Order this document by MBR0540T1/D SEMICONDUCTOR TECHNICAL DATA SOD–123 Power Surface Mount Package The Schottky Power Rectifier employs the Schottky Barrier principle with a barrier SCHOTTKY BARRIER metal that produces optimal forward voltage drop–reverse current tradeoff. Ideally RECTIFIER suited for low voltage, high frequency rectification, or as a free wheeling and polarity 0.5 AMPERES protection diodes in surface mount applications where compact size and weight are 40 VOLTS critical to the system. This package provides an alternative to the leadless 34 MELF style package. These state–of–the–art devices have the following features: • Guardring for Stress Protection • Very Low Forward Voltage • Epoxy Meets UL94, VO at 1/8″ • Package Designed for Optimal Automated Board Assembly Mechanical Characteristics: • Reel Options: 3,000 per 7 inch reel / 8 mm tape CASE 425–04, Style 1 • Reel Options: 10,000 per 13 inch reel / 8 mm tape SOD–123 • Device Marking: B4 • Polarity Designator: Cathode Band • Weight: 11.7 mg (approximately) • Case: Epoxy Molded • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C max. for 10 Seconds MAXIMUM RATINGS Rating Symbol Value Unit VRRM VRWM VR 40 V IO 0.5 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = 115°C) IFRM 1.0 A Non–Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM 5.5 A Tstg, TC –55 to 150 °C TJ –55 to 150 °C dv/dt 1,000 V/ms Rtjl Rtja 118 206 °C/W Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 115°C) Storage / Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25°C) THERMAL CHARACTERISTICS Thermal Resistance – Junction–to–Lead (2) Thermal Resistance – Junction–to–Ambient (3) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (1) VF (IF = 0.5 A) (IF = 1 A) Maximum Instantaneous Reverse Current (VR = 40 V) (VR = 20 V) IR TJ = 25°C TJ = 100°C 0.51 0.62 0.46 0.61 TJ = 25°C TJ = 100°C 20 10 5,000 13,000 V mA This document contains information on a new product. Specifications and information herein are subject to change without notice. (1) Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2.0%. (2) Mounted with minimum recommended pad size, PC Board FR4. (3) 1 inch square pad size (1 X 0.5 inch for each lead) on FR4 board. Rev 2 Device Rectifier Motorola, Inc. 1996 Data 1 100 10 25°C 1.0 TJ = –40°C TJ = 125°C TJ = 25°C TJ = 100°C 0.1 0.2 0.4 0.6 1.0 0.8 1.2 TJ = 100°C TJ = 25°C 0.1 0.2 0.4 0.6 0.8 1.0 1.2 Figure 2. Maximum Forward Voltage 100E–3 I R, MAXIMUM REVERSE CURRENT (AMPS) I R, REVERSE CURRENT (AMPS) TJ = 125°C Figure 1. Typical Forward Voltage 10E–3 TJ = 125°C 1.0E–3 TJ = 125°C 10E–3 1.0E–3 TJ = 100°C 100E–6 TJ = 100°C 10E–6 1.0E–6 TJ = 25°C 100E–9 10E–6 TJ = 25°C 1.0E–6 100E–9 0 10 20 40 30 PFO , AVERAGE POWER DISSIPATION (WATTS) SQUARE WAVE Ipk/Io = p Ipk/Io = 5 0.3 Ipk/Io = 10 0.2 Ipk/Io = 20 0.1 0 20 30 40 Figure 4. Maximum Reverse Current FREQ = 20 kHz 0.4 20 Figure 3. Typical Reverse Current 0.7 0.5 10 VR, REVERSE VOLTAGE (VOLTS) dc 0.6 0 VR, REVERSE VOLTAGE (VOLTS) 0.8 I O , AVERAGE FORWARD CURRENT (AMPS) 1.0 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100E–6 2 10 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100E–3 0 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) MBR0540T1 40 60 80 100 120 140 0.45 0.40 SQUARE WAVE 0.35 dc Ipk/Io = p 0.30 Ipk/Io = 5 0.25 Ipk/Io = 10 0.20 Ipk/Io = 20 0.15 0.10 0.05 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating Figure 6. Forward Power Dissipation 0.8 Rectifier Device Data MBR0540T1 TJ , DERATED OPERATING TEMPERATURE ( °C) 100 C, CAPACITANCE (pF) TJ = 25°C 10 R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) 0 5.0 10 15 20 25 30 35 126 124 Rtja = 118°C/W 122 120 118 149°C/W 116 180°C/W 114 206°C/W 112 228°C/W 110 40 0 5.0 10 15 20 25 30 35 40 VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS) Figure 7. Capacitance Figure 8. Typical Operating Temperature Derating* * Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ may be calculated from the equation: TJ = TJmax – r(t)(Pf + Pr) where r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax – r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. 1.00E+00 1.00E–01 50% 20% 10% 5.0% 2.0% 1.0% 1.00E–02 Rtjl(t) = Rtjl*r(t) 1.00E–03 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1,000 10 100 1,000 R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) T, TIME (s) Figure 9. Thermal Response Junction to Lead 1.00E+00 1.00E–01 50% 20% 10% 5.0% 2.0% 1.00E–02 1.0% 1.00E–03 0.00001 Rtjl(t) = Rtjl*r(t) 0.0001 0.001 0.01 0.1 1.0 T, TIME (s) Figure 10. Thermal Response Junction to Ambient Rectifier Device Data 3 MBR0540T1 RECOMMENDED FOOTPRINT FOR SOD–123 ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ 0.91 0.036 2.36 0.093 4.19 0.165 1.22 0.048 mm inches SOD–123 PACKAGE DIMENSIONS A ÂÂÂÂ ÂÂÂÂ ÂÂÂÂ C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. H 1 K DIM A B C D E H J K B INCHES MIN MAX 0.055 0.071 0.100 0.112 0.037 0.053 0.020 0.028 0.004 ––– 0.000 0.004 ––– 0.006 0.140 0.152 MILLIMETERS MIN MAX 1.40 1.80 2.55 2.85 0.95 1.35 0.50 0.70 0.25 ––– 0.00 0.10 ––– 0.15 3.55 3.85 E 2 STYLE 1: PIN 1. CATHODE 2. ANODE J D CASE 425–04 ISSUE C Motorola reserves the right to make changes without further notice to any products herein. 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