CS8151 CS8151 5V, 100mA Low Dropout Linear Regulator with WATCHDOG, RESET, & WAKE UP Description Features is received, a falling edge is issued on the wake-up signal line. The CS8151 is a precision 5V, 100mA micro-power voltage regulator with very low quiescent current (400µA typical at 200µA load). The 5V output is accurate within ±2% and supplies 100 mA of load current with a typical dropout voltage of 400mV. Microprocessor control logic includes Watchdog, Wake Up and RESET . This unique combination of low quiescent current and full microprocessor control makes the CS8151 ideal for use in battery operated, microprocessor controlled equipment. RESET is independent of VIN and operates correctly to an output voltage as low as 1V. A RESET signal is issued in any of three situations. During power up the RESET is held low until the output voltage is in regulation. During operation if the output voltage shifts below the regulation limits, the RESET toggles low and remains low until proper output voltage regulation is restored. And finally, a RESET signal is issued if the regulator does not receive a WATCHDOG signal within the WAKE UP period. The CS8151 WAKE UP function brings the microprocessor out of Sleep mode. The microprocessor in turn, signals its WAKE UP status back to the CS8151 by issuing a WATCHDOG signal. The RESET pulse width, WAKE UP signal frequency, and WAKE UP delay time are all set by one external capacitor CDelay. The WATCHDOG logic function monitors an input signal (WDI) from the microprocessor. The CS8151 responds to the falling edge of the WATCHDOG signal which it expects at least once during each wake-up period. When the correct WATCHDOG signal VOUT VIN VOUT Over Voltage Shutdown Current Limit Sense internally connected on TO-220 and D2PAK WAKE UP Delay WAKE UP Circuit Timing Circuit + WATCHDOG Circuit WDI Thermal Shutdown Package Options The regulator is protected against short circuit, over voltage, and thermal runaway conditions. The device can withstand 74 volt load dump transients, making it suitable for use in automotive environments. Block Diagram Current Source (Circuit Bias) ■ 5V ±2% / 100 mA Output Voltage ■ Micropower Compatible Control Functions: WAKE UP WATCHDOG RESET ■ Low Dropout Voltage: 400mV @ 100mA ■ Low Sleep Mode Quiescent Current (400µA typ) ■ Protection Features: Thermal Shutdown Short Circuit 74V Load Dump Reverse Transient (-50V) Sense 16 Lead PDIP 16 Lead SOIC Wide* (Internally Fused) N/C N/C WAKE UP Gnd Gnd Gnd Gnd *N/C WDI Sense N/C VOUT VIN * For SO Wide package, pin # 6 is Gnd 7 Lead TO-220 Tab (Gnd) 7 Lead D2PAK Tab (Gnd) - Error Amplifier 1. VOUT 2. VIN 3. WDI 1 4. Gnd 5. WAKE UP 6. RESET 7. Delay Falling Edge Detector Bandgap Reference VOUT Delay ______ RESET 1 N/C RESET RESET Circuit Gnd 1 Cherry Semiconductor Corporation 2000 South County Trail, East Greenwich, RI 02818 Tel: (401)885-3600 Fax: (401)885-5786 Email: [email protected] Web Site: www.cherry-semi.com Rev. 5/4/99 1 A ¨ Company CS8151 Absolute Maximum Ratings Power Dissipation.............................................................................................................................................Internally Limited Output Current (VOUT, RESET , WAKE UP) .................................................................................................Internally Limited Reverse Battery..........................................................................................................................................................................-15V Maximum Load Dump Transient .........................................................................................................................................+74V Maximum Negative Transient (t<2ms) .................................................................................................................................-50V ESD Susceptibility (Human Body Model)..............................................................................................................................2kV ESD Susceptibility (Machine Model).....................................................................................................................................200V Logic Inputs/Outputs ................................................................................................................................................-0.3V to +6V Storage Temperature Range ................................................................................................................................-55¡C to +150¡C Lead Temperature Soldering Wave Solder (through hole styles only) .....................................................................................10 sec. max, 260¡C peak Reflow (SMD styles only) ......................................................................................60 sec. max above 183¡C, 230¡C peak Electrical Characteristics: TA = -40¡C to +125¡C, -40¡C ² TJ ² 150¡C, 6V ² VIN ² 26V, IOUT = 100µA to 100mA, C2 = 47µF (ESR < 8½), CDelay = 0.1µF (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 5.00 5.00 5.10 5.15 V V ■ Output Section Output Voltage, VOUT 9V < VIN < 16V 6V < VIN < 26V, 0 < IOUT < 100mA 4.90 4.85 Dropout Voltage (VIN - VOUT) IOUT = 100mA IOUT = 100µA 400 100 600 150 mV mV Load Regulation VIN = 14V, 100µA < IOUT < 100mA 10 50 mV 10 50 mV Line Regulation IOUT = 1mA, 6V < VIN < 26V Ripple Rejection 7V < VIN < 17V @ f = 120Hz, IOUT = 100mA 60 75 dB Current Limit VOUT = 4.5V 100 250 mA 150 180 210 ¡C 50 56 62 V Thermal Shutdown Overvoltage Shutdown VOUT < 1V Quiescent Current IOUT = 200µA (Sleep) IOUT = 50mA IOUT = 100mA (WAKE UP) 0.40 4 12 0.75 20 mA mA mA VOUT = 5V, VIN = 0V 1.0 1.5 mA VOUT - 0.3 4.50 4.70 VOUT - 0.04 4.91 V V Reverse Current ■ RESET Threshold High (RTH) Threshold Low (RTL) RTH VOUT Increasing RTL VOUT Decreasing Hysteresis RTH Ð RTL 150 200 250 mV 1V < VOUT < RTL, IOUT = 25µA IOUT = 25µA, VOUT > RTH 3.8 0.2 4.2 0.8 5.1 V V 0.025 0.1 0.50 12 1.30 80 mA mA 3 5 7 ms Output LOW HIGH Current Limit RESET = 0V, VOUT > VRTH (sourcing) RESET = 5V, VOUT > 1V (sinking) Delay Time POR Mode 2 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Threshold HIGH LOW 1.4 1.3 2.0 0.8 V V Hysteresis 25 100 -10 0 ■ WATCHDOG Input mV Input Current 0 < WDI < 6V +10 µA Pulse Width 50% WDI falling edge to 50% WDI rising edge and 50% WDI rising edge to 50% WDI falling edge (see Figure 1) 5 WAKE UP Period see Figure 1a 30 40 50 ms WAKE UP Duty Cycle nominal see Figure 1c 40 50 60 % RESET HIGH to WAKE UP Rising Delay Time 50% RESET rising edge to 50% WAKE UP edge (see Figure 1) 15 20 25 ms WAKE UP Response to Watchdog Input 50% WDI falling edge to 50% WAKE UP falling edge 2 10 µs WAKE UP Response to RESET 50% RESET falling edge to 50% WAKE UP falling edge VOUT = 5V®4.5V 2 10 µs 0.2 4.2 0.8 5.1 V V 1.00 7.00 3.50 mA mA µs ■ WAKE UP Output Output LOW HIGH IOUT = 25µA(sinking) IOUT = 25µA(sourcing) Current Limit 3.8 WAKE UP = 5V WAKE UP = 0V 0.025 .05 Package Lead Description Package Lead # 7L TO-220 & 7L D2PAK 2 16 L PDIP Lead Symbol Function 16L SOIC (internally fused) (internally fused) 9 9 VIN Supply voltage to the IC. 3 11 11 WDI CMOS/TTL compatible input lead. The watchdog function monitors the falling edge of the incoming signal. 4 4,5,12,13 4,5,6,12,13 Gnd Ground Connection 7 16 16 Delay Input lead from timing capacitor for RESET and WAKE UP signal. 6 15 15 RESET CMOS/TTL compatible output lead RESET goes low whenever VOUT drops by more than 6% from nominal, or during the absence of a correct watchdog signal. 5 14 14 WAKE UP CMOS/TTL compatible output consisting of a continuously generated signal used to WAKE UP the microprocessor from sleep mode. 1 8 8 VOUT Regulated output voltage 5V ± 2%. 7 7 Sense Kelvin connection which allows remote sensing of the output voltage for improved regulation. If remote sensing is not required, connect to VOUT. 3 CS8151 Electrical Characteristics: continued CS8151 Timing Diagrams Figure 1a. Power Up, Sleep Mode and Normal Operation VIN ______ RESET WAKE UP Duty Cycle = 50% WAKE UP WDI VOUT- POR ______ RESET High to Wakeup Delay Time Power Up Normal Operation with varying WATCHDOG Signal Sleep Mode Figure 1b. Error Condition: Watchdog remains LOW and a RESET is issued ______ RESET delay time VIN ______ RESET WAKE UP WDI VOUT POR ______ RESET HIGH to WAKE UP DELAY TIME WAKE UP period ______ RESET HIGH to WAKEUP DELAY TIME Figure 1c. Power Down and Restart Sequence ______ RESET WAKE UP period WAKE UP WDI RTL VOUT POR POWER DOWN POR WATCHDOG Pulse Width 4 Dropout Voltage: The input-output voltage differential at which the circuit ceases to regulate against further reduction in input voltage. Measured when the output voltage has dropped 100mV from the nominal value obtained at 14V input, dropout voltage is dependent upon load current and junction temperature. Input Voltage: The DC voltage applied to the input terminals with respect to ground. Line Regulation: The change in output voltage for a change in the input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average chip temperature is not significantly affected. Load Regulation: The change in output voltage for a change in load current at constant chip temperature. Quiescent Current: The part of the positive input current that does not contribute to the positive load current. The regulator ground lead current. Ripple Rejection: The ratio of the peak-to-peak input ripple voltage to the peak-to-peak output ripple voltage. Current Limit: Peak current that can be delivered to the output. Circuit Description Capacitor temperature coefficient and tolerance as well as the tolerance of the CS8151 must be taken into account in order to get the correct system tolerance for each parameter. Functional Description To reduce the drain on the battery a system can go into a low current consumption mode when ever its not performing a main routine. The WAKE UP signal is generated continuously and is used to interrupt a microcontroller that is in sleep mode. The nominal output is a 5 volt square wave with a duty cycle of 50% at a frequency that is determined by a timing capacitor, CDelay. WAKE UP When the microprocessor receives a rising edge from the WAKE UP output, it must issue a watchdog pulse and check its inputs to decide if it should resume normal operations or remain in the sleep mode. WDI The first falling edge of the watchdog signal causes the WAKE UP to go low within 2µs (typ) and remain low until the next WAKE UP cycle (see Figure 2). Other watchdog pulses received within the same cycle are ignored (Figure 1). WAKE UP Response to WDI During power up, RESET is held low until the output voltage is in regulation. During operation, if the output voltage shifts below the regulation limits, the RESET toggles low and remains low until proper output voltage regulation is restored. After the RESET delay, RESET returns high. Figure 2. WAKE UP response to WDI ______ RESET The WATCHDOG circuitry continuously monitors the input watchdog signal (WDI) from the microprocessor. The absence of a falling edge on the WATCHDOG input during one WAKE UP cycle will cause a RESET pulse to occur at the end of the WAKE UP cycle. (see Figure 1b). WAKE UP The WAKE UP output is pulled low during a RESET regardless of the cause of the RESET . After the RESET returns high, the WAKE UP cycle begins again (see Figures 1b). The RESET pulse width, WAKE UP signal frequency and RESET high to WAKE UP delay time are all set by one external capacitor CDelay. WAKE UP Response to ______ RESET WAKE UP period=(4x10 5)CDelay Figure 3. WAKE UP response to RESET (Low Voltage) RESET Delay Time=(5x10 4)CDelay RESET HIGH to WAKE UP Delay Time =(2x10 5)CDelay 5 CS8151 Definition of Terms CS8151 Application Notes To determine an acceptable value for C2 for a particular application, start with a tantalum capacitor of the recommended value and work towards a less expensive alternative part. Step 1: Place the completed circuit with a tantalum capacitor of the recommended value in an environmental chamber at the lowest specified operating temperature and monitor the outputs with an oscilloscope. A decade box connected in series with the capacitor will simulate the higher ESR of an aluminum capacitor. Leave the decade box outside the chamber, the small resistance added by the longer leads is negligible. Step 2: With the input voltage at its maximum value, increase the load current slowly from zero to full load while observing the output for any oscillations. If no oscillations are observed, the capacitor is large enough to ensure a stable design under steady state conditions. Step 3: Increase the ESR of the capacitor from zero using the decade box and vary the load current until oscillations appear. Record the values of load current and ESR that cause the greatest oscillation. This represents the worst case load conditions for the regulator at low temperature. Step 4: Maintain the worst case load conditions set in step 3 and vary the input voltage until the oscillations increase. This point represents the worst case input voltage conditions. Step 5: If the capacitor is adequate, repeat steps 3 and 4 with the next smaller valued capacitor. A smaller capacitor will usually cost less and occupy less board space. If the output oscillates within the range of expected operating conditions, repeat steps 3 and 4 with the next larger standard capacitor value. Step 6: Test the load transient response by switching in various loads at several frequencies to simulate its real working environment. Vary the ESR to reduce ringing. Step 7: Remove the unit from the environmental chamber and heat the IC with a heat gun. Vary the load current as instructed in step 5 to test for any oscillations. Once the minimum capacitor value with the maximum ESR is found, a safety factor should be added to allow for the tolerance of the capacitor and any variations in regulator performance. Most good quality aluminum electrolytic capacitors have a tolerance of ±20% so the minimum value found should be increased by at least 50% to allow for this tolerance plus the variation which will occur at low temperatures. The ESR of the capacitor should be less than 50% of the maximum allowable ESR found in step 3 above. Output Stage Protection The output stage is protected against overvoltage, short circuit and thermal runaway conditions (see Figure 4). > 30V VIN VOUT IOUT Load Dump Thermal Shutdown Short Circuit Figure 4: Typical Circuit Waveforms for Output Stage Protection. If the input voltage rises above 56V (e.g. load dump), the output shuts down. This response protects the internal circuitry and enables the IC to survive unexpected voltage transients. Should the junction temperature of the power device exceed 180ûC (typ) the power transistor is turned off. Thermal shutdown is an effective means to prevent die overheating since the power transistor is the principle heat source in the IC. Stability Considerations The output or compensation capacitor C2 (see Figure 5) helps determine three main characteristics of a linear regulator: start-up delay, load transient response and loop stability. VIN VOUT C 1* 0.1mF RRST CS8151 C2** 10mF RESET *C1 required if regulator is located far from the power supply filter. **C2 required for stability. Calculating Power Dissipation in a Single Output Linear Regulator Figure 5. Test and application circuit showing output compensation. The capacitor value and type should be based on cost, availability, size and temperature constraints. A tantalum or aluminum electrolytic capacitor is best, since a film or ceramic capacitor with almost zero ESR can cause instability. The aluminum electrolytic capacitor is the least expensive solution, but, if the circuit operates at low temperatures (-25¡C to -40¡C), both the value and ESR of the capacitor will vary considerably. The capacitor manufacturers data sheet usually provide this information. The value for the output capacitor C2 shown in the test and applications circuit should work for most applications, however it is not necessarily the optimized solution. The maximum power dissipation for a single output regulator (Figure 6) is: PD(max) = {VIN(max) Ð VOUT(min)}IOUT(max) + VIN(max)IQ (1) where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IOUT(max) is the maximum output current for the application, and IQ is the quiescent current the regulator consumes at IOUT(max). 6 CS8151 Application Diagram Once the value of PD(max) is known, the maximum permissible value of RQJA can be calculated: RQJA = 150¡C - TA PD Heat Sinks Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RQJA: (2) The value of RQJA can then be compared with those in the package section of the data sheet. Those packages with RQJA's less than the calculated value in equation 2 will keep the die temperature below 150¡C. RQJA = RQJC + RQCS + RQSA where: RQJC = the junctionÐtoÐcase thermal resistance, RQCS = the caseÐtoÐheatsink thermal resistance, and RQSA = the heatsinkÐtoÐambient thermal resistance. RQJC appears in the package section of the data sheet. Like RQJA, it too is a function of package type. RQCS and RQSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heat sink manufacturers. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heatsink will be required. A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and IIN VIN IOUT Smart Regulator } VOUT Control Features IQ Figure 6. Single output regulator with key performance parameters labeled. into the surrounding air. Application Diagram BATTERY VOUT V VCC IN C1 C2 CS8151 Microprocessor WDI CDelay Gnd (3) I/O ______ RESET ______ RESET WAKE UP CDelay I/O 7 CS8151 Package Specification PACKAGE DIMENSIONS IN mm (INCHES) PACKAGE THERMAL DATA D Metric English Max Min Max Min 16L PDIP (Internally Fused Leads) 19.69 18.67 .775 .735 16L SOIC Wide 10.50 10.10 .413 .398 (Internally Fused Leads) Thermal Data 7 Lead 7 Lead 16 Lead 16 Lead TO-220 D2PAK PDIP SOIC Wide RQJC typ 1.8 1.8 15 18 ûC/W Lead Count RQJA typ 50 10-50* 50 75 ûC/W *Depending on thermal properties of substrate. RQJA = RQJC + RQCA 7 Lead D2PAK (DPS)* Short-Leaded Plastic DIP (N); 300 mil wide 1.68 (.066) 1.40 (.055) 1.40 (.055) 1.14 (.045) 10.31 (.406) 10.05 (.396) 7.11 (.280) 6.10 (.240) 8.53 (.336) 8.28 (.326) 1.77 (.070) 1.14 (.045) 8.26 (.325) 7.62 (.300) 2.79 (.110) 2.54 (.100) 14.71 (.579) 13.69 (.539) 2.54 (.100) BSC 3.68 (.145) 2.92 (.115) 1.98 (.078) 1.47 (.058) 0.91 (.036) 0.66 (.026) TERMINAL 8 1.27 (.050) REF .254 (.010) REF 6.50 (.256) REF 0.39 (.015) MIN. .356 (.014) .203 (.008) .558 (.022) .356 (.014) REF: JEDEC MS-001 D 4.57 (.180) 4.31 (.170) 7.75 (.305) REF Some 8 and 16 lead packages may have 1/2 lead at the end of the package. All specs are the same. 0.10 (.004) 0.00 (.000) Surface Mount Wide Body (DW); 300 mil wide *CHERRY SEMICONDUCTOR SHORT-LEADED FOOTPRINT 7.60 (.299) 7.40 (.291) 0.51 (.020) 0.33 (.013) 1.27 (.050) BSC 2.49 (.098) 2.24 (.088) 1.27 (.050) 0.40 (.016) 7 Lead TO-220 (T) Straight 10.65 (.419) 10.00 (.394) 6.55 (.258) 5.94 (.234) D 14.99 (.590) 14.22 (.560) 3.96 (.156) 3.71 (.146) 0.30 (.012) 0.10 (.004) 14.22 (.560) 13.72 (.540) Ordering Information Part Number CS8151YT7 CS8151YTVA7 CS8151YDPS7 CS8151YDPSR7 Description 7 lead TO-220 Straight 7 lead TO-220 Vertical 7 lead D2PAK Short-Leaded 7 lead D2PAK Short-Leaded (tape & reel) CS8151YNF16 16 lead PDIP (Internally Fused Leads) CS8151YDWF16 16 lead SOIC Wide (Internally Fused Leads) CS8151YDWFR16 16 lead SOIC Wide (Internally Fused Leads) (tape & reel) Rev. 5/4/99 1.40 (.055) 1.14 (.045) 2.87 (.113) 2.62 (.103) 2.65 (.104) 2.35 (.093) 0.32 (.013) 0.23 (.009) REF: JEDEC MS-013 4.83 (.190) 4.06 (.160) 10.54 (.415) 9.78 (.385) 0.94 (.037) 0.58 (.023) 1.40 (.055) 1.14 (.045) 0.64 (.025) 0.38 (.015) 7.75 (.305) 7.49 (.295) 0.56 (.022) 0.36 (.014) 2.92 (.115) 2.29 (.090) Cherry Semiconductor Corporation reserves the right to make changes to the specifications without notice. Please contact Cherry Semiconductor Corporation for the latest available information. 8 © 1999 Cherry Semiconductor Corporation