EClamp2465T Low Capacitance ESD/EMI Protection for SIM Card PRELIMINARY PROTECTION PRODUCTS - EMIClampTM Description Features The EClampTM2465T is a combination EMI filter and line termination device with integrated TVS diodes for use on SIM Card interfaces on cellular phones and other portable electronics. This state-of-the-art device utilizes solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, The device consists of three circuits that include series impedance matching resistors for proper termination of the SIM card interface. Termination resistor value of 100 Ohms is included on the Reset and Data lines and 47 Ohms on the CLK line. TVS diodes are also included on each line for ESD protection in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 610004-2, level 4. An additional TVS diode connection is included for protection of the voltage (Vcc) bus. ±15kV (air), ±8kV (contact) TVS working voltage: 5V Termination Resistors: 100 Ohms & 47 Ohms Capacitance: 10pF (Typical at VR = 0V) Protection and filtering for four lines Solid-state technology Mechanical Characteristics The EClamp2465T is in a 8-pin, RoHS/WEEE compliant, SLP1713P8T package. It measures 1.7 x 1.3 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.4mm and are finished with lead-free NiPdAu. The small package makes it ideal for use in portable electronics such as cell phones and digital still cameras. SLP1713P8T 8-pin package RoHS/WEEE Compliant Nominal Dimensions: 1.7 x 1.3 x 0.40 mm Lead Pitch: 0.4mm Lead finish: NiPdAu Marking: Marking Code + Date Code Packaging: Tape and Reel Applications SIM Card Cell Phone PDAs and Smartphones Package Configuration Pin Configuration 1.70 1 2 Data to Connector 1 8 CLK to Connector 1.30 CLK to IC Gnd Reset to IC Reset to Connector NC Data to IC 4 5 0.40 BSC Vcc to Connector 0.40 Pin Identification and Configuration (Top Side View) Revision 09/24/2008 8 Pin SLP package (Bottom Side View) Nominal Dimensions in mm 1 www.semtech.com EClamp2465T PRELIMINARY PROTECTION PRODUCTS Pin Identification and Configuration Pin Symbol Identification 1 Data Data Input (SIM Connector Side) 2 CLK Clock Input (SIM Connector Side) 3 Reset Reset Input (SIM Connector Side) 4 NC N o Connect 5 Vcc Power Supply ESD Protection (SIM Connector Side) 6 Reset Reset Output (IC Side) 7 CLK Clock input (IC Side) 8 Data Data Output (IC Side) Center tab GN D Ground connection 8 7 6 5 3 4 Gnd 1 2 Pin Configuration (Top View) Schematics & Component Values Vcc (Pin 5) 100 Ω Data to IC Data to Connector (Pin 1) 47 Ω (Pin 8) CLK to IC CLK to Connector (Pin 7) (Pin 2) 100 Ω Reset to IC Reset to Connector (Pin 6) (Pin 3) GND TAB © 2008 Semtech Corp. 2 www.semtech.com EClamp2465T PRELIMINARY PROTECTION PRODUCTS Maximum Ratings R ating Symbol Value Units VESD +/- 18 +/- 10 kV Junction Temp erature TJ 125 o Op erating Temp erature Top -40 to +85 o Storage Temp erature TSTG -55 to +150 o ESD p er IEC 61000-4-2 (Air)1 ESD p er IEC 61000-4-2 (Contact) C C C Electrical Characteristics (T=25oC) P ar am et er S y m b ol Con d i t i on s Mi n i mu m Ty p i c a l M ax i m u m Units 5 V 10 V 0.5 μA T VS Reverse Stand-Off Voltage VRWM T VS Reverse Breakdown Voltage V BR It = 1mA IR VRWM = 5.0V Reset Series Resistors RRST Each Line 85 100 115 Ohms Clk Series Resistors R CLK Each Line 40 47 55 Ohms Data Series Resistors RDATA Each Line 85 100 115 Ohms Cin Inp ut to Gnd, Each Line VR = 0V, f = 1MHz 8 10 12 pF T VS Reverse Leakage Current Total Cap acitance 6 8 Note: 1) ESD input at Pins 1, 2, 3, 5 © 2008 Semtech Corp. 3 www.semtech.com EClamp2465T PRELIMINARY PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Pin 2 to 7) CH1 S21 LOG Typical Insertion Loss S21 (Pin 1 to 8 and Pin 3 to 6) CH1 S21 6 dB / REF 0 dB LOG 6 dB / REF 0 dB 1: -8.7516 dB 506.218 MHz 1: -6.33460 dB 537.824 MHz 0 dB -6 dB 1 2 -12 dB 0 dB 2: -11.352 dB 800 MHz 3: -9.1592 dB 900 MHz -6 dB 3: -12.208 dB 900 MHz 1 -12 dB 3 4: -14.622 dB 1.8 GHz 4 -18 dB 2: -8.4201 dB 800 MHz 4: -17.795 dB 1.8 GHz 2 3 -18 dB 5 4 5: -18.026 dB 2.7 GHz -24 dB 5: -20.591 dB 2.5 GHz -24 dB -30 dB -30 dB -36 dB -36 dB -42 dB -42 dB -48 dB 4 1 MHz 10 MHz 100 MHz -48 dB 3 1 GHz GHz STOP 3000. 000000 MHz START.030 MHz 1 MHz 10 MHz 100 MHz START. 030 MHz ESD Clamping (+8kV Contact) 3 1 GHz GHz STOP 3000. 000000 MHz ESD Clamping (-8kV Contact) Note: Data is taken with a 10x attenuator Note: Data is taken with a 10x attenuator Normalized Capacitance vs. Reverse Voltage 1.1 1 0.9 C J(VR) / CJ(VR=0) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 f = 1 MHz 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Reverse Voltage - VR (V) © 2008 Semtech Corp. 4 www.semtech.com EClamp2465T PRELIMINARY PROTECTION PRODUCTS Device Connection Figure 1 - Pin Identification and Configuration (Top Side View) The EClamp2465T designed with ease of layout in mind. The package has flow through design which allows the designer to route the signals straight in and out between the SIM port connector and the SIM controller. The device is in a 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. Pin connections are noted in Figure 1. Note that the ESD protection diodes are located at pins 1 - 3 for the data and clock lines. This means the device is directional. Therefore, Pins 1 - 3 must be routed to the SIM connector while pins 6 - 8 are routed to the protected IC. Pin 5 is routed to the Vcc pin of the SIM connector. Typical layout examples are shown in Figure 3. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. The center tab should be connected directly to the ground plane. Multiple micro-vias are recommended in the device ground pad as shown in Figure 2. Multiple vias in the device ground pad will result in a lower inductive ground loop, increasing the ESD effectiveness of the device. Data to Connector 1 8 CLK to Connector CLK to IC Gnd Reset to IC Reset to Connector NC Data to IC 4 5 Vcc to Connector Figure 2 - Recommended Layout Using Ground Vias Figure 3 - SIM Protection Layout Examples © 2008 Semtech Corp. 5 www.semtech.com EClamp2465T PRELIMINARY PROTECTION PRODUCTS Applications Information - Spice Model Vcc (Pin 5) 100 Ω Data to IC Data to Connector (Pin 1) 47 Ω (Pin 8) CLK to IC CLK to Connector (Pin 7) (Pin 2) 100 Ω Reset to IC Reset to Connector (Pin 6) (Pin 3) GND TAB EClamp2465T Spice Model Note: All TVS shown in the circuit use D1 Parameters Table 1 - EClamp2465T Spice Parameters © 2008 Semtech Corp. Parameter Unit D1 (T VS) IS Amp 2E-15 BV Volt 7.5 VJ Volt 0.775 RS Ohm 1.05 IB V Amp 1E-3 CJO Farad 9E-12 TT sec 2.541E-9 M -- 0.246 N -- 1.1 EG eV 1.11 6 www.semtech.com EClamp2465T PRELIMINARY PROTECTION PRODUCTS Outline Drawing - SLP1713P8T A D B DIM PIN 1 INDICATOR (LASER MARK) E A SEATING PLANE aaa C A2 C A1 A A1 A2 b D D1 E E1 e L N aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .015 .016 .017 .000 .001 .002 (.005) .006 .008 .010 .065 .067 .070 .047 .051 .055 .049 .051 .054 .008 .012 .016 .016 BSC .008 .010 .012 8 .003 .004 0.37 0.40 0.43 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 1.65 1.70 1.78 1.20 1.30 1.40 1.25 1.30 1.38 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 8 0.08 0.10 D1 2 1 LxN E/2 E1 N bxN e/2 bbb C A B e D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1713P8T P X Z G DIM C G H K P X Y Z H (C) Y DIMENSIONS INCHES MILLIMETERS (.050) (1.27) .027 0.69 .012 0.30 .055 1.40 .016 0.40 .008 0.20 .023 0.58 .073 1.85 K NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. © 2008 Semtech Corp. 7 www.semtech.com EClamp2465T PRELIMINARY PROTECTION PRODUCTS Marking Ordering Information 2465T PIN 1 INDICATOR XXXX Part Number Qty per Reel R eel Size EClamp 2465T.TCT 3000 7 Inch This is a lead-free RoHS/WEEE Compliant Device EMIClamp and EClamp are marks of Semtech Corporation XXXX = Date Code Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.51 +/-0.10 mm B0 K0 1.91 +/-0.10 mm 0.66 +/-0.10 mm Tape Width B, (Max) D D1 8 mm 4.2 mm (.165) 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) 0.8 mm ±0.05 (.031) E 1.750±.10 mm (.069±.004) F K (MAX) P P0 P2 T(MAX) W 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 4.0±0.1 mm (.157±.004) 4.0±0.1 mm (.157±.004) 2.0±0.05mm (.079±.002) 0.4 mm (.016) 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 © 2008 Semtech Corp. 8 www.semtech.com