DS10CP152Q www.ti.com SNLS295E – MAY 2008 – REVISED APRIL 2013 DS10CP152Q Automotive 1.5 Gbps 2X2 LVDS Crosspoint Switch Check for Samples: DS10CP152Q FEATURES DESCRIPTION • • The DS10CP152Q is a 1.5 Gbps 2x2 LVDS crosspoint switch optimized for high-speed signal routing and switching over lossy FR-4 printed circuit board backplanes and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity. The non-blocking architecture allows connections of any input to any output or outputs. 1 2 • • • • • AECQ-100 Grade 3 DC - 1.5 Gbps Low Jitter, Low Skew, Low Power Operation Pin Configurable, Fully Differential, NonBlocking Architecture Wide Input Common Mode Voltage Range Allows DC-Coupled Interface to LVDS, CML and LVPECL Drivers On-Chip 100Ω Input and Output Termination Minimizes Insertion and Return Losses, Reduces Component Count and Minimizes Board Space 8 kV ESD on LVDS I/O Pins Protects Adjoining Components Small SOIC-16 Space Saving Package Wide input common mode range allows the switch to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. Each differential input and output is internally terminated with a 100Ω resistor to lower device return losses, reduce component count and further minimize board space. APPLICATIONS • • • Automotive Display Applications Clock and Data Buffering and Muxing SD/HD SDI Routers Typical Application DS10CP152Q RED RED Navigation Computer 24 TO 1 1 TO 24 GREEN GREEN MONITOR 1 BLUE BLUE SEL0 DS90UR241Q DS90UR124Q SEL1 RED RED Entertainment System 1 TO 24 GREEN GREEN 24 TO 1 MONITOR 2 BLUE BLUE 2x2 CROSSPOINT DS90UR241Q DS90UR124Q 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2013, Texas Instruments Incorporated DS10CP152Q SNLS295E – MAY 2008 – REVISED APRIL 2013 www.ti.com Block Diagram SEL1 SEL0 EN0 IN0+ OUT0+ OUT0- IN02x2 EN1 IN1+ OUT1+ IN1- OUT1- Connection Diagram Figure 1. DS10CP152Q Pin Diagram PIN DESCRIPTIONS Pin Name Pin Number I/O, Type Pin Description IN0+, IN0- , IN1+, IN1- 3, 4, 6, 7 I, LVDS Inverting and non-inverting high speed LVDS input pins. OUT0+, OUT0-, OUT1+, OUT1- 14, 13, 11, 10 O, LVDS Inverting and non-inverting high speed LVDS output pins. SEL1, SEL0 1, 2 I, LVCMOS Switch configuration pins. EN0, EN1 16, 15 I, LVCMOS Output enable pins. NC 8, 9 NC "NO CONNECT" pins. VDD 5 Power Power supply pin. GND 12 Power Ground pin. 2 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q DS10CP152Q www.ti.com SNLS295E – MAY 2008 – REVISED APRIL 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −0.3V to +4V Supply Voltage −0.3V to (VCC + 0.3V) LVCMOS Input Voltage −0.3V to +4V LVDS Input Voltage Differential Input Voltage |VID| 1V −0.3V to (VCC + 0.3V) LVDS Output Voltage LVDS Differential Output Voltage 0V to 1V LVDS Output Short Circuit Current Duration 5 ms Junction Temperature +105°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C Maximum Package Power Dissipation at 25°C D0016A Package 1.10W Derate D0016A Package 13.75 mW/°C above +25°C Package Thermal Resistance θJA +72.7°C/W θJC +41.2°C/W ESD Susceptibility HBM MM (3) CDM (1) (2) (3) (4) (5) ≥8 kV (4) ≥250V (5) ≥1250V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Human Body Model, applicable std. JESD22-A114C Machine Model, applicable std. JESD22-A115-A Field Induced Charge Device Model, applicable std. JESD22-C101-C Recommended Operating Conditions Supply Voltage (VCC) Receiver Differential Input Voltage (VID) Operating Free Air Temperature (TA) Min Typ Max Units 3.0 3.3 3.6 V 1 V +25 +85 °C 0 −40 DC Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions (1) (2) (3) Min Typ Max Units LVCMOS DC SPECIFICATIONS VIH High Level Input Voltage 2.0 VDD V VIL Low Level Input Voltage GND 0.8 V (1) (2) (3) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VOD and ΔVOD. Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not ensured. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q 3 DS10CP152Q SNLS295E – MAY 2008 – REVISED APRIL 2013 www.ti.com DC Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3) Symbol Parameter Conditions IIH High Level Input Current VIN = 3.6V VCC = 3.6V IIL Low Level Input Current VIN = GND VCC = 3.6V VCL Input Clamp Voltage ICL = −18 mA, VCC = 0V Min Typ Max Units 40 175 250 μA ±1 ±10 μA −0.9 −1.5 V 1 V +100 mV LVDS INPUT DC SPECIFICATIONS VID Input Differential Voltage 0 VTH Differential Input High Threshold VTL Differential Input Low Threshold VCMR Common Mode Voltage Range VID = 100 mV IIN Input Current VIN = 3.6V or 0V VCC = 3.6V or 0V ±1 CIN Input Capacitance Any LVDS Input Pin to GND 1.7 pF RIN Input Termination Resistor Between IN+ and IN- 100 Ω VCM = +0.05V or VCC-0.05V 0 −100 0 0.05 mV VCC 0.05 V ±10 μA LVDS OUTPUT DC SPECIFICATIONS VOD Differential Output Voltage ΔVOD Change in Magnitude of VOD for Complimentary Output States 250 VOS Offset Voltage ΔVOS Change in Magnitude of VOS for Complimentary Output States IOS Output Short Circuit Current RL = 100Ω -35 1.05 (4) 350 RL = 100Ω 1.2 -35 450 mV 35 mV 1.375 V 35 mV OUT to GND -23 -55 mA OUT to VCC 8 55 mA COUT Output Capacitance Any LVDS Output Pin to GND 1.2 pF ROUT Output Termination Resistor Between OUT+ and OUT- 100 Ω SUPPLY CURRENT ICC Supply Current EN0 = EN1 = H 58 70 mA ICCZ Outputs Powered Down Supply Current EN0 = EN1 = L 25 30 mA Typ Max Units 440 650 ps 400 650 ps 40 120 ps (4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. AC Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions (1) (2) (3) Min LVDS OUTPUT AC SPECIFICATIONS tPLHD Differential Propagation Delay Low to High tPHLD Differential Propagation Delay High to Low tSKD1 Pulse Skew |tPLHD − tPHLD| (1) (2) (3) (4) 4 RL = 100Ω (4) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured. Typical values represent most likely parametric norms for VCC = +3.3V and TA = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not ensured. Specification is ensured by characterization and is not tested in production. tSKD1, |tPLHD − tPHLD|, Pulse Skew, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of the same channel. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q DS10CP152Q www.ti.com SNLS295E – MAY 2008 – REVISED APRIL 2013 AC Electrical Characteristics (continued) Over recommended operating supply and temperature ranges unless otherwise specified. (1)(2)(3) Symbol Parameter Conditions Min Typ Max Units tSKD2 Channel to Channel Skew 25 60 ps tSKD3 Part to Part Skew 45 190 ps tLHT Rise Time 170 350 ps tHLT Fall Time 170 350 ps tON Output Enable Time 5 20 μs tOFF Output Disable Time 3 12 ns tSEL Select Time 3 12 ns 135 MHz 0.5 1.2 ps 311 MHz 0.5 1.2 ps 503 MHz 0.5 1.2 ps 750 MHz 0.5 1.2 ps 270 Mbps 9 38 ps 622 Mbps 7 36 ps 1.06 Gbps 7 34 ps (5) (6) JITTER PERFORMANCE RL = 100Ω (3) tRJ1 tRJ2 tRJ3 VID = 350 mV VCM = 1.2V Clock (RZ) Random Jitter (RMS Value) tRJ4 tDJ1 tDJ2 tDJ3 VID = 350 mV VCM = 1.2V Deterministic Jitter (Peak-to-Peak Value ) Clock (RZ) tDJ4 tTJ1 tTJ2 tTJ3 Total Jitter (Peak to Peak Value) VID = 350 mV VCM = 1.2V PRBS-23 (NRZ) tTJ4 (5) (6) 1.5 Gbps 9 35 ps 270 Mbps 0.01 0.03 UIP-P 622 Mbps 0.01 0.04 UIP-P 1.06 Gbps 0.01 0.05 UIP-P 1.5 Gbps 0.01 0.07 UIP-P tSKD2, Channel to Channel Skew, is the difference in propagation delay (tPLHD or tPHLD) among all output channels in Broadcast mode (any one input to all outputs). tSKD3, Part to Part Skew, is defined as the difference between the minimum and maximum differential propagation delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range. DC Test Circuits VOH Power Supply OUT+ IN+ R D RL Power Supply IN- OUTVOL Figure 2. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q 5 DS10CP152Q SNLS295E – MAY 2008 – REVISED APRIL 2013 www.ti.com AC Test Circuits and Timing Diagrams OUT+ IN+ R Signal Generator D RL IN- OUT- Figure 3. Figure 4. Figure 5. FUNCTIONAL DESCRIPTION The DS10CP152Q is a 1.5 Gbps 2x2 LVDS digital crosspoint switch optimized for high-speed signal routing and switching over lossy FR-4 printed circuit board backplanes and balanced cables. Table 1. Switch Configuration Truth Table SEL1 SEL0 OUT1 OUT0 0 0 IN0 IN0 0 1 IN0 IN1 1 0 IN1 IN0 1 1 IN1 IN1 Table 2. Output Enable Truth Table 6 EN1 EN0 OUT1 OUT0 0 0 Disabled Disabled 0 1 Disabled Enabled 1 0 Enabled Disabled 1 1 Enabled Enabled Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q DS10CP152Q www.ti.com SNLS295E – MAY 2008 – REVISED APRIL 2013 INPUT INTERFACING The DS10CP152Q accepts differential signals and allows simple AC or DC coupling. With a wide common mode range, the DS10CP152Q can be DC-coupled with all common differential drivers (i.e. LVPECL, LVDS, CML). The following three figures illustrate typical DC-coupled interface to common differential drivers. Note that the DS10CP152Q inputs are internally terminated with a 100Ω resistor. LVDS Driver DS10CP152 Receiver 100: Differential T-Line OUT+ IN+ 100: IN- OUT- Figure 6. Typical LVDS Driver DC-Coupled Interface to an DS10CP152Q Input CML3.3V or CML2.5V Driver VCC 50: DS10CP152 Receiver 100: Differential T-Line 50: OUT+ IN+ 100: IN- OUT- Figure 7. Typical CML Driver DC-Coupled Interface to an DS10CP152Q Input LVPECL Driver OUT+ 100: Differential T-Line LVDS Receiver IN+ 100: OUT150-250: IN150-250: Figure 8. Typical LVPECL Driver DC-Coupled Interface to an DS10CP152Q Input OUTPUT INTERFACING The DS10CP152Q outputs signals compliant to the LVDS standard. Its outputs can be DC-coupled to most common differential receivers. The following figure illustrates typical DC-coupled interface to common differential receivers and assumes that the receivers have high impedance inputs. While most differential receivers have a common mode input range that can accomodate LVDS compliant signals, it is recommended to check respective receiver's data sheet prior to implementing the suggested interface implementation. Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q 7 DS10CP152Q SNLS295E – MAY 2008 – REVISED APRIL 2013 DS10CP152 Driver www.ti.com Differential Receiver 100: Differential T-Line OUT+ IN+ CML or LVPECL or LVDS 100: 100: IN- OUT- Figure 9. Typical DS10CP152Q Output DC-Coupled Interface to an LVDS, CML or LVPECL Receiver 8 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q DS10CP152Q www.ti.com SNLS295E – MAY 2008 – REVISED APRIL 2013 Typical Performance Characteristics Figure 10. A 270 Mbps NRZ PRBS-7 After 2" Differential FR-4 Stripline V:100 mV / DIV, H:500 ps / DIV Figure 11. A 622 Mbps NRZ PRBS-7 After 2" Differential FR-4 Stripline V:100 mV / DIV, H:200 ps / DIV Figure 12. A 1.06 Gbps NRZ PRBS-7 After 2" Differential FR-4 Stripline V:100 mV / DIV, H:200 ps / DIV Figure 13. A 1.5 Gbps NRZ PRBS-7 After 2" Differential FR-4 Stripline V:100 mV / DIV, H:100 ps / DIV Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q 9 DS10CP152Q SNLS295E – MAY 2008 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: DS10CP152Q PACKAGE OPTION ADDENDUM www.ti.com 12-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DS10CP152QMA/NOPB ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS10CP152 QMA DS10CP152QMAX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 DS10CP152 QMA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS10CP152QMA/NOPB SOIC D 16 250 178.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 DS10CP152QMAX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS10CP152QMA/NOPB SOIC D DS10CP152QMAX/NOPB SOIC D 16 250 210.0 185.0 35.0 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated