RT8271 2A, 24V, 1.2MHz Step-Down Converter General Description Features The RT8271 is a high voltage buck converter that can support the input voltage range from 4.75V to 24V and the output current can be up to 2A. Current Mode operation provides fast transient response and eases loop stabilization. The RT8271 also provides adjustable softstart to be a flexible solution for customers. z Wide Operating Input Range : 4.75V to 24V z Adjustable Output Voltage Range : 0.92V to 16V Output Current up to 2A 22μ μA Low Shutdown Current Power MOSFET : 0.18Ω Ω The chip provides protection functions such as cycle-bycycle current limiting and thermal shutdown protection. In shutdown mode, the regulator draws 22μA of supply current. The RT8271 is available in the SOP-8 and MSOP-10 (Exposed Pad) surface mount package. z z z z z z z z z z Ordering Information RT8271 Package Type S : SOP-8 FP : MSOP-10 (Exposed Pad) Lead Plating System G : Green (Halogen Free and Pb Free) Note : Richtek products are : ` Applications z z z z Distributive Power Systems Battery Charger DSL Modems Pre-regulator for Linear Regulators Pin Configurations (TOP VIEW) RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020. ` High Efficiency up to 92% 1.2MHz Fixed Switching Frequency Stable with Low ESR Output Ceramic Capacitors Programmable Soft-Start Thermal Shutdown Protection Cycle-By-Cycle Over Current Protection RoHS Compliant and Halogen Free Suitable for use in SnPb or Pb-free soldering processes. Marking Information For marking information, contact our sales representative directly or through a Richtek distributor located in your area, otherwise visit our website for detail. NC BOOT NC VIN SW 10 2 3 4 5 9 GND 8 11 7 6 SS EN COMP FB GND MSOP-10 (Exposed Pad) 8 BOOT SS VIN 2 7 EN SW 3 6 COMP GND 4 5 FB SOP-8 DS8271-02 March 2011 www.richtek.com 1 RT8271 Typical Application Circuit V IN 4.75V to 24V BOOT VIN C IN 10µF/25V C BOOT L1 10nF 4.7µH RT8271 SW Chip Enable D1 B230A EN FB SS C SS 10nF R1 16.9k CC 1.5nF RC 15k COMP GND V OUT 2.5V C OUT 22µF/6.3V R2 10k CP NC Table 1. Recommended Component Selection VOUT (V) R1 (kΩ) R2 (kΩ) RC (kΩ) C C (nF) L (μH) C OUT (μF) 15 154 10 68 0.56 22 22 10 100 10 49.9 0.82 15 22 8 76.8 10 49.9 1 10 22 5 44.2 10 33 1.2 6.8 22 3.3 25.5 10 22 1.5 4.7 22 2.5 16.9 10 15 1.5 4.7 22 1.8 9.53 10 12 1.5 2.2 22 1.2 3 10 12 1.5 2.2 22 Function Block Diagram VIN VCC Internal Regulator Oscillator 1.2MHz/440kHz 1µA EN 10k 3V VA VCC Foldback Control + 1V Shutdown Comparator VCC + UV Comparator + Current Comparator Logic SW GND + +EA Gm = 920µA/V 0.92V FB www.richtek.com 2 VA BOOT 0.5V 10µA SS Current Sense Slope Comp Amplifier + - COMP DS8271-02 March 2011 RT8271 Functional Pin Description Pin No. Pin Name Pin Function PMSOP-10 SOP-8 1, 3 -- NC No Internal Connection. 2 1 BOOT High Side Gate Drive Boost Input. BOOT supplies the drive for the high side N-MOSFET switch. Connect a 10nF or greater capacitor from SW to BOOT to power the high side switch. 4 2 VIN Power Input. VIN supplies the power to the IC, as well as the step-down converter switches. Bypass VIN to GND with a suitable large capacitor to eliminate noise on the input to the IC. 5 3 SW 6, 11 (Exposed Pad) 4 GND 7 5 FB 8 6 COMP 9 7 EN 10 8 SS DS8271-02 March 2011 Power Switching Output. SW is the switching node that supplies power to the output. Connect the output LC filter from SW to the output load. Note that a capacitor is required from SW to BOOT to power the high side switch. Ground. The exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. Feedback Input. FB senses the output voltage to regulate said voltage. The feedback reference voltage is 0.92V typically. Compensation Node. COMP is used to compensate the regulation control loop. Connect a series RC network from COMP to GND to compensate the regulation control loop. In some cases, an additional capacitor from COMP to GND is required. Enable Input. EN is a digital input that turns the regulator on or off. Drive EN higher than 1.4V to turn on the regulator, lower than 0.4V to turn it off. If the EN pin is open, it will be pulled to high by internal circuit. Soft-Start Control Input. SS controls the soft start period. Connect a capacitor from SS to GND to set the soft-start period. A 10nF capacitor sets the soft-start period to 1ms. www.richtek.com 3 RT8271 Absolute Maximum Ratings z z z z z z z z z z (Note 1) Supply Voltage, VIN ----------------------------------------------------------------------------------------- −0.3V to 26V Switching Voltage, SW ------------------------------------------------------------------------------------- −0.3V to (VIN + 0.3V) BOOT Voltage ------------------------------------------------------------------------------------------------ (VSW − 0.3V) to (VSW + 6V) The Other Pins Voltage ------------------------------------------------------------------------------------- −0.3V to 6V Power Dissipation, PD @ TA = 25°C SOP-8 ---------------------------------------------------------------------------------------------------------- 0.833W MSOP-10 (Exposed Pad) ---------------------------------------------------------------------------------- 1.163W Package Thermal Resistance (Note 2) SOP-8, θJA ---------------------------------------------------------------------------------------------------- 120°C/W MSOP-10 (Exposed Pad), θJA ---------------------------------------------------------------------------- 86°C/W MSOP-10 (Exposed Pad), θJC ---------------------------------------------------------------------------- 30°C/W Junction Temperature --------------------------------------------------------------------------------------- 150°C Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------- 260°C Storage Temperature Range ------------------------------------------------------------------------------- −65°C to 150°C ESD Susceptibility (Note 3) HBM (Human Body Mode) --------------------------------------------------------------------------------- 2kV MM (Machine Mode) ---------------------------------------------------------------------------------------- 200V Recommended Operating Conditions z z z z (Note 4) Supply Voltage, VIN ----------------------------------------------------------------------------------------- 4.75V to 24V Enable Voltage, VEN ----------------------------------------------------------------------------------------- 0V to 5.5V Junction Temperature Range ------------------------------------------------------------------------------ −40°C to 125°C Ambient Temperature Range ------------------------------------------------------------------------------ −40°C to 85°C Electrical Characteristics (VIN = 12V, TA = 25°C unless otherwise specified) Parameter Symbol Test Conditions 4.75V ≤ VIN ≤ 24V Min Typ Max Unit 0.902 0.92 0.938 V Feedback Reference Voltage VFB High Side Switch-On Resistance RDS(ON)1 -- 0.18 -- Ω Low Side Switch-On Resistance Switch Leakage RDS(ON)2 VEN = 0V, VSW = 0V --- 10 -- -10 Ω μA Current Limit ILIM Duty = 75%; VBOOT−SW = 4.8V -- 3 -- A Current Sense Transconductance GCS Output Current to VCOMP -- 2.5 -- A/V Error Amplifier Tansconductance Gm ΔIC = ±10μA 620 920 1220 μA/V Oscillator Frequency fSW Short Circuit Oscillation Frequency Maximum Duty Cycle DMAX Minimum On-Time Under Voltage Lockout Threshold Rising Under Voltage Lockout Threshold Hysteresis tON VFB = 0V VFB = 0.8V -- 1.2 -- MHz --- 440 75 --- kHz % -- 90 -- ns 3.8 4.2 4.5 V -- 250 -- mV To be continued www.richtek.com 4 DS8271-02 March 2011 RT8271 Parameter EN Input Voltage Symbol Test Conditions Min Typ Max Unit Logic High 1.4 -- 5.5 Logic Low -- -- 0.4 --- 1 22 -36 μA μA V Enable Pull Up Current Shutdown Current ISHDN VEN = 0V VEN = 0V Quiescent Current IQ VEN = 2V, VFB = 1V -- 0.6 1 mA CSS = 10nF -- 1 -- ms -- 150 -- °C Soft-Start Period Thermal Shutdown T SD Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective thermal conductivity four layers test board of JEDEC 51-7 thermal measurement standard. The case point of θJC is on the expose pad for MSOP-10 (Exposed Pad) package. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions. DS8271-02 March 2011 www.richtek.com 5 RT8271 Typical Operating Characteristics Current Limit vs. Duty Ratio Efficiency vs. Load Current 100 4.0 VOUT = 3.3V 90 3.8 VOUT = 2.5V 70 Current Limit (A) Efficiency (%) 80 60 50 40 30 3.6 3.4 3.2 3.0 20 2.8 10 VIN = 12V 2.6 0 0 0.25 0.5 0.75 1 1.25 1.5 1.75 0 2 10 20 30 Reference Voltage vs. Temperature 50 60 70 2.528 0.925 2.526 0.920 0.915 0.910 0.905 90 2.524 2.522 2.520 2.518 VIN = 12V, IOUT = 0A 0.900 VIN = 12V 2.516 -50 -25 0 25 50 75 100 125 0 0.25 0.5 0.75 Temperature (°C) 1 1.25 1.5 1.75 2 Load Current (A) Quiescent Current vs. Temperature Shutdown Current vs. Input Voltage 0.80 22 0.75 21 Shutdown Current (µA)1 Quiescent Current (mA) 80 Output Voltage vs. Load Current 0.930 Output Voltage (V) Reference Voltage (V) 40 Duty Ratio (%) Load Current (A) 0.70 0.65 0.60 0.55 20 19 18 17 VIN = 12V 16 0.50 -50 -25 0 25 50 Temperature (°C) www.richtek.com 6 75 100 125 3 6 9 12 15 18 21 24 Input Voltage (V) DS8271-02 March 2011 RT8271 Switching Frequency vs. Input Voltage Switching Frequency vs. Temperature 1.30 Switching Frequency (MHz)1 Switching Frequency (MHz)1 1.35 1.30 1.25 1.20 1.15 1.10 1.25 1.20 1.15 1.10 1.05 VIN = 12V, VOUT = 2.5V, IOUT = 0.3A VOUT = 2.5V, IOUT = 0.3A 1.05 1.00 3 6 9 12 15 18 21 24 -50 -25 0 25 50 75 Input Voltage (V) Temperature (°C) Output Voltage vs. Input Voltage Output Ripple 100 125 2.529 VOUT (5mV/Div) Output Voltage (V) 2.527 2.525 VSW (10V/Div) 2.523 2.521 2.519 IOUT = 1A VIN = 12V VOUT = 2.5V IOUT = 2A IL (1A/Div) 2.517 4 6.5 9 11.5 14 16.5 19 21.5 Time (1μs/Div) 24 Input Voltage (V) Load Transient Response Load Transient Response VIN = 12V, VOUT = 2.5V IOUT = 0A to 2A VIN = 12V, VOUT = 2.5V IOUT = 1A to 2A VOUT (50mV/Div) VOUT (50mV/Div) IOUT (1A/Div) IOUT (1A/Div) Time (100μs/Div) DS8271-02 March 2011 Time (100μs/Div) www.richtek.com 7 RT8271 Power On from EN Pin Power Off from EN Pin VEN (5V/Div) VEN (5V/Div) VOUT (1V/Div) I IN (500mA/Div) VOUT (1V/Div) I IN (500mA/Div) VIN = 12V VOUT = 2.5V IOUT = 2A Time (250μs/Div) www.richtek.com 8 VIN = 12V, VOUT = 2.5V, IOUT = 2A Time (100μs/Div) DS8271-02 March 2011 RT8271 Application Information The RT8271 is an asynchronous high voltage buck converter that can support the input voltage range from 4.75V to 24V and the output current can be up to 2A. Output Voltage Setting The resistive divider allows the FB pin to sense the output voltage as shown in Figure 1. VOUT R1 FB RT8271 R2 GND Figure 1. Output Voltage Setting The output voltage is set by an external resistive divider according to the following equation : VOUT = VFB ⎛⎜ 1+ R1 ⎞⎟ ⎝ R2 ⎠ Where VFB is the feedback reference voltage (0.92V typ.). External Bootstrap Diode Connect a 10nF low ESR ceramic capacitor between the BOOT pin and SW pin. This capacitor provides the gate driver voltage for the high side MOSFET. It is recommended to add an external bootstrap diode between an external 5V and the BOOT pin for efficiency improvement when input voltage is lower than 5.5V or duty ratio is higher than 65%. The bootstrap diode can be a low cost one such as 1N4148 or BAT54. The external 5V can be a 5V fixed input from system or a 5V output of the RT8271. 5V BOOT RT8271 10nF SW Figure 2. External Bootstrap Diode DS8271-02 March 2011 Soft-Start The RT8271 contains an external soft-start clamp that gradually raises the output voltage. The soft-start timming can be programed by the external capacitor between SS pin and GND. The chip provides a 10μA charge current for the external capacitor. If 10nF capacitor is used to set the soft-start and it’ s period will be 1ms (typ.). Inductor Selection The inductor value and operating frequency determine the ripple current according to a specific input and output voltage. The ripple current ΔIL increases with higher VIN and decreases with higher inductance. V V ΔIL = ⎡⎢ OUT ⎤⎥ × ⎡⎢1− OUT ⎤⎥ f × L VIN ⎦ ⎣ ⎦ ⎣ Having a lower ripple current reduces not only the ESR losses in the output capacitors but also the output voltage ripple. High frequency with small ripple current can achieve highest efficiency operation. However, it requires a large inductor to achieve this goal. For the ripple current selection, the value of ΔIL = 0.2(IMAX) will be a reasonable starting point. The largest ripple current occurs at the highest VIN. To guarantee that the ripple current stays below the specified maximum, the inductor value should be chosen according to the following equation : ⎡ VOUT ⎤ ⎡ VOUT ⎤ L =⎢ ⎥ × ⎢1− VIN(MAX) ⎥ f I × Δ L(MAX) ⎣ ⎦ ⎣ ⎦ Inductor Core Selection The inductor type must be selected once the value for L is known. Generally speaking, high efficiency converters can not afford the core loss found in low cost powdered iron cores. So, the more expensive ferrite or mollypermalloy cores will be a better choice. The selected inductance rather than the core size for a fixed inductor value is the key for actual core loss. As the inductance increases, core losses decrease. Unfortunately, increase of the inductance requires more turns of wire and therefore the copper losses will increase. Ferrite designs are preferred at high switching frequency due to the characteristics of very low core losses. So, design goals can focus on the reduction of copper loss and the saturation prevention. www.richtek.com 9 RT8271 Ferrite core material saturates “hard”, which means that inductance collapses abruptly when the peak design current is exceeded. The previous situation results in an abrupt increase in inductor ripple current and consequent output voltage ripple. Do not allow the core to saturate! Different core materials and shapes will change the size/ current and price/current relationship of an inductor. Toroid or shielded pot cores in ferrite or permalloy materials are small and do not radiate energy. However, they are usually more expensive than the similar powdered iron inductors. The rule for inductor choice mainly depends on the price vs. size requirement and any radiated field/ EMI requirements. Diode Selection When the power switch turns off, the path for the current is through the diode connected between the switch output and ground. This forward biased diode must have a minimum voltage drop and recovery times. Schottky diode is recommended and it should be able to handle those current. The reverse voltage rating of the diode should be greater than the maximum input voltage, and current rating should be greater than the maximum load current. For more detail please refer to Table 4. CIN and COUT Selection The input capacitance, C IN, is needed to filter the trapezoidal current at the source of the high side MOSFET. To prevent large ripple current, a low ESR input capacitor sized for the maximum RMS current should be used. The RMS current is given by : IRMS = IOUT(MAX) VOUT VIN VIN −1 VOUT This formula has a maximum at VIN = 2VOUT, where I RMS = I OUT /2. This simple worst-case condition is commonly used for design because even significant deviations do not offer much relief. Choose a capacitor rated at a higher temperature than required. Several capacitors may also be paralleled to meet size or height requirements in the design. For the input capacitor, a 10μF low ESR ceramic capacitor is recommended. For the recommended capacitor, please www.richtek.com 10 refer to table 3 for more detail. The selection of COUT is determined by the required ESR to minimize voltage ripple. Moreover, the amount of bulk capacitance is also a key for COUT selection to ensure that the control loop is stable. Loop stability can be checked by viewing the load transient response as described in a later section. The output ripple, ΔVOUT , is determined by : 1 ⎤ ΔVOUT ≤ ΔIL ⎡⎢ESR + 8fCOUT ⎦⎥ ⎣ The output ripple will be highest at the maximum input voltage since ΔIL increases with input voltage. Multiple capacitors placed in parallel may be needed to meet the ESR and RMS current handling requirement. Dry tantalum, special polymer, aluminum electrolytic and ceramic capacitors are all available in surface mount packages. Special polymer capacitors offer very low ESR value. However, it provides lower capacitance density than other types. Although Tantalum capacitors have the highest capacitance density, it is important to only use types that pass the surge test for use in switching power supplies. Aluminum electrolytic capacitors have significantly higher ESR. However, it can be used in cost-sensitive applications for ripple current rating and long term reliability considerations. Ceramic capacitors have excellent low ESR characteristics but can have a high voltage coefficient and audible piezoelectric effects. The high Q of ceramic capacitors with trace inductance can also lead to significant ringing. Higher values, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple current, high voltage rating and low ESR make them ideal for switching regulator applications. However, care must be taken when these capacitors are used at input and output. When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, VIN. At best, this ringing can couple to the output and be mistaken as loop instability. At worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at VIN large enough to damage the part. DS8271-02 March 2011 RT8271 Checking Transient Response 1.2 PD(MAX) = ( TJ(MAX) - TA ) / θJA Where T J(MAX) is the maximum operation junction temperature, TA is the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of RT8271, the maximum junction temperature is 125°C. The junction to ambient thermal resistance θJA for MSOP-10 (Exposed Pad) package is 86°C/W and for SOP-8 is 120°C/W on the standard JEDEC 51-7 four-layers thermal test board. The maximum power dissipation at TA = 25°C can be calculated by following formula : PD(MAX) = (125°C − 25°C) / (86°C/W) = 1.163W for MSOP-10 (Exposed Pad) PD(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for SOP-8 1.0 SOP-8 0.9 MSOP-10 (Exposed Pad) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Thermal Considerations The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : Four Layer PCB 1.1 Power Dissipation (W) The regulator loop response can be checked by looking at the load transient response. Switching regulators take several cycles to respond to a step in load current. When a load step occurs, VOUT immediately shifts by an amount equal to ΔILOAD (ESR) also begins to charge or discharge COUT generating a feedback error signal for the regulator to return VOUT to its steady-state value. During this recovery time, VOUT can be monitored for overshoot or ringing that would indicate a stability problem. 0 25 50 75 100 125 Ambient Temperature (°C) Figure 3. Derating Curves for RT8271 Packages Layout Consideration Follow the PCB layout guidelines for optimal performance of the RT8271. ` Keep the traces of the main current paths as short and wide as possible. ` Put the input capacitor as close as possible to the device pins (VIN and GND). ` LX node is with high frequency voltage swing and should be kept at small area. Keep sensitive components away from the LX node to prevent stray capacitive noise pickup. ` Place the feedback components to the FB pin as close as possible. ` The GND and Exposed Pad should be connected to a strong ground plane for heat sinking and noise protection. The maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance θJA. For RT8271 packages, the Figure 3 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. DS8271-02 March 2011 www.richtek.com 11 RT8271 C SS SW C BOOT NC BOOT NC VIN D1 SW V IN C IN Input capacitor must be placed as close to the IC as possible. The feedback components must be connected as close to the device as possible. CC C OUT SS EN COMP FB GND 10 2 9 3 GND 8 4 11 7 5 6 CP RC R1 V OUT R2 L1 SW should be connected to inductor by V OUT wide and short trace. Keep sensitive components away from this trace. GND Figure 4. PCB Layout Guide for MSOP-10 (Exposed Pad) GND V IN SW CS CB Input capacitor must be placed as close to the IC as possible. C IN BOOT D1 The parallel distance between COMP and FB traces must be as short as possible. 8 SS VIN 2 7 EN SW 3 6 COMP 5 FB C OUT 4 GND L1 The output capacitor must be placed near V OUT the RT8271. SW should be connected to inductor by wide and short trace. Keep sensitive components away from this trace. CC CP RC GND V OUT The resistor divider must be connected as close to the device as possible. Figure 5. PCB Layout Guide for SOP-8 www.richtek.com 12 DS8271-02 March 2011 RT8271 Table 2. Suggested Inductors for Typical Application Circuit Component Supplier Series Dimensions (mm) TDK SLF12555T 12.5 x 12.5 x 5.5 TAIYO YUDEN NR8040 8x8 x4 TDK SLF12565T 12.5 x 2.5 x 6.5 Table 3. Suggested Capacitors for CIN and COUT Location Component Supplier Part No. Capacitance (μF) Case Size CIN MURATA GRM31CR61E106K 10 1206 CIN TDK C3225X5R1E106K 10 1206 CIN TAIYO YUDEN TMK316BJ106ML 10 1206 COUT MURATA GRM32ER61E226M 22 1210 COUT MURATA GRM21BR60J226M 22 0805 COUT TDK C3225X5R0J226M 22 1210 COUT TAIYO YUDEN EMK325BJ226MM 22 1210 Table 4. Suggested Diode Component Supplier Series VRRM (V) IOUT (A) Package DIODES B330A 30 3 SMA DIODES B220A 20 2 SMA PANJIT SK22 20 2 DO-214AA PANJIT SK23 30 2 DO-214AA DS8271-02 March 2011 www.richtek.com 13 RT8271 Outline Dimension H A M J B F C I D Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 4.801 5.004 0.189 0.197 B 3.810 3.988 0.150 0.157 C 1.346 1.753 0.053 0.069 D 0.330 0.508 0.013 0.020 F 1.194 1.346 0.047 0.053 H 0.170 0.254 0.007 0.010 I 0.050 0.254 0.002 0.010 J 5.791 6.200 0.228 0.244 M 0.400 1.270 0.016 0.050 8-Lead SOP Plastic Package www.richtek.com 14 DS8271-02 March 2011 RT8271 D L EXPOSED THERMAL PAD (Bottom of Package) U E V E1 e A2 A A1 b Dimensions In Millimeters Dimensions In Inches Symbol Min Max Min Max A 0.810 1.100 0.032 0.043 A1 0.000 0.100 0.000 0.004 A2 0.750 0.950 0.030 0.037 b 0.170 0.270 0.007 0.011 D 2.900 3.100 0.114 0.122 e 0.500 0.020 E 4.800 5.000 0.189 0.197 E1 2.900 3.100 0.114 0.122 L 0.400 0.800 0.016 0.031 U 1.300 1.700 0.051 0.067 V 1.500 1.900 0.059 0.075 10-Lead MSOP (Exposed Pad) Plastic Package Richtek Technology Corporation Richtek Technology Corporation Headquarter Taipei Office (Marketing) 5F, No. 20, Taiyuen Street, Chupei City 5F, No. 95, Minchiuan Road, Hsintien City Hsinchu, Taiwan, R.O.C. Taipei County, Taiwan, R.O.C. Tel: (8863)5526789 Fax: (8863)5526611 Tel: (8862)86672399 Fax: (8862)86672377 Email: [email protected] Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek. DS8271-02 March 2011 www.richtek.com 15