VCEsat hFEsat tf Collector-emitter voltage peak value Collector-Base voltage (open emitter) Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage VBE = 0 V 0.32 0.1 700 700 400 12 24 80 1.0 40 0.5 V V V A A W V Fall time PINNING - TO220AB PIN PIN CONFIGURATION DESCRIPTION 1 base 2 collector 3 emitter tab Tmb ≤ 25 ˚C IC = 5.0 A;IB = 1.0 A IC = 5.0 A; VCE = 5 V IC = 5.0 A; IB1 = 1.0 A µs SYMBOL c tab b collector e 1 23 LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL PARAMETER CONDITIONS VCESM VCEO VCBO IC ICM IB IBM Ptot Tstg Tj Collector to emitter voltage Collector to emitter voltage (open base) Collector to base voltage (open emitter) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Total power dissipation Storage temperature Junction temperature VBE = 0 V Tmb ≤ 25 ˚C MIN. MAX. UNIT -65 - 700 400 700 12 24 6 12 80 150 150 V V V A A A A W ˚C ˚C TYP. MAX. UNIT - 1.56 K/W 60 - K/W THERMAL RESISTANCES SYMBOL PARAMETER Rth j-mb Junction to mounting base Rth j-a Junction to ambient March 1999 CONDITIONS in free air 1 Rev 1.000 Philips Semiconductors Preliminary specification Silicon Diffused Power Transistor PHE13009 STATIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL PARAMETER CONDITIONS ICES,ICBO ICES Collector cut-off current 1 VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 ˚C ICEO IEBO VCEOsust Collector cut-off current Emitter cut-off current Collector-emitter sustaining voltage VCEsat Collector-emitter saturation voltage VCEO = VCEOMmax (400V) VEB = 9 V; IC = 0 A IB = 0 A; IC = 10 mA; L = 25 mH IC = 5.0 A;IB = 1.0 A IC = 8.0 A;IB = 1.6 A VBEsat Base-emitter saturation voltage hFE hFEsat DC current gain IC = 5.0 A;IB = 1.0 A IC = 8.0 A;IB = 1.6 A IC = 5.0 A; VCE = 5 V IC = 8.0 A; VCE = 5 V MIN. TYP. MAX. UNIT - - 1.0 5.0 mA mA 400 - 0.1 1 - mA mA V - 0.32 - 1.0 2.0 V V 8 6 1.0 1.1 - 1.3 1.6 40 30 V V TYP. MAX. UNIT 2.2 0.26 3.3 0.7 µs µs 1.35 0.1 2.3 0.5 µs µs - 3.2 0.9 µs µs DYNAMIC CHARACTERISTICS Tmb = 25 ˚C unless otherwise specified SYMBOL ts tf PARAMETER CONDITIONS Switching times (resistive load) ICon = 5 A; IBon = -IBoff = 1 A; RL = 75 ohms; VBB2 = 4 V; Turn-off storage time Turn-off fall time Switching times (inductive load) ts tf Turn-off storage time Turn-off fall time Switching times (inductive load) ts tf Turn-off storage time Turn-off fall time ICon = 5 A; IBon = 1 A; LB = 1 µH; -VBB = 5 V ICon = 5A; IBon = 1 A; LB = 1 µH; -VBB = 5 V; Tj = 100 ˚C 1 Measured with half sine-wave voltage (curve tracer). March 1999 2 Rev 1.000 Philips Semiconductors Preliminary specification Silicon Diffused Power Transistor PHE13009 ICon 90 % + 50v 100-200R 90 % IC 10 % ts Horizontal ton tf toff Oscilloscope IBon IB Vertical 10 % 300R 1R tr 30ns 6V 30-60 Hz -IBoff Fig.4. Switching times waveforms with resistive load. Fig.1. Test circuit for VCEOsust. VCC IC / mA LC 250 IBon 100 LB T.U.T. 10 0 -VBB min VCE / V VCEOsust Fig.2. Oscilloscope display for VCEOsust. Fig.5. Test circuit inductive load. VCC = 300 V; -VBE = 5 V; LC = 200 uH; LB = 1 uH VCC ICon 90 % IC RL VIM 10 % RB 0 T.U.T. ts toff tp IB tf t IBon T t -IBoff Fig.6. Switching times waveforms with inductive load. Fig.3. Test circuit resistive load. VIM = -6 to +8 V VCC = 250 V; tp = 20 µs; δ = tp / T = 0.01. RB and RL calculated from ICon and IBon requirements. March 1999 3 Rev 1.000 Philips Semiconductors Preliminary specification Silicon Diffused Power Transistor 120 PHE13009 VBEsat VOLTAGE/V 1.4 Normalised Power Derating PD% 110 1.3 100 90 1.2 1.1 80 70 IC/IB = 3 1 60 50 0.9 0.8 40 30 0.7 20 10 0.6 0.5 0 0 20 40 60 80 100 Tmb / C 120 140 0.4 0.5 0.8 3 5 IC, COLLECTOR CURRENT/A 7 9 12 Fig.10. Base-Emitter saturation voltage. Solid lines = typ values, VBEsat = f(IC); at IC/IB =5. Fig.7. Normalised power dissipation. PD% = 100⋅PD/PD 25˚C = f (Tmb) HFE 50 VCEsat VOLTAGE/V 1.75 30 1.5 5V 20 1.25 15 1V 10 1 IC/IB = 3 0.75 5 0.5 2 0.25 0.01 0.05 0.1 0.5 IC/A 1 2 3 5 0 0.5 12 Fig.8. Typical DC current gain. hFE = f(IC) parameter VCE 0.8 3 5 IC, COLLECTOR CURRENT/A 7 9 12 Fig.11. Collector-Emitter saturation voltage. Solid lines = typ values, VCEsat = f(IC); at IC/IB =5. VCEsat/V 2 10 Zth / (K/W) 1.8 1.6 1.4 1 D= 0.5 1.2 1 0.8 0.1 0.6 0.2 0.1 0.05 0.02 0 PD tp D= 0.4 1A 0 0.01 T 4A 0.2 0.1 1 0.01 1E-06 3A 2A 10 IB/A 1E-02 t/s t 1E+00 Fig.12. Transient thermal impedance. Zth j-mb = f(t); parameter D = tp/T Fig.9. Collector-Emitter saturation voltage. Solid lines = typ values, VCEsat = f(IB); Tj=25˚C. March 1999 1E-04 tp T 4 Rev 1.000 Philips Semiconductors Preliminary specification Silicon Diffused Power Transistor PHE13009 IC/A 14 VCC 12 10 LC 8 VCL(RBSOAR) 6 IBon -5V 4 -3V 2 -1V -VBB PROBE POINT LB T.U.T. 0 0 100 200 300 400 500 VCEclamp/V 600 700 800 900 Fig.13. Reverse bias safe operating area (Tj < Tjmax) for -Vbe = 5V,3V and 1V. Fig.14. Test circuit for reverse bias safe operating area. Vclamp < 700V; Vcc = 150V; -Vbe = 5V,3V & 1V; LB = 1µH; LC = 200µH March 1999 5 Rev 1.000 Philips Semiconductors Preliminary specification Silicon Diffused Power Transistor PHE13009 MECHANICAL DATA Dimensions in mm 4,5 max Net Mass: 2 g 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 0,9 max (3x) 2,54 2,54 0,6 2,4 Fig.15. TO220AB; pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8". March 1999 6 Rev 1.000 Philips Semiconductors Preliminary specification Silicon Diffused Power Transistor PHE13009 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1999 7 Rev 1.000