ROHM BU28SA4WGWL

Datasheet
CMOS LDO Regulators for Portable Equipments
1ch 200mA
CMOS LDO Regulators
BUxxSA4 series
●General Description
BUxxSA4 series are high-performance CMOS LDO
regulators with output current ability of up to 200-mA.
These devices have excellent noise and load response
characteristics despite of its low circuit current
consumption of 40µA. They are most appropriate for
various applications such as power supplies for logic IC,
RF, and camera modules.
●Key Specifications
„ Input Power Supply Voltage Range:
1.7V to 5.5V
„ Output Current Range:
0 to 200mA
„ Operating Temperature Range:
-40℃ to +85℃
„ Output Voltage Lineup:
1.8V,2.5V,2.55V
2.8V,3.0V,3.3V
„ Output Voltage Accuracy:
±0.6%
„ Circuit Current:
40µA(Typ.)
„ Standby Current:
0μA (Typ.)
●Package
W(Typ.) x D(Typ.) x H(Max.)
UCSP50L1(BUXXSA4WGWL)
0.8mm x 0.8mm x 0.5mm
●Features
„ High Output Voltage Accuracy: ±0.6%
(±15mV on VOUT<2.5V)
„ High Ripple Rejection: 70 dB (Typ, 1 kHz,)
„ Compatible with small ceramic capacitor
(Cin=Cout=0.47 µF)
„ Low Current Consumption: 40 µA
„ Output Voltage ON/OFF control
„ Built-in Over Current Protection Circuit (OCP)
„ Built-in Thermal Shutdown Circuit (TSD)
„ Adopting ultra-small WLCSP UCSP50L1
●Applications
„ Portable devices
„ Camera modules
„ Other electronic devices using microcontrollers or
logic circuits
●Typical Application Circuit
Vin
VOUT
VIN
Cin
Vout
Cout
BUxxSD2MG-M
BUxxSA4
On
Off
STBY
GND
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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Datasheet
BUxxSA4 series
●Pin Configuration
1Pin Mark
1
2
A
B
Top View
(Mark Side)
B
A
1
2
Bottom View
●Pin Description
Pin No.
Symbol
Function
A1
GND
GND Pin
A2
STBY
Output Control Pin
(High:ON, Low:OFF)
B1
VOUT
Output Pin
B2
VIN
Input Pin
●Block Diagram
VIN
VIN
1
VREF
VOUT
Cin
VOUT
5
GND 2
OCP
Cout
TSD
VSTBY
STBY
3
STBY
4 N.C.
Cin(min)=0.47µF (Ceramic)
Cout(min)=0.47µF (Ceramic)
Figure 2. Block diagram
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Datasheet
BUxxSA4 series
●Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
VMAX
-0.3 to +6.5
V
Power Dissipation
Pd
410(*1)
mW
Maximum Junction
Temperature
Tjmax
+125
℃
Operating Temperature Range
Topr
-40 to +85
℃
Storage Temperature Range
Tstg
-55 to +125
℃
Power Supply Voltage
(*1)
Derate by 4.1mW/℃ when operating above Ta=25℃.(When mounted on a board 63mm×55mm×1.6mm glass-epoxy board, 9 layer)
●Recommended Operating Ratings
Parameter
Symbol
Limit
Unit
VIN
1.7 to 5.5
V
Input Power Supply Voltage
Range
●Recommended Operating Conditions
Parameter
Symbol
Input capacitor
Output capacitor
Rating
Unit
Conditions
－
µF
A ceramic capacitor is recommended.
－
µF
A ceramic capacitor is recommended.
Min.
Typ.
Max.
Cin
0.47(*2)
1.0
Cout
0.47(*2)
1.0
(*2) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics,
DC device characteristics, and degradation with time.
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Datasheet
BUxxSA4 series
●Electrical Characteristics
(*6)
(Unless otherwise noted, Ta=-25℃, VIN=VOUT+1.0V , VSTBY=1.5V, Cin=1μF, Cout=1μF.)
Limit
PARAMETER
Symbol
Unit
Conditions
MIN.
TYP.
MAX.
VOUT
VOUT
IOUT = 10μA, VOUT≧2.5V
×0.994
×1.006
Output Voltage 1
VOUT1
VOUT
V
VOUT
VOUT
IOUT = 10μA, VOUT＜2.5V
-15mV
+15mV
IOUT=0 to 200mA, VOUT≧2.5V
VOUT
VOUT
VIN=VOUT+0.5 to 5.5V
×0.98
×1.02
Ta=-40 to +85℃(*3,4,5)
Output Voltage 2
VOUT2
VOUT
V
IOUT=0 to 200mA, VOUT＜2.5V
VOUT
VOUT
VIN=3.0 to 5.5V
-50mV
+50mV
(*3,4,5)
Ta=-40 to +85℃
Circuit Current 1
IGND1
40
65
μA
IOUT=0mA
Circuit Current 2
IGND2
40
80
μA
Ta=-40 to +85℃(*4), IOUT=0mA
Circuit Current (STBY)
ICCST
1.0
μA
STBY=0V
Ripple Rejection Ratio1
RR1
70
dB
VRR=-20dBv,fRR=1kHz,IOUT=10mA
Ripple Rejection Ratio2
RR2
55
dB
VRR=-20dBv,fRR=10kHz,IOUT=10mA
Ripple Rejection Ratio3
RR3
45
dB
VRR=-20dBv,fRR=100kHz,IOUT=10mA
VIN=0.98×VOUT, IOUT=100mA
80
150
mV
Ta=-40 to +85℃, VOUT≧2.5V
Dropout Voltage
VDROP
VIN=0.98×VOUT, IOUT=100mA
150
360
mV
Ta=-40 to +85℃, VOUT＜2.5V
Io=1 to 150mA,Trise=Tfall=1μs,
Load transient resp.
VLOT
±65
mV
VIN=VOUT+1.0V(*4)
VIN=VOUT+0.5 to VOUT+1.0V,
Line Transient resp.
VLIT
±5
mV
Trise=Tfall=10μs
VNOIS
-
30
-
μVrms
Startup time
TST
-
100
300
μsec
Line Regulation
VDLI
-
2
8
mV
IOUT=10mA VIN=VOUT+0.5 to 5.5V(*5)
Load Regulation1
VDLO1
-
2
8
mV
IOUT=1 to 100mA
Load Regulation2
VDLO2
-
4
16
mV
IOUT=1 to 200mA
Maximum Output Current
Limit Current
Short Current
STBY Pin Current
ON
STBY Control
Voltage
OFF
IOMAX
ILMAX
ISHORT
ISTBY
VSTBH
VSTBL
200
250
1.1
-0.2
400
100
-
200
4.0
VIN
0.5
mA
mA
mA
μA
V
V
VIN=VOUT+1.0V(*6)
Vo=VOUT×0.98
Vo=0V
Output noise voltage
Bandwidth 10 to 100kHz
Output voltage settled
within tolerancies
Ta=-40 to +85℃
(*3) Operating conditions are limited by Pd.
(*4) Typical values apply for Ta=25℃.
(*5) VIN=3.0V to 5.0V for VOUT＜2.5V.
(*6) VIN=3.5V for VOUT＜2.5V.
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Datasheet
BUxxSA4 series
●Reference data BU18SA4WGWL (Unless otherwise specified, Ta=25℃.)
1.90
1.80
VIN=ST BY
Output Voltage (V)
Output Voltage (V)
1.88
T emp=25°C
1.60
1.40
1.20
IOUT =0uA
1.00
IOUT =50mA
0.80
IOUT =200mA
0.60
0.40
Temp=25°C
VIN=STBY
1.86
1.84
1.82
1.80
1.78
1.76
IOUT =0uA
IOUT =50mA
1.74
IOUT =200mA
0.20
1.72
0.00
1.70
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
1
1.5
Input Voltage (V)
3
3.5
4
4.5
5
5.5
Figure 4. Line Regulation
1.90
100
1.88
VIN=2.8V
ST BY=1.5V
1.86
VIN=ST BY
Output Voltage (V)
IOUT =0uA
GND Current (uA)
2.5
Input Voltage (V)
Figure 3. Output Voltage vs. Input Voltage
80
2
Temp=-40°C
Temp=25°C
Temp=85°C
60
40
1.84
Temp=25°C
1.82
1.80
1.78
1.76
Temp=-40°C
1.74
20
Temp=85°C
1.72
0
1.70
0 0.5
1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage (V)
50
100
150
200
Output Current (mA)
Figure 5. GND Current vs. Input Voltage
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Figure 6. Load Regulation
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Datasheet
BUxxSA4 series
●Reference data BU18SA4WGWL (Unless otherwise specified, Ta=25℃.)
2.5
120
100
2.0
80
Temp=25°C
Output Voltage (V)
GND Current (uA)
Temp=85°
60
40
VIN=2.8V
Temp=-40°C
20
1.5
VIN=2.3V
VIN=2.8V
VIN=5.5V
1.0
Temp=25°C
0.5
ST BY=1.5V
STBY=1.5V
0.0
0
0
50
100
150
0
200
100
Output Current (mA)
Figure 7. GND Current vs. Output Current
VIN=2.8V
STBY=1.5V
Io=0.1mA
50
1.80
1.78
1.76
1.74
-40
500
60
GND Current (uA)
Output Voltage (V)
1.82
400
Figure 8. OCP Threshold
1.86
1.84
200
300
Output Current (A)
40
30
20
VIN=2.8V
STBY=1.5V
Io=0.1mA
10
-15
10
35
60
0
-40
85
Temperature (°C)
10
35
60
85
Temperature (°C)
Figure 10. GND Current vs. Temperature
Figure 9. Output Voltage vs. Temperature
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Datasheet
BUxxSA4 series
●Reference data BU18SA4WGWL (Unless otherwise specified, Ta=25℃.)
100
3.5
90
VIN=2.8V
Io=0.1mA
80
GND Current (at STBY) (nA)
Output Voltage (V)
3.0
2.5
2.0
Temp=-40°C
Temp=25°C
Temp=85°C
1.5
1.0
0.5
0.0
VIN=5.5V
STBY=0V
70
60
50
40
30
20
10
0
-40
0
0.25
0.5
0.75
1
1.25
-15
10
35
60
85
1.5
Temperature (°C)
STBY Voltage (V)
Figure 11. STBY Threshold
Figure 12. GND Current (at STBY) vs. Temperature
1.6
STBY Pin Current (uA)
1.4
1.2
1.0
0.8
Temp=-40°C
Temp=25°C
Temp=85°C
0.6
0.4
0.2
0.0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
STBY Voltage (V)
Figure 13. STBY Pin Current vs. STBY Pin Voltage
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Datasheet
BUxxSA4 series
80
100
70
90
Ripple Rejection (dB)
Ripple Rejection (dB)
●Reference data BU18SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
60
50
40
30
20
Ta = 25℃
Iout = 10mA
VIN_AC = -20dBV
10
0
1.5
2
2.5
3
3.5
4
4.5
5
Ta = 25℃
Iout = 10mA
80
70
60
50
40
30
20
10
0
100
5.5
1000
Figure 14. Ripple Rejection vs. Input Voltage
100000
Figure 15. Ripple Rejection vs. Freqency
10
Output Noise Density (uV / √Hz)
70
60
Output Noise (uVrms)
10000
Frequency (Hz)
Input Voltage (V)
50
40
30
20
Ta = 25℃
Vin = 2.8V
10
Ta = 25℃
Iout = 10mA
1
0.1
0.01
0
0
50
100
150
200
100
1000
10000
100000
Figure 17. Output Noise Density vs. Frequency
Figure 16. Output Noise vs. Output Current
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10
Frequency (Hz)
Output Current (mA)
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Datasheet
BUxxSA4 series
●Reference data BU18SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
1V/div
1.0
0.0
2.0
STBY=0V→1.5V
0.0
20us/div
Output Volatage(V)
Output Volatage(V)
20us/div
VOUT
2.0
Cout=0.47uF
Cout=1uF
1.0
0.0
Cout=2.2uF
1V/div
VIN=2.8V
2.0
0.0
1.0
STBY=1.5V→0V
20us/div
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1V/div
0.0
VIN=2.8V
Figure 20. Discharge time ( Rout = none )
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1V/div
0.0
400ms/div
VOUT
VIN=2.8V
2.0
Output Volatage(V)
Output Volatage(V)
0.0
3.0
1V/div
STBY Voltage(V)
1V/div
STBY Voltage(V)
1.0
1.0
Cout=1uF
Cout=2.2uF
Figure 19. Startup time ( Rout = 9 ohm )
2.0
2.0
Cout=0.47uF
1.0
Figure 18. Startup time ( Rout = none )
STBY=1.5V→0V
1.0
1V/div
2.0
1.0
VOUT
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1V/div
0.0
VIN=2.8V
Figure 21. Discharge time ( Rout = 9 ohm )
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STBY Voltage(V)
STBY=0V→1.5V
STBY Voltage(V)
2.0
Datasheet
BUxxSA4 series
●Reference data BU18SA4WGWL (Unless otherwise specified, Ta=25℃, Cin = Cout =1μF.)
100
Output Volatage(V)
IOUT=1mA→150mA
1.85
0
100
100mA/div
2.0us/div
1.80
1.75
VOUT
50mV/div
1.70
2.0us/div
1.85
VOUT
1.80
1.75
Output Volatage(V)
2.3
1.81
1.80
10mV/div
1.79
STBY=2.9V→2.3V
Io=10mA
Cout=1uF
2.7
2.5
2.3
Figure 24. Line response
( Vin= 2.3V → 2.9V)
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2.9
200mV/div
Output Volatage(V)
2.5
VIN=2.9V→2.3V
Input Voltage(V)
2.7
Input Voltage(V)
2.9
10us/div
50mV/div
Figure 23. Load response
( Iout = 150mA → 1mA)
VIN=2.3V→2.9V
STBY=2.3V→2.9V
Io=10mA
Cout=1uF
VIN=2.8V
STBY=2.8V
Cout=1uF
1.90
Figure 22. Load response
( Iout = 1mA → 150mA)
200mV/div
0
IOUT=150mA→1mA
Output Volatage(V)
VIN=2.8V
STBY=2.8V
Cout=1uF
200
Output Current(mA)
100mA/div
Output Current(mA)
200
10us/div
1.81
1.80
VOUT
1.79
Figure 25. Line response
( Vin= 2.9V → 2.3V)
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Datasheet
BUxxSA4 series
●Reference data BU28SA4WGWL (Unless otherwise specified, Ta=25℃.)
3.2
2.90
Temp=25°C
2.8
2.88
VIN=STBY
2.4
O utput Voltage (V)
O utput Voltage (V)
VIN=STBY
2.0
1.6
1.2
0.8
IO=0uA
IO=50mA
IO=200mA
0.4
2.85
Temp=25°C
2.83
IO=0uA
IO=50mA
IO=200mA
2.80
2.78
2.75
2.73
2.70
0.0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
5.5
Input Voltage (V)
Input Voltage (V)
Figure 26. Output Voltage vs. Input Voltage
Figure 27. Line Regulation
2.90
100
VIN=STBY
VIN=3.8V
STBY=1.5V
2.86
IO=0uA
O utput Voltage (V)
G N D C urrent (uA)
80
Temp=-40°C
Temp=25°C
Temp=85°C
60
40
20
Temp=25°C
2.82
2.78
Temp=85°C
Temp=-40°C
2.74
0
2.70
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
50
100
150
200
Output Current (mA)
Input Voltage (V)
Figure 28. GND Current vs. Input Voltage
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Figure 29. Load Regulation
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Datasheet
BUxxSA4 series
●Reference data BU28SA4WGWL (Unless otherwise specified, Ta=25℃.)
3.5
120
3.0
Temp=85°C
O utput Voltage (V)
G ND Current (uA)
100
Temp=25°C
80
60
40
20
VIN=3.8V
STBY=1.5V
Temp=-40°C
2.5
VIN=3.3V
2.0
VIN=3.8V
VIN=5.5V
1.5
1.0
0.5
0
0.0
0
50
100
150
0
200
100
Output Current (mA)
200
300
400
500
Output Current (A)
Figure 31. OCP Threshold
Figure 30. GND Current vs. Output Current
60
2.85
2.84
2.82
50
VIN=3.8V
STBY=1.5V
Io=0.1mA
GND Current (uA)
Output Voltage (V)
2.83
2.81
2.80
2.79
2.78
2.77
40
30
20
VIN=3.8V
STBY=1.5V
Io=0.1mA
10
2.76
2.75
-40
0
-15
10
35
60
85
-40
Temperature (°C)
10
35
60
85
Temperature (°C)
Figure 32. Output Voltage vs. Temperature
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Figure 33. GND Current vs. Temperature
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Datasheet
BUxxSA4 series
●Reference data BU28SA4WGWL
(Unless otherwise specified, Ta=25℃.)
100
3.5
90
3.0
GND Current (at STBY) (nA)
2.5
Output Voltage (V)
80
VIN=3.8V
Io=0.1mA
2.0
Temp=-40°C
Temp=25°C
Temp=85°C
1.5
1.0
0.5
0.0
0
0.25
0.5
0.75
1
1.25
VIN=5.5V
STBY=0V
70
60
50
40
30
20
10
0
-40
1.5
-15
10
STBY Voltage (V)
Figure 34. STBY Threshold
60
85
Figure 35. GND Current (at STBY) vs. Temperature
1.6
200
1.4
180
VIN = 0.98 x VOUT
STBY=1.5V
160
1.2
D ropout Voltage (m V)
ST BY Pin C urrent (uA)
35
Temperature (°C)
1.0
0.8
0.6
Temp=-40°C
Temp=25°C
Temp=85°C
0.4
Temp=85°C
140
120
Temp=25°C
100
Temp=-40°C
80
60
40
0.2
20
0.0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
STBY Voltage (V)
Figure 36. STBY Pin Current vs. STBY Voltage
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0
50
100
150
Output Current (mA)
200
Figure 37. Dropuout Voltage vs. Output Current
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Datasheet
BUxxSA4 series
80
80
70
70
Ripple Rejection (dB)
Ripple Rejection (dB)
●Reference data BU28SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
60
50
40
30
Ta = 25℃
Iout = 10mA
VIN_AC = -20dBV
20
10
0
2.8
3.3
3.8
4.3
4.8
Ta = 25℃
Iout = 10mA
60
50
40
30
20
10
0
100
5.3
1000
Input Voltage (V)
100000
Figure 39. Ripple Rejection vs. Frequency
Figure 38. Ripple Rejection vs. Input Voltage
70
Output Noise Density (uV / √Hz)
10
60
Output Noise (uVrms)
10000
Frequency (Hz)
50
40
30
20
Ta = 25℃
Vin = 3.8V
10
0
Ta = 25℃
Iout = 10mA
1
0.1
0.01
0
50
100
150
200
10
Output Current (mA)
1000
10000
100000
Frequency (Hz)
Figure 40. Output Noise vs. Output Current
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
100
Figure 41. Output Noise Density vs. Frequency
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
●Reference data BU28SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
1V/div
1.0
0.0
2.0
20us/div
VOUT
Output Volatage(V)
Output Volatage(V)
3.0
1V/div
2.0
1.0
VOUT
Cout=0.47uF
Cout=1uF
Cout=2.2uF
0.0
VIN=3.8V
1.0
0.0
1.0
STBY=1.5V→0V
400ms/div
3.0
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1V/div
0.0
VIN=3.8V
Figure 44. Discharge time ( Rout = none )
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
1V/div
0.0
Output Volatage(V)
Output Volatage(V)
1.0
2.0
2.0
1.0
20us/div
VOUT
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1V/div
0.0
VIN=3.8V
Figure 45. Discharge time ( Rout = 14 ohm )
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
STBY Voltage(V)
1V/div
0.0
2.0
VIN=3.8V
STBY Voltage(V)
1.0
VOUT
VOUT
Cout=0.47uF
Cout=1uF
Cout=2.2uF
Figure 43. Startup time ( Rout = 14 ohm )
2.0
STBY=1.5V→0V
1V/div
2.0
Figure 42. Startup time ( Rout = none )
3.0
1.0
0.0
20us/div
3.0
1V/div
STBY=0V→1.5V
STBY Voltage(V)
STBY=0V→1.5V
STBY Voltage(V)
2.0
Datasheet
BUxxSA4 series
●Reference data BU28SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
VIN=3.8V
STBY=3.8V
Cout=1uF
IOUT=1mA→150mA
100
100mA/div
IOUT=150mA→1mA
2.80
VOUT 50mV/div
2.75
2.70
2.0us/div
2.81
2.80
VOUT
10mV/div
2.79
Output Volatage(V)
3.5
Figure 48. Line response ( Vin= 3.3V → 3.9V)
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
VIN=3.9V→3.3V
3.9
200mV/div
STBY=3.9V→3.3V
IOUT=10mA
Cout=1uF
3.7
3.5
Input Voltage(V)
3.7
3.3
10us/div
50mV/div
2.75
Input Voltage(V)
3.9
STBY=3.3V→3.9V
IOUT=10mA
Cout=1uF
VOUT
2.80
Figure 47. Load response
( Iout = 150mA → 1mA)
VIN=3.3V→3.9V
200mV/div
VIN=3.8V
STBY=3.8V
Cout=1uF
2.85
Figure 46. Load response
( Iout = 1mA → 150mA)
Output Volatage(V)
0
2.80
2.0us/div
Output Volatage(V)
Output Volatage(V)
2.85
0
200
3.3
10us/div
2.81
2.80
VOUT
10mV/div
2.79
Figure 49. Line response ( Vin= 3.9V → 3.3V)
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Output Current(mA)
100
100mA/div
Output Current(mA)
200
Datasheet
BUxxSA4 series
●Reference data BU30SA4WGWL (Unless otherwise specified, Ta=25℃.)
3.5
3.10
3.08
VIN=STBY
VIN=ST BY
3.06
2.5
Output Voltage (V)
Output Voltage (V)
T emp=25°C
T emp=25°C
3.0
2.0
1.5
1.0
IOUT =0uA
IOUT =50mA
3.02
3.00
IOUT=0uA
2.98
IOUT=50mA
IOUT=200mA
2.96
2.94
IOUT =200mA
0.5
3.04
2.92
0.0
2.90
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
0.5
Input Volatage (V)
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Figure 50. Output Voltage vs. Input Voltage
Figure 51. Line Regulation
100
3.10
VIN=STBY
IOUT=0uA
80
3.08
VIN=4.0V
STBY=1.5V
3.06
Temp=-40°C
Temp=25°C
Temp=85°C
60
Output Voltage (V)
GND Current (uA)
1
40
3.04
Temp=25°C
3.02
3.00
2.98
Temp=-40°C
2.96
Temp=85°C
2.94
20
2.92
2.90
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
50
100
150
200
Output Current (mA)
Figure 52. GND Current vs. Input Voltage
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
0
Figure 53. Load Regulation
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
●Reference data BU30SA4WGWL (Unless otherwise specified, Ta=25℃.)
3.5
120
80
O utput Voltage (V)
GND Current (uA)
3.0
Temp=85°C
100
Temp=25°C
60
40
Temp=-40°C
VIN=4.0V
STBY=1.5V
20
2.5
VIN=3.5V
VIN=4.0V
2.0
VIN=5.5V
1.5
1.0
Temp=25°C
STBY=1.5V
0.5
0.0
0
0
50
100
150
0
200
100
200
300
400
500
Output Current (mA)
Output Current (mA)
Figure 54. GND Current vs. Output Current
Figure 55. OCP Threshold
3.10
60
3.08
VCC=4.0V
STBY=1.5V
IOUT=0.1mA
3.04
50
GND Current (uA)
Output Voltage (V)
3.06
3.02
3.00
2.98
2.96
2.94
40
30
VIN=4.0V
STBY=1.5V
IOUT=0.1mA
20
10
2.92
0
2.90
-40
-15
10
35
60
85
Temperature (°C)
-15
10
35
60
85
Temperature (°C)
Figure 56. Output Voltage vs. Temperature
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-40
Figure 57. GND Current vs. Temperature
18/34
TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
●Reference data BU30SA4WGWL (Unless otherwise specified, Ta=25℃.)
100
3.5
90
VIN=4.0V
IOUT=0.1mA
80
GND Current (at STBY) (nA)
O u tp u t V o lta g e (V )
3.0
Temp=-40°C
2.5
Temp=25°C
2.0
Temp=85°C
1.5
1.0
0.5
VIN=5.5V
STBY=0V
70
60
50
40
30
20
10
0
-40
0.0
0
0.25
0.5
0.75
1
1.25
-15
10
1.5
60
85
Temperature (°C)
STBY Voltage (V)
Figure 58. STBY Threshold
Figure 59. GND Current(at STBY) vs. Temperature
200
1.6
VCC = 0.98 x VOUT
STBY=1.5V
180
Dropout Voltage (mV)
1.4
ST BY Pin C urrent (uA)
35
1.2
1.0
0.8
0.6
Temp=-40°C
Temp=25°C
Temp=85°C
0.4
160
Temp=85°C
140
Temp=25°C
120
Temp=-40°C
100
80
60
40
0.2
20
0.0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
100
150
200
Figure 61. Dropout Voltage vs. Output Current
Figure 60. STBY Pin Voltage vs. STBY Pin Current
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
50
Output Current (mA)
STBY Voltage (V)
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
80
80
70
70
Ripple Rejection (dB)
Ripple Rejection (dB)
●Reference data BU30SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
60
50
40
30
Ta = 25℃
Iout = 10mA
VIN_AC = -20dBV
20
60
50
40
30
20
10
10
0
100
0
3
3.5
4
4.5
5
Ta = 25℃
Iout = 10mA
5.5
1000
Input Voltage (V)
100000
Figure 63. Ripple Rejection vs. Frequency
Figure 62. Ripple Rejection vs. Input Voltage
70
Output Noise Density (uV / √Hz)
10
60
Output Noise (uVrms)
10000
Frequency (Hz)
50
40
30
20
Ta = 25℃
Vin = 4.0V
10
0
Ta = 25℃
Iout = 10mA
1
0.1
0.01
0
50
100
150
200
10
Figure 64. Output Noise vs. Output Current
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
100
1000
10000
100000
Frequency (Hz)
Output Current (mA)
Figure 65. Output Noise Density vs. Frequency
20/34
TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
●Reference data BU30SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
1.0
0.0
2.0
STBY=0V→1.5V
20us/div
Output Volatage(V)
Output Volatage(V)
2.0
1V/div
VOUT
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1.0
0.0
VIN=4.0V
3.0
1V/div
2.0
0.0
3.0
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1.0
1V/div
0.0
VIN=4.0V
Figure 68. Discharge time ( Rout = none )
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
1V/div
2.0
1.0
20us/div
VOUT
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1V/div
0.0
VIN=4.0V
Figure 69. Discharge time ( Rout = 15 ohm )
21/34
1.0
0.0
Output Volatage(V)
Output Volatage(V)
STBY=1.5V→0V
TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
STBY Voltage(V)
2.0
2.0
400ms/div
VOUT
VIN=4.0V
STBY Voltage(V)
1.0
0.0
3.0
Cout=0.47uF
Cout=1uF
Cout=2.2uF
Figure 67. Startup time ( Rout = 15 ohm )
2.0
1V/div
VOUT
1.0
Figure 66. Startup time ( Rout = none )
STBY=1.5V→0V
1.0
0.0
20us/div
3.0
1V/div
STBY Voltage(V)
1V/div
STBY=0V→1.5V
STBY Voltage(V)
2.0
Datasheet
BUxxSA4 series
●Reference data BU30SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
100
100mA/div
VIN = 4.0 V
STBY = 1.5 V
Cout = 1 uF
IOUT=1mA→150mA
100
100mA/div
0
IOUT=150mA→1mA
VIN = 4.0 V
STBY = 1.5 V
Cout = 1 uF
3.10
2.0us/div
Output Volatage(V)
Output Volatage(V)
3.05
0
200
3.00
VOUT
2.95
50mV/div
2.9
2.0us/div
3.05
VOUT
3.00
50mV/div
2.95
Figure 70. Load response
( Iout = 1mA → 150mA)
Figure 71. Load response
( Iout = 150mA → 1mA)
200mV/div
STBY=3.5V→4.1V
IOUT=10mA
Cout=1uF
3.9
3.7
VIN=4.1V→3.5V
4.1
200mV/div
STBY=4.1V→3.5V
IOUT=10mA
Cout=1uF
3.00
10mV/div
2.99
Output Volatage(V)
Output Volatage(V)
3.01
Figure 72. Line response ( Vin= 3.5 V → 4.1 V)
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
3.7
3.5
3.5
10us/div
3.9
10us/div
3.01
3.00
VOUT 10mV/div
2.99
Figure 73. Line response ( Vin= 4.1 V → 3.5 V)
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Input Voltage(V)
4.1
Input Voltage(V)
VIN=3.5V→4.1V
VOUT
Output Current(mA)
Output Current(mA)
200
Datasheet
BUxxSA4 series
●Reference data BU33SA4WGWL (Unless otherwise specified, Ta=25℃.)
3.5
3.40
Temp=25°C
VIN=STBY
3.0
Temp=25°C
VIN=STBY
3.38
3.36
Output Voltage (V)
Output Voltage (V)
2.5
2.0
1.5
1.0
IOUT=0uA
IOUT=50mA
IOUT=200mA
0.5
3.34
3.32
3.30
IOUT=0uA
IOUT=50mA
IOUT=200mA
3.28
3.26
3.24
3.22
0.0
3.20
0
0.5 1
1.5 2 2.5 3 3.5 4
Input Voltage (V)
4.5 5
0
5.5
0.5
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Figure 74. Output Voltage vs. Input Voltage
Figure 75. Line Regulation
100
3.40
VIN=STBY
IOUT=0uA
3.38
80
VIN=4.3V
STBY=1.5V
3.36
Output Voltage (V)
GND Current (uA)
1
Temp=-40°C
Temp=25°C
Temp=85°C
60
40
3.34
3.32
Temp=25°C
3.30
3.28
Temp=-40°C
3.26
Temp=85°C
3.24
20
3.22
3.20
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
5.5
100
150
200
Output Current (mA)
Input Voltage (V)
Figure 76. GND Current vs. Input Voltage
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
50
Figure 77. Load Regulation
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
●Reference data BU33SA4WGWL (Unless otherwise specified, Ta=25℃.)
120
3.5
Temp=85°C
100
3.0
Output voltage (V)
GND Current (µA)
VIN=3.8V
Temp=25°C
80
60
40
2.5
VIN=4.3V
2.0
1.5
VIN=5.5V
1.0
Temp=-40°C
20
0.5
0
0.0
0
50
100
150
200
0
Output Current (mA)
200
300
400
500
Output Current (mA)
Figure 78. GND Current vs. Output Current
Figure 79. OCP Threshold
3.40
60
VIN=4.3V
STBY=1.5V
IOUT=0.1mA
3.38
50
GND Current (µA)
3.36
Output Voltage (V)
100
3.34
3.32
3.30
3.28
3.26
3.24
40
30
VIN=4.3V
STBY=1.5V
IOUT=0.1ｍ A
20
10
3.22
3.20
-40
-15
10
35
60
0
-40
85
Temperature (°C)
10
35
60
85
Temperature (°C)
Figure 80. Output Voltage vs. Temperature
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
-15
Figure 81. GND Current vs. Temperature
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
●Reference data BU33SA4WGWL (Unless otherwise specified, Ta=25℃.)
100
3.5
80
GND Current (at STBY) (nA)
3.0
Output Voltage (V)
90
VIN=4.3V
IOUT=0.1m A
Tem p=-40°C
2.5
Tem p=25°C
2.0
Tem p=85°C
1.5
1.0
0.5
0.0
0
0.25
0.5
0.75
1
1.25
VIN=5.5V
STBY=0V
70
60
50
40
30
20
10
0
-40
1.5
-15
Figure 82. STBY Threshold
60
85
Figure 83. GND Current (at STBY) vs. Temperature
1.6
200
1.4
180
VIN=0.98×VO UT
STBY=1.5V
160
1.2
Dropout VOUT [V]
STBY Pin Current (µA)
35
Temperature (°C)
STBY Voltage (V)
1.0
0.8
0.6
Tem p=-40°C
Tem p=25°C
Tem p=85°C
0.4
10
Tem p=85°C
140
Tem p=25°C
120
Tem p=-40°C
100
80
60
40
0.2
20
0.0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0
STBY Voltage (V)
100
150
200
Output Current (mA)
Figure 84. STBY Pin Current vs. STBY Voltage
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
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50
Figure 85. Dropout Voltage vs. Output Current
25/34
TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
80
80
70
70
Ripple Rejection (dB)
Ripple Rejection (dB)
●Reference data BU33SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
60
50
40
30
Ta = 25℃
Iout = 10mA
VIN_AC = -20dBV
20
10
Ta = 25℃
Iout = 10mA
60
50
40
30
20
10
0
3.3
3.8
4.3
4.8
0
100
5.3
Input Voltage (V)
1000
10000
100000
Frequency (Hz)
Figure 86. Ripple Rejection vs. Input Voltage
Figure 87. Ripple Rejection vs. Frequency
70
10
Output Noise Density (uV / √Hz)
Output Noise (uVrms)
60
50
40
30
20
Ta = 25℃
Vin = 4.3V
10
1
0.1
0.01
0
0
50
100
150
10
200
1000
10000
100000
Figure 89. Output Noise Density vs. Frequency
Figure 88. Output Noise vs. Output Current
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
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100
Frequency (Hz)
Output Current (mA)
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TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
●Reference data BU33SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
1.0
0.0
2.0
20us/div
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1.0
0.0
Output Volatage(V)
Output Volatage(V)
3.0
VOUT
VOUT
2.0
1V/div
VIN=4.3V
1.0
0.0
0.0
1.0
1V/div
STBY=1.5V→0V
400ms/div
VOUT
0.0
STBY Voltage(V)
1V/div
2.0
3.0
20us/div
3.0
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1.0
1V/div
0.0
VIN=4.3V
Output Volatage(V)
Output Volatage(V)
VIN=4.3V
STBY Voltage(V)
1.0
2.0
1V/div
Cout=0.47uF
Cout=1uF
Cout=2.2uF
Figure 91. Startup time ( Rout = 16.5 ohm )
2.0
VOUT
VOUT
2.0
Figure 90. Startup time ( Rout = none )
STBY=1.5V→0V
1.0
0.0
20us/div
3.0
1V/div
STBY=0V→1.5V
STBY Voltage(V)
1V/div
STBY=0V→1.5V
STBY Voltage(V)
2.0
Figure 92. Discharge time ( Rout = none )
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
2.0
1.0
Cout=0.47uF
Cout=1uF
Cout=2.2uF
1V/div
0.0
VIN=4.3V
Figure 93. Discharge time ( Rout = 16.5 ohm )
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Datasheet
BUxxSA4 series
●Reference data BU33SA4WGWL (Unless otherwise specified, Ta=25℃,Cin = Cout =1μF.)
VIN=4.3V
STBY=4.3V
Cout=1uF
IOUT=1mA→150mA
100
100mA/div
VIN=4.3V
STBY=4.3V
Cout=1uF
3.40
2.0us/div
3.30
3.25
VOUT 50mV/div
3.20
2.0us/div
3.35
VOUT
3.30
Figure 95. Load response
( Iout = 150mA → 1mA)
STBY=3.8V→4.4V
Io=10mA
Cout=1uF
4.2
4.0
3.8
10us/div
3.31
3.30
10mV/div
3.29
Figure 96. Line response
( Vin= 3.8 V → 4.4 V)
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4.4
200mV/div
STBY=4.4V→3.8V
Io=10mA
Cout=1uF
Output Volatage(V)
200mV/div
VIN=4.4V→3.8V
4.0
3.8
10us/div
3.31
3.30
VOUT
10mV/div
3.29
Figure 97. Line response
( Vin= 4.4 V → 3.8 V)
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Input Voltage(V)
4.4
Input Voltage(V)
VIN=3.8V→4.4V
VOUT
50mV/div
3.25
Figure 94. Load response
( Iout = 1mA → 150mA)
Output Volatage(V)
0
IOUT=150mA→1mA
Output Volatage(V)
Output Volatage(V)
3.35
0
200
Output Current(mA)
100
100mA/div
Output Current(mA)
200
Datasheet
BUxxSA4 series
●Input/Output Capacitor
Capacity value of ceramic capacitor - DC bias characteristics
(Example)
10-V withstand voltage
B1characteristics
GRM188B11A105KA61D
10
0
-10
Capacitance Change [%]
It is recommended that an input capacitor is placed near pins
between the VCC pin and GND as well as an output capacitor
between the output pin and GND. The input is valid when the
power supply impedance is high or when the PCB trace has
significant length. For the output capacitor, the greater the
capacitance, the more stable the output will be depending on
the load and line voltage variations. However, please check the
actual functionality of this capacitor by mounting it on a board
for the actual application. Ceramic capacitors usually have
different, thermal and equivalent series resistance
characteristics, and may degrade gradually over continued
use.
For additional details, please check with the manufacturer,
and select the best ceramic capacitor for your application
10-V withstand voltage
B characteristics
-20
6.3-V withstand voltage
B characteristics
-30
10-V withstand voltage
F characteristics
-40
-50
-60
4-V withstand voltage
X6S characteristics
10-V withstand voltage
F characteristics
-70
-80
-90
-100
0
0.5
1
1.5
2
2.5
3
3.5
4
DC Bias Voltage [V]
Figure 98. Capacity-bias characteristics
Stable region
Cin=Co=0.47uF　Ta=-40 to 85℃
Capacitors generally have ESR (equivalent series resistance)
and it operates stably in the ESR-IOUT area shown on the right.
Since ceramic capacitors, tantalum capacitors, electrolytic
capacitors, etc. generally have different ESR, please check the
ESR of the capacitor to be used and use it within the stability
area range shown in the right graph for evaluation of the actual
application.
100
Unstable region
10
ESR[Ω]
●Equivalent Series Resistance (ESR) of a Ceramic Capacitor
1
Stable region
0.1
0.01
0
50
100
IOUT[mA]
150
200
Figure 99. Stability area characteristics
(Example)
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Datasheet
BUxxSA4 series
●Power Dissipation (Pd)
As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so
please use these for reference. Since power dissipation changes substantially depending on the implementation conditions
(board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd
on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as
causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare
sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
Where : VIN=Input voltage
VOUT= Output voltage IOMAX: Maximum output current)
PMAX=(VIN-VOUT)×IOMAX
○Measurement conditions
Evaluation board
Layout of Board for
Measurement
Top Layer (Top View)
Measurement State
Bottom Layer (Top View)
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (9 layers)
Board Size
63 mm x 55 mm x 1.6 mm
Wiring
Rate
Top layer
Metal (GND) wiring rate: Approx. 0%
Bottom layer
Metal (GND) wiring rate: Approx. 50%
Through Hole
Diameter 0.5mm x 6 holes
Power Dissipation
Thermal
Resistance
0.41W
θja=243.9°C/W
0.5
0.41W
評価基板1
Pd [W]
0.4
0.3
* Please design the margin so that
PMAX is less than Pd (PMAX<Pd) within
the usage temperature range
0.2
0.1
0
0
25
50
75
85
100
125
Ta[℃]
Figure 100. UCSP50L1(BUXXSA4WGWL) Power dissipation heat reduction characteristics (Reference)
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Datasheet
BUxxSA4 series
●I/O Equivalence Circuits
B1 pin (VOUT)
A1 pin (GND)
A2 pin (STBY)
B2 pin (VIN)
VIN
VOUT
Figure 101. Input / Output equivalent circuit
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Datasheet
BUxxSA4 series
●Operational Notes
1) Absolute maximum ratings
This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute
maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open
circuit modes, etc. T h e r e f o r e , i t i s i m p o r t a n t t o c o n s i d e r c i r c u i t p r o t e c t i o n m e a s u r e s , l i k e a d d i n g a
fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings.
2) GND Potential
GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a
voltage below the ground pin at any time, even during transient condition.
3) Setting of Heat
Carry out the heat design that have adequate margin considering Pd of actual working states.
4) Pin Short and Mistake Fitting
When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC
may be burned up.
5) Actions in Strong Magnetic Field
Using the IC within a strong magnetic field may cause the IC to malfunction.
6) Mutual Impedance
Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible.
Use a capacitor to keep ripple to a minimum.
7) STBY Pin Voltage
To enable standby mode for all channels, set the STBY pin to 0.5 V or less, and for normal operation, to 1.1 V or more.
Setting STBY to a voltage between 0.5 and 1.1 V may cause malfunction and should be avoided. Keep transition time
between high and low (or vice versa) to a minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit,
causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present,
overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always
be completely discharged before turning the IC on.
8) Over Current Protection Circuit
Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short
circuit. These protection circuits are effective in the destructive prevention by sudden accidents, please avoid
applications to where the over current protection circuit operates continuously.
9) Thermal Shutdown
This IC has Thermal Shutdown Circuit (TSD Circuit). When the temperature of IC Chip is higher than 175℃, the output
is turned off by TSD Circuit. TSD Circuit is only designed for protecting IC from thermal over load. Therefore it is not
recommended that you design application where TSD will work in normal condition.
10) Actions under Strong light
A strong light like a halogen lamp may be caused malfunction. In our testing, fluorescence light and white LED causes
little effects for the IC, but infrared light causes strong effects on the IC. The IC should be shielded from light like
sunrays or halogen lamps.
11) Output capacitor
To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 99. It
operates at the capacitance of more than 0.47μF. As capacitance is larger, stability becomes more stable and
characteristic of output load fluctuation is also improved.
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Datasheet
BUxxSA4 series
●Ordering Information
B
ROHM
Part No.
U
x
x
S
Output voltage
xx=18:1.8V
xx=25:2.5V
xx=2F:2.55V
xx=28:2.8V
xx=30:3.0V
xx=33:3.3V
A
4
W
G
Series name
SA4W:High-speed
SA4W:load response
SA4W:Low noise
W
L
-
Package
GWL: UCSP50L1
GWL: (BUXXSA4WGWL)
E
2
Packaging and forming
specifications
E2:Embossed tape and reel
UCSP50L1(BUXXSA4WGWL)
SA4W:Shutdown SW
●Physical Dimension Tape and Reel Information
UCSP50L1(BUXXSA4WGWL)
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
0.55MAX
0.8±0.05
0.8±0.05
0.1±0.05
1PIN MARK
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
S
4-φ0.25±0.05
0.05 A B
A
0.4
B B
A
0.2±0.05
0.2±0.05
0.06 S
1
0.4
2
1pin
(Unit : mm)
Reel
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram
1Pin Mark
Marking
Part No.
BU18SA4WGWL
BU25SA4WGWL
BU2FSA4WGWL
BU28SA4WGWL
BU30SA4WGWL
BU33SA4WGWL
Lot No.
x
x
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TSZ22111・15・001
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Marking
C3
C9
FA
E2
E5
E8
TSZ02201-0RBR0A300100-1-2
2013.04.04 Rev.001
Datasheet
BUxxSA4 series
●Revision History
Date
04.Apr.2013
Revision
001
Changes
New Release
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
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Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
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