BCcomponents DATA SHEET 150 CLZ Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance Preliminary specification Supersedes data of 26th September 2001 File under BCcomponents, BC01 2002 Feb 27 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ FEATURES • Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, reflow solderable • Very low impedance, very high ripple current • Very long useful life: 3000 hours at 105 °C CCA716 • Charge and discharge proof, no peak current limitation • Supplied in blister tape on reel. Fig.1 Component outline. APPLICATIONS • SMD technology, for high mounting density 140 CLH 125 °C • Industrial and professional applications • Automotive, general industrial 175 °C solid SMD 175 TMP standard 153 CLV high temperature • Smoothing, filtering, buffering. 150 CLZ JW14 QUICK REFERENCE DATA DESCRIPTION VALUE Nominal case sizes (L × W × H in mm) 8 × 8 × 10 to 10 × 10 × 14 33 to 1000 µF Rated capacitance range, CR ±20% Tolerance on CR 6.3 to 63 V Rated voltage range, UR −55 to +105 °C Category temperature range Endurance test at 105 °C: 2000 hours Useful life at 105 °C: case size ≤10 × 10 × 10 2500 hours case size 10 × 10 × 14 3000 hours Useful life at 40 °C; 1.8 × lR applied: case size ≤10 × 10 × 10 125000 hours case size 10 × 10 × 14 150000 hours Shelf life at 0 V, 105 °C 1000 hours Based on sectional specification IEC 60384-18/CECC32300 Climatic category IEC 60068 2002 Feb 27 55/105/56 2 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ Selection chart for CR, UR and relevant nominal case sizes (L × W × H in mm) Preferred types in bold. CR (µF) 33 47 UR (V) 6.3 10 16 25 35 50 63 − − − − − − 8 × 8 × 10 − − − − − − 8 × 8 × 10 − − − − − − 10 × 10 × 10 68 − − − − − 8 × 8 × 10 10 × 10 × 10 100 − − − − 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 150 − − − 8 × 8 × 10 − − − 220 − − 8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 − 330 − 8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 − − 470 8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 − − − 680 − 10 × 10 × 10 10 × 10 × 14 − − − − 10 × 10 × 10 10 × 10 × 14 − − − − − 1000 MARKING • Rated capacitance (in µF) • Rated voltage (in V) • Black mark or ‘−’ sign indicating the cathode (the anode is identified by bevelled edges) • Code indicating group number (Z) • Date code, in accordance with “IEC 60062”. 2002 Feb 27 3 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ MECHANICAL DATA 0.4 ±0.2 L W B S L1 D H JW07 0.3 max. Dimensions in mm. For dimensions see Table 1. Fig.2 Dimensional outline. Table 1 Physical dimensions, mass and packaging quantities; see Fig.2 NOMINAL CASE SIZE L×W×H (mm) CASE CODE Lmax (mm) Wmax (mm) Hmax (mm) ∅D (mm) 8 × 8 × 10 0810 8.5 8.5 10.5 10 ×10 × 10 1010 10.5 10.5 10 × 10 × 14 1014 10.5 10.5 Bmax (mm) S (mm) L1 max (mm) MASS (g) 8.0 1.0 3.1 9.9 ≈1.0 10.5 10.0 1.0 4.5 11.8 ≈1.3 14.3 10.0 1.0 4.5 11.8 ≈1.5 PACKAGING Supplied in blister tape on reel. For general packaging information refer to data handbook BC01, section “Packaging”. Table 2 Tape and reel dimensions NOMINAL CASE SIZE L×W×H (mm) CASE CODE PITCH P1 (mm) TAPE WIDTH W (mm) TAPE THICKNESS T2 (mm) REEL DIA. (mm) PACKAGING QUANTITY PER REEL 500 8 × 8 × 10 0810 16 24 11.8 380 10 ×10 × 10 1010 16 24 11.8 380 500 10 × 10 × 14 1014 16 24 15.0 330 250 2002 Feb 27 4 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ MOUNTING The capacitors are designed for automatic placement on to printed-circuit boards. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print lay-out and/or adjacent components. b CCA857 a Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the soldering pad during processing. a For dimensions see Table 3. Fig.3 Recommended soldering pad dimensions. For recommended soldering pad dimensions, refer to Fig.3 and Table 3 Soldering c Table 3 Recommended soldering pad dimensions; see Fig.3 CASE CODE a (mm) b (mm) c (mm) 0810 3.5 2.5 3.0 1010 4.3 2.5 4.0 1014 4.3 2.5 4.0 For maximum conditions refer to Fig.4. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE GOOD SOLDERING CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM CURVES SHOULD NEVER BE EXCEEDED. MBA533 280 T PAD o ( C) 260 240 220 200 180 160 140 120 100 80 0 Fig.4 2002 Feb 27 50 100 150 200 t (s) 250 Maximum temperature load during infrared reflow soldering measured on the soldering pad. 5 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ ELECTRICAL DATA AND ORDERING INFORMATION Electrolytic capacitor 150 CLZ series Unless otherwise specified, all electrical values in Table 4 apply at Tamb = 20 °C, P = 86 to 106 kPa, RH = 45 to 75%. 220 µF/50 V; ±20% SYMBOL DESCRIPTION CR rated capacitance at 100 Hz, tolerance ±20% IR rated RMS ripple current at 100 kHz, 105 °C IL2 max. leakage current after 2 minutes at UR Tan δ max. dissipation factor at 100 Hz Z max. impedance at 100 kHz Nominal case size: 10 × 10 × 14 mm; taped on reel Catalogue number: 2222 150 95102. Ordering example Table 4 UR (V) Electrical data and ordering information; preferred types in bold CR (µF) 6.3 470 1000 10 330 NOMINAL CASE SIZE L×W×H (mm) IR 105 °C (mA) 100 kHz IL2 2 min (µA) Tan δ 100 Hz Z 100 kHz +20 °C ( Ω) CATALOGUE NUMBER 2222 150 ..... 95311 8 × 8 × 10 435 30 0.24 0.25 10 × 10 × 10 670 63 0.24 0.13 95301 8 × 8 × 10 435 33 0.20 0.25 95411 470 8 × 8 × 10 435 47 0.20 0.25 95412 680 10 × 10 × 10 670 68 0.20 0.13 95401 1000 16 25 35 50 63 2002 Feb 27 10 × 10 × 14 850 100 0.20 0.10 95402 220 8 × 8 × 10 435 35 0.16 0.25 95511 330 8 × 8 × 10 435 53 0.16 0.25 95512 470 10 × 10 × 10 670 75 0.16 0.13 95501 680 10 × 10 × 14 850 109 0.16 0.10 95502 150 8 × 8 × 10 420 38 0.14 0.28 95611 220 8 × 8 × 10 420 55 0.14 0.28 95612 330 10 × 10 × 10 640 83 0.14 0.14 95601 95602 470 10 × 10 × 14 820 118 0.14 0.11 100 8 × 8 × 10 405 35 0.12 0.30 95011 220 10 × 10 × 10 630 77 0.12 0.15 95001 330 10 × 10 × 14 790 116 0.12 0.12 95002 68 8 × 8 × 10 333 34 0.12 0.48 95111 100 10 × 10 × 10 490 50 0.12 0.24 95101 220 10 × 10 × 14 620 110 0.12 0.19 95102 33 8 × 8 × 10 270 21 0.10 0.65 95812 47 8 × 8 × 10 270 30 0.10 0.65 95811 47 10 × 10 × 10 390 30 0.10 0.38 95801 68 10 × 10 × 10 390 43 0.10 0.38 95802 100 10 × 10 × 14 507 63 0.10 0.29 95803 6 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ Additional electrical data PARAMETER CONDITIONS VALUE Voltage Surge voltage for short periods IEC 60384-18, subclause 4.14 Us ≤ 1.15 × UR Reverse voltage for short periods IEC 60384-18, subclause 4.16 Urev ≤ 1 V after 2 minutes at UR IL2 ≤ 0.01 × CR × UR Current Leakage current Inductance Equivalent series inductance (ESL) typ. 16 nH Resistance Equivalent series resistance (ESR) at 100 Hz calculated from tan δmax and CR (see Table 4) ESR = tan δ / 2πfCR Capacitance (C) JW15 1.2 C C0 1 1.1 2 1.0 2 0.9 Curve 1: 10 V. Curve 2: 63 V. C0 = capacitance at 20 °C, 100 Hz. 1 0.8 −60 −40 −20 0 20 40 60 80 100 120 Tamb (°C) Fig.5 Typical multiplier of capacitance as a function of ambient temperature. 2002 Feb 27 7 140 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ Dissipation factor (tan δ) JW16 102 tan δ tan δ 0 1 10 2 2 1 1 Curve 1: 10 V. Curve 2: 63 V. Tan δ0 = typical tan δ at 20 °C, 100 Hz. 10−1 −60 −40 −20 0 20 40 60 80 100 Tamb (°C) 120 Fig.6 Multiplier of dissipation factor (tan δ) as a function of ambient temperature. Equivalent series resistance (ESR) JW17 10 ESR ESR 0 3 2 1 1 1 2 3 Curve 1: 10 V. Curve 2: 35 V. Curve 3: 63 V. ESR0 = typical ESR at 20 °C, 100 Hz. 0.1 101 102 103 Fig.7 Typical multiplier of ESR as a function of frequency. 2002 Feb 27 8 104 f (Hz) 105 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ Impedance (Z) JW169 102 Z (Ω ) 1 2 3 10 1 UR = 10 V Curve 1: case code 0810, 470 µF. Curve 2: case code 1010, 680 µF. Curve 3: case code 1014, 1000 µF. Tamb = 20 °C. 0.1 0.01 10 10 2 10 3 10 4 f (Hz) 10 5 Fig.8 Typical impedance as a function of frequency. JW170 102 Z (Ω ) 10 1 1 2 0.1 UR = 35 V Curve 1: case code 0810, 100 µF. Curve 2: case code 1010, 220 µF. Curve 3: case code 1014, 330 µF. Tamb = 20 °C. 3 0.01 10 10 2 10 3 Fig.9 Typical impedance as a function of frequency. 2002 Feb 27 9 10 4 f (Hz) 10 5 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ JW171 102 Z (Ω ) 10 1 1 2 3 0.1 UR = 63 V Curve 1: case code 0810, 47 µF. Curve 2: case code 1010, 68 µF. Curve 3: case code 1014, 100 µF. Tamb = 20 °C. 0.01 10 10 2 10 3 10 4 f (Hz) 10 5 Fig.10 Typical impedance as a function of frequency. RIPPLE CURRENT AND USEFUL LIFE Table 5 Multiplier of ripple current (IR) as a function of frequency FREQUENCY (Hz) IR MULTIPLIER UR = 6.3 to 25 V UR = 35 V UR = 50 to 63 V 100 0.70 0.65 0.60 300 0.80 0.80 0.75 1000 0.85 0.85 0.85 3000 0.93 0.93 0.93 10000 0.95 0.95 0.95 30000 0.97 0.97 0.97 100000 1.00 1.00 1.00 2002 Feb 27 10 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ MEA240 3.8 IA 3.7 IR 3.6 3.5 3.4 3.3 3.2 3.1 3.0 2.8 lifetime multiplier 2.6 1. 0 2.4 5 1. 0 2. 2.2 0 3. 0 4. 2.0 0 6. 0 8. 1.8 12 1.6 20 60 1) 0 10 0 15 0 20 1.2 1.0 0.8 0.5 0.0 30 1.4 40 50 60 70 80 90 100 110 Tamb ( oC) IA = actual ripple current at 100 kHz. IR = rated ripple current at 100 kHz, 105 °C. (1) Useful life at 105 °C and IR applied: case code ≤1010: 2500 hours; case code = 1014: 3000 hours. Fig.11 Multiplier of useful life as a function of ambient temperature and ripple current load. 2002 Feb 27 11 BCcomponents Preliminary specification Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance 150 CLZ SPECIFIC TESTS AND REQUIREMENTS General tests and requirements are specified in data handbook BC01, section “Tests and Requirements”. Table 6 Test procedures and requirements TEST NAME OF TEST Mounting Endurance REFERENCE PROCEDURE (quick reference) REQUIREMENTS shall be performed prior to tests mentioned below; reflow soldering; for maximum temperature load refer to chapter “Mounting” ∆C/C: ±5% IEC 60384-18/ CECC32300, subclause 4.15 Tamb = 105 °C; UR applied; 2000 hours UR = 6.3 V; ∆C/C: ±25% UR ≥ 10 V; ∆C/C: ±20% CECC 30301, subclause 1.8.1 Tamb = 105 °C; UR and IR applied; case size ≤10 × 10 × 10: 2 500 hours case size = 10 × 10 × 14: 3 000 hours, IEC 60384-18, subclause 4.3 tan δ ≤ spec. limit IL2 ≤ spec. limit tan δ ≤ 2 × spec. limit IL2 ≤ spec. limit Useful life ∆C/C: ±50% tan δ ≤ 3 × spec. limit IL2 ≤ spec. limit no short or open circuit total failure percentage: ≤1% Shelf life (storage at high temperature) 2002 Feb 27 IEC 60384-18/ CECC32300, subclause 4.17 Tamb = 105 °C; no voltage applied; 1000 hours after test: UR to be applied for 30 minutes, 24 to 48 hours before measurement 12 for requirements see ‘Endurance test’ above