CD54AC04, CD74AC04 HEX INVERTERS SCHS305C – JANUARY 2001 – REVISED JUNE 2002 D D D D D D CD54AC04 . . . F PACKAGE CD74AC04 . . . E OR M PACKAGE (TOP VIEW) AC Types Feature 1.5-V to 5.5-V Operation and Balanced Noise Immunity at 30% of the Supply Voltage Speed of Bipolar F, AS, and S, With Significantly Reduced Power Consumption Balanced Propagation Delays ±24-mA Output Drive Current – Fanout to 15 F Devices SCR-Latchup-Resistant CMOS Process and Circuit Design Exceeds 2-kV ESD Protection Per MIL-STD-883, Method 3015 1A 1Y 2A 2Y 3A 3Y GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y description The ‘AC04 devices contain six independent inverters. The devices perform the Boolean function Y = A. ORDERING INFORMATION PDIP – E –55°C 55°C to 125°C ORDERABLE PART NUMBER PACKAGE† TA SOIC – M Tube CD74AC04E Tube CD74AC04M Tape and reel CD74AC04M96 TOP-SIDE MARKING CD74AC04E AC04M CDIP – F Tube CD54AC04F3A CD54AC04F3A † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H logic diagram, each inverter (positive logic) A Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CD54AC04, CD74AC04 HEX INVERTERS SCHS305C – JANUARY 2001 – REVISED JUNE 2002 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC VIH Supply voltage High-level input voltage TA = 25°C –40°C TO 85°C –55°C TO 125°C MIN MAX MIN MAX MIN MAX 1.5 5.5 1.5 5.5 1.5 5.5 VCC = 1.5 V VCC = 3 V 1.2 1.2 1.2 2.1 2.1 2.1 VCC = 5.5 V VCC = 1.5 V 3.85 VIL Low-level input voltage VI VO Input voltage 0 Output voltage 0 IOH IOL High-level output current ∆t/∆v Input transition rise or fall rate Low-level output current VCC = 3 V VCC = 5.5 V 3.85 3.85 0.3 0.3 0.9 0.9 0.9 1.65 1.65 0 0 V V 0.3 VCC VCC UNIT VCC VCC V 1.65 0 0 VCC VCC V V VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V –24 –24 –24 mA 24 24 24 mA VCC = 1.5 V to 3 V VCC = 3.6 V to 5.5 V 50 50 50 20 20 20 ns/V NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CD54AC04, CD74AC04 HEX INVERTERS SCHS305C – JANUARY 2001 – REVISED JUNE 2002 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –50 µA VOH VI = VIH or VIL IOH = –4 mA IOH = –24 mA IOH = –50 mA† IOH = –75 mA† IOL = 50 µA VOL II ICC VI = VIH or VIL VI = VCC or GND VI = VCC or GND, VCC TA = 25°C –40°C TO 85°C –55°C TO 125°C MIN MIN MIN MAX MAX 1.5 V 1.4 1.4 1.4 3V 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 3V 2.58 2.48 2.4 4.5 V 3.94 3.8 V 3.7 5.5 V 3.85 5.5 V 3.85 1.5 V 0.1 0.1 0.1 3V 0.1 0.1 0.1 4.5 V 0.1 0.1 0.1 IOL = 12 mA IOL = 24 mA IOL = 50 mA† 3V 0.36 0.44 0.5 4.5 V 0.36 0.44 0.5 IOL = 75 mA† 5.5 V 5.5 V V 1.65 1.65 5.5 V IO = 0 UNIT MAX 5.5 V Ci ±0.1 ±1 ±1 µA 4 40 80 µA 10 10 10 pF † Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C. switching characteristics over recommended operating free-air temperature range, VCC = 1.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) A Y –40°C TO 85°C –55°C TO 125°C MIN MIN MAX UNIT MAX 74 81 74 81 ns switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL FROM (INPUT) A TO (OUTPUT) Y POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 –40°C TO 85°C –55°C TO 125°C MIN MAX MIN MAX 2.3 8.3 2.3 9.1 2.3 8.3 2.3 9.1 UNIT ns 3 CD54AC04, CD74AC04 HEX INVERTERS SCHS305C – JANUARY 2001 – REVISED JUNE 2002 switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) A Y –40°C TO 85°C –55°C TO 125°C MIN MAX MIN MAX 1.7 5.9 1.6 6.5 1.7 5.9 1.6 6.5 UNIT ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd 4 Power dissipation capacitance POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP UNIT 105 pF CD54AC04, CD74AC04 HEX INVERTERS SCHS305C – JANUARY 2001 – REVISED JUNE 2002 PARAMETER MEASUREMENT INFORMATION S1 R1 = 500 Ω† From Output Under Test 2 × VCC Open GND CL = 50 pF (see Note A) R2 = 500 Ω† TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 2 × VCC GND tw VCC † When VCC = 1.5 V, R1 = R2 = 1 kΩ Input 50% VCC 50% VCC 0V LOAD CIRCUIT VOLTAGE WAVEFORMS PULSE DURATION CLR Input VCC Reference Input VCC 50% VCC 50% VCC 0V 0V tsu trec Data 50% Input 10% VCC 50% VCC CLK 90% VOLTAGE WAVEFORMS RECOVERY TIME tf VCC 50% VCC 50% VCC tPLH tPHL 50% 10% 90% 90% tr tPHL Out-of-Phase Output VCC 50% VCC 10% 0 V VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 0V In-Phase Output 90% tr 0V Input th 90% VOH 50% VCC 10% VOL tf Output Waveform 1 S1 at 2 × VCC (see Note B) tPLH 50% VCC 10% tf 50% 10% 90% tr VOH VOL VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VCC Output Control 50% VCC 50% VCC 0V tPLZ tPZL 50% VCC tPHZ tPZH Output Waveform 2 S1 at GND (see Note B) ≈VCC 20% VCC VOL 50% VCC VOH 80% VCC ≈0 V VOLTAGE WAVEFORMS OUTPUT ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns. Phase relationships between waveforms are arbitrary. D. For clock inputs, fmax is measured with the input duty cycle at 50%. E. The outputs are measured one at a time with one input transition per measurement. F. tPLH and tPHL are the same as tpd. G. tPZL and tPZH are the same as ten. H. tPLZ and tPHZ are the same as tdis. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 24-Jul-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) CD54AC04F3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type CD74AC04-W ACTIVE WAFERSALE YS 0 6517 TBD Call TI Call TI CD74AC04E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU CD74AC04EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CD74AC04M ACTIVE SOIC D 14 50 CD74AC04M96 ACTIVE SOIC D 14 CD74AC04M96E4 ACTIVE SOIC D CD74AC04M96G4 ACTIVE SOIC CD74AC04ME4 ACTIVE CD74AC04MG4 ACTIVE (4/5) -55 to 125 CD54AC04F3A N / A for Pkg Type -55 to 125 CD74AC04E CU NIPDAU N / A for Pkg Type -55 to 125 CD74AC04E Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC04M 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC04M 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC04M D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC04M SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC04M SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC04M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Jul-2013 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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OTHER QUALIFIED VERSIONS OF CD54AC04, CD74AC04 : • Catalog: CD74AC04 • Military: CD54AC04 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74AC04M96 Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC04M96 SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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