PHILIPS BT169

Philips Semiconductors
Product specification
Thyristor
logic level
GENERAL DESCRIPTION
Glass passivated, sensitive gate
thyristor in a plastic envelope, suitable
for surface mounting, intended for use
in general purpose switching and
phase control applications. This
device is intended to be interfaced
directly to microcontrollers, logic
integrated circuits and other low
power gate trigger circuits.
PINNING - SOT223
PIN
QUICK REFERENCE DATA
SYMBOL
VDRM,
VRRM
IT(AV)
IT(RMS)
ITSM
PARAMETER
cathode
2
anode
3
gate
anode
MAX. MAX. MAX. MAX. UNIT
BT169
Repetitive peak
off-state voltages
Average on-state
current
RMS on-state current
Non-repetitive peak
on-state current
PIN CONFIGURATION
DESCRIPTION
1
tab
BT169W Series
BW
200
DW
400
EW
500
GW
600
V
0.5
0.5
0.5
0.5
A
0.8
8
0.8
8
0.8
8
0.8
8
A
A
SYMBOL
4
a
2
1
k
g
3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
VDRM, VRRM Repetitive peak off-state
voltages
IT(AV)
Average on-state current
IT(RMS)
ITSM
RMS on-state current
Non-repetitive peak
on-state current
I2t
dIT/dt
IGM
VGM
VRGM
PGM
PG(AV)
Tstg
Tj
half sine wave;
Tsp ≤ 112 ˚C
all conduction angles
half sine wave;
Tj = 25 ˚C prior to surge
t = 10 ms
t = 8.3 ms
t = 10 ms
ITM = 2 A; IG = 10 mA;
dIG/dt = 100 mA/µs
I2t for fusing
Repetitive rate of rise of
on-state current after
triggering
Peak gate current
Peak gate voltage
Peak reverse gate voltage
Peak gate power
Average gate power
over any 20 ms period
Storage temperature
Operating junction
temperature
MAX.
B
2001
D
4001
E
5001
UNIT
G
6001
V
-
0.63
A
-
1
A
-
8
9
0.32
50
A
A
A2s
A/µs
-40
-
1
5
5
2
0.1
150
125
A
V
V
W
W
˚C
˚C
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
September 1997
1
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
logic level
BT169W Series
THERMAL RESISTANCES
SYMBOL
PARAMETER
Rth j-sp
Thermal resistance
junction to solder point
Thermal resistance
junction to ambient
Rth j-a
CONDITIONS
pcb mounted, minimum footprint
pcb mounted; pad area as in fig:14
MIN.
TYP.
MAX.
UNIT
-
-
15
K/W
-
156
70
-
K/W
K/W
MIN.
TYP.
MAX.
UNIT
0.2
50
2
2
1.35
0.5
0.3
200
6
5
1.5
0.8
-
µA
mA
mA
V
V
V
-
0.05
0.1
mA
MIN.
TYP.
MAX.
UNIT
-
25
-
V/µs
-
2
-
µs
-
100
-
µs
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
IGT
IL
IH
VT
VGT
Gate trigger current
Latching current
Holding current
On-state voltage
Gate trigger voltage
ID, IR
Off-state leakage current
VD = 12 V; IT = 10 mA; gate open circuit
VD = 12 V; IGT = 0.5 mA; RGK = 1 kΩ
VD = 12 V; IGT = 0.5 mA; RGK = 1 kΩ
IT = 2 A
VD = 12 V; IT = 10 mA; gate open circuit
VD = VDRM(max); IT = 10 mA; Tj = 125 ˚C;
gate open circuit
VD = VDRM(max); VR = VRRM(max); Tj = 125 ˚C;
RGK = 1 kΩ
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL
PARAMETER
CONDITIONS
dVD/dt
Critical rate of rise of
off-state voltage
Gate controlled turn-on
time
Circuit commutated
turn-off time
VDM =67% VDRM(max); Tj = 125 ˚C;
exponential waveform; RGK = 1k Ω
ITM = 2 A; VD = VDRM(max); IG = 10 mA;
dIG/dt = 0.1 A/µs
VD = 67% VDRM(max); Tj = 125 ˚C;
ITM = 1.6 A; VR = 35 V; dITM/dt = 30 A/µs;
dVD/dt = 2 V/µs; RGK = 1 kΩ
tgt
tq
September 1997
2
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
logic level
1
BT169W Series
BT169W
Ptot / W
conduction form
angle
factor
degrees
a
30
4
60
2.8
90
2.2
120
1.9
180
1.57
0.8
Tsp(max) / C
1.9
8
116
6
0.4
119
4
0.2
122
2
125
0.7
0
0
2.2
0.1
0.2
0.3
0.4
IF(AV) / A
0.5
0.6
Fig.1. Maximum on-state dissipation, Ptot, versus
average on-state current, IT(AV), where a = form
factor = IT(RMS)/ IT(AV).
1000
1
10
100
Number of half cycles at 50Hz
1000
Fig.4. Maximum permissible non-repetitive peak
on-state current ITSM, versus number of cycles, for
sinusoidal currents, f = 50 Hz.
BT169
ITSM / A
I TSM
time
T
Tj initial = 25 C max
2.8
4
0
BT169
IT
113
0.6
ITSM / A
10
110
a = 1.57
2
IT(RMS) / A
BT134W
1.5
100
1
10
I TSM
IT
0.5
time
T
Tj initial = 25 C max
1
10us
100us
0
0.01
10ms
1ms
T/s
Fig.2. Maximum permissible non-repetitive peak
on-state current ITSM, versus pulse width tp, for
sinusoidal currents, tp ≤ 10ms.
1.2
1.6
10
VGT(Tj)
VGT(25 C)
BT151
1.4
0.8
1.2
0.6
1
0.4
0.8
0.2
0.6
0
50
Tsp / C
100
0.4
-50
150
Fig.3. Maximum permissible rms current IT(RMS) ,
versus solder point temperature Tsp.
September 1997
1
112 C
1
0
-50
surge duration / s
Fig.5. Maximum permissible repetitive rms on-state
current IT(RMS), versus surge duration, for sinusoidal
currents, f = 50 Hz; Tsp ≤ 112˚C.
BT134W
IT(RMS) / A
0.1
0
50
Tj / C
100
150
Fig.6. Normalised gate trigger voltage
VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
3
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
logic level
3
BT169W Series
IGT(Tj)
IGT(25 C)
5
BT169
BT169W
IT / A
Tj = 125 C
Tj = 25 C
2.5
4
2
3
Vo = 1.0 V
Rs = 0.27 Ohms
1.5
typ
2
max
1
1
0.5
0
-50
0
50
Tj / C
100
0
150
IL(Tj)
IL(25 C)
0.5
1
1.5
2
2.5
VT / V
Fig.10. Typical and maximum on-state characteristic.
Fig.7. Normalised gate trigger current
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
3
0
100
BT169
2.5
BT169W
Zth j-sp (K/W)
10
2
1
1.5
P
D
1
tp
0.1
0.5
t
0
-50
0
50
Tj / C
100
0.01
10us
150
IH(Tj)
IH(25 C)
1ms
10ms
0.1s
1s
10s
tp / s
Fig.11. Transient thermal impedance Zth j-sp, versus
pulse width tp.
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C),
versus junction temperature Tj, RGK = 1 kΩ.
3
0.1ms
1000
BT169
dVD/dt (V/us)
2.5
100
RGK = 1 kohms
2
1.5
10
1
0.5
0
-50
0
50
Tj / C
100
1
150
50
100
150
Tj / C
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C),
versus junction temperature Tj, RGK = 1 kΩ.
September 1997
0
Fig.12. Typical, critical rate of rise of off-state voltage,
dVD/dt versus junction temperature Tj.
4
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
logic level
BT169W Series
MOUNTING INSTRUCTIONS
Dimensions in mm.
3.8
min
1.5
min
2.3
1.5
min
6.3
(3x)
1.5
min
4.6
Fig.13. soldering pattern for surface mounting SOT223.
PRINTED CIRCUIT BOARD
Dimensions in mm.
36
18
60
4.5
4.6
9
10
7
15
50
Fig.14. PCB for thermal resistance and power rating for SOT223.
PCB: FR4 epoxy glass (1.6 mm thick), copper laminate (35 µm thick).
September 1997
5
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
logic level
BT169W Series
MECHANICAL DATA
Dimensions in mm
6.7
6.3
Net Mass: 0.11 g
B
3.1
2.9
0.32
0.24
0.2
4
A
A
0.10
0.02
16
max
M
7.3
6.7
3.7
3.3
13
2
1
10
max
1.8
max
1.05
0.80
2.3
0.60
0.85
4.6
3
0.1 M
B
(4x)
Fig.15. SOT223 surface mounting package.
Notes
1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines".
Order code: 9397 750 00505.
2. Epoxy meets UL94 V0 at 1/8".
September 1997
6
Rev 1.200
Philips Semiconductors
Product specification
Thyristor
logic level
BT169W Series
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1997
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
September 1997
7
Rev 1.200