TDA5051A Home automation modem Rev. 5 — 13 January 2011 Product data sheet 1. General description The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 baud or 1200 baud data rate. It operates from a single 5 V supply. 2. Features and benefits Full digital carrier generation and shaping Modulation/demodulation frequency set by clock adjustment, from microcontroller or on-chip oscillator High clock rate of 6-bit D/A (Digital to Analog) converter for rejection of aliasing components Fully integrated output power stage with overload protection Automatic Gain Control (AGC) at receiver input 8-bit A/D (Analog to Digital) converter and narrow digital filtering Digital demodulation delivering baseband data Easy compliance with EN50065-1 with simple coupling network Few external components for low cost applications SO16 plastic package 3. Applications Home appliance control (air conditioning, shutters, lighting, alarms and so on) Energy/heating control Amplitude Shift Keying (ASK) data transmission using the home power network TDA5051A NXP Semiconductors Home automation modem 4. Quick reference data Table 1. Quick reference data Symbol Parameter VDD supply voltage IDD(tot) total supply current Conditions Min Typ Max Unit 4.75 5.0 5.25 V - 28 38 mA - 47 68 mA - 19 25 mA fosc = 8.48 MHz Reception mode Transmission mode; DATA_IN = 0; ZL = 30 Ω [1] Power-down mode [2] fcr carrier frequency fosc oscillator frequency Vo(rms) output carrier signal (RMS value) Vi(rms) input signal (RMS value) THD total harmonic distortion on CISPR16 load with coupling network Tamb ambient temperature DATA_IN = LOW; ZL = CISPR16 [3] - 132.5 - kHz 6.08 - 9.504 MHz 120 - 122 dBμV 82 - 122 dBμV - −55 - dB −50 - +100 °C [1] The value of the total transmission mode current is the sum of IDD(RX/TX)(tot) + IDD(PAMP) in the Table 5 “Characteristics”. [2] Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency. [3] The minimum value can be improved by using an external amplifier; see application diagrams Figure 19 and Figure 20. 5. Ordering information Table 2. Ordering information Type number TDA5051AT TDA5051A Product data sheet Package Name Description Version SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 2 of 29 TDA5051A NXP Semiconductors Home automation modem 6. Block diagram DGND AGND VDDA 12 13 5 VDDD VDDAP 3 11 modulated carrier 6 ROM D/A CLK_OUT OSC1 OSC2 DATA_OUT 1 10 9 DAC clock 10 DATA_IN POWER DRIVE WITH PROTECTION CONTROL LOGIC APGND TDA5051A 15 filter clock 4 TX_OUT PD 7 8 2 ÷2 OSCILLATOR DIGITAL BAND-PASS FILTER DIGITAL DEMODULATOR 14 A/D RX_IN 8 5 PEAK DETECT 16 TEST1 Fig 1. H U L D U/D COUNT 6 SCANTEST 002aaf038 Block diagram TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 3 of 29 TDA5051A NXP Semiconductors Home automation modem 7. Pinning information 7.1 Pinning DATA_IN 1 16 TEST1 DATA_OUT 2 15 PD VDDD 3 14 RX_IN CLK_OUT 4 DGND 5 SCANTEST 6 11 VDDAP OSC1 7 10 TX_OUT OSC2 8 9 TDA5051AT 13 VDDA 12 AGND APGND 002aaf039 Fig 2. Pin configuration for SO16 7.2 Pin description Table 3. TDA5051A Product data sheet Pin description Symbol Pin Description DATA_IN 1 digital data input (active LOW) DATA_OUT 2 digital data output (active LOW) VDDD 3 digital supply voltage CLK_OUT 4 clock output DGND 5 digital ground SCANTEST 6 test input (LOW in application) OSC1 7 oscillator input OSC2 8 oscillator output APGND 9 analog ground for power amplifier TX_OUT 10 analog signal output VDDAP 11 analog supply voltage for power amplifier AGND 12 analog ground VDDA 13 analog supply voltage RX_IN 14 analog signal input PD 15 power-down input (active HIGH) TEST1 16 test input (HIGH in application) All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 4 of 29 TDA5051A NXP Semiconductors Home automation modem 8. Functional description Both transmission and reception stages are controlled either by the master clock of the microcontroller or by the on-chip reference oscillator connected to a crystal. This ensures the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on. The interface with the power network is made by means of an LC network (see Figure 15). The device includes a power output stage that feeds a 120 dBμV (RMS) signal on a typical 30 Ω load. To reduce power consumption, the IC is disabled by a power-down input (pin PD): in this mode, the on-chip oscillator remains active and the clock continues to be supplied at pin CLK_OUT. For low-power operation in reception mode, this pin can be dynamically controlled by the microcontroller, see Section 8.4 “Power-down mode”. When the circuit is connected to an external clock generator (see Figure 6), the clock signal must be applied at pin OSC1 (pin 7); OSC2 (pin 8) must be left open-circuit. Figure 7 shows the use of the on-chip clock circuit. All logic inputs and outputs are compatible with TTL/CMOS levels, providing an easy connection to a standard microcontroller I/O port. The digital part of the IC is fully scan-testable. Two digital inputs, SCANTEST and TEST1, are used for production test: these pins must be left open-circuit in functional mode (correct levels are internally defined by pull-up or pull-down resistors). 8.1 Transmission mode To provide strict stability with respect to environmental conditions, the carrier frequency is generated by scanning the ROM memory under the control of the microcontroller clock or the reference frequency provided by the on-chip oscillator. High frequency clocking rejects the aliasing components to such an extent that they are filtered by the coupling LC network and do not cause any significant disturbance. The data modulation is applied through pin DATA_IN and smoothly applied by specific digital circuits to the carrier (shaping). Harmonic components are limited in this process, thus avoiding unacceptable disturbance of the transmission channel (according to CISPR16 and EN50065-1 recommendations). A −55 dB Total Harmonic Distortion (THD) is reached when the typical LC coupling network (or an equivalent filter) is used. The DAC and the power stage are set in order to provide a maximum signal level of 122 dBμV (RMS) at the output. The output of the power stage (TX_OUT) must always be connected to a decoupling capacitor, because of a DC level of 0.5VDD at this pin, which is present even when the device is not transmitting. This pin must also be protected against overvoltage and negative transient signals. The DC level of TX_OUT can be used to bias a unipolar transient suppressor, as shown in the application diagram (see Figure 15). Direct connection to the mains is done through an LC network for low-cost applications. However, an HF signal transformer could be used when power-line insulation has to be performed. TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 5 of 29 TDA5051A NXP Semiconductors Home automation modem Remark: In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this mode, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to −6 dB as long as DATA_IN is LOW. Then, the old gain setting is automatically restored. 8.2 Reception mode The input signal received by the modem is applied to a wide range input amplifier with AGC (−6 dB to +30 dB). This is basically for noise performance improvement and signal level adjustment, which ensures a maximum sensitivity of the ADC. An 8-bit conversion is then performed, followed by digital band-pass filtering, to meet the CISPR16 normalization and to comply with some additional limitations met in current applications. After digital demodulation, the baseband data signal is made available after pulse shaping. The signal pin (RX_IN) is a high-impedance input which has to be protected and DC decoupled for the same reasons as with pin TX_OUT. The high sensitivity (82 dBμV) of this input requires an efficient 50 Hz rejection filter (realized by the LC coupling network), which also acts as an anti-aliasing filter for the internal digital processing; (see Figure 15). 8.3 Data format 8.3.1 Transmission mode The data input (DATA_IN) is active LOW: this means that a burst is generated on the line (pin TX_OUT) when DATA_IN pin is LOW. Pin TX_OUT is in a high-impedance state as long as the device is not transmitting. Successive logic 1s are treated in a Non-Return-to-Zero (NRZ) mode, see pulse shapes in Figure 8 and Figure 9. 8.3.2 Reception mode The data output (pin DATA_OUT) is active LOW; this means that the data output is LOW when a burst is received. Pin DATA_OUT remains LOW as long as a burst is received. 8.4 Power-down mode Power-down input (pin PD) is active HIGH; this means that the power consumption is minimum when pin PD is HIGH. Now, all functions are disabled, except clock generation. TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 6 of 29 TDA5051A NXP Semiconductors Home automation modem 9. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDD Conditions Min Max Unit supply voltage 4.5 5.5 V fosc oscillator frequency - 12 MHz Tstg storage temperature −50 +150 °C Tamb ambient temperature −50 +100 °C Tj junction temperature - 125 °C 10. Characteristics Table 5. Characteristics VDDD = VDDA = 5 V ± 5 %; Tamb = −40 °C to +85 °C; VDDD connected to VDDA; DGND connected to AGND. Symbol Parameter Conditions Min Typ Max Unit 4.75 5 5.25 V - 28 38 mA - 47 68 mA - 19 25 mA Supply VDD supply voltage IDD(tot) total supply current fosc = 8.48 MHz Reception mode Transmission mode; DATA_IN = 0; ZL = 30 Ω [1] Power-down mode IDD(RX/TX)(tot) total analog + digital supply current VDD = 5 V ± 5 %; Transmission or Reception mode - 28 38 mA IDD(PD)(tot) total analog + digital supply current VDD = 5 V ± 5 %; PD = HIGH; Power-down mode - 19 25 mA IDD(PAMP) power amplifier supply current VDD = 5 V ± 5 %; ZL = 30 Ω; DATA_IN = LOW in Transmission mode - 19 30 mA VDD = 5 V ± 5 %; ZL = 1 Ω; DATA_IN = LOW in Transmission mode - 76 - mA IDD(PAMP)(max) maximum power amplifier supply current DATA_IN and PD inputs; DATA_OUT and CLK_OUT outputs VIH HIGH-level input voltage 0.2VDD + 0.9 - VDD + 0.5 V VIL LOW-level input voltage −0.5 - 0.2VDD − 0.1 V VOH HIGH-level output voltage IOH = −1.6 mA 2.4 - - V VOL LOW-level output voltage IOL = 1.6 mA - - 0.45 V TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 7 of 29 TDA5051A NXP Semiconductors Home automation modem Table 5. Characteristics …continued VDDD = VDDA = 5 V ± 5 %; Tamb = −40 °C to +85 °C; VDDD connected to VDDA; DGND connected to AGND. Symbol Parameter Conditions Min Typ Max Unit OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when using an external clock generator) VIH HIGH-level input voltage 0.7VDD - VDD + 0.5 V VIL LOW-level input voltage −0.5 - 0.2VDD − 0.1 V VOH HIGH-level output voltage IOH = −1.6 mA 2.4 - - V VOL LOW-level output voltage IOL = 1.6 mA - - 0.45 V MHz Clock fosc oscillator frequency 6.080 - 9.504 fosc/fcr ratio between oscillator and carrier frequency - 64 - fosc/fCLKOUT ratio between oscillator and clock output frequency - 2 - - 132.5 - kHz Transmission mode [2] fcr carrier frequency fosc = 8.48 MHz tsu set-up time of the shaped burst fosc = 8.48 MHz; see Figure 8 - 170 - μs th hold time of the shaped burst fosc = 8.48 MHz; see Figure 8 - 170 - μs tW(DI)(min) minimum pulse width of DATA_IN signal fosc = 8.48 MHz; see Figure 8 - 190 - μs Vo(rms) output carrier signal (RMS value) DATA_IN = LOW; ZL = CISPR16 120 - 122 dBμV Io(max) power amplifier maximum output current (peak value) DATA_IN = LOW; ZL = 1 Ω - 160 - mA Zo output impedance of the power amplifier - 5 - Ω VO output DC level at pin TX_OUT - 2.5 - V THD total harmonic distortion on CISPR16 load with the coupling network (measured on the first ten harmonics) Vo(rms) = 121 dBμV on CISPR16 load; fosc = 8.48 MHz; DATA_IN = LOW (no modulation); see Figure 3 and Figure 22 - −55 - dB B−20dB bandwidth of the shaped output signal (at −20 dB) on CISPR16 load with the coupling network Vo(rms) = 121 dBμV on CISPR16 load; fosc = 8.48 MHz; DATA_IN = 300 Hz; duty factor = 50 %; see Figure 4 - 3000 - Hz TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 8 of 29 TDA5051A NXP Semiconductors Home automation modem Table 5. Characteristics …continued VDDD = VDDA = 5 V ± 5 %; Tamb = −40 °C to +85 °C; VDDD connected to VDDA; DGND connected to AGND. Symbol Parameter Conditions Min Typ Max Unit 82 - 122 dBμV Reception mode [3] Vi(rms) analog input signal (RMS value) VI DC level at pin RX_IN - 2.5 - V Zi RX_IN input impedance - 50 - kΩ RAGC AGC range - 36 - dB tc(AGC) AGC time constant fosc = 8.48 MHz; see Figure 5 - 296 - μs td(dem)(su) demodulation delay set-up time fosc = 8.48 MHz; see Figure 21 - 350 400 μs td(dem)(h) demodulation delay hold time fosc = 8.48 MHz; see Figure 21 - 420 470 μs Bdet detection bandwidth fosc = 8.48 MHz - 3 - kHz BER bit error rate fosc = 8.48 MHz; 600 baud; S/N = 35 dB; signal 76 dBμV; see Figure 23 - 1 - 1 × 10−4 Power-up timing td(pu)(TX) delay between power-up and DATA_IN in transmission mode XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp = 2.2 MΩ; see Figure 10 - 1 - μs td(pu)(RX) delay between power-up and DATA_OUT in reception mode XTAL = 8.48 MHz; C1 = C2 = 27 pF; Rp = 2.2 MΩ; fRXIN = 132.5 kHz; 120 dBμV sine wave; see Figure 11 - 1 - μs Power-down timing td(pd)(TX) delay between PD = 0 and DATA_IN in transmission mode fosc = 8.48 MHz; see Figure 12 - 10 - μs td(pd)(RX) delay between PD = 0 and DATA_OUT in reception mode fosc = 8.48 MHz; fRXIN = 132.5 kHz; 120 dBμV sine wave; see Figure 13 - 500 - μs tactive(min) minimum active time with T = 10 ms power-down period in reception mode fosc = 8.48 MHz; fRXIN = 132.5 kHz; 120 dBμV sine wave; see Figure 14 - 1 - μs [1] The value of the total transmission mode current is the sum of IDD(RX/TX)(tot) + IDD(PAMP). [2] Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency. [3] The minimum value can be improved by using an external amplifier; see application diagrams Figure 19 and Figure 20. TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 9 of 29 TDA5051A NXP Semiconductors Home automation modem 0 Vo(rms) (dBV) −20 002aaf054 132.5 kHz −40 −60 −80 −100 105 106 f (Hz) Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBμV (RMS); marker at −5 dBV (RMS) = 115 dBμV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBμV (RMS). Fig 3. Carrier spectrum 1500 Hz −10 dBV (RMS) −20 002aaf057 20 dB −30 −40 −50 −60 117.5 132.5 147.5 f (kHz) Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 × 1500 Hz). Fig 4. Shaped signal spectrum VRXIN modulated sine wave 122 dBμV amplitude V(I) 0 t GAGC +30 dB 8.68 dB AGC range −6 dB tc(AGC) (AGC time constant) Fig 5. TDA5051A Product data sheet 002aaf058 AGC time constant definition (not to scale) All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 10 of 29 TDA5051A NXP Semiconductors Home automation modem 11. Timing 11.1 Configuration for clock OSC1 CLK_OUT 7 fosc TDA5051A MICROCONTROLLER XTAL DGND GND 5 002aaf042 For parameter description, see Table 6. Fig 6. External clock CLK_OUT CLK_OUT 1/ f 2 osc 4 DGND 5 C1 OSC2 TDA5051A MICROCONTROLLER GND 8 Rp 7 OSC1 XTAL C2 002aaf043 For parameter description, see Table 6. Fig 7. Table 6. Carrier frequency fcr Clock output frequency External components 1⁄ f 2 osc 6.080 MHz to 9.504 MHz 95 kHz to 148.5 kHz 3.040 MHz to 4.752 MHz C1 = C2 = 27 pF to 47 pF; Rp = 2.2 MΩ to 4.7 MΩ; XTAL = standard quartz crystal Calculation of parameters depending on the clock frequency Symbol Parameter Conditions Unit fosc oscillator frequency with on-chip oscillator: frequency of the crystal quartz Hz with external clock: frequency of the signal applied at OSC1 Hz clock output frequency 1⁄ 2fosc Hz fcr carrier frequency/digital filter tuning frequency 1⁄ 64fosc Hz tsu set-up time of the shaped burst 23/fcr or 1472/fosc s th hold time of the shaped burst 23/fcr or 1472/fosc s tW(DI)(min) minimum pulse width of DATA_IN signal tsu + 1/fcr s fCLKOUT Product data sheet Clock oscillator parameters Oscillator frequency fosc Table 7. TDA5051A Typical configuration for on-chip clock circuit All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 11 of 29 TDA5051A NXP Semiconductors Home automation modem Table 7. Calculation of parameters depending on the clock frequency …continued Symbol Parameter tW(burst)(min) minimum burst time of VO(DC) signal tW(DI)(min) + th Conditions Unit s tc(AGC) AGC time constant 2514/fosc s tsu(demod) demodulation set-up time 3200/fosc (max.) s th(demod) demodulation hold time 3800/fosc (≈max.) s tW(burst)(min) TX_OUT tW(burst) VO(DC) tsu th 0 tW(DI)(min) tW(DI) DATA_IN (1) (2) (3) 002aaf044 (1) tW(DI) > tW(DI)(min) (2) tW(DI)(min) = tsu + 1/fcr (3) tW(DI)(min) < tsu; wrong operation Fig 8. Relationship between DATA_IN and TX_OUT (see Table 8) Table 8. Relationship between DATA_IN and TX_OUT X = don’t care. PD DATA_IN TX_OUT 1 X high-impedance 0 1 high-impedance (after th) 0 0 active with DC offset tW(burst) tsu th 100 % 002aaf045 Fig 9. TDA5051A Product data sheet Pulse shape characteristics All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 12 of 29 TDA5051A NXP Semiconductors Home automation modem 11.2 Timing diagrams 90 % VDD VDD CLK_OUT not defined DATA_IN(1) clock stable HIGH TX_OUT td(pu)(TX) 002aaf046 (1) DATA_IN is an edge-sensitive input and must be HIGH before starting a transmission. Fig 10. Timing diagram during power-up in Transmission mode 90 % VDD VDD CLK_OUT not defined clock stable RX_IN DATA_OUT not defined HIGH td(dem)(h) td(pu)(RX) 002aaf047 Fig 11. Timing diagram during power-up in Reception mode PD DATA_IN TX_OUT td(pd)(TX) normal operation wrong operation TX_OUT delayed by PD 002aaf048 Fig 12. Power-down sequence in Transmission mode TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 13 of 29 TDA5051A NXP Semiconductors Home automation modem PD RX_IN DATA_OUT td(dem)(su) td(pd)(RX) DATA_OUT delayed by PD td(pd)(RX) 002aaf049 Fig 13. Power-down sequence in Reception mode PD RX_IN DATA_OUT tactive(min) T IDD IDD(RX) IDD(PD) 0 002aaf050 Fig 14. Power saving by dynamic control of power-down TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 14 of 29 TDA5051A NXP Semiconductors Home automation modem 12. Application information 250 V (AC) max T 630 mA 2 μF 250 V (AC) MOV 250 V (AC) U 68 Ω (2 W) +5 V 7V5 (1.3 W) 470 μF (16 V) 1 μF (16 V) VDDAP VDDA VDDD DATA_IN DATA_OUT 3 1 11 13 14 2 TDA5051A CLK_OUT PD 47 μH 1N4006 100 μF (16 V) 47 nF 47 μH low RS 1N4006 3 78L05 2 MICROCONTROLLER 47 nF (63 V) 1 mH 1 +5 V 47 nF/X2 250 V (AC) 10 4 RX_IN 10 nF TX_OUT SA5.0A 15 8 7 OSC1 5 9 12 OSC2 DGND APGND AGND 2.2 MΩ XTAL 7.3728 MHz 27 pF 27 pF 002aaf059 fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal. Fig 15. Application diagram without power line insulation TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 15 of 29 TDA5051A NXP Semiconductors Home automation modem 002aaf055 20 G (dB) −20 −60 −100 10 102 103 104 105 106 107 f (Hz) a. Gain 002aaf431 103 Zi (Ω) 102 10 10 102 103 104 105 106 107 f (Hz) b. Input impedance fcr = 115.2 kHz; L = 47 μH; C = 47 nF. Main features of the coupling network: 50 Hz rejection > 80 dB; anti-aliasing for the digital filter > 50 dB at the sampling frequency (1⁄2fosc). Input impedance always higher than 10 Ω within the 95 kHz to 148.5 kHz band. Fig 16. Gain (a) and input impedance (b) of the coupling network TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 16 of 29 TDA5051A NXP Semiconductors Home automation modem 002aaf056 130 Vo (dBμV) 120 110 100 1 102 10 Zline (Ω) with coupling network; L = 47 μH; C = 47 nF. Fig 17. Output voltage as a function of line impedance 250 V (AC) max T 630 mA 470 nF/X2 250 V (AC) 100 Ω (0.5 W) MOV 250 V (AC) U 230 V 1 1 VA 47 μH low RS 6 5 2 6V +5 V Newport/ Murata 78250 100 Ω 1 3 78L05 2 + − FDB08 100 nF 470 μF (16 V) (63 V) 22 μH 100 μF (16 V) 47 nF +5 V DATA_IN DATA_OUT MICROCONTROLLER 3 1 11 13 14 2 TDA5051A CLK_OUT PD 1 μF (16 V) VDDAP VDDA VDDD 10 4 RX_IN 10 nF TX_OUT SA5.0A 15 7 8 OSC1 5 9 12 OSC2 DGND APGND AGND 2.2 MΩ XTAL 7.3728 MHz 27 pF 27 pF 002aaf060 fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal. Fig 18. Application diagram with power line insulation TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 17 of 29 TDA5051A NXP Semiconductors Home automation modem 250 V (AC) max T 630 mA 2 μF 250 V (AC) MOV 250 V (AC) U 68 Ω (2 W) +5 V 47 nF (63 V) 1N4006 3 78L05 2 7V5 (1.3 W) 470 μF (16 V) 1 μF (16 V) VDDAP VDDA VDDD DATA_IN DATA_OUT 3 1 11 10 kΩ 13 14 2 TDA5051A CLK_OUT PD 47 μH 1N4006 100 μF (16 V) 47 nF MICROCONTROLLER 47 μH low RS 1 mH 1 +5 V 47 nF/X2 250 V (AC) 10 4 15 150 kΩ RX_IN 10 nF 10 nF TX_OUT BC547B 1 kΩ 8 7 OSC1 5 33 kΩ 9 12 OSC2 DGND APGND AGND 2.2 MΩ SA5.0A XTAL 7.3728 MHz 27 pF 27 pF 002aaf061 fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal. Fig 19. Application diagram without power line insulation, with improved sensitivity (68 dBμV typ.) TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 18 of 29 TDA5051A NXP Semiconductors Home automation modem 250 V (AC) max T 630 mA 470 nF/X2 250 V (AC) 100 Ω (0.5 W) MOV 250 V (AC) U 230 V 1 1 VA 1 3 78L05 2 + 6 100 Ω − FDB08 47 μH low RS 5 2 6V +5 V Newport/ Murata 78250 100 nF 470 μF (16 V) (63 V) 22 μH 100 μF (16 V) 47 nF +5 V DATA_IN DATA_OUT MICROCONTROLLER 3 1 11 10 kΩ 13 14 2 TDA5051A CLK_OUT PD 10 4 15 1 μF (16 V) VDDAP VDDA VDDD RX_IN 10 nF TX_OUT BC547B 1 kΩ 7 8 OSC1 5 150 kΩ 10 nF 33 kΩ 9 12 OSC2 DGND APGND AGND 2.2 MΩ SA5.0A XTAL 7.3728 MHz 27 pF 27 pF 002aaf062 fcr = 115.2 kHz for XTAL = 7.3728 MHz standard crystal. Fig 20. Application diagram with power line insulation, with improved sensitivity (68 dBμV typ.) TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 19 of 29 TDA5051A NXP Semiconductors Home automation modem 13. Test information DATA_IN pulse generator 300 Hz 50 % 1 10 TX_OUT 1 μF TDA5051A G DATA_OUT (to be tested) 2 14 7 Y1 RX_IN 10 nF 8 30 Ω Y2 XTAL fosc OSCILLOSCOPE DATA_IN TX_OUT/RX_IN DATA_OUT td(dem)(su) td(dem)(h) 002aaf051 Fig 21. Test set-up for measuring demodulation delay coupling network(3) OSC1 10 7 TX_OUT 33 nF 47 μH 250 nF 33 nF TDA5051A OSC2 10 μF CISPR16 network(4) 47 μH 12, 5, 9 AGND, DGND, APGND 8 1 50 μH 50 Ω 13, 3, 11 DATA_IN VDDA, VDDD, VDDAP 5Ω 250 nF (1) (2) G +5 V POWER SUPPLY 50 μH SPECTRUM ANALYZER 50 Ω 5Ω 002aaf052 (1) Square wave TTL signal 300 Hz, duty factor = 50 % for measuring signal bandwidth (see Figure 3). (2) DATA_IN + LOW for measuring total harmonic distortion (see Figure 3). (3) Tuned for fcr = 132.5 kHz. (4) The CISPR16 network provides a −6 dB attenuation. Fig 22. Test set-up for measuring THD and bandwidth of the TX_OUT signal TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 20 of 29 TDA5051A NXP Semiconductors Home automation modem TX_OUT 10 in TDA5051A 1 DATA_IN 7 OSC1 12, AGND, DGND, APGND 5, 8 9 out + COUPLING NETWORK(1) + SPECTRUM ANALYZER 50 Ω OSC2 out WHITE NOISE GENERATOR XTAL = 8.48 MHz OSC1 OSC2 7 8 14 RX_IN TDA5051A (to be tested) 2 in out 12, AGND, DGND, APGND 5, 9 COUPLING NETWORK(1) PARAMETERS 600 BAUD PSEUDO RANDOM SEQUENCE: 29−1 BITS LONG DATA_OUT DATA_IN DATA_OUT RXD V24/TTL INTERFACE V24 SERIAL DATA ANALYZER TXD 002aaf053 (1) See Figure 22. Fig 23. Test set-up for measuring Bit Error Rate (BER) TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 21 of 29 TDA5051A NXP Semiconductors Home automation modem 14. Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c HE y v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp L 8 1 e detail X w M bp 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.3 0.1 2.45 2.25 0.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.01 0.019 0.013 0.014 0.009 0.41 0.40 0.30 0.29 0.05 0.043 0.419 0.055 0.394 0.016 inches 0.1 0.012 0.096 0.004 0.089 0.043 0.039 0.01 0.01 Z (1) 0.9 0.4 0.035 0.004 0.016 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT162-1 075E03 MS-013 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 24. Package outline SOT162-1 (SO16) TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 22 of 29 TDA5051A NXP Semiconductors Home automation modem 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 16.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 16.3 Wave soldering Key characteristics in wave soldering are: TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 23 of 29 TDA5051A NXP Semiconductors Home automation modem • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 25) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 9 and 10 Table 9. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 10. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 25. TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 24 of 29 TDA5051A NXP Semiconductors Home automation modem maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 25. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 11. TDA5051A Product data sheet Abbreviations Acronym Description ADC Analog-to-Digital Converter AGC Automatic Gain Control ASK Amplitude Shift Keying CMOS Complementary Metal-Oxide Semiconductor DAC Digital-to-Analog Converter HF High-Frequency I/O Input/Output IC Integrated Circuit LC inductor-capacitor filter NRZ Non-Return-to-Zero RMS Root Mean Squared ROM Read-Only Memory THD Total Harmonic Distortion TTL Transistor-Transistor Logic All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 25 of 29 TDA5051A NXP Semiconductors Home automation modem 18. Revision history Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA5051A v.5 20110113 Product data sheet - TDA5051A v.4 Modifications: • Table 1 “Quick reference data”, Tamb, ambient temperature: – Min value changed from −10 °C to −50 °C – Max value changed from +80 °C to +100 °C • Table 4 “Limiting values”, Tamb, ambient temperature: – Min value changed from −10 °C to −50 °C – Max value changed from +80 °C to +100 °C • Table 5 “Characteristics”, descriptive line below title is changed from “Tamb = 0 °C to 70 °C” to “Tamb = −40 °C to +85 °C” TDA5051A v.4 20100701 Product data sheet - TDA5051A v.3 TDA5051A v.3 20100422 Preliminary data sheet - TDA5051A v.2 TDA5051A v.2 (9397 750 05035) 19990531 Product specification - TDA5051A v.1 TDA5051A v.1 (9397 750 02571) 19970919 Product specification - - TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 26 of 29 TDA5051A NXP Semiconductors Home automation modem 19. Legal information 19.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 27 of 29 TDA5051A NXP Semiconductors Home automation modem Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TDA5051A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — 13 January 2011 © NXP B.V. 2011. All rights reserved. 28 of 29 TDA5051A NXP Semiconductors Home automation modem 21. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.3.1 8.3.2 8.4 9 10 11 11.1 11.2 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Transmission mode . . . . . . . . . . . . . . . . . . . . . 5 Reception mode . . . . . . . . . . . . . . . . . . . . . . . . 6 Data format . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Transmission mode . . . . . . . . . . . . . . . . . . . . . 6 Reception mode . . . . . . . . . . . . . . . . . . . . . . . . 6 Power-down mode . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Configuration for clock . . . . . . . . . . . . . . . . . . 11 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 13 Application information. . . . . . . . . . . . . . . . . . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 20 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22 Handling information. . . . . . . . . . . . . . . . . . . . 23 Soldering of SMD packages . . . . . . . . . . . . . . 23 Introduction to soldering . . . . . . . . . . . . . . . . . 23 Wave and reflow soldering . . . . . . . . . . . . . . . 23 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 24 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26 Legal information. . . . . . . . . . . . . . . . . . . . . . . 27 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Contact information. . . . . . . . . . . . . . . . . . . . . 28 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 13 January 2011 Document identifier: TDA5051A