CX65101
1700 - 2200 MHz Linear Power Amplifier
Conexant’s CX65101 power amplifier is a fully matched 8-pin Leadless Chip
Carrier (LCC) surface mount module, developed for Personal Communications
System (PCS) and Wireless Local Loop (WLL) applications. This small, powerefficient amplifier has a full 1700 to 2200 MHz bandwidth coverage packed into a
single compact package. All active circuitry in the module is contained in a single
Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC). This
device is manufactured with Conexant’s Aluminum (Al)GaAs Heterojunction Bipolar
Transistor (HBT) process, which allows for single supply operation while
maintaining high efficiency and good linearity.
•
•
•
•
•
Typical POUT of 28.5 dBm
High linearity
Low power consumption
8-pin LCC package
Single +3.4 V supply
Applications
• PCS/DCS/UMTS
• Repeaters
• WLL, and Industrial, Scientific, Medical (ISM)
bands
• Mobile radio
• Telematics
8
3
4
DRIVER STAGE
BIAS
RFIN
2
INPUT MATCH
8
VCC2
VCC1
VREF
VCC1
Figure 1 shows a functional block diagram for the CX65101. The device package
and pinout are shown in Figure 2.
Distinguishing Features
POWER STAGE
BIAS
INTERSTAGE
MATCH
DA
OUTPUT
MATCH
DA
6
RFOUT
GND
1
7
GND
RFIN
2
6
RFOUT
VREF
3
5
GND
4
MMIC
5, 7
GND
GND
Figure 2. CX65101 Pinout– 8-Pin LCC Package
Top View
Figure 1. CX65101 Functional Block Diagram
Data Sheet
VCC2
MODULE
1
Conexant
Proprietary Information and Specifications Are Subject to Change
Doc. No. 101472D
March 12, 2002
CX65101
Power Amplifier
Electrical and Mechanical Specifications
Typical performance characteristics over temperature of the
CX65101 are illustrated in Figures 3, 4, 5, 6, 7 and 8.
The signal pin assignments and functions are described in
Table 1. The absolute maximum ratings of the CX65101 are
provided in Table 2. The recommended operating conditions are
specified in Table 3 and electrical specifications are provided in
Table 4.
Table 1. CX65101 Signal Descriptions
Pin #
Name
Description
1
GND
Ground
2
RFIN
RF input
3
VREF
Reference voltage
4
VCC2
Supply voltage
5
GND
Ground
6
RFOUT
7
GND
Ground
8
VCC1
Supply voltage
RF output
Table 2. CX65101 Absolute Maximum Ratings
Parameter
Symbol
Min
Typical
Max
Units
RF input power
PIN
10
dBm
Supply voltage
VCC
5
V
Reference voltage
VREF
3.6
V
Case operating temperature
TC
–30
100
°C
Storage temperature
TST
–55
125
°C
Note: No damage to device if only one parameter is applied at a time with other parameters at nominal conditions.
Table 3. CX65101 Recommended Operating Conditions
Parameter
2
Symbol
Min
Typical
Max
Units
Supply voltage
VCC
3.4
V
Reference voltage
VREF
3.3
V
Operating frequency
FO
1700
1900
2200
MHz
Case operating temperature
TC
–30
25
85
°C
Conexant
Proprietary Information and Specifications Are Subject to Change
101472D
March 12, 2002
Power Amplifier
CX65101
Table 4. CX65101 Electrical Characteristics
(VCC = 3.4 V, VREF = 3.3 V, Frequency = 1900 MHz, TC = 25 °C)
Parameter
Symbol
Test
Conditions
Min
Typical
Max
Units
1700
1900
2200
MHz
130
170
mA
Analog Inputs
Frequency range
Quiescent current
Iq
Small signal gain
G
PIN = –15 dBm
20.0
21.5
dB
Output power
POUT
PIN = 7 dBm
27.5
28.5
dBm
Efficiency
PAE
PIN = 7 dBm
27.5
30.0
Noise Figure (NF)
NF
Output IP3
%
5
OIP3
Two tones with
100 kHz
spacing
PIN = 0 dBm
per tone
37
6
40
dB
dBm
Note: The above specifications apply only to the 1900 MHz operating frequency.
30
Pout (dBm)
29
28
-30C
27
25C
85C
26
25
24
3
4
5
6
7
8
Pin (dBm)
Figure 3. Typical POUT vs PIN Over Temperature
101472D
March 12, 2002
Conexant
Proprietary Information and Specifications Are Subject to Change
3
CX65101
Power Amplifier
34
32
PAE (%)
30
28
-30C
26
25C
85C
24
22
20
18
3
4
5
6
7
8
Pin (dBm)
Figure 4. Typical PAE vs PIN Over Temperature
Small Signal Gain (dB)
30
25
20
-30C
15
25C
85C
10
5
0
1700
1800
1900
2000
2100
2200
Freq (MHz)
Figure 5. Typical Small Signal Gain vs Frequency Over Temperature
8
7
NF (dB)
6
5
-30C
4
25C
85C
3
2
1
0
1700
1800
1900
2000
2100
2200
Freq (MHz)
Figure 6. Typical Noise Figure vs Frequency Over Temperature
4
Conexant
Proprietary Information and Specifications Are Subject to Change
101472D
March 12, 2002
Power Amplifier
CX65101
50
OIP3 (dBm)
40
30
-30C
25C
85C
20
10
0
1700
1800
1900
2000
2100
2200
Freq (MHz)
Figure 7. Typical OIP3 vs Frequency Over Temperature
35
Pout (dBm)
30
25
20
-30C
25C
15
85C
10
5
0
1700
1800
1900
2000
2100
2200
Freq (MHz)
Figure 8. Typical POUT vs Frequency Over Temperature
Evaluation Board Description
1.
Paths to ground should be made as short as possible.
Conexant's CX65101 Evaluation Board is used to test the
CX65101 power amplifier’s performance. The CX65101
Evaluation Board schematic diagram is shown in Figure 9. The
schematic shows the basic design of the board for the 1700 to
2200 MHz range. Figure 10 provides the Evaluation Board
assembly diagram. Figure 11 provides the Evaluation Board
layer detail.
2.
The ground pad of the CX65101 power amplifier has
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since
the circuit board acts as the heat sink, it must shunt as
much heat as possible from the amplifier. As such, design
the connection to the ground pad to dissipate the maximum
wattage produced to the circuit board. Multiple vias to the
grounding layer are required.
3.
Two external output bypass capacitors, 0.01 µF and
4.7 µF, are required on the VCC1 (pin 8) supply input. The
same two capacitors are also required on the VCC2 (pin 4)
supply input. Both capacitors should be placed in parallel
Circuit Design Considerations ________________________
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
101472D
March 12, 2002
Conexant
Proprietary Information and Specifications Are Subject to Change
5
CX65101
Power Amplifier
Package Dimensions
between the supply line and ground. Also, a bypass
capacitor of 0.01 µF is required on the VREF input (pin 3).
See Figure 9 for a detailed diagram.
4.
VCC1 (pin 8) and VCC2 (pin 4) may be connected together
at the supply.
5.
At the RF input (pin 2), a DC blocking capacitor is required.
6.
The RF output includes an onboard internal DC blocking
capacitor. All impedance matching is provided internally.
Therefore, the application only needs to provide a good
50 Ω load.
Testing Procedure __________________________________
Use the following procedure to set up the CX65101 Evaluation
board for testing. Refer to Figure 12 for guidance:
1.
Connect a +3.4 V supply voltage to VCC1 and VCC2, and
+3.3 V supply voltage to VREF. If available, enable the
current limiting function of the power supplies to 1.0 A for
the +3.4 V supply current and 30 mA for the +3.3 V supply
current.
2.
Connect a signal generator to the RF signal input port. Set
it to the desired RF frequency at a power level of 7 dBm or
less to the Evaluation Board but do NOT enable the RF
signal.
3.
Connect a spectrum analyzer to the RF signal output port.
4.
Enable the power supply.
5.
Enable the RF signal.
6.
Take measurements.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it
is baked and vacuum packed before shipping. Instructions on
the shipping container label regarding exposure to moisture
after the container seal is broken must be followed. Otherwise,
problems related to moisture absorption may occur when the
part is subjected to high temperature during solder assembly.
If the part is attached in a reflow oven, the temperature ramp
rate should not exceed 5 °C per second. Maximum temperature
should not exceed 225 °C and the time spent at a temperature
that exceeds 210 °C should be limited to less than 10 seconds.
If the part is manually attached, precaution should be taken to
ensure that the part is not subjected to a temperature that
exceeds 300 °C for more than 10 seconds.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment. For
additional details on both attachment techniques, precautions,
and recommended handling procedures, refer to the Conexant
document Solder Reflow Application Note, document number
101536.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the
Conexant document Tape and Reel Information Application
Note, document number 101568.
Electrostatic Discharge (ESD) Sensitivity
Caution: If the input signal exceeds the rated power, the
CX65101 Evaluation Board can be permanently
damaged.
6
Figure 13 shows the package dimensions for the 8-pin CX65101
LCC and Figure 14 provides the tape and reel dimensions.
The CX65101 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper
ESD precautions.
Conexant
Proprietary Information and Specifications Are Subject to Change
101472D
March 12, 2002
Power Amplifier
CX65101
+3.4 V
C1
4.7 F
C2
0.01 F
VCC1
8
T2
50
microstrip
T1
1
7
2
6
3
5
RF in
C5
3.3 pF
RFIN
VREF
T3
50
microstrip RF out
RFOUT
4
C6
0.01 F
Pin 9
Package Base
VCC2
C3
0.01 F
+3.3 V
Notes:
1) Pin 9 provides both a thermal and electrical ground.
This ground path is critical and must be as short
as possible.
2) Transmission line lengths T1 and T2 should be
minimized.
C4
4.7 F
+3.4 V
C1237b
Figure 9. Evaluation Board Schematic, 1700 MHz to 2200 MHz
8X8 PA EVALUATION BD.
CX65101
TW10 D815
07-02-01
C2
C1
CX65101
C5
C6
J1 (RF In)
C3
GND
J2 (RF Out)
GND
VCC 2
VREF
VCC 1
GND
C4
J3
C1257a
Figure 10. Evaluation Board Assembly Diagram
(Top View)
101472D
March 12, 2002
Conexant
Proprietary Information and Specifications Are Subject to Change
7
CX65101
Power Amplifier
Layer 1: Top - Metal
Layer 2: Inner Traces
Layer 3: Solid Ground Plane
C1253b
Figure 11. Evaluation Board Layer Detail
8
Conexant
Proprietary Information and Specifications Are Subject to Change
101472D
March 12, 2002
Power Amplifier
CX65101
Power Supply
Input
Signal Generator
Power Meter
or
Spectrum Analyzer
Output
CX65101
Evaluation Board
C1240b
Figure 12. CX65101 Evaluation Board Testing Configuration
1.955 ± 0.155
1.45 ± 0.10
Pin 8
Pin 7
Pin 1
8.385 ± 0.125
7.875 ± 0.075
Pin 2
Pin 6
Pin 5
Pin 3
Pin 4
0.51 ± 0.05
8.385 ± 0.125
7.875 ± 0.075
3.30 (2X)
DETAIL A
1.65 (2X)
Note: pin 1 connects to ground
0.81 (12X)
3.30 (2X)
R.20 (8X)
3.99
R 2.54
3.94
Pin 9
1.91 (2X)
1.91 (2X)
0.61 (12X)
SEE DETAIL A
3.94
1.65 (2X)
3.99
COPPER BOTTOM
SOLDER MASK BOTTOM
The bottom solder mask thickness = 0.063 maximum
All dimensions are in millimeters
C1201
Figure 13. CX65101 8-Pin LCC Package Dimension Drawing
101472D
March 12, 2002
Conexant
Proprietary Information and Specifications Are Subject to Change
9
CX65101
Power Amplifier
12.00 ± 0.10
1.50± 0.10
4.00 ± 0.10
2.00 ± 0.10
1.75 ± 0.10
B
Pin #1
A
A
7.50 ± 0.10
16.00 +0.30/-0.10
B
1.50 ± 0.25
8˚ Max
5˚ Max
0.318 ± 0.013
8.89 ± 0.10
8.88 ± 0.10
A
B
2.14 ± 0.10
Notes:
1. Carrier tape: black conductive polycarbonate.
2. Cover tape material: transparent conductive PSA.
3. All dimensions are in millimeters.
C1221
Figure 14. CX65101 8-Pin LCC Tape and Reel Dimensions
10
Conexant
Proprietary Information and Specifications Are Subject to Change
101472D
March 12, 2002
Power Amplifier
CX65101
Ordering Information
Model Name
Ordering Part Number
Evaluation Kit Part
Number
CX65101 1700-2200 MHz Linear Power
Amplifier
CX65101-11
TW10-D812
© 2001, 2002, Conexant Systems, Inc. All Rights Reserved.
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Conexant
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11
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