DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 DS92LV16 16-Bit Bus LVDS Serializer/Deserializer - 25 - 80 MHz Check for Samples: DS92LV16 FEATURES DESCRIPTION • The DS92LV16 Serializer/Deserializer (SERDES) pair transparently translates a 16–bit parallel bus into a BLVDS serial stream with embedded clock information. This single serial stream simplifies transferring a 16-bit, or less bus over PCB traces and cables by eliminating the skew problems between parallel data and clock paths. It saves system cost by narrowing data paths that in turn reduce PCB layers, cable width, and connector size and pins. 1 2 • • • • • • • • • • • • • • 25–80 MHz 16:1/1:16 Serializer/Deserializer (2.56Gbps Full Duplex Throughput) Independent Transmitter and Receiver Operation With Separate Clock, Enable, Power Down Pins Hot Plug Protection (Power Up High Impedance) and Synchronization (Receiver Locks To Random Data) Wide +/−5% Reference Clock Frequency Tolerance for Easy System Design Using Locally-Generated Clocks Line and Local Loopback Modes Robust BLVDS Serial Transmission Across Backplanes and Cables for Low EMI No External Coding Required Internal PLL, No External PLL Components Required Single +3.3V Power Supply Low Power: 104mA (typ) Transmitter, 119mA (typ) Receiver at 80MHz ±100mV Receiver Input Threshold Loss of Lock Detection and Reporting Pin Industrial −40 to +85°C Temperature Range >2.5kV HBM ESD Compact, Standard 80-Pin LQFP Package This SERDES pair includes built-in system and device test capability. The line loopback and local loopback features provide the following functionality: the local loopback enables the user to check the integrity of the transceiver from the local parallel-bus side and the system can check the integrity of the data transmission line by enabling the line loopback. The DS92LV16 incorporates BLVDS signaling on the high-speed I/O. BLVDS provides a low power and low noise environment for reliably transferring data over a serial transmission path. The equal and opposite currents through the differential data path control EMI by coupling the resulting fringing fields together. Block Diagram Figure 1. DS92LV16 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2013, Texas Instruments Incorporated DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) −0.3V to +4V Supply Voltage (VCC) LVCMOS/LVTTL Input Voltage −0.3V to (VCC +0.3V) LVCMOS/LVTTL Output Voltage −0.3V to (VCC +0.3V) Bus LVDS Receiver Input Voltage −0.3V to +3.9V Bus LVDS Driver Output Voltage −0.3V to +3.9V Bus LVDS Output Short Circuit Duration 10ms Junction Temperature +150°C Storage Temperature −65°C to +150°C Lead Temperature (Soldering, 4 seconds) +260°C Maximum Package Power Dissipation Capacity Package Derating: 23.2 mW/°C above LQFP +25°C θJA 43°C/W θJC 11.1°C/W ESD Rating (HBM) (1) (2) >2.5kV Absolute Maximum Ratings are those values beyond which the safety of the device cannot be ensured. They are not meant to imply that the devices should be operated at these limits. The table of ELECTRICAL CHARACTERISTICS specifies conditions of device operation. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. RECOMMENDED OPERATING CONDITIONS Min Nom Max Units Supply Voltage (VCC) 3.15 3.3 3.45 V Operating Free Air Temperature (TA) −40 +25 +85 °C Clock Rate 25 80 MHz 2 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Pin/Freq. Min Typ Max Units 2.0 VCC V GND 0.8 V -0.7 −1.5 V ±2 +10 μA V LVCMOS/LVTTL DC Specifications VIH High Level Input Voltage VIL Low Level Input Voltage VCL Input Clamp Voltage TCLK_R/F,DEN, TCLK, TPWDN, DIN, ICL = −18 mA IIN Input Current VOH High Level Output Voltage IOH = −9 mA VOL Low Level Output Voltage IOL = 9 mA IOS Output Short Circuit Current VOUT = 0V IOZ TRI-STATE Output Current PWRDN or REN = 0.8V, VOUT = 0V or VCC SYNC, RCLK_R/F, REN, REFCLK, PWRDN −10 VIN = 0V or 3.6V ROUT, RCLK, LOCK ROUT, RCLK, 2.3 3.0 VCC GND 0.33 0.5 V −15 −48 −85 mA −10 ±0.4 +10 μA +100 mV Bus LVDS DC specifications VTH Differential Threshold High Voltage VTL Differential Threshold Low Voltage IIN Input Current VOD Output Differential Voltage (DO+) - (DO-) ΔVOD Output Differential Voltage Unbalance VOS Offset Voltage ΔVOS Offset Voltage Unbalance IOS Output Short Circuit Current IOZ VCM = +1.1V −100 RI+, RIVIN = +2.4V, VCC = 3.6V or 0V −10 ±5 +10 μA VIN = 0V, VCC = 3.6V or 0V −10 ±5 +10 μA RL = 100Ω, See Figure 18 350 500 550 mV 2 15 mV 1.2 1.25 V 2.7 15 mV -35 -50 -70 mA TXPWDN or DEN = 0.8V, DO = 0V OR VDD -10 ±1 10 µA VDD = 0V, DO = 0V or 3.6V -10 ±1 10 µA 1.05 Tri-State Output Current IOX Power-Off Output Current ICCT Total Supply Current (includes load current) mV DO = 0V, Din = H, TXPWDN and DEN = 2.4V DO+, DO- SER/DES SUPPLY CURRENT (DVDD, PVDD and AVDD pins) ICCX Supply Current Powerdown CL = 15 pF, RL = 100 Ω f = 80 MHz, PRBS15 pattern 209 CL = 15 pF, RL = 100 Ω f = 80 MHz, Worse case pattern (Checker-board pattern) 225 320 mA 0.35 1.0 mA PWRDN = 0.8V, REN = 0.8V mA Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 3 DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com SERIALIZER TIMING REQUIREMENTS FOR TCLK Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min Typ Max Units tTCP Transmit Clock Period 12.5 T 40 ns tTCIH Transmit Clock High Time 0.4T 0.5T 0.6T ns tTCIL Transmit Clock Low Time 0.4T 0.5T 0.6T ns tCLKT TCLK Input Transition Time 3 6 ns tJIT TCLK Input Jitter 80 ps (rms) SERIALIZER SWITCHING CHARACTERISTICS Over recommended operating supply and temperature ranges unless otherwise specified. (1) Symbol Parameter tLLHT Bus LVDS Low-to-High Transition Time tLHLT Bus LVDS High-to-Low Transition Time tDIS DIN (0-15) Setup to TCLK tDIH DIN (0-15) Hold from TCLK tHZD DO ± HIGH to TRI-STATE Delay tLZD DO ± LOW to TRI-STATE Delay tZHD DO ± TRI-STATE to HIGH Delay tZLD DO ± TRI-STATE to LOW Delay tSPW SYNC Pulse Width tPLD Serializer PLL Lock Time tSD Serializer Delay tRJIT Random Jitter tDJIT Deterministic Jitter See Figure 16 Conditions Min RL = 100Ω See Figure 4 CL=10pF to GND RL = 100Ω See Figure 7 CL=10pF to GND Typ Max Units 0.2 0.4 ns 0.2 0.4 ns 2.4 ns 0 ns RL = 100Ω See Figure 8 (1) CL=10pF to GND 2.3 10 ns 1.9 10 ns 1.0 10 ns 1.0 10 ns RL = 100Ω See Figure 9 5*tTCP 6*tTCP ns 510*tTCP 513*tTCP ns RL = 100Ω See Figure 10 tTCP + 1.0 tTCP + 4.0 ns tTCP + 2.0 10 ps (rms) 35 MHz -240 140 ps 80 MHz -75 100 ps Due to TRI-STATE of the Serializer, the Deserializer will lose PLL lock and have to resynchronize before data transfer. DESERIALIZER TIMING REQUIREMENTS FOR REFCLK Over recommended operating supply and temperature ranges unless otherwise specified. Symbol 4 Parameter Conditions Min Typ Max Units tRFCP REFCLK Period 12.5 T 40 ns tRFDC REFCLK Duty Cycle 40 50 60 % tRFCP / tTCP Ratio of REFCLK to TCLK 0.95 tRFTT REFCLK Transition Time 1.05 6 Submit Documentation Feedback ns Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 DESERIALIZER SWITCHING CHARACTERISTICS Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Parameter tRCP Receiver out Clock Period tRDC RCLK Duty Cycle tCLH CMOS/TTL Low-to-High Transition Time tCHL tROS CMOS/TTL High-to-Low Transition Time ROUT (0-9) Setup Data to RCLK tROH ROUT (0-9) Hold Data to RCLK tHZR HIGH to TRI-STATE Delay tLZR LOW to TRI-STATE Delay Conditions tRCP = tTCP See Figure 10 Pin/Freq. Min RCLK 12.5 RCLK 45 Typ Max Units 40 ns 50 55 % 2 4 ns 2 4 ns CL = 15 pF See Figure 5 Rout(0-9), LOCK, RCLK 0.35*tRCP 0.5*tRCP ns −0.35*tRCP −0.5*tRCP ns See Figure 12 See Figure 13 Rout(0-9), LOCK 2.2 10 ns 2.2 10 ns 2.3 10 ns 2.9 10 ns 1.75*tRCP + 7 ns tZHR TRI-STATE to HIGH Delay tZLR TRI-STATE to LOW Delay tDD Deserializer Delay RCLK tDSR1 Deserializer PLL Lock Time from PWRDWN (with SYNCPAT) 35MHz 3.7 10 μs 80 MHz 1.9 4 μs 35MHz 1.5 5 μs 80 MHz 0.9 See (1) tDSR2 Deserializer PLL Lock time from SYNCPAT tRNMI-R Ideal Deserializer Noise Margin Right See Figure 17 (2) tRNMI-L Ideal Deserializer Noise Margin Left See Figure 17 (2) (1) (2) 1.75*tRCP + 2 1.75*tRCP + 5 35 MHz 80 MHz 2 μs +630 ps +230 ps 35 MHz −630 ps 80 MHz −230 ps Sync pattern is a fixed pattern with 8-bit of data high followed by 8-bit of data low. tRNMI is a measure of how much phase noise (jitter) the deserializer can tolerate in the incoming data stream before bit errors occur. It is a measurement in reference with the ideal bit position, please see Tl’s AN-1217(SNLA053) for detail. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 5 DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com AC TIMING DIAGRAMS AND TEST CIRCUITS Figure 2. “Worst Case” Serializer ICC Test Pattern Figure 3. “Worst Case” Deserializer ICC Test Pattern Figure 4. Serializer Bus LVDS Output Load and Transition Times Figure 5. Deserializer CMOS/TTL Output Load and Transition Times 6 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 Figure 6. Serializer Input Clock Transition Time Figure 7. Serializer Setup/Hold Times Figure 8. Serializer TRI-STATE Test Circuit and Timing Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 7 DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com Figure 9. Serializer PLL Lock Time, SYNC Timing and PWRDN TRI-STATE Delays Figure 10. Serializer Delay Figure 11. Deserializer Delay Figure 12. Deserializer Setup and Hold Times 8 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 Figure 13. Deserializer TRI-STATE Test Circuit and Timing Figure 14. Deserializer PLL Lock Times and PWRDN TRI-STATE Delays Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 9 DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com Figure 15. Deserializer PLL Lock Time from SyncPAT Figure 16. Deterministic Jitter and Ideal Bit Position 10 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 tRNMI-L is the noise margin on the left of the above figure. It is a negative value to indicate early with respect to ideal. tRNMI-R is the noise margin on the right of the above figure. It is a positive value to indicate late with respect to ideal. Figure 17. Deserializer Noise Margin (tRNMI) and Sampling window VOD = (DO+)–(DO−). Differential output signal is shown as (DO+)–(DO−), device in Data Transfer mode. Figure 18. VOD Diagram Figure 19. Icc vs Freq Figure 20. Icc vs Freq (Rx only) Figure 21. Icc vs Freq (Tx only) Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 11 DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com FUNCTIONAL DESCRIPTION The DS92LV16 combines a serializer and deserializer onto a single chip. The serializer accepts a 16-bit LVCMOS or LVTTL data bus and transforms it into a BLVDS serial data stream with embedded clock information. The deserializer then recovers the clock and data to deliver the resulting 16-bit wide words to the output. The device has a separate Transmit block and Receive block that can operate independent of each other. Each has a power down control to enable efficient operation in various applications. For example, the transceiver can operate as a standby in a redundant data path but still conserve power. The part can be configured as a Serializer, Deserializer, or as a Full Duplex SER/DES. The DS92LV16 serializer and deserializer blocks each has three operating states. They are the Initialization, Data Transfer, and Resynchronization states. In addition, there are two passive states: Powerdown and TRISTATE. The following sections describe each operation mode and passive state. INITIALIZATION Before the DS92LV16 sends or receives data, it must initialize the links to and from another DS92LV16. Initialization refers to synchronizing the Serializer's and Deserializer's PLL's to local clocks. The local clocks must be the same frequency or within a specified range if from different sources. After the Serializers synchronizes to the local clocks, the Deserializers synchronize to the Serializers as the second and final initialization step. Step 1: When VCC is applied to both Serializer and/or Deserializer, the respective outputs are held in TRI-STATE and internal circuitry is disabled by on-chip power-on circuitry. When VCC reaches VCC OK (2.2V) the PLL in each device begins locking to a local clock. For the Serializer, the local clock is the transmit clock, TCLK. For the Deserializer, the local clock is applied to the REFCLK pin. A local on-board oscillator or other source provides the specified clock input to the TCLK and REFCLK pin. The Serializer outputs are held in TRI-STATE while the PLL locks to the TCLK. After locking to TCLK, the Serializer block is now ready to send data or synchronization patterns. If the SYNC pin is high, then the Serializer block generates and sends the synchronization patterns (sync-pattern). The Deserializer output will remain TRI-STATE while its PLL locks to the REFCLK. Also, the Deserializer LOCK output will remain high until its PLL locks to an incoming data or sync-pattern on the RIN pins. Step 2: The Deserializer PLL must synchronize to the Serializer to complete the initialization. The Serializer that is generating the stream to the Deserializer must send random (non-repetitive) data patterns or sync-patterns during this step of the Initialization State. The Deserializer will lock onto sync-patterns within a specified amount of time. The lock to random data depends on the data patterns and therefore, the lock time is unspecified. In order to lock to the incoming LVDS data stream, the Deserializer identifies the rising clock edge in a syncpattern and after 150 clock cycles will synchronize. If the Deserializer is locking to a random data stream from the Serializer, then it performs a series of operations to identify the rising clock edge and locks to it. Because this locking procedure depends on the data pattern, it is not possible to specify how long it will take. At the point where the Deserializer's PLL locks to the embedded clock, the LOCK pin goes low and valid data appears on the output. Note that the LOCK signal is synchronous to valid data appearing on the outputs. The user's application determines whether sync-pattern or lock to random data is the preferred method for synchronization. If sync-patterns are preferred, the associated deserializers LOCK pin is a convenient way to provide control of the SYNC pin. DATA TRANSFER After initialization, the DS92LV16 Serializer is able to transfer data to the Deserializer. The serial data stream includes a start bit and stop bit appended by the serializer, which frame the sixteen data bits. The start bit is always high and the stop bit is always low. The start and stop bits also function as clock bits embedded in the serial stream. The Serializer block accepts data from the DIN0-DIN15 parallel inputs. The TCLK signal latches the incoming data on the rising edge. If the SYNC input is high for 6 TCLK cycles, the DS92LV16 does not latch data on the DIN0-DIN15. 12 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 The Serializer transmits the data and clock bits (16+2 bits) at 18 times the TCLK frequency. For example, if TCLK is 60 MHz, the serial rate is 60 X 18 = 1080 Mbps. Since only 16 bits are from input data, the serial 'payload' rate is 16 times the TCLK frequency. For instance, if TCLK = 60 MHz, the payload data rate is 60 X 16 = 960 Mbps. TCLK is provided by the data source and must be in the range of 25 MHz to 80 MHz. When the Deserializer channel synchronizes to the input from a Serializer, it drives its LOCK pin low and synchronously delivers valid data on the output. The Deserializer locks to the embedded clock, uses it to generate multiple internal data strobes, and then drives the recovered clock on the RCLK pin. The RCLK is synchronous to the data on the ROUT[0:15] pins. While LOCK is low, data on ROUT[0:15] is valid. Otherwise, ROUT[0:15] is invalid. ROUT[0:15], LOCK, and RCLK signals will drive a minimum of three CMOS input gates (15pF total load) at a 80 MHz clock rate. This drive capacity allows bussing outputs of multiple Deserializers and multiple destination ASIC inputs. REN controls TRI-STATE of the all outputs. The Deserializer input pins are high impedance during Receiver Powerdown (RPWDN* low) and power-off (VCC = 0V). RESYNCHRONIZATION Whenever the Deserializer loses lock, it will automatically try to resynchronize. For example, if the embedded clock edge is not detected two times in succession, the PLL loses lock and the LOCK pin is driven high. The Deserializer then enters the operating mode where it tries to lock to random a data stream. It looks for the embedded clock edge, identifies it and then proceeds through the synchronization process. The logic state of the LOCK signal indicates whether the data on ROUT is valid; when it is low, the data is valid. The system must monitor the LOCK pin to determine whether data on the ROUT is valid. Because there is a short delay in the LOCK signals response to the PLL losing synchronization to the incoming data stream, the system must determine the validity of data for the cycles before the LOCK signal goes high. The user can choose to resynchronize to the random data stream or to force fast synchronization by pulsing the Serializer SYNC pin. Since lock time varies due to data stream characteristics, we cannot possibly predict exact lock time. The primary constraint on the "random" lock time is the initial phase relation between the incoming data and the REFCLK when the Deserializer powers up. An advantage of using the SYNC pattern to force synchronization is the ability for user to predict the delay for PLL to regain lock. This scheme is left up to the user discretion. One recommendation is to provide a feedback loop using the LOCK pin itself to control the sync request of the Serializer, which is the SYNC pin. If a specific pattern is repetitive, the Deserializer’s PLL will not lock in order to prevent the Deserializer to lock to the data pattern rather than the clock. We refer to such pattern as a repetitive multi-transition, RMT. This occurs when more than one Low-High transition takes places in a clock cycle over multiple cycles. This occurs when any bit, except DIN 15, is held at a low state and the adjacent bit is held high, creating a 0-1 transition. The internal circuitry accomplishes this by detecting more than one potential position for clocking bits. Upon detection, the circuitry will prevent the LOCK output from becoming active until the RMT pattern changes. Once the RMT pattern changes and the internal circuitry recognized the clock bits in the serial data stream, the PLL of the Deserializer will lock, which will drive the LOCK output to low and the output data ROUT will become valid. POWERDOWN The Powerdown state is a low power sleep mode that the Serializer and Deserializer will occupy while waiting for initialization. You can also use TPWDN* and RPWDN* to reduce power when there are no pending data transfers. The Deserializer enters Powerdown when RPWDN* is driven low. In Powerdown, the PLL stops and the outputs go into TRI-STATE, which reduces supply current to the μA range. To bring the Deserializer block out of the Powerdown state, the system drives RPWDN* high. When the Deserializer exits Powerdown, it automatically enters the Initialization state. The system must then allow time for Initialization before data transfer can begin. The TPWDN* driven to a low condition forces the Serializer block into low power consumption where the supply current is in the μA range. The Serializer PLL stops and the output goes into a TRI-STATE condition. To bring the Serializer block out of the Powerdown state, the system drives TPWDN* high. When the Serializer exits Powerdown, its PLL must lock the TCLK before it is ready for the Initialization state. The system must then allow time for Initialization before data transfer can begin. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 13 DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com LOOPBACK TEST OPERATION The DS92LV16 includes two Loopback modes for testing the device functionality and the transmission line continuity. Asserting the Line Loopback control signal connects the serial data input (RIN+/−) to the serial data output (DO+/−) and to the parallel data output (ROUT[0:15]). The serial data goes through deserializer and serializer blocks. Asserting the Local Loopback control signal connects the parallel data input (DIN[0:15]) back to the parallel data output (ROUT[0:15]). The connection route includes all the functional blocks of the SER/DES Pair. The serial data output (DO+/−) is automatically disabled during the Local Loopback operating mode. TRI-STATE When the system drives the REN pin low, the Deserializer output enter TRI-STATE. This will TRI-STATE the receiver output pins (ROUT[0:15]) and RCLK. When the system drives REN high, the Deserilaizer will return to the previous state as long as all other control pins remain static (RPWDN*). When the system drives the DEN pin low, the Serializer output enters TRI-STATE. This will TRI-STATE the LVDS output. When the system drives the DEN signal high, the Serializer output will return to the previous state as long as all other control and data input pins remain in the same condition as when the DEN was driven low. APPLICATION INFORMATION Using the DS92LV16 The DS92LV16 combines a Serializer and a Deserializer into a single chip that sends 16 bits of parallel TTL data over a serial Bus LVDS link up to 1.28 Gbps. Serialization of the input data is accomplished using an onboard PLL at the Serializer which embeds two clock bits with the data. The Deserializer uses a separate reference clock (REFCLK) and an onboard PLL to extract the clock information from the incoming data stream and deserialize the data. The Deserializer monitors the incoming clock information to determine lock status and will indicate loss of lock by raising the LOCK output. Power Considerations All CMOS design of the Serializer and Deserializer makes them inherently low power devices. Additionally, the constant current source nature of the LVDS outputs minimize the slope of the speed vs. ICC curve of CMOS designs. Powering Up the Deserializer The REFCLK input can be running before the Deserializer is powered up and it must be running in order for the Deserializer to lock to incoming data. The Deserializer outputs will remain in TRI-STATE until the Deserializer detects data transmission at its inputs and locks to the incoming stream. Noise Margin The Deserializer noise margin is the amount of input jitter (phase noise) that the Deserializer can tolerate and still reliably receive data. Various environmental and systematic factors include: • Serializer: TCLK jitter, VCC noise (noise bandwidth and out-of-band noise) • Media: ISI, VCM noise • Deserializer: VCC noise For typical receiver noise margin, please see Figure 17. Recovering from LOCK Loss In the case where the Serializer loses lock during data transmission up to 5 cycles of data that was previously received can be invalid. This is due to the delay in the lock detection circuit. The lock detect circuit requires that invalid clock information be received 2 times in a row to indicate loss of lock. Since clock information has been lost it is possible that data was also lost during these cycles. When the Deserializer LOCK pin goes low, data from at least the previous 5 cycles should be resent upon regaining lock. Lock can be regained at the Deserializer by causing the Serializer to resend SYNC patterns as described above or by random lock which can take more time depending upon the data patterns being received. 14 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 Input Failsafe In the event that the Deserializer is disconnected from the Serializer, the failsafe circuitry is designed to reject certain amount of noise from being interpreted as data or clock. The outputs will be tri-stated and the Deserializer will lose lock. Hot Insertion All the LVDS devices are hot pluggable if you follow a few rules. When inserting, ensure the Ground pin(s) makes contact first, then the VCC pin(s), then the I/O pins. When removing, the I/O pins should be unplugged first, then the VCC, then the Ground. PCB Layout and Power System Considerations Circuit board layout and stack-up for the BLVDS devices should be designed to provide low-noise power feed to the device. Good layout practice will also separate high-frequency or high-level inputs and outputs to minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance for the PCB power system with low-inductance parasitic, especially proven effective at high frequencies above approx 50MHz, and makes the value and placement of external bypass capacitors less critical. External bypass capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the tantalum capacitors should be at least 5X the power supply voltage being used. It is a recommended practice to use two vias at each power pin as well as at all RF bypass capacitor terminals. Dual vias reduce the interconnect inductance by up to half, thereby reducing interconnect inductance and extending the effective frequency range of the bypass components. Locate RF capacitors as close as possible to the supply pins, and use wide low impedance traces (not 50 Ohm traces). Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power entry. This is typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is recommended to connect power and ground pin straight to the power and ground plane, with the bypass capacitors connected to the plane with via on both ends of the capacitor. Connecting power or ground pin to an external bypass capacitor will increase the inductance of the path. A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size reduces the parasitic inductance of the capacitor. User must pay attention to the resonance frequency of these external bypass capacitors, usually in the range of 20-30MHz range. To provide effective bypassing, very often, multiple capacitors are used to achieve low impedance between the supply rails over the frequency of interest. At high frequency, it is also a common practice to use two via from power and ground pins to the planes, reducing the impedance at high frequency. Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs. Use at least a four layer board with a power and ground plane. Locate CMOS (TTL) swings away from the LVDS lines to prevent coupling from the CMOS lines to the LVDS lines. Closely-coupled differential lines of 100 Ohms are typically recommended for LVDS interconnect. The closely-coupled lines help to ensure that coupled noise will appear as common-mode and thus is rejected by the receivers. Also the tight coupled lines will radiate less. Termination of the LVDS interconnect is required. For point-to-point applications termination should be located at the load end. Nominal value is 100 Ohms to match the line's differential impedance. Place the resistor as close to the receiver inputs as possible to minimize the resulting stub between the termination resistor and receiver. Additional general guidance can be found in the LVDS Owner's Manual - available in PDF format from the Texas Instruments web site at: http://www.ti.com/ww/en/analog/interface/lvds.shtml Specific guidance for this device is provided next: Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 15 DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com DS92LV16 BLVDS SER/DES PAIR General device specific guidance is given below. Exact guidance can not be given as it is dictated by other board level /system level criteria. This includes the density of the board, power rails, power supply, and other integrated circuit power supply needs. DVDD = Digital section power supply These pins supply the digital portion of the device and also receiver output buffers. The TX DVDD is less critical. The RX DVDD requires more bypass to power the outputs under synchronous switching conditions. The receiver DVDD pins power 4 outputs from each DVDD pin. An estimate of local capacitance required indicates a minimum of 22nF is required. This is calculated by taking 4 times the maximum short current (4 X 70 = 280mA) multiplying by the rise time of the part (4ns) and dividing by the maximum allowed droop in VDD (assume 50mV) yields 22.4nF. Rounding up to a standard value, 0.1uF is selected for each DVDD pin. PVDD = PLL section power supply The PVDD pin supplies the PLL circuit. Note that the DS92LV16 has two separate PLLs and supply pins. The PLL(s) require clean power for the minimization of Jitter. A supply noise frequency in the 300kHZ to 1MHz range can cause increased output jitter. Certain power supplies may have switching frequencies or high harmonic content in this range. If this is the case, filtering of this noise spectrum may be required. A notch filter response is best to provide a stable VDD, suppression of the noise band, and good high-frequency response (clock fundamental). This may be accomplished with a pie filter (CRC or CLC). If employed, a separate pie filter is recommended for each PLL to minimize drop in potential due to the series resistance. The pie filter should be located close to the PVDD power pin. Separate power planes for the PVDD pins is typically not required. AVDD = LVDS section power supply The AVDD pin supplies the LVDS portion of the circuit. The DS92LV16 has four AVDD pins. Due to the nature of the design, current draw is not excessive on these pins. A 0.1uF capacitor is sufficient for these pins. If space is available it 0.01uF may be used in parallel with the 0.1uF capacitor for additional high frequency filtering. GROUNDs The AGND pin should be connected to the signal common in the cable for the return path of any common-mode current. Most of the LVDS current will be odd-mode and return within the interconnect pair. A small amount of current may be even-mode due to coupled noise, and driver imbalances. This current should return via a low impedance known path. A solid ground plane is recommended for both DVDD, PVDD or AVDD. Using a split plane may have potential problem of ground loops, or difference in ground potential at various ground pins of the device. 16 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 PIN DIAGRAM Figure 22. DS92LV16TVHG (Top View) PIN DESCRIPTIONS Pin # (1) Pin Name I/O 1 RPWDN* CMOS, I RPWDN* = Low will put the Receiver in low power, stand-by, mode. Note: The Receiver PLL will lose lock. (1) 2 REN CMOS, I REN = Low will disable the Receiver outputs. Receiver PLL remains locked. (See LOCK pin description) (1) 3 CONFIG1 4 REFCLK 5, 10, 11, 15 AVDD 6,9,12,16 AGND 7 RIN+ Description Configuration pin - strap or tie this pin to High with pull-up resistor. Noconnect or Low reserved for future use. CMOS, I Frequency reference clock input for the receiver. Analog Voltage Supply Analog Ground LVDS, I Receiver LVDS True Input 8 RIN- LVDS, I Receiver LVDS Inverting Input 13 DO+ LVDS, O Transmitter LVDS True Output Input defaults to "low" state when left open due to internal pull-device. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 17 DS92LV16 SNLS138H – JANUARY 2001 – REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS (continued) Pin # Pin Name I/O 14 DO- LVDS, O Transmitter LVDS Inverting Output 17 TCLK CMOS, I Transmitter reference clock. Used to strobe data at the DIN Inputs and to drive the transmitter PLL. See SERIALIZER TIMING REQUIREMENTS FOR TCLK 18 CONFIG2 19 DEN CMOS, I DEN = Low will disable the Transmitter outputs. The transmitter PLL will remain locked. (1) 20 SYNC CMOS, I SYNC = High will cause the transmitter to ignore the data inputs and send SYNC patterns to provide a locking reference to receiver(s). See Functional Description. (1) DIN (0:15) CMOS, I Transmitter data inputs. (1) 21, 22, 23, 24, 25, 26, 27, 28, 33, 34, 35, 36, 37, 38, 39, 40 29,32 Description Configuration pin - strap or tie this pin to High with pull-up resistor. Noconnect or Low reserved for future use. PGND PLL Ground. 30,31 PVDD PLL Voltage supply. 41, 44, 51, 52, 59, 60, 61, 68, 80 DGND Digital Ground. 42 43, 50, 53, 58, 62, 69 45, 46, 47, 48, 54, 55, 56, 57, 64, 65, 66, 67, 70, 71, 72, 73 (2) 18 TPWDN* CMOS, I DVDD TPWDN* = Low will put the Transmitter in low power, stand-by mode. Note: The transmitter PLL will lose lock. (2) Digital Voltage Supplies. ROUT (0:15) CMOS, O Receiver Outputs. 49 RCLK CMOS, O Recovered Clock. Parallel data rate clock recovered from embedded clock. Used to strobe ROUT (0:15). LVCMOS Level output. 63 LOCK* CMOS, O LOCK* indicates the status of the receiver PLL. LOCK = H - receiver PLL is unlocked, LOCK = L - receiver PLL is locked. 74,76 PGND PLL Grounds. 75,77 PVDD PLL Voltage Supplies. 78 LINE_LE CMOS, I LINE_LE = High enables the receiver loopback mode. Data received at the RIN+/- inputs is fed back through the DO+/- outputs. (2) 79 LOCAL_LE CMOS, I LOCAL_LE = High enables the transmitter loopback mode. Date received at the DIN inputs is fed back through the ROUT outputs. (2) Input defaults to "low" state when left open due to internal pull-device. Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 DS92LV16 www.ti.com SNLS138H – JANUARY 2001 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision G (April 2013) to Revision H • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 17 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: DS92LV16 19 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DS92LV16TVHG ACTIVE LQFP PN 80 119 TBD Call TI Call TI -40 to 85 DS92LV16TVHG >B DS92LV16TVHG/NOPB ACTIVE LQFP PN 80 119 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR -40 to 85 DS92LV16TVHG >B DS92LV16TVHGX ACTIVE LQFP PN 80 1000 TBD Call TI Call TI -40 to 85 DS92LV16TVHG >B DS92LV16TVHGX/NOPB ACTIVE LQFP PN 80 1000 Green (RoHS & no Sb/Br) SN Level-3-260C-168 HR -40 to 85 DS92LV16TVHG >B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2013 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS92LV16TVHGX LQFP PN 80 1000 330.0 24.4 14.65 14.65 2.15 24.0 24.0 Q2 DS92LV16TVHGX/NOPB LQFP PN 80 1000 330.0 24.4 14.65 14.65 2.15 24.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS92LV16TVHGX LQFP PN 80 1000 367.0 367.0 45.0 DS92LV16TVHGX/NOPB LQFP PN 80 1000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996 PN (S-PQFP-G80) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 0,08 M 41 60 61 40 80 21 0,13 NOM 1 20 Gage Plane 9,50 TYP 12,20 SQ 11,80 14,20 SQ 13,80 0,25 0,05 MIN 0°– 7° 0,75 0,45 1,45 1,35 Seating Plane 0,08 1,60 MAX 4040135 / B 11/96 NOTES: A. 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