DISCRETE SEMICONDUCTORS SMA BZG01 series Voltage regulator diodes Product specification 1999 Dec 23 Philips Semiconductors Product specification Voltage regulator diodes SMA BZG01 series FEATURES DESCRIPTION • Glass passivated DO-214AC surface mountable package with glass passivated chip. • High maximum operating temperature The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. • Ideal for surface mount automotive applications • Low leakage current • Excellent stability • UL 94V-O classified plastic package • Zener working voltage range: 10 to 270 V for 35 types • Supplied in 12 mm embossed tape and reel, 1500 and 7500 pieces • Marking: cathode, date code, type name • Easy pick and place. Fig.1 Simplified outline (DO-214AC) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Ptot total power dissipation Ttp = 100 °C; see Fig.2 − 2.50 W Ptot total power dissipation Tamb = 25 °C; see Fig.2; device mounted on an Al2O3 PCB (see Fig.5) − 1.50 W PZSM non-repetitive peak reverse power dissipation tp = 100 µs; square pulse; Tj = 25 °C prior to surge; see Fig.3 − 150 W Tstg storage temperature −65 +175 °C Tj junction temperature −65 +175 °C 1999 Dec 23 2 Philips Semiconductors Product specification Voltage regulator diodes SMA BZG01 series ELECTRICAL CHARACTERISTICS Total series Tj = 25 °C unless otherwise specified. SYMBOL VF PARAMETER CONDITIONS forward voltage MAX. IF = 0.1 A; see Fig.4 1.2 UNIT V Per type Tj = 25 °C unless otherwise specified. TYPE No. SUFFIX (1) WORKING VOLTAGE VZ (V) at IZ MIN. DIFFERENTIAL TEMPERATURE TEST RESISTANCE COEFFICIENT CURRENT rdif (Ω) at IZ SZ (%/K) at IZ NOM. MAX. TYP. MAX. MIN. MAX. IZ (mA) REVERSE CURRENT at REVERSE VOLTAGE IR (µA) MAX. VR (V) C10 9.4 10 10.6 2 7 0.05 0.09 25 10 7.5 C11 10.4 11 11.6 3 8 0.05 0.10 20 4 8.2 C12 11.4 12 12.7 3 9 0.05 0.10 20 3 9.1 C13 12.4 13 14.1 3 10 0.05 0.10 20 2 10 C15 13.8 15 15.6 5 15 0.05 0.10 15 1 11 C16 15.3 16 17.1 5 15 0.06 0.11 15 1 12 C18 16.8 18 19.1 7 20 0.06 0.11 15 1 13 C20 18.8 20 21.2 8 24 0.06 0.11 10 1 15 C22 20.8 22 23.3 8 25 0.06 0.11 10 1 16 C24 22.8 24 25.6 8 25 0.06 0.11 10 1 18 C27 25.1 27 28.9 10 30 0.06 0.11 8 1 20 C30 28 30 32 10 30 0.06 0.11 8 1 22 C33 31 33 35 12 35 0.06 0.11 8 1 24 C36 34 36 38 13 40 0.06 0.11 8 1 27 C39 37 39 41 17 50 0.06 0.11 6 1 30 C43 40 43 46 17 50 0.07 0.12 6 1 33 C47 44 47 50 30 90 0.07 0.12 4 1 36 C51 48 51 54 40 115 0.07 0.12 4 1 39 C56 52 56 60 40 120 0.07 0.12 4 1 43 C62 58 62 66 40 125 0.08 0.13 4 1 47 C68 64 68 72 40 130 0.08 0.13 4 1 51 C75 70 75 79 40 135 0.08 0.13 4 1 56 C82 77 82 87 70 200 0.08 0.13 2.7 1 62 C91 85 91 96 80 250 0.09 0.13 2.7 1 68 C100 94 100 106 120 350 0.09 0.13 2.7 1 75 C110 104 110 116 150 450 0.09 0.13 2.7 1 82 1999 Dec 23 3 Philips Semiconductors Product specification Voltage regulator diodes WORKING VOLTAGE TYPE No. SUFFIX (1) SMA BZG01 series DIFFERENTIAL TEMPERATURE TEST RESISTANCE COEFFICIENT CURRENT VZ (V) at IZ MIN. NOM. rdif (Ω) at IZ MAX. SZ (%/K) at IZ TYP. MAX. MIN. MAX. IZ (mA) REVERSE CURRENT at REVERSE VOLTAGE IR (µA) MAX. VR (V) C120 114 120 127 200 550 0.09 0.13 2 1 91 C130 124 130 141 250 700 0.09 0.13 2 1 100 C150 138 150 156 300 1000 0.09 0.13 2 1 110 C160 153 160 171 350 1100 0.09 0.13 1.5 1 120 C180 168 180 191 400 1200 0.09 0.13 1.5 1 130 C200 188 200 212 500 1500 0.09 0.13 1.5 1 150 C220 208 220 233 700 2250 0.09 0.13 1 1 160 C240 228 240 256 800 2550 0.09 0.13 1 1 180 C270 251 270 289 1000 3000 0.09 0.13 1 1 200 Note 1. To complete the type number the suffix is added to the basic type number, e.g. BZG01-C130. THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth j-tp thermal resistance from junction to tie-point Rth j-a thermal resistance from junction to ambient CONDITIONS VALUE UNIT 30 K/W note 1 100 K/W note 2 150 K/W Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5. For more information please refer to the ‘General Part of associated Handbook’. 1999 Dec 23 4 Philips Semiconductors Product specification Voltage regulator diodes SMA BZG01 series GRAPHICAL DATA Solid line: tie-point temperature. Tj = 25 °C prior to surge. Dotted line: ambient temperature; device mounted on an Al2O3 PCB as shown in Fig.5. Fig.3 Fig.2 Maximum total power dissipation as a function of temperature. Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Tj = 25 °C. Dimensions in mm. Fig.4 Forward current as a function of forward voltage; typical values. 1999 Dec 23 Fig.5 Printed-circuit board for surface mounting. 5 Philips Semiconductors Product specification Voltage regulator diodes SMA BZG01 series PACKAGE OUTLINE 1999 Dec 23 6 Philips Semiconductors Product specification Voltage regulator diodes SMA BZG01 series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1999 Dec 23 7