DS14185 www.ti.com SNLS093C – APRIL 1999 – REVISED APRIL 2013 DS14185 EIA/TIA-232 3 Driver x 5 Receiver Check for Samples: DS14185 FEATURES DESCRIPTION • • • • • • • The DS14185 is a three driver, five receiver device which conforms to the EIA/TIA-232-E standard. 1 2 Replaces One 1488 and Two 1489s Conforms to EIA/TIA-232-E 3 Drivers and 5 Receivers Flow Through Pinout Failsafe Receiver Outputs 20-pin SOIC Package LapLink Compatible −200 kbps Data Rate The flow-through pinout facilitates simple noncrossover board layout. The DS14185 provides a one-chip solution for the common 9-pin serial RS-232 interface between data terminal and data communications equipment. Connection Diagram Figure 1. SOIC See Package DW0020B Functional Diagram Figure 2. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated DS14185 SNLS093C – APRIL 1999 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage (VCC) +7V Supply Voltage (V+) +15V Supply Voltage (V−) −15V Driver Input Voltage 0V to VCC Driver Output (3) Voltage (Power Off) ±15V Receiver Input Voltage ±25V Receiver Output Voltage (ROUT) Maximum Package Power Dissipation @ +25°C 0V to VCC DW Package 1488 mW Derate DW Package 11.9 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range (Soldering, 4 seconds) +260°C ESD Ratings (HBM, 1.5 kΩ, 100 pF) ≥1.5 kV (1) (2) (3) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be specified. They are not meant to imply that the devices should be operated at these limits. The table of Electrical Characteristics specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Only one driver output shorted at a time. Recommended Operating Conditions Min Typ Max Units Supply Voltage (VCC) +4.75 +5.0 +5.25 V Supply Voltage (V+) +9.0 +12.0 +13.2 V Supply Voltage (V−) −13.2 −12.0 −9.0 V 0 25 70 °C Operating Free Air Temperature (TA) Electrical Characteristics (1) Over recommended supply voltage and operating temperature ranges, unless otherwise specified. Symbol Parameter Conditions Min Typ (2) Max Units 21.0 30 mA 8.7 15 mA DEVICE CHARACTERISTICS ICC VCC Supply Current No Load, All Inputs at +5V I+ V+ Supply Current (1) No Load, All Driver Inputs at 0.8V or +2V All Receiver Inputs at 0.8V or 2.4V. I− (1) (2) 2 V− Supply Current (1) V+ = 9V, V− = −9V + − V = 13.2V, V = −13.2V 13 22 mA V+ = 9V, V− = −9V −12.5 −22 mA V+ = 13.2V, V− = −13.2V −16.5 −28 mA Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified. For current, minimum and maximum values are specified as an absolute value and the sign is used to indicate direction. For voltage logic levels, the more positive value is designated as maximum. For example, if −6V is a maximum, the typical value (−6.8V) is more negative. All typicals are given for: VCC = +5.0V, V+ = +12.0V, V− = −12V, TA = +25°C. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14185 DS14185 www.ti.com SNLS093C – APRIL 1999 – REVISED APRIL 2013 Electrical Characteristics(1) (continued) Over recommended supply voltage and operating temperature ranges, unless otherwise specified. Symbol Parameter Conditions Min Typ (2) Max Units DRIVER CHARACTERISTICS VIH High Level Input Voltage VIL Low Level Input Voltage IIH High Level Input Current (3) VIN = 5V IIL Low Level Input Current (3) VIN = 0V VOH High Level Output Voltage (3) RL = 3 kΩ, VIN = 0.8V, V+ = 9V, V− = −9V 6 7 V RL = 3 kΩ, VIN = 0.8V, V+ = +12V, V− = −12V 8.5 9 V RL = 7 kΩ, VIN = 0.8V, V+ = +13.2V, V− = −13.2V 10 11.5 V Low Level Output Voltage (3) VOL 2.0 V −1.24 0.8 V 10 μA −1.5 mA RL = 3 kΩ, VIN = 2V, V+ = 9V, V− = −9V −7 −6 V RL = 3 kΩ, VIN = 2V, V+ = +12V, V− = −12V −8 −7.5 V RL = 7 kΩ, VIN = 0.8V, V+ = +13.2V, V− = −13.2V −11 −10 V IOS+ Output High Short Circuit Current (3) VO = 0V, VIN = 0.8V −6 −13 −18 mA IOS− Output Low Short Circuit Current (3) VO = 0V, VIN = 2.0V 6 13 18 mA RO Output Resistance −2V ≤ VO ≤ +2V, V+ = V− = VCC = 0V 300 Ω −2V ≤ VO ≤ +2V, V+ = V− = VCC = Open Ckt 300 Ω RECEIVER CHARACTERISTICS VTH Input High Threshold (Recognized as a High Signal) VO ≤ 0.4V, IO = 3.2 mA VTL Input Low Threshold (Recognized as a Low Signal) VO ≥ 2.5V, IO = −0.5 mA 0.7 1.0 RIN Input Resistance VIN = ±3V to ±15V 3.0 4.1 7.0 kΩ IIN Input Current (3) VIN = +15V 2.1 4.1 5.0 mA High Level Output Voltage (4) VOH V V 0.43 0.7 1 mA VIN = −15V −5.0 −4.1 −2.1 mA VIN = −3V −1 −0.65 −0.43 mA IOH = −0.5 mA, VIN = −3V 2.6 4 V IOH = −10 μA, VIN = −3V 4.0 4.9 V IOH = −0.5 mA, VIN = Open Circuit 2.6 4 V IOH = −10 μA, VIN = Open Circuit 4.0 4.9 V 0.2 0.4 V −4 −2.7 −1.7 mA Low Level Output Voltage IOL = 3.2 mA, VIN = +3V IOSR Short Circuit Current (3) VO = 0V, VIN = 0V (4) 2.4 VIN = +3V VOL (3) 1.85 Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified. For current, minimum and maximum values are specified as an absolute value and the sign is used to indicate direction. For voltage logic levels, the more positive value is designated as maximum. For example, if −6V is a maximum, the typical value (−6.8V) is more negative. If receiver inputs are unconnected, receiver output is a logic high. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14185 3 DS14185 SNLS093C – APRIL 1999 – REVISED APRIL 2013 www.ti.com Switching Characteristics (1) TA = 25°C Symbol Parameter Conditions Min Typ (2) Max Units 60 350 ns 240 350 ns DRIVER CHARACTERISTICS tPHL Propagation Delay High to Low tPLH Propagation Delay Low to High tr, tf Output Slew Rate (3) RL = 3 kΩ, CL = 50 pF (Figure 3 Figure 4) 50 ns RECEIVER CHARACTERISTICS tPHL Propagation Delay High to Low tPLH Propagation Delay Low to High tr tf (1) (2) (3) RL = 1.5 kΩ, CL = 15 pF (includes fixture plus probe), (Figure 5 Figure 6) 150 350 ns 240 350 ns Rise Time 87 175 ns Fall Time 40 100 ns Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified. For current, minimum and maximum values are specified as an absolute value and the sign is used to indicate direction. For voltage logic levels, the more positive value is designated as maximum. For example, if −6V is a maximum, the typical value (−6.8V) is more negative. All typicals are given for: VCC = +5.0V, V+ = +12.0V, V− = −12V, TA = +25°C. Refer to typical curves. Driver output slew rate is measured from the +3.0V to the −3.0V level on the output waveform. Inputs not under test are connected to VCC or GND. Slew rate is determined by load capacitance. To comply with a 30 V/μs maximum slew rate, a minimum load capacitance of 390 pF is recommended. Parameter Measurement Information Generator characteristics for driver input: f = 64 kHz (128 kbits/sec), tr = tf < 10 ns, VIH = 3V, VIL = 0V, duty cycle = 50%. Figure 3. Driver Propagation Delay and Transition Time Test Circuit Figure 4. Driver Propagation Delay and Transition Time Waveforms Slew Rate (SR) = 6V/(tr or tf) Generator characteristics for receiver input: f = 64 kHz (128 kbits/sec), tr = tf = 200 ns, VIH = 3V, VIL = −3V, duty cycle = 50%. Figure 5. Receiver Propagation Delay and Transition Time Test Circuit 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14185 DS14185 www.ti.com SNLS093C – APRIL 1999 – REVISED APRIL 2013 Figure 6. Receiver Propagation Delay and Transition Time Waveform PIN DESCRIPTIONS Pin # 13, 15, 16 5, 6, 8 2, 3, 4, 7, 9 Name Description DIN Driver Input Pins DOUT Driver Output Pins, RS-232 Levels RIN Receiver Input Pins, RS-232 Levels 12, 14, 17, 18, 19 ROUT Receiver Output Pins 11 GND Ground 1 + Positive Power Supply Pin (+9.0 ≤ V+ ≤ +13.2) − V 10 V Negative Power Supply Pin (−9.0 ≤ V− ≤ −13.2) 20 VCC Positive Power Supply Pin (+5V ±5%) Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14185 5 DS14185 SNLS093C – APRIL 1999 – REVISED APRIL 2013 www.ti.com APPLICATIONS INFORMATION In a typical Data Terminal Equipment (DTE) to Data Circuit-Terminating Equipment (DCE) 9-pin de-facto interface implementation, 2 data lines and 6 control lines are required. The data lines are TXD and RXD. The control lines are RTS, DTR, DSR, DCD, CTS, and RI. The DS14185 is a 3 x 5 Driver/Receiver and offers a single chip solution for this DTE interface. As shown in Figure 7, this interface allows for direct flow-thru interconnect. For a more conservative design, the user may wish to insert ground traces between the signal lines to minimize cross talk. LapLink COMPATIBILITY The DS14185 can easily provide 128 kbps data rate under maximum driver load conditions of CL = 2500 pF and RL = 3 kΩ, while power supplies are: VCC = 4.75V, V+ = 10.8V, V− = −10.8V (1) MOUSE DRIVING A typical mouse can be powered from the drivers. Two driver outputs connected in parallel and set to VOH can be used to supply power to the V+ pin of the mouse. The third driver output is set to VOL to sink the current from the V− terminal. Refer to typical curves of VOUT/IOUT.Typical mouse specifications are: 10 mA at +6V 5 mA at −6V (2) (3) Figure 7. Typical DTE Application 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14185 DS14185 www.ti.com SNLS093C – APRIL 1999 – REVISED APRIL 2013 Typical Performance Characteristics The below input waveforms were used to generate all Typical AC Characteristics. Figure 8. Figure 9. Driver Output Slew Rate between +3V and −3V vs Load Capacitance Conditions: VCC = 5V, RL = 5 kΩ, TA = 25°C, fIN = 64 kHz Square Wave Driver Output Voltage vs Frequency and CL Conditions: VCC = 5V, RL = 5 kΩ, TA = 25°C Figure 10. Figure 11. Supply Current vs Frequency and Driver CL Supply Current vs Frequency and Driver CL Figure 12. Figure 13. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14185 7 DS14185 SNLS093C – APRIL 1999 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 8 Supply Current vs Frequency Driver Output Current vs Output Voltage Figure 14. Figure 15. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14185 DS14185 www.ti.com SNLS093C – APRIL 1999 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: DS14185 9 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS14185WM NRND SOIC DW 20 36 TBD Call TI Call TI 0 to 70 DS14185WM DS14185WM/NOPB ACTIVE SOIC DW 20 36 Green (RoHS & no Sb/Br) SN | CU SN Level-3-260C-168 HR 0 to 70 DS14185WM DS14185WMX NRND SOIC DW 20 1000 TBD Call TI Call TI 0 to 70 DS14185WM DS14185WMX/NOPB ACTIVE SOIC DW 20 1000 Green (RoHS & no Sb/Br) SN | CU SN Level-3-260C-168 HR 0 to 70 DS14185WM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS14185WMX SOIC DW 20 1000 330.0 24.4 10.9 13.3 3.25 12.0 24.0 Q1 DS14185WMX/NOPB SOIC DW 20 1000 330.0 24.4 10.9 13.3 3.25 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS14185WMX SOIC DW 20 1000 367.0 367.0 45.0 DS14185WMX/NOPB SOIC DW 20 1000 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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