Order this document by MOCZ500/D SEMICONDUCTOR TECHNICAL DATA GlobalOptoisolator Motorola Preferred Device This device consists of a gallium arsenide infrared emitting diode optically coupled to a zero–cross triac circuit and a power triac. It is capable of driving loads up to 500 mA rms on AC voltages from 20 to 280 V rms. • • • • • • • OPTOISOLATOR ZERO CROSS TRIAC OUTPUT Provides Normally Open AC Output with 500 mA Rating @ 40_C Small Outline, Standard 6–PIN DIP Package Simplified Logic Control of 240 Vac Power High Input–Output Isolation of 7500 Vac (rms) 7 Amp Single Cycle Surge Capability Wide Load Power Factor Range 0.1–1 Low Input/Output Capacitance Applications: • • • • • • Logic to AC Line Interface Microprocessor to AC Line Peripheral Industrial Controls EM Relays and Contactors Small AC Motor Drives Incandescent Lamp Drive • • • • CASE 730J–01 STYLE 1 Appliance Solenoids Appliance Actuators Appliance Fan Motors Appliance Lights PINOUT MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Symbol Value Unit 1 2 INPUT LED Reverse Voltage VR 6 V Forward Current — Continuous IF 50 mA Off–State Output Terminal Voltage (1) VDRM 600 V Peak Repetitive Surge Current (1 Cycle) ITSM I2T 7 A 0.4 A2sec IT(rms) 0.030 to 0.500 A pF 0.1 – 1.0 — VISO 7500 Vac(pk) Total Power Dissipation @ TA = 40°C (Device Soldered on PCB) PD 600 mW Junction Temperature Range TJ – 40 to +125 °C Ambient Operating Temperature Range TA – 40 to +85 °C Ambient Operating Relative Humidity @ TA = 85°C RHA 85 % Storage Temperature Range Tstg – 40 to +125 °C TL 260 °C 6 MOCZ500 3 4 1. LED Anode 2. LED Cathode 3. Not Connected 4. MT2 6. MT1 Connected to Internal Triac Heat Spreader OUTPUT TRIAC Main Terminal Fusing Current (t = 8.3 ms) On–State Current Range Load Power Factor Range COUPLER SCHEMATIC TOTAL DEVICE Isolation Surge Voltage (2) Soldering Temperature (10 sec) LED Drive Triac Anode Cathode 6 1 2 * 4 MT1 MT2 * ZERO VOLTAGE * ACTIVATION 1. Test voltages must be applied within dv/dt rating. 2. Input–Output isolation voltage, VISO. is an internal device dielectric breakdown rating. For this test, pins 1 and 2 are common and pins 4 and 6 are common. Preferred devices are Motorola recommended choices for future use and best overall value. REV 2 Optoelectronics Device Data Motorola Motorola, Inc. 1997 1 MOCZ500 THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance, Junction to Air (Device Soldered on PCB) RθJA 130 _C/W Thermal Resistance, Junction to Case (Pin 4) (Device Soldered on PCB) RθJC 40 _C/W ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Min Typ Max Unit Reverse Leakage Current (VR = 6 V) IR — 0.05 100 µA Forward Voltage (IF = 10 mA) VF — 1.2 1.5 V IDRM — — 100 µA dv/dt(s) — 2,000 — V/µs IH1 — 150 500 µA IFT(on) — — 10 mA On–State Voltage (IT = 500 mA) VTM — 1.2 1.5 V Inhibit Voltage (IF = IFT) VINH — 10 20 V Characteristic INPUT LED OUTPUT TRIAC Leakage with LED Off @ TA = 85°C (VDRM = 600 V) Critical Rate of Rise of Off–State Voltage (Static) (1) (Vp = 400 V) LED On, Driver Holding Current COUPLED LED Trigger Current Required to Latch Output (2) (3) (Main Terminal Voltage = 5 V) Commutating dv/dt Common–Mode Input–Output dv/dt Input–Output Capacitance Isolation Resistance @ 500 Vdc dv/dt (c) 10 — — V/µs dv/dt (cm) 40,000 — — V/µs CISO — — 1 pF RISO 1012 — — Ohms 1. Additional dv/dt information, including test methods, can be found in Motorola applications note AN1048/D, Figure 40. 2. All devices are guaranteed to trigger at as IF value less than or equal to the max IFT. Therefore, the recommended operating IF lies between the device’s maximum IFT(on) limit and the Maximum Rating of 60 mA. 3. Current–limiting resistor required in series with LED. ENVIRONMENTAL TEST REQUIREMENTS Test Test Conditions Autoclave TA = 121°C, RH = 100%, P = 15 PSIG, 48 Hr. Moisture Resistance Mil–Std–883, Method 1004 Temp Cycle TA = –40/+125°C, Air to Air, Dwell Resistance to Solder Heat Mil–Std–750, Method 2031, 260°C followed by VISO Lead Pull Mil–Std–750, Method 2036, Condition A, 2 lbs., 1 min. w15 min., Transfer v5 min., 200 Cycles LIFE TEST REQUIREMENTS Test Conditions Test Environment Bias Duration High Temperature, Reverse Bias TA = +100°C VTM = 280 Vac 1000 Hr. High Humidity, High Temperature, Reverse Bias TA = +85°C RH = 85% VTM = 100 Vdc Pin 4 = + Pin 6 = – 500 Hr. Intermittent Operating Life ton = 2 min. toff = 2 min. TA = +25°C IF = 50 mA ITM = 60 mA 1000 Hr. Human Body Model & Machine Models 1 & 2 N/A N/A ESD 2 Motorola Optoelectronics Device Data MOCZ500 TYPICAL ELECTRICAL CHARACTERISTICS 1.8 50 VF, FORWARD VOLTAGE (V) IF, FORWARD LED CURRENT (mA) 60 40 30 20 1.6 1.4 25°C 1 10 0 – 40 TA = – 40°C 1.2 85°C 0.8 – 20 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 100 1 Figure 1. Maximum Allowable Forward LED Current versus Ambient Temperature IT = IT Max Figure 2. LED Forward Voltage versus LED Forward Current 500 12 IT, TERMINAL CURRENT (mA) IFT, FORWARD TRIGGER CURRENT (mA) 14 GUARANTEED 10 8 6 TYPICAL 4 2 – 40 – 20 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 400 300 200 100 0 – 40 100 Figure 3. Forward Trigger Current versus Ambient Temperature IDRM , LEAKAGE CURRENT (µA) V TM, MAIN TERMINAL VOLTAGE (V) 1.2 TA = – 40°C 1 25°C 0.8 0.01 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 100 10 1.3 0.9 – 20 Figure 4. RMS ON–State Current versus Ambient Temperature 1.4 1.1 10 IF, FORWARD CURRENT (mA) 85°C 0.1 ITM, MAIN TERMINAL CURRENT (A) Figure 5. Main Terminal Voltage versus Main Terminal Current Motorola Optoelectronics Device Data 1 1 0.1 0.01 0.001 – 40 – 20 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 100 Figure 6. Typical Leakage Current versus Ambient Temperature 3 MOCZ500 300 11.5 250 11 VIH, INHIBIT VOLTAGE (V) IH, HOLDING CURRENT (µA) TYPICAL ELECTRICAL CHARACTERISTICS (continued) 200 150 100 50 – 40 10.5 10 9.5 – 20 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 100 9 – 40 – 20 Figure 7. Holding Current versus Ambient Temperature 0 20 40 60 TA, AMBIENT TEMPERATURE (°C) 80 100 Figure 8. Inhibit Voltage versus Ambient Temperature APPLICATION CONSIDERATIONS Input Drive Circuit The MOCZ500 SSR is guaranteed to trigger with an input current of 10 mA at 25°C. This trigger current increases with lower ambient temperatures as shown on Figure 3 Forward Trigger Current (IFT) versus Ambient Temperature. When the input drive circuit is capable to supply the MOCZ500 input LED trigger current, only a current limiting resistor in series with the LED is required. TTL, DTL and microcontrollers with enhanced current capability output ports are able to meet this requirement. Most CMOS logic circuits and Microcontroller output ports are not rated to sink or source currents required to trigger the MOCZ500. In this case a drive circuit is required as shown in Figure 10 or a TTL buffer interface circuit as shown in Figure 9. VCC R1 MOCZ500 R2 Q1 Vin Figure 10. Noninverting Discrete NPN Buffer and Level Shifter VCC VCC R1 R1 MOCZ500 TTI/DTL R1 for VCC (low) 4.5 V, IFT = 10 mA, VF LED = 1.2 V, VOL = 0.5 V R1 = (4.5 V – 1.2 V – 0.5 V): 10 mA = 280 Ω Choose 270 Ω Figure 9. Input Drive Circuit Snubber Circuit Snubberless operation of resistive loads is possible, but snubbers are recommended for all applications. A typical application is shown in Figure 11. The snubber attenuates the high kickback voltages and commutating dv/dt generated by inductive loads during the turn off of the SSR. It also protects the SSR from line transients generated elsewhere within the equipment (for example inductive loads switched by mechanical contacts such as relays manual on/off switches etc.) or outside the equipment such as air conditioners, electrical heaters and motors. 4 LOAD µP Rs R2 AC LINE Cs Q1 Buffer Circuit R1 = (VCC – VFLED – Vsat Q1): IF MOCZ500 R2 = 10 kΩ Q1 = General Purpose Trans. NPN Typical Snubber circuit: For inductive and resistive loads Rs = 45 Ω Cs = 0.01 µF Figure 11. Typical Application with an µP Output Buffer Motorola Optoelectronics Device Data MOCZ500 Snubbers are also necessary to pass noise immunity tests such as IEC1000 4–4 for fast transients. In this test fast rising high voltage spikes are superimposed onto the line voltage to simulate AC line transients. Switching Loads with Currents Below the Minimum Current Rating The MOCZ500 is capable to switch any inductive or resistive load within its rating of minimum 30 mA and a maximum of 500 mA RMS. At operating currents below the minimum specified value the Power triac remains in the off state and the triac driver carries the current. This may cause a problem, because the triac driver has a significant lower commutating dv/dt than the power triac. For loads below 30 mA AC rms a snubber is mandatory. Evaluations with various low current inductive and resistive loads concluded that a snubber of R = 100 Ω and C = 10 nF is sufficient. PAD FOR POWER DISSIPATION ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓ CREEPAGE AND CLEARANCE DISTANCE FOR SAFE ISOLATION (8mm FOR APPLIANCES) ENLARGED PAD FOR IMPROVED POWER DISSIPATION CREEPAGE AND CLEARANCE DISTANCE FOR FUNCTIONAL ISOLATION (3.5mm APPLIANCES JAPAN) Figure 12. Motorola Optoelectronics Device Data 5 MOCZ500 Thermal Considerations Heat generated inside the MOCZ500’s power triac is transferred through the leads to the circuit board where it is dissipated. It is therefore important to solder all leads to the circuit board. Pin 4 is thermally and electrically direct connected to the Power triac and carries the highest amount of thermal energy. For loads which approach the maximum current rating of the SSR it is advisable to layout the pad size for pin 4 as large as possible. See Figure 12 which considers thermal and Regulatory requirements on a PCB. Regulatory Safety Considerations The MOCZ500 is designed to meet the National and International Regulatory requirements for safe isolation between input and output and functional isolation creepage and clearance distances between the AC output pins. Many equipment standards demand a creepage and clearance distance between input and output circuit of 8mm and a thickness through insulation of 0.4mm (16 mil). All Motorola Optocouplers do meet the thickness through insulation requirement. Product with lead bend option “T” meets the creepage path requirement. The most stringent requirement for creepage and clearance between the AC output pins is 3.5mm. Figure 12 shows a PCB pattern layout which meets the regulatory requirements for 115 Vrms and 240 Vrms supply line applications. OUTLINE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. –A– 6 4 –B– 1 F –T– 4 PL SEATING PLANE 3 C N L K J G E M 5 PL D 5 PL 0.13 (0.005) M T A 0.13 (0.005) M B M 5 PL T B M M A M DIM A B C D E F G J K L M N STYLE 1: PIN 1. 2. 3. 4. 5. 6. INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.300 BSC 0_ 15 _ 0.015 0.100 MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 7.62 BSC 0_ 15_ 0.38 2.54 LED ANODE LED CATHODE NC MAIN TERMINAL ABSENT MAIN TERMINAL CASE 730J–01 ISSUE O 6 Motorola Optoelectronics Device Data MOCZ500 OUTLINE DIMENSIONS (continued) –A– 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 –B– 1 F –T– 3 4 PL N SEATING PLANE DIM A B C D E F G J K L N L C K STYLE 1: PIN 1. 2. 3. 4. 5. 6. G E 5 PL D 5 PL 0.13 (0.005) J M T A M B INCHES MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.21 0.30 2.54 3.81 10.16 10.80 0.38 1.02 M MILLIMETERS MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.008 0.012 0.100 0.150 0.400 0.425 0.015 0.040 LED ANODE LED CATHODE NC MAIN TERMINAL ABSENT MAIN TERMINAL CASE 730K–01 ISSUE O –A– 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 –B– 1 F 4 PL S 3 H L C –T– G E J 5 PL D 5 PL 0.13 (0.005) DIM A B C D E F G H J K L S K 5 PL 0.13 (0.005) M T A M B M T B SEATING PLANE M M A M INCHES MIN MAX 0.320 0.350 0.240 0.260 0.115 0.200 0.016 0.020 0.040 0.070 0.010 0.014 0.100 BSC 0.020 0.025 0.008 0.012 0.006 0.035 0.320 BSC 0.332 0.390 STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS MIN MAX 8.13 8.89 6.10 6.60 2.93 5.08 0.41 0.50 1.02 1.77 0.25 0.36 2.54 BSC 0.51 0.63 0.20 0.30 0.16 0.88 8.13 BSC 8.43 9.90 LED ANODE LED CATHODE NC MAIN TERMINAL ABSENT MAIN TERMINAL CASE 730L–01 ISSUE A Motorola Optoelectronics Device Data 7 MOCZ500 Motorola reserves the right to make changes without further notice to any products herein. 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