CY54FCT157T, CY74FCT157T QUAD 2-INPUT MULTIPLEXERS WITH 3-STATE OUTPUTS SCCS014B – MAY 1994 – REVISED NOVEMBER 2001 D D D D D D D D description CY74FCT157T . . . Q OR SO PACKAGE (TOP VIEW) S 1 16 I0a I1a Ya I0b I1b Yb GND 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC E I0d I1d Yd I0c I1c Yc CY54FCT157T . . . L PACKAGE (TOP VIEW) I 0a S NC VCC E D Function, Pinout, and Drive Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) CY54FCT157T – 32-mA Output Sink Current – 12-mA Output Source Current CY74FCT157T – 64-mA Output Sink Current – 32-mA Output Source Current 3-State Outputs I1a Ya NC I0b I1b 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 I0d I1d NC Yd I0c Yb GND NC Yc I1c D NC – No internal connection The ’FCT157T devices are quad two-input multiplexers that select four bits of data from two sources under the control of a common data-select (S) input. The output-enable (E) input is active low. When E is high, all of the outputs (Y) are forced low, regardless of all other input conditions. Moving data from two groups of registers to four common output buses is a common use of the ’FCT157T devices. The state of S determines the particular register from which the data comes. It also can be used as a function generator. These devices are useful for implementing highly irregular logic by generating any 4 of the 16 different functions of 2 variables, with 1 variable common. The ’FCT157T devices are logic implementations of a four-pole, two-position switch, where the position of the switch is determined by the logic levels at S. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY54FCT157T, CY74FCT157T QUAD 2-INPUT MULTIPLEXERS WITH 3-STATE OUTPUTS SCCS014B – MAY 1994 – REVISED NOVEMBER 2001 PIN DESCRIPTION NAME DESCRIPTION S Common select input E Enable inputs (active low) I0 I1 Data inputs from source 0 Y Noninverted outputs Data inputs from source 1 ORDERING INFORMATION TA QSOP – Q SOIC – SO –40°C 40°C to 85°C SPEED (ns) PACKAGE† QSOP – Q SOIC – SO ORDERABLE PART NUMBER Tape and reel 4.3 CY74FCT157CTQCT Tube 4.3 CY74FCT157CTSOC Tape and reel 4.3 CY74FCT157CTSOCT Tape and reel 5 CY74FCT157ATQCT Tube 5 CY74FCT157ATSOC Tape and reel 5 CY74FCT157ATSOCT TOP-SIDE MARKING FT157-3 FCT157C FT157-1 FCT157A –55°C to 125°C LCC – L Tube 5.8 CY54FCT157ATLMB † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS E S I1 X OUTPUT Y H X I0 X L H X L L L H X H H L L L X L L L H X H L H = High logic level, L = Low logic level, X = Don’t care 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT157T, CY74FCT157T QUAD 2-INPUT MULTIPLEXERS WITH 3-STATE OUTPUTS SCCS014B – MAY 1994 – REVISED NOVEMBER 2001 logic diagram (positive logic) I0a 2 4 I1a I0b 3 5 7 I1b I0c 6 I0d 10 E S Yc 14 12 I1d Yb 11 9 I1c Ya 13 Yd 15 1 Pin numbers shown are for the Q and SO packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θJA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY54FCT157T, CY74FCT157T QUAD 2-INPUT MULTIPLEXERS WITH 3-STATE OUTPUTS SCCS014B – MAY 1994 – REVISED NOVEMBER 2001 recommended operating conditions (see Note 2) CY54FCT157T CY74FCT157T MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 UNIT VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 V High-level output current –12 –32 mA IOL TA Low-level output current 32 64 mA 85 °C High-level input voltage 2 Operating free-air temperature 2 –55 125 V V –40 NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH CY54FCT157T TYP† MAX TEST CONDITIONS VCC = 4.5 V, VCC = 4.75 V, IIN = –18 mA IIN = –18 mA VCC = 4.5 V, IOH = –12 mA IOH = –32 mA VCC = 4 4.75 75 V MIN –0.7 –1.2 –0.7 2.4 2.4 Vhys All inputs II VCC = 5.5 V, VCC = 5.25 V, VIN = VCC VIN = VCC 5 IIH VCC = 5.5 V, VCC = 5.25 V, VIN = 2.7 V VIN = 2.7 V ±1 IIL VCC = 5.5 V, VCC = 5.25 V, VIN = 0.5 V VIN = 0.5 V ±1 IOZH VCC = 5.5 V, VCC = 5.25 V, VOUT = 2.7 V VOUT = 2.7 V 10 IOZL VCC = 5.5 V, VCC = 5.25 V, VOUT = 0.5 V VOUT = 0.5 V –10 IOS‡ VCC = 5.5 V, VCC = 5.25 V, VOUT = 0 V VOUT = 0 V VCC = 0 V, VCC = 5.5 V, VOUT = 4.5 V VIN ≤ 0.2 V, ∆ICC 0.3 3.3 0.55 IOL = 64 mA 0.3 0.2 0.55 0.2 ±1 ±1 10 –10 –120 –225 –60 –120 ±1 VIN ≥ VCC – 0.2 V VIN ≤ 0.2 V, VIN ≥ VCC – 0.2 V § VCC = 5.5 V, VIN = 3.4 V , f1 = 0, Outputs open 0.1 VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open 0.5 –225 ±1 0.2 VCC = 5.25 V, V V 5 –60 V V 2 IOH = –15 mA IOL = 32 mA VCC = 4.5 V, VCC = 4.75 V, ICC –1.2 UNIT 3.3 VOL Ioff CY74FCT157T TYP† MAX MIN 0.1 0.2 0.5 2 µA µA µA µA µA mA µA mA 2 mA † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT157T, CY74FCT157T QUAD 2-INPUT MULTIPLEXERS WITH 3-STATE OUTPUTS SCCS014B – MAY 1994 – REVISED NOVEMBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) PARAMETER ICCD¶ CY54FCT157T TYP† MAX TEST CONDITIONS MIN VCC = 5.5 V, One input switching at 50% duty cycle, Outputs open, E = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.06 CY74FCT157T TYP† MAX MIN 0.12 VCC = 5.25 V, One input switching at 50% duty cycle, Outputs open, E = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V One input switching at f1 = 10 MHz at 50% duty cycle VCC = 5.5 V, Out uts o en, Outputs open, E = GND Four bits switching at f1 = 2.5 MHz at 50% duty cycle IC# One input switching at f1 = 10 MHz at 50% duty cycle VCC = 5.25 V, Out uts o en, Outputs open, E = GND Four bits switching at f1 = 2.5 MHz at 50% duty cycle 0.06 VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.7 1.4 1 2.4 VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.7 1.4|| VIN = 3.4 V or GND 1.7 5.4|| VIN = 3.4 V or GND 0.12 UNIT mA/ MHz mA VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.7 1.4 VIN = 3.4 V or GND 1 2.4 VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.7 1.4|| VIN = 3.4 V or GND 1.7 5.4|| Ci 5 10 5 10 pF Co 9 12 9 12 pF † Typical values are at VCC = 5 V, TA = 25°C. ¶ This parameter is derived for use in total power-supply calculations. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL I Y tPLH tPHL E Y tPLH tPHL S Y POST OFFICE BOX 655303 CY54FCT157AT CY74FCT157AT CY74FCT157CT MIN MAX MIN MAX MIN MAX 1.5 5.8 1.5 5 1.5 4.3 1.5 5.8 1.5 5 1.5 4.3 1.5 7.4 1.5 6 1.5 4.8 1.5 7.4 1.5 6 1.5 4.8 1.5 8.1 1.5 7 1.5 5.2 1.5 8.1 1.5 7 1.5 5.2 • DALLAS, TEXAS 75265 UNIT ns ns ns 5 CY54FCT157T, CY74FCT157T QUAD 2-INPUT MULTIPLEXERS WITH 3-STATE OUTPUTS SCCS014B – MAY 1994 – REVISED NOVEMBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 21-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9220803M2A ACTIVE LCCC FK 20 1 TBD CY74FCT157ATD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATQCT ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT157ATQCTE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT157ATQCTG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT157ATSOC ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATSOCE4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATSOCG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATSOCT ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATSOCTE4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157ATSOCTG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTQCT ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT157CTQCTE4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT157CTQCTG4 ACTIVE SSOP/ QSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 21-May-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT157CTSOC ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTSOCE4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTSOCG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTSOCT ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTSOCTE4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT157CTSOCTG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CY74FCT157ATDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CY74FCT157ATSOCT SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 CY74FCT157CTDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CY74FCT157CTSOCT SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT157ATDR SOIC D 16 2500 333.2 345.9 28.6 CY74FCT157ATSOCT SOIC DW 16 2000 346.0 346.0 33.0 CY74FCT157CTDR SOIC D 16 2500 333.2 345.9 28.6 CY74FCT157CTSOCT SOIC DW 16 2000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated