Product Brief BP2 Entry & Basic Platform Infineon’s cost-optimised GSM/GPRS platform BP2 is one of the highest integrated and most complete system solutions available today. It allows customers to develop and market mobile phones in record time. Included are all components needed to build a mobile phone: baseband, RF, power management and cellular RAM ICs, complemented by state of the art protocol stack, the APOXI TM application framework and a fully customizable Man-Machine-Interface (MMI) Infineon’s development environment offers development boards, a comprehensive tool chain and a SDK for the application framework. Customers will also benefit from Infineon’s extensive experience with chipsets and complete customized solutions in the mobile market. The BP2 fulfills all requirements to meet the handset success factors in the entry and basic phone segment: lowest-cost electronic bill-of-material, smallest PCB size area and a hardware independent application and MMI development platform. Therefore handset manufacturers can completely concentrate on handset differentiation factors like design, product variants, MMI styles etc. www.infineon.com/mobilesolutions Mobile Solutions N e v e r s t o p t h i n k i n g . Product Brief BP2 Modem Functions Standards ■ GSM/GPRS Dualband ■ Triband & Quadband options ■ RF Band: 850/900/1800/1900 MHz ■ Protocol stack GSM/GPRS Rel. 97 Data Features ■ GPRS class B, multi-slot class 10, coding scheme CS 1..4 ■ CSD 9.6 kbit/s ■ SMS MO/MT, cell broadcast ■ AT command set ■ Fax class 2 ■ STK class 3 Voice Features ■ Telephony ■ Vocoders: HR, FR, EFR, AMR ■ Echo cancellation ■ Noise suppression Supported Applications Common SW Feature Set ■ WAP 2.0 ■ EMS Rel. 5 ■ MMS Rel. 1.1 ■ Java MIDP 1.0 ■ Integrated polyringer 32 voices @ 16 kHz ■ Predictive text input ■ Voice dialling & command Optional Hardware Features ■ IrDA 115 kbit/s ■ Stereo FM radio ■ Polyphone ringer more than 40 voices ■ Integrated camera System Architecture of BP2 Key Components ■ Baseband E-GOLDlite ■ Power management E-Powerlite ■ RF transceiver SMARTi SD ■ 16 – 32 Mbit Cellular RAM Handsfree, 8 Ω/400 mW 32 Polyphone Ringer Vibrator Charge Earpiece and Poly-Ringer Backlight E-Powerlite Analog Predefined Component Hardware Option Customer Specific Infineon Component 1 2 3 4 5 6 7 8 9 * 0 # IQ/RF Control 6x4 PA SMARTi SD FEM E-GOLDlite µC C166 @ 52 MHz TEAKlite @ 104 MHz V24/IrDA Modulated IrDA Driver and Diodes IrDA Option Standard or Secondary Display B&W or Color SIM Card Battery Li-Ion, Li-Pol, NiMH I2C I2C, SSC Flash Polyphone Ringer Cellular RAM Direct SIM Interface RTC Back-up Data + Address Bus Connectors > 32 Voices Display/ Camera Controller Up to VGA Highest Integrated GSM/GPRS Platform Leading low-cost GSM/GPRS platform for basic & entry level terminals ■ 140 components (without customer specific parts) ■ Leading edge eBOM ■ CMOS RF transceiver ■ Comprehensive feature set built-in Smallest system PCB size ■ ■ Modem 10 cm 2 Flip-chip baseband, 8 x 8 mm A P O X I TM A p p l i c a t i o n F r a m e w o r k The APOXI TM Application Framework enables and includes ■ A platform independent, easily reusable environment for rapid development and cost efficient solutions ■ A powerful reference MMI with a broad range of pre-integrated reference applications ■ An open API to enable unlimited 3rd party applications ■ APIs for SIM, NVRAM, Flash, Display, Audio, Video, Real Time Operating Systems and the TCP/UDP family ■ An object-oriented framework, ideal for developing customized “Look & Feel” MMIs & applications ■ Support for Java, camera, and a broad range of advanced multimedia codecs ■ An innovative roadmap of advanced applications provided by a leading developer network How to reach us: http://www.infineon.com Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81669 München © Infineon Technologies AG 2004. All Rights Reserved. Template: pb_tmplt.fm/4/2004-01-01 Published by Infineon Technologies AG Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Ordering No. B134-H8365-X-0-7600 Printed in Germany PS 0104.8 NB