LD-001 Series LED displays Flat displays LD-001 Series The LD-001 series were designed in response to the need for medium-sized, flat displays. These are two-chip, flat displays with high luminance. !External dimensions (Units : mm) 10.7 +0 −0.1 0.3 5.6±0.1 (2.5) (2.5) 0.6 0.6 5.0±0.5 Cathode mark Max.0.8 Pin No.1 2 3 R4 !Features 1) 4.5 x 9.5 mm planar emission from two chips connected in series. 2) High luminance, uniform emission. 3) Four colors : red, orange, yellow and green. (1.8) 4.5±0.1 +0 5.7 −0.1 2° 9.5±0.1 Pin No.1 2 3 Tolerances are ±0.3 unless otherwise noted: !Selection guide Emitting color Type Red Orange Yellow Green LD-001VR LD-001DU∗ LD-001YY∗ LD-001MG ∗Order-based production. !Absolute maximum ratings (Ta = 25°C) Parameter Symbol Green LD-001MG Unit Power dissipation PD 120 120 120 150 mW Forward current Red LD-001VR Orange LD-001DU Yellow LD-001YY IF 20 20 20 25 mA Peak forward current IFP 60∗ 60∗ 60∗ 60∗ mA Reverse voltage VR 3 3 3 3 V Operating temperature Topr −25~+75 °C Storage temperature Tstg −30~+85 °C ∗ Pulse width 1ms duty 1 / 5 LD-001 Series LED displays !Electrical and optical characteristics (Ta = 25°C) Parameter Red Symbol Conditions Orange Yellow Green Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Forward voltage VF IF = 10mA − 2.0 2.8 − 2.0 2.8 − 2.1 2.8 − 2.1 2.8 V Reverse current IR VR = 3V − − 10 − − 10 − − 10 − − 10 µA Peak wavelength λP IF = 10mA − 650 − − 610 − − 585 − − 563 − nm Spectral line half width ∆λ IF = 10mA − 40 − − 40 − − 40 − − 40 − nm Electrical and optical values are guaranteed values per element. !Luminous intensity vs. wavelength Axial Luminous Intensity 1.0 0.8 Green Yellow Orange Red 0.6 0.4 0.2 0 500 550 600 650 700 750 Wavelength : λP (nm) !Luminous intensity Type Min. Typ. Max. Unit Red LD-001VR 2.2 6.3 − mcd Orange LD-001DU 2.2 6.3 − mcd Yellow LD-001YY 1.4 4.0 − mcd Green LD-001MG 3.6 10 − mcd Color Note 1: Measured at IF = 10mA Note 2: Current passes through 2 elements in series. !Operation notes When forming leads, the bend should be at least 2mm from the base of the package. Solder after forming the leads, and ensure that the inside of the LED is not subjected to mechanical stress while it is hot.